阅读说明：本技术 一种多层轻薄复合保温板及其制备方法 (Multilayer light and thin composite insulation board and preparation method thereof ) 是由 栾焕光 吕文东 王淦 汪涛 陈和锐 于 2018-11-01 设计创作，主要内容包括：本发明公开了一种多层轻薄复合保温板,其技术方案要点是：包括第一隔热层,所述第一隔热层的一侧依次设有第二隔热层、第三隔热层、第四隔热层,且各隔热层之间采用胶粘剂粘合,所述第一隔热层由重量百分比为陶瓷纤维15～25％、漂珠15～25％、热反射材料5～30％、无机树脂30～60％构成；所述第二隔热层由重量百分比为气凝胶25～40％、无机树脂10～20％、有机硅树脂35～55％、固化剂10～25％构成；本发明提供一种多层轻薄复合保温板,板材设置多个隔热层区间,能够满足温度区间在-60℃～1200℃区间的多个保温隔热区间需求,能够同时满足高、中、低温场所需求,板材不变形,保持环境温度变化很小,方便使用者应对多种中温度环境下隔热材料的使用。(The invention discloses a multilayer light and thin composite insulation board, which has the technical scheme that: the heat insulation structure comprises a first heat insulation layer, wherein a second heat insulation layer, a third heat insulation layer and a fourth heat insulation layer are sequentially arranged on one side of the first heat insulation layer, and are bonded by an adhesive, wherein the first heat insulation layer comprises 15-25 wt% of ceramic fibers, 15-25 wt% of floating beads, 5-30 wt% of a heat reflection material and 30-60 wt% of inorganic resin; the second heat insulation layer is composed of 25-40 wt% of aerogel, 10-20 wt% of inorganic resin, 35-55 wt% of organic silicon resin and 10-25 wt% of curing agent; the invention provides a multilayer light and thin composite insulation board, wherein a board is provided with a plurality of insulation layer intervals, the requirement of a plurality of insulation layer intervals with the temperature interval of-60-1200 ℃ can be met, the requirement of high, medium and low temperature places can be met simultaneously, the board is not deformed, the change of the environmental temperature is kept very small, and a user can conveniently use the insulation material under various medium temperature environments.)

1. The utility model provides a frivolous composite insulation board of multilayer which characterized in that: the heat insulation structure comprises a first heat insulation layer, wherein a second heat insulation layer, a third heat insulation layer and a fourth heat insulation layer are sequentially arranged on one side of the first heat insulation layer, and are bonded by an adhesive, wherein the first heat insulation layer comprises 15-25 wt% of ceramic fibers, 15-25 wt% of floating beads, 5-30 wt% of a heat reflection material and 30-60 wt% of inorganic resin; the second heat insulation layer is composed of 25-40 wt% of aerogel, 10-20 wt% of inorganic resin, 35-55 wt% of organic silicon resin and 10-25 wt% of curing agent; the third heat insulation layer is composed of 45-65 wt% of organic silicon resin, 20-35 wt% of aerogel and 15-25 wt% of heat reflection materials; the adhesive comprises a first layer of adhesive, a second layer of adhesive and a third layer of adhesive, wherein the first layer of adhesive is arranged between a first heat insulation layer and a second heat insulation layer, and the first layer of adhesive comprises 20-40% of inorganic silicate or phosphate, 20-40% of organic silicon resin, 5-20% of heat reflection material and 5-20% of floating beads in parts by weight; the fourth heat insulation layer comprises 35-55 wt% of organic silicon modified acrylic acid, 25-45 wt% of organic silicon modified epoxy resin or modified polyurethane and 5-10 wt% of aerogel; the second layer of adhesive is arranged between the second heat insulation layer and the third heat insulation layer, and the components in the second layer of adhesive comprise, by weight, 20-40% of organic silicon modified acrylic acid, 20-40% of organic silicon modified epoxy resin or modified polyurethane, 5-20% of heat reflection material and 5-20% of floating beads; the total thickness of the heat insulation board is 5-15 cm.

2. The multilayer light and thin composite insulation board according to claim 1, characterized in that: the third layer of adhesive is arranged between the third heat insulation layer and the fourth heat insulation layer, and the third layer of adhesive comprises, by weight, 20-40% of organic silicon modified acrylic acid, 20-40% of organic silicon modified epoxy resin or modified polyurethane, 5-20% of a heat reflection material, and 5-20% of floating beads.

