阅读说明：本技术 一种增强非导体表面金属化附着力的方法 (Method for enhancing metalized adhesion of non-conductor surface ) 是由 徐雷 于 2020-04-27 设计创作，主要内容包括：本申请提供一种增强非导体表面金属化附着力的方法,对塑料件表面进行机械粗化处理,增加所述塑料件的表面粗糙度；再置于化学药剂中,对所述塑料件表面进行化学粗化处理；在所述塑料件表面浸入调整剂,所述调整剂带有与钯水相反的电荷；再将带有调整剂的所述塑料件放入钯水中,对所述塑料件表面进行沉钯处理；以及对所述塑料件进行化学电镀,完成所述塑料件的表面金属化。所述方法在机械粗化后,在塑料件表面增加调整剂,通过调整剂带有的负电荷,与钯水带有的正电荷之间产生结合力,提高金属附着力。(The application provides a method for enhancing the metallization adhesion force of a non-conductor surface, which comprises the steps of carrying out mechanical roughening treatment on the surface of a plastic part to increase the surface roughness of the plastic part; then placing the plastic piece in a chemical agent, and carrying out chemical roughening treatment on the surface of the plastic piece; immersing a conditioning agent on the surface of the plastic part, wherein the conditioning agent has an electric charge opposite to that of palladium water; putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part; and carrying out chemical plating on the plastic part to complete surface metallization of the plastic part. According to the method, after mechanical roughening, the modifier is added on the surface of the plastic part, and the negative charges of the modifier generate binding force with the positive charges of the palladium water, so that the metal adhesion is improved.)

1. A method of enhancing the adhesion of a non-conductive surface metallization comprising the steps of:

mechanically roughening the surface of the plastic part to increase the surface roughness of the plastic part;

immersing the plastic part into an acidic chemical reagent, and carrying out chemical roughening treatment on the surface of the plastic part;

immersing the plastic part in a conditioning agent having an opposite charge to palladium water;

putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part;

and carrying out chemical electroplating on the plastic part to complete the surface metallization of the plastic part.

2. The method of enhancing non-conductive surface metallization adhesion of claim 1, wherein said plastic member has a predetermined configuration and is formed by an injection molding process.

3. The method of enhancing non-conductive surface metallization adhesion of claim 1, wherein the step of mechanically roughening the surface of the plastic part to increase the surface roughness of the plastic part comprises:

carrying out sand blasting treatment on the surface of the plastic part by adopting 60-80 meshes of white corundum; and the surface roughness of the plastic part meets the preset requirement by adjusting the sand blasting speed and the air pressure parameter.

4. The method of enhancing non-conductor surface metallization adhesion according to claim 3, further comprising:

and removing the residual sand blasting impurities on the surface of the plastic part by ultrasonic cleaning.

5. The method of enhancing the metallization adhesion of non-conductive surfaces according to claim 1, wherein in the step of immersing said plastic part in an acidic chemical agent to chemically roughen the surface of said plastic part,

the acid substance is a chemical pool containing chromic acid, sulfuric acid and potassium permanganate, the concentration of the acid substance is 20-120g/L, the chemical coarsening time is 5-50min, and the coarsening temperature is 20-75 ℃.

6. The method of enhancing non-conductor surface metallization adhesion according to claim 5, further comprising:

and cleaning the surface of the plastic part to remove residual chemical reagents.

7. The method of enhancing non-conductive surface metallization adhesion of claim 1, wherein the step of immersing said plastic member in a conditioning agent comprises:

soaking the plastic part in weak alkali solution containing 1-2.5mol/L of hydroxide ions and 0.11-0.58mol/L of hypophosphite solution to make the plastic part have negative charges;

and putting the plastic part into palladium water to carry out palladium precipitation treatment on the surface of the plastic part, wherein the palladium water has positive charges so as to increase the adhesive force between palladium ions and the plastic part with negative charges.

8. The method of enhancing non-conductor surface metallization adhesion according to claim 7, further comprising:

and carrying out degumming process treatment on the surface of the plastic part so as to expose palladium particles on the surface of the plastic part.

