阅读说明：本技术 一种闪烁体面板的封装工艺 (Packaging process of scintillator panel ) 是由 张静 焦启刚 蒲燕 刘金铭 白超群 于 2021-08-10 设计创作，主要内容包括：本申请涉及闪烁体封装的技术领域公开了一种闪烁体面板的封装工艺,其包括裁切封装膜、放置闪烁体、涂胶、抽真空和取出闪烁体等步骤,涂胶是沿着封装膜的周侧对封装膜的端面边缘处进行涂胶。本申请通过设置涂胶的步骤,对闪烁体进行封装时,选用无胶的封装膜,继而减少了封装膜上有胶而产生静电的情况发生,进而减少封装膜对闪烁体造成的损坏。(The application relates to the technical field of scintillator packaging and discloses a packaging technology of a scintillator panel, which comprises the steps of cutting a packaging film, placing a scintillator, gluing, vacuumizing, taking out the scintillator and the like, wherein the gluing is carried out on the edge of the end face of the packaging film along the peripheral side of the packaging film. This application is through setting up the rubber coated step, when encapsulating the scintillator, chooses for use the encapsulation membrane that does not have to glue, has reduced then to have gluey and the condition emergence that produces static on the encapsulation membrane, and then reduces the damage that the encapsulation membrane led to the fact the scintillator.)

1. A packaging process of a scintillator panel is characterized in that: the method comprises the following steps:

s1, cutting the packaging film (200), and cutting the packaging film (200) with a specified size;

s2, placing a scintillator, and placing the scintillator into the sealed cavity;

s3, gluing, namely gluing the periphery of the packaging film (200) and attaching the packaging film to the scintillator;

s4, vacuumizing the sealed cavity;

and S5, taking out the scintillator, and taking out the scintillator coated with the packaging film (200) from the sealed cavity.

2. The process of claim 1, wherein: in step S4, after the sealed cavity is vacuumized, the sealed cavity is pressurized.

3. The process of claim 1, wherein: further comprises a step S6 of gluing the peripheral side of the joint of the packaging film (200) and the scintillator.

4. The process of claim 1, wherein: in step S2, a vacuum device is required to be used, the vacuum device includes a device body (300) with an opening at one side, a door body (400) hinged at the opening of the device body (300), a negative pressure assembly (500) communicated with the inside of the device body (300), and a pressurizing assembly (600) communicated with the device body (300), the negative pressure assembly (500) is used for evacuating the device body (300), and the pressurizing assembly (600) is used for pressurizing the device body (300).

5. The process of claim 4, wherein: be provided with supporting disk (700) in device body (300), sliding connection has two chucking strips (710) on supporting disk (700), two chucking strip (710) are along the direction that is close to each other or keeps away from and supporting disk (700) sliding connection.

6. The process of claim 5, wherein: the supporting plate (700) is provided with sliding grooves (720) corresponding to the two clamping strips (710), the two clamping strips (710) are fixedly connected with sliding blocks (711) connected to the sliding grooves (720) in a sliding mode, and springs (721) used for driving the two clamping strips (710) towards the direction close to each other are arranged in the sliding grooves (720).

7. The process of claim 4, wherein: the device is characterized in that a telescopic rod (310) is vertically arranged in the device body (300), the lower end of the telescopic rod (310) is hinged with a connecting rod (311), and the tail end of the connecting rod (311) is fixedly connected with a sucker (312).

8. The process of claim 4, wherein: the negative pressure assembly (500) comprises a vacuum pump (510) and an exhaust pipe (520), wherein one end of the exhaust pipe is communicated with an air inlet of the vacuum pump (510), and the other end of the exhaust pipe is communicated with the bottom of the device body (300).

9. The process of claim 4, wherein: the pressurizing assembly (600) comprises an air pump (610) and an air inlet pipe (620) with one end communicated with the air outlet of the air pump (610) and the other end communicated with the device body (300).

10. The process of claim 1, wherein: an ultraviolet lamp (320) is fixedly connected in the device body (300).

Technical Field

The application relates to the technical field of scintillator packaging, in particular to a packaging process of a scintillator panel.

