阅读说明：本技术 一种半导体器件测量装置 (Semiconductor device measuring device ) 是由 翟丹 于 2021-10-21 设计创作，主要内容包括：本发明提供了一种半导体器件测量装置,属于半导体器件测量技术领域,包括支撑部、第一驱动部、第二驱动部、检测部、盛放部以及卸料部,所述盛放部转动设置在所述支撑部一侧,用于对半导体器件提供支撑,所述第一驱动部设置在所述支撑部一侧,用于带动所述盛放部转动,所述检测部设置在所述盛放部远离所述支撑部的一侧,用于对半导体器件的厚度进行测量,所述卸料部安装在所述盛放部内部,所述第二驱动部设置在所述支撑部内侧,第二驱动部用于带动所述卸料部移动,以将测量后的半导体器件自所述盛放部边缘顶出。本发明实施例相较于现有技术,能够实现多个半导体器件的连续测量,具有测量效率高的优点。(The invention provides a semiconductor device measuring device, which belongs to the technical field of semiconductor device measurement and comprises a supporting part, a first driving part, a second driving part, a detecting part, a containing part and a discharging part, wherein the containing part is rotatably arranged on one side of the supporting part and used for supporting a semiconductor device, the first driving part is arranged on one side of the supporting part and used for driving the containing part to rotate, the detecting part is arranged on one side, far away from the supporting part, of the containing part and used for measuring the thickness of the semiconductor device, the discharging part is arranged in the containing part, the second driving part is arranged on the inner side of the supporting part and used for driving the discharging part to move so as to push the measured semiconductor device out of the edge of the containing part. Compared with the prior art, the embodiment of the invention can realize continuous measurement of a plurality of semiconductor devices and has the advantage of high measurement efficiency.)

1. A semiconductor device measuring apparatus is characterized by comprising a supporting part, a first driving part, a second driving part, a detecting part, a containing part and a discharging part,

the containing part is rotatably arranged on one side of the supporting part and is used for providing support for the semiconductor device,

the first driving part is arranged on one side of the supporting part and is used for driving the containing part to rotate,

the detection part is arranged on one side of the containing part far away from the supporting part and is used for measuring the thickness of the semiconductor device,

the discharging part is arranged in the containing part, the second driving part is arranged on the inner side of the supporting part and used for driving the discharging part to move so as to eject the measured semiconductor device from the edge of the containing part.

2. The semiconductor device measuring apparatus according to claim 1, wherein the detecting section includes a support cylinder, a probe, a displacement sensor, a controller, and a display,

the probe is matched at one end of the supporting cylinder in a telescopic way, one end of the probe far away from the supporting cylinder is abutted against one side of the containing part,

the displacement sensor is arranged in the supporting cylinder and electrically connected with the controller, the displacement sensor is used for detecting displacement data of the probe and transmitting the displacement data to the controller, the controller is electrically connected with the display, and the controller can transmit the displacement data to the display for numerical value display.

3. A semiconductor device measuring apparatus according to claim 2, wherein a first elastic member for supporting the probe is further provided inside the supporting cylinder.

4. The semiconductor device measuring apparatus according to claim 2, wherein a supporting pillar is fixedly disposed at one side of the containing portion, one end of the supporting pillar, which is far away from the containing portion, is rotatably connected to the supporting portion, a transmission gear is fixedly disposed on the supporting pillar,

the first driving part comprises a motor fixedly arranged on one side of the supporting part and a driving gear connected with the output end of the motor through a rotating shaft, and the driving gear is meshed with the transmission gear.

5. The semiconductor device measuring apparatus according to claim 4, wherein a plurality of second engaging grooves are formed at an edge of one side of the containing portion, the size of the second engaging grooves is matched with that of the semiconductor device, and the depth of the second engaging grooves is smaller than the thickness of the semiconductor device.

6. The semiconductor device measuring apparatus as claimed in claim 5, wherein a plurality of guide blocks are further disposed on one side of the containing portion, the guide blocks are correspondingly disposed on one side of the second slot, and a slope is disposed on one side of the guide blocks away from the containing portion.

7. The semiconductor device measuring apparatus as claimed in claim 6, wherein a ball is movably embedded in an end of the probe away from the supporting cylinder.

8. The semiconductor device measuring apparatus as claimed in claim 5, wherein a plurality of first slots are formed on the other side edge of the containing portion and are correspondingly communicated with the second slots,

the discharging part comprises a push plate and a push rod, the push plate is movably arranged in the first clamping groove, an inner cavity is arranged in the containing part, one end of the push rod is fixedly connected with the push plate, the other end of the push rod extends into the inner cavity and is in telescopic fit with the containing part,

the second driving portion comprises a fan and a pipeline, the fan is arranged inside the supporting column, one end of the pipeline is communicated with the inner cavity, and the other end of the pipeline extends to the inside of the supporting column and is communicated to the output end of the fan.