9. The method of enhancing non-conductive surface metallization adhesion of claim 1, wherein the step of chemically plating said plastic member comprises:

carrying out chemical nickel plating on the surface of the plastic part to ensure that the thickness of a nickel layer is less than or equal to 1 um;

performing laser etching on the surface of the plastic part to form an electroplating area and an electroless plating area;

carrying out copper plating treatment on the surface of the plastic part through an electroplating process to ensure that the thickness of a copper layer is more than or equal to 8 um;

carrying out nickel stripping treatment on the surface of the plastic part, and removing a nickel layer in an electroless plating area;

and carrying out electrotinning treatment on the surface of the plastic part, forming an electrotinning layer on the copper plating area and carrying out tin layer protection treatment.

10. The method of enhancing non-conductor surface metallization adhesion of claim 9, wherein the step of laser etching the plastic member surface comprises:

performing laser etching on the complex surface of the plastic part to form an electroplating area and an electroless plating area;

and carrying out laser etching on the simple surface of the plastic part, and dividing a separation line with the width larger than or equal to 0.5mm between the electroplating area and the non-electroplating area.

Technical Field

The application relates to the technical field of plastic surface metallization, in particular to a method for enhancing the metallization adhesion force of a non-conductor surface.

Background

The plastic surface metallization refers to attaching a metal material to a plastic surface by means of electroplating, coating and the like, so that properties of the metal material and the plastic material are fully utilized to manufacture different parts. Thanks to the plasticity and light weight of plastic materials and the continuous maturity of selective plating processes, more and more plastics are applied in large scale in the fields of communication, automobiles, electronics and the like, so that users can flexibly design complex plastic parts to replace traditional processes such as Printed Circuit Board etching (PCB), metal sheet metal, die casting or LDS (Laser Direct structuring) and the like.

The antenna oscillator is most suitable for applying a plastic surface metallization process, and in order to attach a metal material to an oscillator body made of a plastic material, a selective electroplating technology process can be applied, and the process flow generally comprises the following steps: firstly, preparing a vibrator body with a preset structure through injection molding; then, carrying out physical coarsening and ultrasonic cleaning on the surface of the vibrator body; forming a barrier line by chemical nickel plating and laser etching of a nickel layer to form an electroplating area and an non-electroplating area on the surface of the oscillator body; then carrying out electro-coppering treatment on the electroplating area; and finally, carrying out nickel stripping treatment to remove the wiring in the non-electroplating area on the surface, forming a metallization layer by tinning to obtain a final product, and carrying out pretreatment such as coarsening, target sinking, activation and the like on the oscillator body before chemical nickel plating in order to obtain a better adhesion effect.

However, the existing selective electroplating process has disadvantages, and as the requirements of customers on the use conditions of the antenna are higher and the application range is wider and wider, the antenna is required to be assembled and not easy to damage in the use process. Furthermore, the antenna is required to be capable of soldering electronic components as much as possible. Therefore, there is a high demand for surface adhesion of the metallization layer. Namely, in the actual operation of the prior art, the metallization layer has the problem of insufficient metal adhesion.

Disclosure of Invention

The application provides a method for enhancing the metallization adhesion of a non-conductor surface, which aims to solve the problem of insufficient metal adhesion of a metallization layer in the traditional process.

The application provides a method for enhancing the metallization adhesion of a non-conductor surface, which comprises the following steps:

mechanically roughening the surface of the plastic part to increase the surface roughness of the plastic part;

immersing the plastic part into an acidic chemical reagent, and carrying out chemical roughening treatment on the surface of the plastic part;

immersing the plastic part in a conditioning agent having an opposite charge to palladium water;

putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part;

and carrying out chemical electroplating on the plastic part to complete the surface metallization of the plastic part.

Optionally, the plastic part has a predetermined structure and is formed by an injection molding process.

Optionally, the step of mechanically roughening the surface of the plastic part to increase the surface roughness of the plastic part comprises:

carrying out sand blasting treatment on the surface of the plastic part by adopting 60-80 meshes of white corundum; and the surface roughness of the plastic part meets the preset requirement by adjusting the sand blasting speed and the air pressure parameter.