Background

The inorganic scintillator plays an important role in radiation detection, and is widely applied to the fields of image nuclear medicine, nuclear physics, high-energy physics and the like. Inorganic scintillators are currently most studied and used, and among them, cesium iodide scintillators having high brightness and high resolution are most widely used. However, cesium iodide material is a moisture-absorbing material, and when it absorbs moisture in the air and deliquesces, the image resolution of the scintillator is lowered. Therefore, how to effectively package the cesium iodide scintillator is very important, and different substrates and packaging processes are different.

In the related art, for example, chinese patent publication No. CN101900824B discloses a method for packaging a scintillator packaging film, which includes the following steps: (1) placing a scintillator to be encapsulated in a sealed cavity and fixing; (2) cutting the packaging film into a size corresponding to the size of the scintillator to be packaged, and then placing the packaging film on the upper surface of the scintillator to be packaged; (3) and vacuumizing the sealed cavity, and pressing the packaging film and the surface of the scintillator. The production steps improve the production efficiency of the scintillator packaging film.

In view of the above-described related art, the inventors of the present invention have considered that the above-described sealing film for sealing the scintillator is a film with a tape, and the film with the tape is likely to generate static electricity, and further, the sealing film is likely to damage the scintillator.

Disclosure of Invention

In order to reduce the problem that the scintillator is easily damaged by the packaging film, the application provides a packaging process of a scintillator panel.

The packaging process of the scintillator panel adopts the following technical scheme:

a process for packaging a scintillator panel, comprising the steps of:

s1, cutting the packaging film, and cutting the packaging film with a specified size;

s2, placing a scintillator, and placing the scintillator into the sealed cavity;

s3, gluing, namely gluing the periphery of the packaging film and attaching the packaging film to the scintillator;

s4, vacuumizing the sealed cavity;

and S5, taking out the scintillator, and taking out the scintillator coated with the packaging film from the sealed cavity.

Through adopting above-mentioned technical scheme, when encapsulating the scintillator, cut the encapsulation membrane earlier, then place into sealed chamber with the scintillator, carry out the rubber coating around the encapsulation membrane that cuts, and paste the encapsulation membrane of scribbling gluey on the scintillator, then take out the air to sealed chamber, make the air displacement between encapsulation membrane and the scintillator extrude then, the inseparabler laminating of encapsulation membrane is on the scintillator, then take out the scintillator of the encapsulation membrane that will cover from sealed chamber, when accomplishing above-mentioned technology, the use is the encapsulation membrane of no glue, so the damage that the static that the encapsulation membrane that has the glue produced caused the scintillator has been reduced.

Optionally, in step S4, after the sealed cavity is vacuumized, the sealed cavity is pressurized.

Through adopting above-mentioned technical scheme, take the back out with the air in the seal chamber, again to conveying air in the seal chamber, then make the pressure of air in the seal chamber increase to make the pressure of air in the seal chamber extrude encapsulation membrane and scintillator, and then increase the stability after the encapsulation membrane pastes on the scintillator.

Optionally, step S6 is further included, in which the peripheral side of the joint between the package film and the scintillator is glued.

Through adopting above-mentioned technical scheme, to pressurizing in the sealed chamber and accomplish the back, reuse glues and carries out the rubber coating to encapsulating film and scintillator hookup location all around, further increases the stability of being connected of encapsulating film and scintillator on the one hand, and on the other hand increases the humidity resistance of scintillator.

Optionally, in step S2, a vacuum device is required to be used, where the vacuum device includes a device body with an opening at one side, a door body hinged at the opening of the device body, a negative pressure assembly communicated with the inside of the device body, and a pressurizing assembly communicated with the device body, where the negative pressure assembly is used to evacuate the device body, and the pressurizing assembly is used to pressurize the device body.

Through adopting above-mentioned technical scheme, when using vacuum apparatus, open the door body earlier, then place the device body with the scintillator through the opening in, then will scribble gluey encapsulation membrane all around and cover and paste the scintillator on, close the door body, start the negative pressure subassembly, the vacuum pumping is carried out to the negative pressure subassembly in to the device body, after having taken out the vacuum, starts the pressurization subassembly, the pressurization subassembly pressurizes in to the device body, accomplishes the encapsulation of scintillator in the sealed chamber promptly.

