阅读说明：本技术 一种电磁辐射防护酚醛泡沫板 (Electromagnetic radiation protection phenolic foam board ) 是由 姜晓文 张昳 史有强 周卓辉 李业华 周淳 于 2021-09-27 设计创作，主要内容包括：本发明属于建筑用材料技术领域,涉及一种电磁辐射防护酚醛泡沫板；所述的建筑用辐射防护酚醛泡沫板包括包括底层(铝箔)、胶粘剂层、酚醛泡沫板层、封孔剂层、有机导电涂层共五层。所述底层厚度0.1mm～1mm；酚醛泡沫板厚度为28mm～62mm。其中有机导电涂层涂料各个成分即环氧树脂E51、填料、三乙烯四胺、乙酸丁酯的质量分数比为100：(15～20)：(25～30)：(25～30)。本发明提供了一种建筑用酚醛泡沫板,可以有效消除手机辐射问题。(The invention belongs to the technical field of building materials, and relates to an electromagnetic radiation protection phenolic foam board; the radiation protection phenolic foam board for the building comprises five layers including a bottom layer (aluminum foil), an adhesive layer, a phenolic foam board layer, a hole sealing agent layer and an organic conductive coating. The thickness of the bottom layer is 0.1 mm-1 mm; the thickness of the phenolic foam board is 28 mm-62 mm. Wherein the mass fraction ratio of each component of the organic conductive coating paint, namely epoxy resin E51, filler, triethylene tetramine and butyl acetate, is 100: (15-20): (25-30): (25-30). The invention provides a phenolic foam board for buildings, which can effectively eliminate the problem of radiation of mobile phones.)

1. The utility model provides an electromagnetic radiation protection phenolic foam board which characterized in that: the radiation protection phenolic foam board comprises a bottom layer, an adhesive layer, a phenolic foam board layer, a hole sealing agent layer and an organic conductive coating;

the bottom layer is a metal layer with the thickness of 0.1 mm-1 mm; the thickness of the phenolic foam plate is 28-62 mm; the surface density of the hole sealing agent layer is 100-150 g/m²。

2. The electromagnetic radiation protective phenolic foam board of claim 1, wherein: the metal layer is an aluminum foil with the thickness of 0.1 mm-0.2 mm.

3. The electromagnetic radiation protective phenolic foam board of claim 1, wherein: the sealant layer comprises epoxy resin E51, a filler and a curing agent, and the mass fraction ratio is 100: (13-17): (20-30).

4. The electromagnetic radiation protective phenolic foam board of claim 1, wherein: the organic conductive coating is composed of epoxy resin E51, a filler, triethylene tetramine and butyl acetate, and the mass fraction ratio is 100: (15-20): (25-30): (25-30).

5. The electromagnetic radiation protective phenolic foam board of claim 3, wherein: the filler is one of copper powder, nickel powder and silver powder, and the size of the filler is 500-1000 meshes.

6. The electromagnetic radiation protective phenolic foam board of claim 1, wherein: the layer surface density of the adhesive is 100-150 g/m²(ii) a The adhesive is selected from one of the following: epoxy resin adhesives and phenolic resin adhesives.

7. The electromagnet of claim 1Radiation protection phenolic foam board, its characterized in that: the surface density of the organic conductive coating is 90-110 g/m²；

8. The electromagnetic radiation protective phenolic foam board of claim 1, wherein:

when the phenolic foam board is used for protecting 2G and 4G signal radiation, the thickness of the phenolic foam board is 58 mm-62 mm;

when the phenolic foam board is used for protecting 5G signal radiation, the thickness of the phenolic foam board is 28-32 mm.