Optionally, the method further includes:

and removing the residual sand blasting impurities on the surface of the plastic part by ultrasonic cleaning.

Optionally, in the step of immersing in an acidic chemical agent to chemically roughen the surface of the plastic part,

the acid substance is a chemical pool containing chromic acid, sulfuric acid and potassium permanganate, the concentration of the acid substance is 20-120g/L, the chemical coarsening time is 5-50min, and the coarsening temperature is 20-75 ℃.

Optionally, the method further includes:

and cleaning the surface of the plastic part to remove residual chemical reagents.

Optionally, the step of immersing the plastic part in a conditioning agent comprises:

soaking the plastic part in weak alkali solution containing 1-2.5mol/L of hydroxide ions and 0.11-0.58mol/L of hypophosphite solution to make the plastic part have negative charges;

and putting the plastic part into palladium water to carry out palladium precipitation treatment on the surface of the plastic part, wherein the palladium water has positive charges so as to increase the adhesive force between palladium ions and the plastic part with negative charges.

Optionally, the method further includes:

and carrying out degumming process treatment on the surface of the plastic part so as to expose palladium particles on the surface of the plastic part.

Optionally, the step of chemically plating the plastic part comprises:

carrying out chemical nickel plating on the surface of the plastic part to ensure that the thickness of a nickel layer is less than or equal to 1 um;

performing laser etching on the surface of the plastic part to form an electroplating area and an electroless plating area;

carrying out copper plating treatment on the surface of the plastic part through an electroplating process to ensure that the thickness of a copper layer is more than or equal to 8 um;

carrying out nickel stripping treatment on the surface of the plastic part, and removing a nickel layer in an electroless plating area;

and carrying out electrotinning treatment on the surface of the plastic part, forming an electrotinning layer on the copper plating area and carrying out tin layer protection treatment.

Optionally, the step of performing laser etching on the surface of the plastic part includes:

performing laser etching on the complex surface of the plastic part to form an electroplating area and an electroless plating area;

and carrying out laser etching on the simple surface of the plastic part, and dividing a separation line with the width larger than or equal to 0.5mm between the electroplating area and the non-electroplating area.

According to the technical scheme, the method for enhancing the metalized adhesion force of the non-conductor surface is used for producing the antenna oscillator, and the method comprises the steps of firstly, carrying out mechanical roughening treatment on the surface of a plastic part to increase the surface roughness of the plastic part; then immersing the plastic piece into an acidic chemical reagent to perform chemical roughening treatment on the surface of the plastic piece; the plastic part is then immersed in a conditioning chemical agent having an opposite charge to the palladium water; putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part; and carrying out chemical plating on the plastic part to complete surface metallization of the plastic part. According to the method, after chemical roughening, the modifier is added on the surface of the plastic part, and the negative charges of the modifier generate binding force with the positive charges of the palladium water, so that the metal adhesion is improved. Therefore, the palladium water can be contacted and attached to the surface of a product more quickly and uniformly, and palladium particles can be attached to the surface of a plastic piece more uniformly and fully after the glue is removed, so that the stability of the electrical and mechanical properties is improved.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic flow chart of a method for enhancing the adhesion of a non-conductive surface metallization according to the present application;

fig. 2 is a schematic flow chart of the oscillator body electroless plating process according to the present application.

Detailed Description

Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following examples do not represent all embodiments consistent with the present application. But merely as exemplifications of systems and methods consistent with certain aspects of the application, as recited in the claims.

Referring to fig. 1, a flow chart of a method for enhancing the adhesion of a non-conductive surface metallization according to the present application is shown. As can be seen from fig. 1, the method for enhancing the non-conductor surface metallization adhesion provided by the present application may be used to plate a metal conductor on the surface of an antenna element made of a non-metal material in the process of producing the antenna element, so as to reduce the overall weight of the antenna element on the premise of meeting the antenna operation requirements.