Optionally, be provided with the supporting disk in the device body, sliding connection has two chucking strips on the supporting disk, two chucking strip is along the direction that is close to each other or keeps away from and supporting disk sliding connection.

Through adopting above-mentioned technical scheme, when placing into the device body with the scintillator, place the supporting disk with the scintillator earlier on, then slide two chucking strips to make two chucking strips all contradict with the base plate of scintillator and carry out spacingly to the scintillator, and then increase the stability that the scintillator was placed into in the device body.

Optionally, a sliding groove is formed in the supporting plate corresponding to the two clamping strips, the sliding grooves are formed in the supporting plate, the two clamping strips are fixedly connected with sliding blocks in the sliding grooves in a sliding mode, and springs used for driving the two clamping strips towards the direction close to each other are arranged in the sliding grooves.

Through adopting above-mentioned technical scheme, when placing the backup pad with the scintillator on, drive two chucking strips earlier, then make two chucking strips move towards the direction of keeping away from each other, slider and spout take place the relative slip simultaneously, the slider compresses the spring, then place the scintillator between two chucking strips, loosen two chucking strips, two chucking strips move towards the direction that is close to each other under the effect of spring, finally make two relative sides conflict on two chucking strips and the base plate of scintillator, and then increase the stability of scintillator after placing into the device body.

Optionally, a telescopic rod is vertically arranged in the device body, a connecting rod is hinged to the lower end of the telescopic rod, and a sucker is fixedly connected to the tail end of the connecting rod.

Through adopting above-mentioned technical scheme, with the scintillator fixed back in the device body, the connecting rod rotates, the relative rotation takes place for connecting rod and telescopic link, then paste the encapsulating film on the sucking disc, then carry out the rubber coating to the encapsulating film along the circumference of encapsulating film again, after having scribbled the glue, the reverse rotation connecting rod, thereby make the encapsulating film be located the scintillator directly over, then the pulling telescopic link, the length of telescopic link increases, even get the encapsulating film paste the scintillator on, and then reach the effect that the staff of being convenient for advances line location to the encapsulating film.

Optionally, the negative pressure assembly comprises a vacuum pump and an exhaust tube, one end of the exhaust tube is communicated with an air inlet of the vacuum pump, and the other end of the exhaust tube is communicated with the bottom of the device body.

Through adopting above-mentioned technical scheme, paste the back on the scintillator with the packaging film, close a body, start the vacuum pump, the vacuum pump takes out the air in with the device body, makes the air in the device body reduce gradually then, is close the vacuum state in the device body, through the one end with the exhaust tube and the bottom intercommunication of device body, when can making the vacuum pump take out the air in with the device body, applys the pressure towards the scintillator to the packaging film, and then increases the effect that the packaging film pasted on the scintillator.

Optionally, the pressurizing assembly comprises an air pump and an air inlet pipe, one end of the air inlet pipe is communicated with an air outlet of the air pump, and the other end of the air inlet pipe is communicated with the device body.

Through adopting above-mentioned technical scheme, when pressurizeing in the device body, start the air pump, the air pump passes through the intake pipe and to the air delivery in the device body, makes the pressure of air in the device body increase gradually then to make scintillator and encapsulation membrane more tight that pastes under the effect of device body medium pressure, and then increase the stability of being connected of encapsulation membrane and scintillator.

Optionally, an ultraviolet lamp is fixedly connected in the device body.

Through adopting above-mentioned technical scheme, after accomplishing the pressurization of device body, open the ultraviolet lamp in the device body, make ultraviolet lamp shine the hookup location of encapsulation membrane and scintillator then to accelerate gluey solidification rate, and then improve the work efficiency when encapsulating the scintillator.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by arranging the cutting packaging film, placing the scintillator, gluing the packaging film, vacuumizing and taking the scintillator, the process uses the packaging film without glue, so that the condition that the scintillator is damaged by static electricity generated by the packaging film can be reduced;

2. after the sealed cavity is vacuumized, the sealed cavity is pressurized, so that the pressure in the device body is gradually increased, and when the pressure in the device body is higher, the packaging film and the scintillator are pressurized, so that the sealing property between the packaging film and the scintillator is further improved;

3. the adhesive is applied to the peripheral side of the connecting position of the packaging film and the scintillator again, so that the connecting stability of the packaging film and the scintillator is further improved on one hand, and the sealing performance between the packaging film and the scintillator is further improved on the other hand.