9. The semiconductor device measuring apparatus according to claim 8, wherein a second elastic member for supporting the push rod is further disposed inside the inner cavity, an exhaust pipe is connected to a side wall of the pipe, a first electromagnetic valve is disposed on the pipe, a second electromagnetic valve is disposed on the exhaust pipe, and both the first electromagnetic valve and the second electromagnetic valve are electrically connected to the controller.

Technical Field

The invention belongs to the technical field of semiconductor device measurement, and particularly relates to a semiconductor device measuring device.

Background

At present, after the semiconductor device is assembled, the semiconductor device needs to be measured, including thickness measurement, so as to prevent the semiconductor device with the thickness not reaching the standard from flowing into the market, and further influence the production quality of the semiconductor device.

In the prior art, when the thickness of a semiconductor device is measured, most of the thickness of the semiconductor device is measured by means of corresponding sensor elements, when a large quantity of semiconductor devices are measured, the semiconductor devices are often required to be manually arranged on one side of a sensor in sequence, the measurement mode is more traditional, the defect of low measurement efficiency exists, and improvement is needed urgently.

Disclosure of Invention

In view of the above-mentioned deficiencies of the prior art, an embodiment of the present invention provides a semiconductor device measuring apparatus.

In order to solve the technical problems, the invention provides the following technical scheme:

a semiconductor device measuring apparatus comprises a supporting portion, a first driving portion, a second driving portion, a detecting portion, a containing portion and a discharging portion,

the containing part is rotatably arranged on one side of the supporting part and is used for providing support for the semiconductor device,

the first driving part is arranged on one side of the supporting part and is used for driving the containing part to rotate,

the detection part is arranged on one side of the containing part far away from the supporting part and is used for measuring the thickness of the semiconductor device,

the discharging part is arranged in the containing part, the second driving part is arranged on the inner side of the supporting part and used for driving the discharging part to move so as to eject the measured semiconductor device from the edge of the containing part.

As a further improvement of the invention: the detection part comprises a supporting cylinder, a probe, a displacement sensor, a controller and a display,

the probe is matched at one end of the supporting cylinder in a telescopic way, one end of the probe far away from the supporting cylinder is abutted against one side of the containing part,

the displacement sensor is arranged in the supporting cylinder and electrically connected with the controller, the displacement sensor is used for detecting displacement data of the probe and transmitting the displacement data to the controller, the controller is electrically connected with the display, and the controller can transmit the displacement data to the display for numerical value display.

As a further improvement of the invention: the supporting cylinder is internally provided with a first elastic piece for supporting the probe.

As a still further improvement of the invention: a supporting column is fixedly arranged on one side of the containing part, one end of the supporting column, which is far away from the containing part, is rotatably connected with the supporting part, a transmission gear is fixedly arranged on the supporting column,

the first driving part comprises a motor fixedly arranged on one side of the supporting part and a driving gear connected with the output end of the motor through a rotating shaft, and the driving gear is meshed with the transmission gear.

As a still further improvement of the invention: a plurality of second clamping grooves are formed in the edge of one side of the containing portion, the size of each second clamping groove is matched with that of the semiconductor device, and the depth of each second clamping groove is smaller than the thickness of the semiconductor device.

As a still further improvement of the invention: a plurality of guide blocks are further arranged on one side of the containing portion and are correspondingly arranged on one side of the second clamping groove, and a slope is arranged on one side, far away from the containing portion, of each guide block.

As a still further improvement of the invention: and a ball is movably embedded in one end of the probe, which is far away from the supporting cylinder.

As a still further improvement of the invention: a plurality of first clamping grooves which are correspondingly communicated with the second clamping grooves are arranged on the other side edge of the containing part,

the discharging part comprises a push plate and a push rod, the push plate is movably arranged in the first clamping groove, an inner cavity is arranged in the containing part, one end of the push rod is fixedly connected with the push plate, the other end of the push rod extends into the inner cavity and is in telescopic fit with the containing part,

the second driving portion comprises a fan and a pipeline, the fan is arranged inside the supporting column, one end of the pipeline is communicated with the inner cavity, and the other end of the pipeline extends to the inside of the supporting column and is communicated to the output end of the fan.

As a still further improvement of the invention: the inner cavity is internally provided with a second elastic part used for supporting the push rod, the side wall of the pipeline is connected with an exhaust pipe, the pipeline is provided with a first electromagnetic valve, the exhaust pipe is provided with a second electromagnetic valve, and the first electromagnetic valve and the second electromagnetic valve are both electrically connected with the controller.