3. The multilayer light and thin composite insulation board according to claim 1, characterized in that: the heat reflection material is one or a mixture of titanium dioxide, titanium sol and potassium hexatitanate whisker.

4. A preparation method of a multilayer light and thin composite insulation board is characterized by comprising the following steps:

1) fully mixing inorganic silicate or phosphate, organic silicon resin, a heat reflecting material and floating beads according to a proportion for 15 minutes to prepare a first layer of adhesive;

2) laying a substrate at the bottom of the prefabricated section mould, mixing and stirring ceramic fibers, floating beads, a heat reflecting material and inorganic resin for 25min, laying the mixture on the substrate at the bottom of the prefabricated section mould, and drying the mixture for 1-3H under the conditions that the thickness is 8-25 mm and the relative humidity is 45% to obtain a first heat insulation layer;

3) coating a first layer of adhesive on the first heat insulation layer, wherein the thickness of the first layer of adhesive is 3-5 mm, mixing and stirring aerogel, inorganic resin, organic silicon resin and curing agent in proportion to prepare a second heat insulation layer, coating the second heat insulation layer on the other side of the first layer of adhesive, wherein the thickness of the second heat insulation layer is 8-25 mm, and drying the second heat insulation layer for 3-8H under the condition that the relative humidity is 45%;

4) fully mixing organic silicon modified acrylic acid, organic silicon modified epoxy resin or modified polyurethane, a heat reflecting material and floating beads in a ratio for 15 minutes to prepare a second layer of adhesive, coating the second layer of adhesive on a second heat insulation layer, wherein the thickness of the second layer of adhesive is 3-5 mm, then mixing and stirring an organic silicon material, aerogel and a heat reflecting material in a ratio to prepare a third heat insulation layer, coating the third heat insulation layer on the other side of the second layer of adhesive, wherein the thickness of the third heat insulation layer is 8-25 mm, and drying is carried out for 1-3H under the condition that the relative humidity is 45%;

5) fully mixing organic silicon modified acrylic acid, organic silicon modified epoxy resin or modified polyurethane, a heat reflecting material and floating beads in a ratio for 15 minutes to prepare a third layer of adhesive, coating the third layer of adhesive on a third heat insulation layer with the thickness of 3-5 mm, mixing and stirring the organic silicon resin, the modified acrylic acid and aerogel in a ratio to prepare a fourth heat insulation layer, coating the fourth heat insulation layer on the other side of the adhesive with the thickness of 8-25 mm, and drying for 24-48H under the condition that the relative humidity is 45%;

6) and taking out the dried insulation board from the prefabricated mould to obtain the composite insulation board.

[ technical field ] A method for producing a semiconductor device

The invention belongs to the technical field of heat insulation materials, and particularly relates to a multilayer light and thin composite heat insulation board and a preparation method thereof.

[ background of the invention ]

Along with the improvement of the complexity of industrial products, higher requirements are put forward on the application of heat-insulating materials, and due to the difference of the materials, the effect of a general heat-insulating material in a specific temperature range is better, and when the temperature of the general heat-insulating material exceeds or is lower than the specific temperature range, the heat-insulating effect of the general heat-insulating material is reduced, and for a plurality of specific process applications, the material is required to have better heat-insulating effect under a high-temperature condition and also has better heat-insulating effect under a low-temperature condition, even below 0 ℃, and the existing materials generally have thick and heavy insulating layers, so that the miniaturization development of equipment or products is greatly limited in production application, and the heat-insulating and heat-insulating intervals of various materials are narrower, and the application scenes of the materials are also limited.

[ summary of the invention ]

According to the multilayer light and thin composite insulation board, the multilayer structure is arranged for heat insulation, the insulation requirements of multiple temperature intervals can be met, the thickness of the insulation board is greatly shortened, and the multilayer light and thin composite insulation board can be applied to more production scenes.

The invention further provides a preparation method of the multilayer light and thin composite insulation board.