Drawings

FIG. 1 is a schematic structural diagram of a coated cesium iodide scintillator film in an embodiment of the present application, where A is indicated by glue;

FIG. 2 is a schematic structural diagram of a vacuum apparatus in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a support plate in a vacuum apparatus according to an embodiment of the present invention.

Description of reference numerals: 100. a cesium iodide scintillator; 110. cesium iodide; 120. a substrate; 200. packaging the film; 300. a device body; 310. a telescopic rod; 311. a connecting rod; 312. a suction cup; 320. an ultraviolet lamp; 400. a door body; 500. a negative pressure assembly; 510. a vacuum pump; 520. an air exhaust pipe; 600. a pressurizing assembly; 610. an air pump; 620. an air inlet pipe; 700. a support disc; 710. a clamping strip; 711. a slider; 720. a chute; 721. a spring.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a packaging process of a scintillator panel.

Referring to fig. 1, a main objective of a process for packaging a scintillator panel is to use a non-adhesive packaging film 200 to package a scintillator, so as to reduce damage to the scintillator caused by static electricity generated by the adhesive packaging film 200. The cesium iodide scintillator 100 includes a substrate 120 and cesium iodide 110 fixedly attached to the substrate 120.

The packaging process mainly comprises the following steps: s1, the sealing film 200 is cut to a size that can cover the cesium iodide 110 fixedly attached to the substrate 120. S2, placing the cesium iodide scintillator 100 in a sealed cavity, and fixing the cesium iodide scintillator 100 in the sealed cavity. S3, applying glue to the end face of the cut packaging film 200 along the circumferential direction of the packaging film 200, then facing the end face of the packaging film 200 to the cesium iodide 110, attaching the packaging film 200 coated with the glue to the cesium iodide 110, and simultaneously fixedly connecting the glue on the packaging film 200 to the substrate 120 (the glue is one of UV glue, AV glue, or thermal curing glue, in this embodiment, the UV glue is selected).

S4, vacuumizing, namely vacuumizing a sealed cavity in which the cesium iodide scintillator 100 is placed, gradually reducing the pressure in the vacuum cavity, and extruding air between the packaging film 200 and the cesium iodide 110 under the pressure action of the sealed cavity, so that the packaging film 200 and the cesium iodide 110 are attached more tightly; and then pressurizing the sealed cavity, so that the pressure of the air in the sealed cavity is increased, and the packaging film 200 and the cesium iodide 110 are attached more tightly under the action of the pressure in the sealed cavity. Through carrying out evacuation and pressurization to the sealed chamber, can also make glue on the packaging film 200 even distribution on packaging film 200, increase the scintillator quality of producing, improve the display effect of scintillator.

S5, taking out the scintillator, and taking out the scintillator covered with the packaging film 200 from the sealed cavity, wherein it should be noted that the cesium iodide scintillator 100 is taken out after the glue on the packaging film 200 is solidified. And S6, gluing again, gluing the periphery of the joint of the packaging film 200 and the cesium iodide scintillator 100, increasing the sealing property between the packaging film 200 and the cesium iodide scintillator 100, improving the moisture resistance of the cesium iodide scintillator 100, and finally achieving the effect of prolonging the service life of the scintillator.

Referring to fig. 2, in the above-mentioned packaging process, a vacuum apparatus is required to be used, and the vacuum apparatus includes an apparatus body 300, a door 400, a negative pressure assembly 500 and a pressure assembly 600, wherein one side of the apparatus body 300 has an opening, and the door 400 is hinged at the opening of the apparatus body 300, and after the door 400 closes the opening of the apparatus body 300, a sealed cavity is formed in the apparatus body 300. One end of the negative pressure assembly 500 is communicated with the sealed cavity, and when the negative pressure assembly 500 works, the negative pressure assembly 500 pumps out air in the sealed cavity, so that the pressure in the sealed cavity is gradually reduced. One end of the pressurizing assembly 600 is communicated with the sealed cavity, and when the pressurizing assembly 600 works, the pressurizing assembly 600 conveys air into the sealed cavity, so that the amount of air in the sealed cavity is increased, and the pressure in the sealed cavity is gradually increased.