9. The electromagnetic radiation protective phenolic foam board of claim 1, wherein: the preparation method comprises the following steps:

firstly, bonding a bottom layer of a phenolic foam board:

selecting a phenolic foam board, and bonding a metal layer on the bottom surface of the foam board by using an adhesive;

secondly, sealing holes of the phenolic aldehyde plate:

uniformly mixing epoxy resin E51, magnesium hydroxide and curing agent triethylene tetramine to prepare coating A, coating the coating A on the surface of a surface layer by adopting a coating process, sealing holes on the surface of phenolic foam, reacting at normal temperature for 24-48 hours, and curing the coating to complete hole sealing to form a hole sealing agent layer;

thirdly, preparing an organic conductive coating:

uniformly mixing epoxy resin E51, a filler, a curing agent triethylene tetramine and butyl acetate to prepare a conductive coating B, coating the conductive coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature to form an organic conductive coating, thereby finally obtaining the radiation protection phenolic foam board.

Technical Field

The invention belongs to the technical field of building materials, and relates to an electromagnetic radiation protection phenolic foam board.

Background

The phenolic aldehyde insulation board is regarded as a new generation of heat insulation and fire prevention material, is known as heat insulation king, has low heat conductivity coefficient, good heat insulation performance, flame retardancy, good thermal stability, no toxicity, low smoke and capability of taking account of building energy conservation and fire prevention safety.

Nowadays, more and more mobile phone signal transmitting towers (large base stations) are built, people enjoy smooth networks and are in electromagnetic environments everywhere, particularly in cities, and micro base stations are visible everywhere. In addition, the wide application of industrial electromagnetic equipment has made the problems of electromagnetic pollution and electromagnetic radiation increasingly prominent. Long-term electromagnetic radiation can have adverse effects on human health. At present, most of related patent documents at home and abroad only pay attention to the heat insulation performance and the fire resistance of the phenolic insulation board; the elimination of electromagnetic radiation is therefore an urgent problem to be solved.

Disclosure of Invention

The purpose of the invention is: the invention designs a phenolic foam board for buildings and a preparation method thereof, aiming at solving the problem of shielding electromagnetic signal radiation of a base station.

In order to solve the technical problem, the technical scheme of the invention is as follows:

a radiation protection phenolic foam board comprises a bottom layer, an adhesive layer, a phenolic foam board layer, a hole sealing agent layer and an organic conductive coating, wherein the bottom layer is a first layer;

the bottom layer is a metal layer with the thickness of 0.1 mm-1 mm; the thickness of the phenolic foam board is 28-32 mm.

The metal layer is an aluminum foil with the thickness of 0.1 mm-0.2 mm.

The surface density of the hole sealing agent layer is 100-150 g/m²。

The sealant layer comprises epoxy resin E51, a filler and a curing agent, and the mass fraction ratio is 100: (13-17): (20-30), preferably, the mass fraction ratio is 100: 15: 25.

the organic conductive coating is composed of epoxy resin E51, a filler, triethylene tetramine and butyl acetate, and the mass fraction ratio is 100: (15-20): (25-30): (25-30); preferably, the mass fraction ratio is 100: 17: 27: 28;

the filler is one of copper powder, nickel powder and silver powder, and the size of the filler is 500-1000 meshes.

The layer surface density of the adhesive is 100-150 g/m²(ii) a The adhesive is selected from one of the following: epoxy resin adhesives, phenolic resin adhesives;

the surface density of the organic conductive coating is 90-110 g/m²。

When the radiation protection phenolic foam board is used for protecting 2G and 4G signal radiation, the thickness of the phenolic foam board is 58-62 mm; when the phenolic foam board is used for protecting 5G signal radiation, the thickness of the phenolic foam board is 28-32 mm.

The preparation method of the radiation protection phenolic foam board comprises the following steps:

firstly, bonding a bottom layer of a phenolic foam board:

selecting a phenolic foam board, and bonding a metal layer on the bottom surface of the foam board by using an adhesive;

secondly, sealing holes of the phenolic aldehyde plate:

uniformly mixing epoxy resin E51, magnesium hydroxide and curing agent triethylene tetramine to prepare coating A, coating the coating A on the surface of a surface layer by adopting a coating process, sealing holes on the surface of phenolic foam, reacting at normal temperature for 24-48 hours, and curing the coating to complete hole sealing to form a hole sealing agent layer;

thirdly, preparing an organic conductive coating:

uniformly mixing epoxy resin E51, a filler, a curing agent triethylene tetramine and butyl acetate to prepare a conductive coating B, coating the conductive coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature to form an organic conductive coating, thereby finally obtaining the electromagnetic radiation protection phenolic foam board.