Therefore, in the embodiment of the present application, the vibrator body having the predetermined structure may be manufactured through an injection molding process. According to different practical application approaches, the oscillator body can have different shapes, and if the oscillator body is divided according to the complexity of the shape of the oscillator body, the oscillator body can comprise a complex surface and a simple surface. The simple surface refers to a surface with smooth change of the surface shape of the oscillator body, the surface is in a regular shape, and the complex surface refers to a surface with nonstandard surface shape and a plurality of transitions and pore channels. Obviously, the plating of the simple surface area is easier to realize the attachment on the vibrator body.

Further, in some embodiments of the present application, the vibrator is formed by injection molding a vibrator body having a predetermined structure. In the embodiment, the corresponding plastic part body is obtained by injection molding of enhanced polyphenylene sulfide (PPS + 40% glass fiber) (material number ER008655 of Sabic corporation) containing metal particles, and the material finished product has high yield, is stable in injection molding, and is not easy to have injection molding defects such as material shortage and the like.

S1: and carrying out mechanical roughening treatment on the surface of the plastic part to increase the surface roughness of the plastic part.

The mechanical roughening treatment of the plastic part is to treat the surface of the plastic part in a mechanical polishing mode so as to increase the surface roughness of the plastic part. The specific mechanical roughening method can be a roughening process such as grinding, sand blasting and the like. Chemical reagents are more easily adhered to the surface of the plastic part after the roughening treatment, so that the plastic part can fully contact the chemical reagents to finish the palladium deposition and electroplating processes.

Specifically, in the step of mechanically roughening the surface of the plastic part, the surface of the plastic part may be sandblasted by using 60-80 mesh white corundum; and the surface roughness of the plastic part meets the preset requirement by adjusting the sand blasting speed and the air pressure parameter. In practical application, the surface of the plastic part body is subjected to mechanical roughening treatment by adopting 60-80-mesh white corundum according to set parameters such as injection speed, air pressure and the like, and due to the fact that the white corundum material is high in hardness, the surface of the plastic part can be polished in the sand blasting process, and therefore the surface roughness of the plastic part is increased. The adhesive force of the subsequent plating layer is improved, and the bad phenomena of peeling, falling off and the like of the plating layer are prevented. In order to complete the subsequent processing process, the method can also remove the residual sand blasting impurities on the surface of the plastic part by ultrasonic cleaning.

In practical application, the time of sand blasting and ultrasonic cleaning can be set by self according to the specific structure of the plastic part, for example, the plastic part body has a simple structure, and when chemical reagents are not easy to adhere to the plastic part body, the sand blasting time and the spraying speed of white corundum can be properly increased, so that a rougher surface is formed on the plastic part. When the structure of the plastic part body is complex and white corundum in the sand blasting process is easy to remain on the surface of the plastic part, the ultrasonic cleaning time needs to be properly increased so as to fully remove sand blasting impurities.

Through the working of plastics of mechanical coarsening processing, not only the adhesion chemical reagent more easily can be favorable to keeping the roughness of each part to tend to unanimity moreover, and whole working of plastics can more evenly adhere to chemical reagent promptly to possess more even metal coating.

S2: immersing the plastic part into an acidic chemical reagent, and carrying out chemical roughening treatment on the surface of the plastic part.

According to the chemical property of the plastic part, in practical application, the surface of the plastic part can be subjected to shallow layer corrosion by adopting an acidic substance with proper concentration, so that the surface roughness of the plastic part is further improved. The acid substance is a chemical pool containing chromic acid, sulfuric acid and potassium permanganate, the concentration of the acid substance is 20-120g/L, the chemical coarsening time is 5-50min, and the coarsening temperature is 20-75 ℃.

In practical application, the plastic part can be subjected to micro-corrosion roughening through a chemical pool containing chromic acid, sulfuric acid and potassium permanganate. The plastic part is soaked in a chemical tank containing chromic acid, sulfuric acid and potassium permanganate, so that the chromic acid, the sulfuric acid and the potassium permanganate in the chemical tank can chemically react with the surface material of the plastic part to corrode a part of the surface material, and the roughness of the surface of the plastic part is improved. In practical application, the micro-etching and roughening time of the surface of the plastic part is related to the specific concentration of the acidic substance, namely, the chemical roughening time is shorter when the concentration of the acidic substance is higher, and the chemical roughening time is longer when the concentration of the acidic substance is lower. Illustratively, the time for chemical roughening may be 5-50 min.