The technical scheme of the invention is as follows:

the utility model provides a frivolous compound heated board of multilayer, includes first insulating layer, one side of first insulating layer is equipped with second insulating layer, third insulating layer, fourth insulating layer and fifth insulating layer in proper order, and adopts the gluing agent bonding between each insulating layer, first insulating layer comprises 15 ~ 25% of ceramic fibre, floats pearl 15 ~ 25%, epoxy 45 ~ 65% by weight percent. The main components of the ceramic fiber are alumina and zirconia, and the ceramic fiber has the characteristics of light weight, high temperature resistance, small heat capacity, good heat insulation performance and good high-temperature heat insulation performance and has a certain radial length; the floating bead mainly comprises silicon dioxide and aluminum oxide, has the characteristics of fine particles, hollowness, light weight, high strength, wear resistance, high temperature resistance, insulation, flame retardance and the like, can play a certain supporting role on a product structure, particularly bears a certain heat load at high temperature, enables the material to keep an original structure and not to change phase, and enables a first heat insulation layer to bear the high-temperature condition of 650-1200 ℃ after epoxy resin is added into a system as a heat curing agent.

Preferably, the second heat insulation layer is composed of 25-40 wt% of aerogel, 10-20 wt% of inorganic resin, 35-55 wt% of organic silicon resin and 10-25 wt% of curing agent. The second heat insulation layer has better heat preservation and heat insulation performance in a temperature range of 300-650 ℃.

Preferably, the third heat insulation layer is composed of, by weight, 45-65% of an organic silicon material, 20-35% of aerogel and 15-25% of a heat reflection material. The third heat insulation layer has better heat insulation performance in a temperature range of 150-300 ℃.

Preferably, the fourth heat insulation layer is composed of, by weight, 35-55% of organic silicon resin, 25-45% of modified acrylic acid and 20-35% of aerogel. The fourth heat insulation layer has better heat insulation performance in a temperature range of-20 to 150 ℃.

Preferably, the fifth heat insulation layer is formed by compounding 20-30 wt% of organic silicon resin, 15-25 wt% of engineering plastic, 20-35 wt% of heat reflection material and 30-45 wt% of expandable polystyrene beads. The second heat insulation layer is added with foaming agent expandable polystyrene beads, and has better heat insulation performance in a temperature range of minus 20 to minus 60 ℃.

Preferably, the adhesive comprises, by weight, 45-55% of polyester polyurethane, 10-12% of talcum powder, 5-15% of alumina powder, 5-12% of 1, 4-dimethylpiperazine and 6-18% of polycaprolactone diol. The adhesive used in the application is a high molecular polymer with poor flowability and excellent flame retardant effect under a high-temperature condition, and a carbon source, a phosphorus source and other combinations are fully utilized to form a stable polymer, so that each heat insulation layer is prevented from being layered or peeled off in a long-time heat insulation process.

Preferably, the total thickness of the heat insulation plate is 2-10 cm.

Preferably, the heat reflection material is one or a mixture of two of titanium dioxide and potassium hexatitanate whisker.

A preparation method of a multilayer light and thin composite insulation board comprises the following steps:

1) mixing and stirring polyester polyurethane, talcum powder, alumina powder, 1, 4-dimethyl piperazine and polycaprolactone diol in proportion for 15min to obtain an adhesive;

2) laying a substrate at the bottom of the prefabricated section mould, mixing and stirring ceramic fibers, floating beads and epoxy resin for 25min, adding a curing agent, stirring for 100min, laying the mixture on the substrate at the bottom of the prefabricated section mould, and drying for 2-6H under the conditions that the thickness is 3-12 mm and the relative humidity is 45% to obtain a first heat insulation layer;

3) coating an adhesive on the first heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the aerogel, the inorganic resin, the organic silicon resin and the curing agent in proportion, coating a second heat insulation layer on the other side of the adhesive, wherein the thickness of the second heat insulation layer is 3-8 mm, and drying the second heat insulation layer for 3-8H under the condition that the relative humidity is 45%;

4) coating an adhesive on the second heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organosilicon material, the aerogel and the heat reflection material in proportion, coating a third heat insulation layer on the other side of the adhesive, wherein the thickness of the third heat insulation layer is 3-8 mm, and the third heat insulation layer is dried for 4-8H under the condition that the relative humidity is 45%;

5) coating an adhesive on the third heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organic silicon resin, the modified acrylic acid and the aerogel according to a proportion, coating the fourth heat insulation layer on the other side of the adhesive, wherein the thickness of the fourth heat insulation layer is 3-8 mm, and drying the fourth heat insulation layer for 5-10H under the condition that the relative humidity is 45%;

6) coating an adhesive on the fourth heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organic silicon resin, the engineering plastic, the heat reflection material and the expandable polystyrene beads in proportion, coating the fifth heat insulation layer on the other side of the adhesive, wherein the thickness of the fifth heat insulation layer is 3-8 mm, and drying the fifth heat insulation layer for 6-12H under the condition that the relative humidity is 45%;

7) and taking the dried insulation board out of the prefabricated mold, and sintering for 1-3H at 1000 ℃ to obtain the composite insulation board.