Referring to fig. 1, 2 and 3, in order to facilitate the placement of the cesium iodide scintillator 100 into the apparatus body 300, a support plate 700 is slidably connected in the apparatus body 300, and the sliding direction of the support plate 700 is a direction close to or away from the opening of the apparatus body 300. Two clamping strips 710 are arranged on the supporting plate 700 in parallel, and the two clamping strips 710 are connected with the supporting plate 700 in a sliding manner along the direction approaching to or departing from each other. Sliding grooves 720 are formed in the supporting plate 700 in the sliding direction corresponding to the two clamping strips 710, sliding blocks 711 are fixedly connected to each clamping strip 710 corresponding to the sliding grooves 720, and the sliding blocks 711 are connected to the sliding grooves 720 in a sliding mode. The two sliders 711 are provided with springs 721 on their sides facing away from each other, and the springs 721 are located in the sliding grooves 720. One end of the spring 721 is abutted against the slider 711, and the other end of the spring 721 is abutted against the groove wall of the sliding groove 720, so that the spring 721 drives the slider 711.

When placing cesium iodide scintillator 100 into device body 300, open door body 400, then slide supporting disk 700 out of device body 300, then drive two chucking strips 710 towards the direction of keeping away from each other, spring 721 is compressed this moment, then place cesium iodide scintillator 100 between two chucking strips 710, loosen chucking strip 710, two chucking strips 710 move towards the direction that is close to each other under the effect of spring 721, finally make two chucking strips 710 contradict and support tightly with the relative two sides of base plate 120, then slide supporting disk 700 to device body 300 in, and then reach the effect that makes things convenient for the staff to place cesium iodide scintillator 100 into device body 300.

In order to attach the encapsulating film 200 to the cesium iodide 110 conveniently, a telescopic rod 310 is slidably connected to the device body 300, the telescopic rod 310 is vertically disposed, and the telescopic rod 310 is slidably connected to the device body 300 along a direction close to or away from the opening of the device body 300. The lower end of the telescopic rod 310 is hinged with a connecting rod 311, and one end of the connecting rod 311 far away from the telescopic rod 310 is fixedly connected with a suction cup 312. When the packaging film 200 is coated with glue, the telescopic rod 310 is slid first, the telescopic rod 310 is slid to an opening of the device body 300, then the connecting rod 311 is rotated, one end of the connecting rod 311, which is provided with the suction cup 312, is rotated out of the device body 300, then the packaging film 200 is attached to the suction cup 312, and then the packaging film 200 is coated with glue along the circumferential direction of the packaging film 200. After the glue is coated, the connecting rod 311 is rotated reversely, the connecting rod 311 drives the suction cup 312 and the packaging film 200 to enter the device body 300, then the positions of the packaging film 200 and the cesium iodide 110 are aligned, the connecting rod 311 is pulled down, and the length of the telescopic rod 310 is lengthened, so that the packaging film 200 is attached to the cesium iodide 110, meanwhile, the glue on the packaging film 200 is in contact with the substrate 120, and the effect of conveniently attaching the packaging film 200 to the cesium iodide 110 is achieved.

Referring to fig. 1 and 2, in order to enable a vacuum to be formed in the sealed chamber, the negative pressure module 500 includes a vacuum pump 510 and an exhaust tube 520, one end of the exhaust tube 520 is communicated with an air inlet of the vacuum pump 510, and the other end of the exhaust tube 520 is fixedly connected to the bottom of the apparatus body 300 and is communicated with the sealed chamber. After the packaging film 200 is attached to the cesium iodide scintillator 100, the vacuum pump 510 is started, the vacuum pump 510 pumps air in the sealed cavity, and then the air in the sealed cavity is gradually pumped out of the sealed cavity, so that the pressure in the sealed cavity is small, and finally the sealed cavity is in a state of approximate vacuum. Through installing the bottom at device body 300 with the one end of exhaust tube 520, can make when vacuum pump 510 is to the air in the sealed chamber pump, the air in the sealed chamber moves towards the bottom in sealed chamber to make the air of moving in the sealed chamber exert the power towards cesium iodide scintillator 100 to encapsulating film 200, and then make encapsulating film 200 and cesium iodide scintillator 100 laminate tighter, increase encapsulating film 200 and cesium iodide scintillator 100's leakproofness.