After the chemical roughening treatment, the plastic part can be cleaned for one time to remove residual chromic acid and sulfuric acid.

S3: immersing the plastic part in a conditioning agent having an opposite charge to the palladium water.

According to the technical scheme, after the chemical roughening process is completed, the plastic part is placed into a chemical pool with a regulator, so that the regulator is adhered to the surface of the regulator. The regulator may be formed by mixing various solutes, such as weak alkali solution of hydroxide ion and hypophosphite solution. Illustratively, the plastic part is negatively charged by soaking the plastic part in a weak alkali solution containing 1-2.5mol/L of hydroxide ions and 0.11-0.58mol/L of hypophosphite solution, and then the plastic part is put into palladium water to carry out palladium precipitation treatment on the surface of the plastic part, wherein the palladium water has positive charges so as to increase the adhesion force of the palladium ions and the plastic part with negative charges.

S4: and putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part.

In the technical scheme provided by the application, the metal ions in the palladium water are positively charged, so that the regulator can be negatively charged. Through the electric charge force between the positive and negative charges, the metal in the palladium water can be adhered to the surface of the plastic part more easily, the binding force between the metal layer and the plastic part is improved, and in the palladium deposition process, the metal palladium can be contacted with the surface of a product more quickly and uniformly, so that adsorption is realized, and the binding force of the metal layer is increased.

S5: and carrying out chemical electroplating on the plastic part to complete the surface metallization of the plastic part.

After the palladium deposition treatment is finished, the surface of the plastic part can be subjected to degumming process treatment so as to expose palladium particles on the surface of the plastic part, and then selective chemical plating is carried out on the plastic part with metal palladium on the surface, so that the surface metallization of the plastic part is finished.

Specifically, as shown in fig. 2, the step of performing electroless plating on the plastic part further includes:

s501: carrying out chemical nickel plating on the surface of the plastic part to ensure that the thickness of a nickel layer is less than or equal to 1 um;

s502: performing laser etching on the surface of the plastic part to form an electroplating area and an electroless plating area;

s503: carrying out copper plating treatment on the surface of the plastic part through an electroplating process to ensure that the thickness of a copper layer is more than or equal to 8 um;

s504: carrying out nickel stripping treatment on the surface of the plastic part, and removing a nickel layer in an electroless plating area;

s505: and carrying out electrotinning treatment on the surface of the plastic part, forming an electrotinning layer on the copper plating area and carrying out tin layer protection treatment.

In practical application, the surface of the plastic part can be chemically plated with nickel to form a chemical nickel layer. The nickel layer may have an effect of improving the connectivity, and the thickness of the nickel layer should be less than or equal to 1um in order not to affect the thickness of the other metal layers. After the chemical nickel layer is formed, a plating area and a non-plating area can be formed by performing laser etching on the surface of the plastic part, wherein the plating area refers to an area needing surface metallization, and the area can be used for receiving radio signals in practical application. The non-plating area on the plastic part refers to other areas except the plating area, and the non-plating area is generally the mounting area of the vibrator.

Further, the step of performing laser etching on the surface of the plastic part further comprises: performing laser etching on the complex surface of the plastic part to form an electroplating area and an electroless plating area; and carrying out laser etching on the simple surface of the plastic part, and dividing a separation line with the width larger than or equal to 0.5mm between the electroplating area and the non-electroplating area. In this embodiment, it is preferred to treat the complex surface of the plastic part first and then treat the simple surface, so as to adapt to the electroplating area and the non-electroplating area of the complex surface by adjusting the laser etching shape on the simple surface, thereby simplifying the complexity of the laser etching process of the complex surface. The electroplated area and the non-electroplated area can be divided by the barrier line so as to facilitate the subsequent copper plating treatment.

After the plating and non-plating regions are formed, the plastic part may be subjected to a copper plating process. In practical application, the copper plating treatment can be carried out on the electroplating area only to form a copper layer on the surface of the plastic part, and the copper layer is a main conductive material for metallization of the surface of the plastic part, so that the copper plating process can be adopted, and the thickness of the copper layer is set to be more than or equal to 8um to ensure that the surface of the plastic part has sufficient conductivity.