Compared with the prior art, the invention has the following beneficial effects and advantages:

according to the multilayer light and thin composite insulation board, the board is provided with five insulation layer intervals, the requirements of a plurality of insulation intervals with temperature intervals ranging from minus 60 ℃ to 1200 ℃ can be met, the heat conductivity coefficient is lower than 0.2, the requirements of high, medium and low temperature places can be met simultaneously, the board is not deformed, the change of the environmental temperature is kept very small, the thickness of the board is light and thin, a user can conveniently deal with the use of insulation materials in various medium temperature environments, and the packaging scale of equipment or products is further reduced;

the preparation method of the multilayer light and thin composite insulation board is mild in process, free of material pollution and strong in market competitiveness.

[ detailed description ] embodiments

The invention is further described below with reference to specific examples 1-6:

a preparation method of a multilayer light and thin composite insulation board comprises the following steps:

1) mixing and stirring polyester polyurethane, talcum powder, alumina powder, 1, 4-dimethyl piperazine and polycaprolactone diol in proportion for 15min to obtain an adhesive;

2) laying a substrate at the bottom of the prefabricated section mould, mixing and stirring ceramic fibers, floating beads and epoxy resin for 25min, adding a curing agent, stirring for 100min, laying the mixture on the substrate at the bottom of the prefabricated section mould, and drying for 2-6H under the conditions that the thickness is 3-12 mm and the relative humidity is 45% to obtain a first heat insulation layer;

3) coating an adhesive on the first heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the aerogel, the inorganic resin, the organic silicon resin and the curing agent in proportion, coating a second heat insulation layer on the other side of the adhesive, wherein the thickness of the second heat insulation layer is 3-8 mm, and drying the second heat insulation layer for 3-8H under the condition that the relative humidity is 45%;

4) coating an adhesive on the second heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organosilicon material, the aerogel and the heat reflection material in proportion, coating a third heat insulation layer on the other side of the adhesive, wherein the thickness of the third heat insulation layer is 3-8 mm, and the third heat insulation layer is dried for 4-8H under the condition that the relative humidity is 45%;

5) coating an adhesive on the third heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organic silicon resin, the modified acrylic acid and the aerogel according to a proportion, coating the fourth heat insulation layer on the other side of the adhesive, wherein the thickness of the fourth heat insulation layer is 3-8 mm, and drying the fourth heat insulation layer for 5-10H under the condition that the relative humidity is 45%;

6) coating an adhesive on the fourth heat insulation layer, wherein the thickness of the adhesive is 0.3-1.5 mm, mixing and stirring the organic silicon resin, the engineering plastic, the heat reflection material and the expandable polystyrene beads in proportion, coating the fifth heat insulation layer on the other side of the adhesive, wherein the thickness of the fifth heat insulation layer is 3-8 mm, and drying the fifth heat insulation layer for 6-12H under the condition that the relative humidity is 45%;

7) and taking the dried insulation board out of the prefabricated mold, and sintering for 1-3H at 1000 ℃ to obtain the composite insulation board.

Table 1: examples 1 to 6 Each component ratio

Table 2: EXAMPLES 1 to 6 preparation method conditions for respective steps

Table 3: practical test data of composite insulation board obtained in embodiment 1-6

Note: the 1150 ℃ environment heat insulation and heat insulation test means that a heat source of 1150 ℃ is continuously added on one side of a heat insulation plate, the temperature difference is within plus or minus 5 ℃, the actual measurement is carried out on the other side of the heat insulation plate, and the room temperature changes;

according to the composite insulation board, the board is provided with the five insulation layer intervals, the requirements of a plurality of insulation intervals with temperature intervals ranging from minus 20 ℃ to 1200 ℃ can be met, the heat conductivity coefficient is lower than 0.2, the requirements of high, medium and low temperature places can be met simultaneously, the board is not deformed, the change of the environmental temperature is kept small, the thickness of the board is light and thin, a user can conveniently deal with the use of insulation materials in various medium temperature environments, and the packaging scale of equipment or products is further reduced.