In order to realize pressurization in the sealed cavity, the pressurizing assembly 600 includes an air pump 610 and an air inlet pipe 620, one end of the air inlet pipe 620 is communicated with an air outlet of the air inlet pump 610, and the other end of the air inlet pipe 620 is fixedly connected with the top of the device body 300 and is communicated with the sealed cavity. After the sealed cavity is vacuumized, the vacuum pump 510 is turned off, the air pump 610 is started, air generated by the air pump 610 enters the sealed cavity through the air inlet pipe 620, so that air in the sealed cavity is gradually increased, and the pressure in the sealed cavity is gradually increased. One end of the air inlet pipe 620 is arranged at the top of the device body 300, so that when air is supplied into the sealed cavity, the air entering the sealed cavity can apply downward pressure on the packaging film 200, and the sealing performance between the packaging film 200 and the cesium iodide scintillator 100 is further improved.

In order to improve the production efficiency to the scintillator, fixedly connected with ultraviolet lamp 320 in device body 300 pressurizes the completion back to sealed chamber, opens ultraviolet lamp 320, makes ultraviolet lamp 320 shine the glue on the encapsulation membrane 200 in the sealed chamber then to accelerate the design speed of encapsulation membrane 200 rubberizing, and then reach the production efficiency who improves the scintillator.

After the glue on the packaging film 200 is solidified, the door body 400 is opened, the supporting disc 700 is slid, the supporting disc 700 drives the cesium iodide scintillator 100 to move out of the device body 300, then the peripheral side of the connecting position of the packaging film 200 and the cesium iodide 110 is glued, finally the supporting disc 700 is slid into the device body 300 again, the ultraviolet lamp 320 irradiates the glue, the sealing performance between the cesium iodide scintillator 100 and the packaging film 200 is improved, and the service life of the cesium iodide scintillator 100 is prolonged.

The implementation principle of the packaging process of the scintillator panel in the embodiment of the application is as follows: when the scintillator is produced, the packaging film 200 is cut first. Then, the door 400 of the vacuum apparatus is opened, the support plate 700 is pulled out, the cesium iodide scintillator 100 is placed on the support plate 700, and the support plate 700 is slid into the apparatus body 300 in the reverse direction. The telescopic rod 310 is slid so that the telescopic rod 310 moves to the opening of the device body 300, and then the connection rod 311 is rotated, and the end of the connection rod 311 where the suction cup 312 is installed is rotated out of the device body 300. The packaging film 200 is attached to the suction cup 312, the connecting rod 311 is rotated in the opposite direction, and the suction cup 312 drives the packaging film 200 into the device body 300. The position of the telescopic rod 310 is adjusted, so that the packaging film 200 is aligned to the cesium iodide scintillator 100, then the connecting rod 311 is pulled down, the length of the telescopic rod 310 is lengthened, the packaging film 200 is attached to the cesium iodide scintillator 100, the connecting rod 311 is loosened, and the sucker 312 is separated from the packaging film 200.

And then starting the vacuum pump 510, pumping the air in the sealed cavity by the vacuum pump 510, reducing the pressure in the sealed cavity, and enabling the packaging film 200 and the cesium iodide scintillator 100 to be attached tightly under the action of the pressure in the sealed cavity. And stopping the vacuum pump 510, starting the air pump 610, delivering air to the sealed cavity by the air pump 610, increasing the pressure in the sealed cavity, and further enabling the packaging film 200 and the cesium iodide scintillator 100 to be tightly attached under the action of the pressure in the sealed cavity. Then, the air pump 610 is turned off, the ultraviolet lamp 320 is turned on, and the ultraviolet lamp 320 irradiates the glue on the encapsulation film 200 to accelerate the solidification of the glue. Finally, the door body 400 is opened, the support disc 700 is slid out of the device body 300, the glue is applied again to the periphery of the connection between the packaging film 200 and the cesium iodide scintillator 100, the support disc 700 is pushed into the device body 300 again after the glue is applied, and the ultraviolet lamp 320 is opened to irradiate the glue.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.