After the copper plating is finished, nickel removing treatment can be carried out on the surface of the plastic part, and the nickel layer in the non-plating area is removed. The nickel stripping treatment may be performed by applying a nickel stripping agent treatment to the electroless plating region. The nickel stripping agent, also called environmental-friendly nickel stripping water, is a chemical plating solution for the surface of a nickel material, for example: Q/YS.601, can remove the metal nickel plating layer on the surface of PC, PMMA (acrylic), PET, circuit board, optical glass and plastic products. And finally, carrying out electrotinning treatment on the surface of the plastic part, forming an electrotinning layer on the copper plating area and carrying out tin layer protection treatment. According to the technical scheme, the characteristics that the surface of the tin layer can form the oxide film can be utilized, the copper layer in the electroplating area is protected, and the service life of the plastic part is prolonged.

The process flow of the method for metallizing a plastic surface according to the present application will be described with reference to a specific example. In a specific embodiment, the glass fiber-containing reinforced polyphenylene sulfide is firstly adopted and is molded by an injection molding process to obtain a corresponding plastic part. And performing surface sand blasting treatment on the plastic part by using 80-mesh white corundum. After sand blasting treatment, the plastic part is soaked in a chemical tank which is provided with a roughening solution consisting of 70g/L chromic acid, sulfuric acid and potassium permanganate solution and a proper amount of wetting agent, and chemical roughening is completed.

And soaking the plastic part after chemical coarsening in a regulator chemical pool containing 2mol/L of weak alkaline solution of hydroxide ions and 0.34mol/L of hypophosphite solution, wherein the plastic part has negative charges. And then putting the plastic part with the regulator into palladium water, performing surface palladium precipitation treatment on the plastic part, and obtaining the plastic part with the metal palladium exposed on the surface through a degumming process.

Then the plastic piece is electroplated with metal, namely the plastic piece is chemically plated with nickel, and the nickel layer is less than or equal to 1 um; performing laser etching on the complex surface of the plastic part to form an electroplating area and an non-electroplating area; performing laser etching on the large-scale simple surface of the plastic part, dividing a barrier line with the width of 0.5mm at the periphery of a required wiring area, and dividing an electroplating area and a non-electroplating area; then copper plating is carried out on the plastic part, and the copper plating process is adopted to ensure that the thickness of the copper layer is more than or equal to 8 um; then using Q/YS.601 nickel removing agent to remove nickel from the plastic part and removing the nickel layer in the non-electroplating area; and finally, performing electrotinning treatment on the surface of the plastic part to form an electrotinning layer on the copper plating layer and performing tin protection treatment to finish the surface metallization process. Through the process parameters, the bonding force of the metal layer on the surface of the plastic part can meet the preset requirement, and the coating quality is good.

According to the technical scheme, the method for enhancing the metalized adhesion force of the non-conductor surface is used for producing the antenna oscillator, and the method comprises the steps of firstly, carrying out mechanical roughening treatment on the surface of a plastic part to increase the surface roughness of the plastic part; then, carrying out chemical roughening treatment on the surface of the plastic part through an acidic substance; coating a conditioning agent on the surface of the plastic part, wherein the conditioning agent has an electric charge opposite to that of palladium water; putting the plastic part with the regulator into palladium water, and performing palladium precipitation treatment on the surface of the plastic part; and carrying out chemical plating on the plastic part to complete surface metallization of the plastic part. According to the method, after chemical roughening, the modifier is added on the surface of the plastic part, and the negative charges of the modifier generate binding force with the positive charges of the palladium water, so that the metal adhesion is improved. Therefore, the palladium water can be contacted and attached to the surface of a product more quickly and uniformly, and palladium particles can be attached to the surface of a plastic piece more uniformly and fully after the glue is removed, so that the stability of the electrical and mechanical properties is improved.

The embodiments provided in the present application are only a few examples of the general concept of the present application, and do not limit the scope of the present application. Any other embodiments extended according to the scheme of the present application without inventive efforts will be within the scope of protection of the present application for a person skilled in the art.