The invention has the beneficial effects that:

aiming at buildings and test sites needing to be protected against radiation, the electromagnetic radiation protection phenolic foam plate can effectively protect electromagnetic radiation generated by 2G-5G signals. On the other hand, the preparation process is mature, the thickness of the aluminum foil is 0.1mm, the cost is controllable, and the cost of the overall foam board is not obviously increased.

Drawings

FIG. 1 is a schematic diagram of a schematic structural layer of an electromagnetic radiation protection phenolic foam board of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the drawings and the following description, well-known structures and techniques are not shown to avoid unnecessarily obscuring the present invention.

The experimental procedures used in the following examples are all conventional procedures unless otherwise specified.

Materials, reagents and the like used in the following examples are commercially available unless otherwise specified.

"wt%" in the following examples represents a mass percentage.

The density of the phenolic foam used in the following examples is 40 to 70Kg/m²。

The method of testing the phenolic foam boards prepared in the following examples was as follows:

1. plate thickness: the test was performed with a vernier caliper.

Surface density: measurements were made with a micrometer with an accuracy of 0.01mm at 9 measurement positions (three rows, upper, middle and lower, 3 evenly spaced measurement points per row) no less than 1cm from the edge of the template (recommended dimensions 180mm x 180 mm). Firstly, measuring the thickness of a flat plate of an unpainted substrate, then preparing a coating on the flat plate, measuring the thickness of each corresponding point of the sample plate after the coating is cured, and taking the difference between the thickness of each point and the thickness of the coating. And taking the arithmetic average value of the thicknesses of all points as the average thickness value of the coating.

2. The signal reflectances at 900MHz (analog 2G signal), 1800MHz (analog 3G, 4G signal), 3500MHz (analog 5G signal), and 4800MHz (analog 5G signal) were measured by a vector network analyzer.

Example 1:

firstly, bonding a bottom layer of a phenolic foam board:

a commercially available phenolic foam board was selected and had a thickness of 5.8 cm. Adhering a layer of aluminum foil with the thickness of 0.1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 100g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48 hours to cure the coating, thereby completing hole sealing; wherein the surface density of the coating after the coating A is cured is 100g/m²；

Thirdly, preparing an organic conductive coating:

epoxy resin E51, copper powder with the size of 500 meshes, diethylenetriamine and butyl acetate are mixed according to the mass ratio of 100: 15: 25: 25 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 90g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 2:

firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6.2 cm. Adhering a layer of aluminum foil with the thickness of 1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 150g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48 hours to cure the coating, thereby completing hole sealing; wherein the surface density of the coating after the coating A is cured is 150g/m²；

Thirdly, preparing an organic conductive coating:

mixing epoxy resin E51, silver powder with the size of 1000 meshes, diethylenetriamine and butyl acetate according to the mass ratio of 100: 20: 30: 30 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 110g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 3:

firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6 cm. Adhering a layer of aluminum foil with the thickness of 0.5mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 120g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48 hours to cure the coating, thereby completing hole sealing; wherein the surface density of the coating after the coating A is cured is 120g/m²；

Thirdly, preparing an organic conductive coating:

epoxy resin E51, copper powder with the size of 800 meshes, diethylenetriamine and butyl acetate are mixed according to the mass ratio of 100: 18: 27: 27 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 100g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 4:

firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6 cm. Adhering a layer of aluminum foil with the thickness of 0.1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 120g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating A is applied to the surface of the surface layer by a coating process and is usually carried outReacting for 48 hours at the temperature, and curing the coating to finish hole sealing; wherein the surface density of the coating after the coating A is cured is 120g/m²；

Thirdly, preparing an organic conductive coating:

mixing epoxy resin E51, nickel powder with the size of 500 meshes, diethylenetriamine and butyl acetate according to the mass ratio of 100: 18: 27: 27 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 100g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 5:

firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6 cm. Adhering a layer of aluminum foil with the thickness of 0.1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 120g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48 hours to cure the coating, thereby completing hole sealing; wherein the surface density of the coating after the coating A is cured is 120g/m²；

Thirdly, preparing an organic conductive coating:

epoxy resin E51, copper powder with the size of 1000 meshes, diethylenetriamine and butyl acetate are mixed according to the mass ratio of 100: 15: 30: 30 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 100g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 6:

firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6 cm. Adhering a layer of aluminum foil with the thickness of 0.1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the adhesive layer isThe surface density is 120g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48 hours to cure the coating, thereby completing hole sealing; wherein the surface density of the coating after the coating A is cured is 120g/m²；

Thirdly, preparing an organic conductive coating:

mixing epoxy resin E51, nickel powder with the size of 1000 meshes, diethylenetriamine and butyl acetate according to the mass ratio of 100: 20: 25: 25 to prepare a coating B, coating the coating B on the surface after hole sealing by adopting a coating process, and reacting for 48 hours at normal temperature, wherein the surface density of the coating after the coating B is cured is 100g/m²Obtaining the radiation protection phenolic foam board for the building; the obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 7:

a commercially available phenolic foam board was selected and had a thickness of 3 cm. The other layers were identical to example 6. The obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Example 8:

a commercially available phenolic foam board was selected and had a thickness of 2.2 cm. The other layers were identical to example 6. The obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Comparative example 1: pure phenolic foam board

A commercial phenolic foam board was selected and had a thickness of 6 cm. The phenolic foam boards were subjected to electromagnetic protection performance tests and the results are shown in table 1.

Comparative example 2: phenolic foam board with hole sealed on surface

A commercial phenolic foam board was selected and had a thickness of 6 cm. Coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48h for curing the coating to complete hole sealing to obtain the phenolic foam board with the sealed hole on the surface; wherein the surface density of the coating after the coating A is cured is 120g/m²(ii) a The obtained phenolic foam board with the surface sealed with holes is subjected to an electromagnetic protection performance test, and the result is shown in table 1.

Comparative example 3: phenolic foam board with bottom layer aluminum foil

Firstly, bonding a bottom layer of a phenolic foam board:

a commercial phenolic foam board was selected and had a thickness of 6 cm. Adhering a layer of aluminum foil with the thickness of 0.1mm on the bottom surface of the foam board by using an epoxy resin adhesive, wherein the layer surface density of the adhesive is 150g/m²。

Secondly, sealing holes of the phenolic aldehyde plate:

coating the coating A on the surface of the surface layer by adopting a coating process, and reacting at normal temperature for 48h for curing the coating to complete hole sealing to obtain the phenolic foam board with the bottom layer aluminum foil; wherein the surface density of the coating after the coating A is cured is 120g/m². The obtained phenolic foam board with the bottom layer aluminum foil is subjected to electromagnetic protection performance test, and the result is shown in table 1.

Comparative example 4: phenolic foam board with hole sealed on surface

A commercially available phenolic foam board was selected and had a thickness of 3 cm. The other layers were identical to comparative example 2. The obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

Comparative example 5: phenolic foam board with bottom layer aluminum foil

A commercially available phenolic foam board was selected and had a thickness of 2.2 cm. The other layers were identical to comparative example 3. The obtained phenolic foam board was subjected to electromagnetic protection performance test, and the results are shown in table 1.

TABLE 1 numerical index of phenolic foam prepared according to the examples of the invention and comparative examples

It can be seen that the electromagnetic radiation protection phenolic foam board can effectively protect electromagnetic radiation generated by 2G-5G signals.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present invention, and these modifications or substitutions should be covered within the scope of the present invention.