Compared with the prior art, the invention has the beneficial effects that:

in the embodiment of the invention, during measurement, a plurality of semiconductor devices can be arranged on one side of the containing part, the containing part is driven to rotate by the first driving part, the containing part can drive the semiconductor devices on one side of the containing part to rotate when rotating, so that the semiconductor devices can move from the first side of the detecting part, the thickness of the semiconductor devices is measured by the detecting part, and after the semiconductor devices are measured, the discharging part can be driven by the second driving part to move so as to eject the semiconductor devices from the edge of the containing part.

Drawings

FIG. 1 is a schematic structural view of a semiconductor device measuring apparatus;

FIG. 2 is a schematic view showing a structure of a housing part in a semiconductor device measuring apparatus;

FIG. 3 is an enlarged view of area A of FIG. 1;

in the figure: the device comprises a support part 1, a support column 11, a transmission gear 12, a first drive part 2, a motor 21, a rotating shaft 22, a drive gear 23, a second drive part 3, a fan 31, a pipeline 32, a detection part 4, a probe 41, a support cylinder 42, a first elastic part 43, a displacement sensor 44, a ball 45, a holding part 5, a first clamping groove 51, a second clamping groove 52, a guide block 53, a discharge part 6, a push rod 61, a push plate 62 and a second elastic part 63.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1, the present embodiment provides a semiconductor device measuring apparatus, including a supporting portion 1, a first driving portion 2, a second driving portion 3, a detecting portion 4, a containing portion 5, and a discharging portion 6, where the containing portion 5 is rotatably disposed on one side of the supporting portion 1 to support a semiconductor device, the first driving portion 2 is disposed on one side of the supporting portion 1 to drive the containing portion 5 to rotate, the detecting portion 4 is disposed on one side of the containing portion 5 away from the supporting portion 1 to measure a thickness of the semiconductor device, the discharging portion 6 is mounted inside the containing portion 5, the second driving portion 3 is disposed inside the supporting portion 1, and the second driving portion 3 is configured to drive the discharging portion 6 to move so as to eject the measured semiconductor device from an edge of the containing portion 5.

During the measurement, can place a plurality of semiconductor device in and hold 5 one sides of portion, drive through first drive division 2 and hold 5 rotations of portion, hold 5 and can drive a plurality of semiconductor device rotations of its one side when rotating of portion for a plurality of semiconductor device are moved by 4 sides of detection portion, utilize detection portion 4 to measure the thickness of a plurality of semiconductor device, measure at semiconductor device and finish the back, second drive division 3 can drive portion of unloading 6 and remove, in order to ejecting semiconductor device from holding 5 edges of portion.

Referring to fig. 1, in an embodiment, the detecting portion 4 includes a supporting cylinder 42, a probe 41, a displacement sensor 44, a controller and a display, the probe 41 is telescopically fitted at one end of the supporting cylinder 42, one end of the probe 41 away from the supporting cylinder 42 abuts against one side of the containing portion 5, the displacement sensor 44 is disposed inside the supporting cylinder 42 and electrically connected to the controller, the displacement sensor 44 is configured to detect displacement data of the probe 41 and transmit the displacement data to the controller, the controller is electrically connected to the display, and the controller can transmit the displacement data to the display for displaying a numerical value.

During actual installation, support cylinder 42 accessible support isotructure is fixed in the portion of holding 5 one side of keeping away from supporting part 1, when holding 5 rotation, probe 41 can slide along portion of holding 5 one side, and the displacement volume of probe 41 is zero this moment, and when probe 41 can be excessive to semiconductor device by holding 5 one side, probe 41 carries out the displacement this moment in comparison with support cylinder 42, utilizes displacement sensor 44 to detect this displacement volume to reflect current semiconductor device's thickness.

Referring to fig. 1, in an embodiment, the supporting cylinder 42 is further provided with a first elastic member 43 for supporting the probe 41, and the first elastic member 43 provides an elastic supporting force for the probe 41 to drive the probe 41 to be tightly attached to the containing portion 5 and the semiconductor device, so as to improve the detection accuracy.

In another embodiment, the detecting unit 4 may further include a laser distance measuring sensor disposed at one side of the containing unit 5 and facing the containing unit 5, wherein when the containing unit 5 rotates, the laser distance measuring sensor measures a distance between the surface of one side of the containing unit 5, which is denoted as L1, and when the containing unit 5 drives a group of semiconductor devices to move to one side of the laser distance measuring sensor, the laser distance measuring sensor measures a distance between the surface of one side of the semiconductor devices, which is denoted as L2, and the current thickness value of the semiconductor devices can be obtained by using L1-L2.

Referring to fig. 1, in an embodiment, a supporting column 11 is fixedly disposed on one side of the containing portion 5, one end of the supporting column 11, which is far away from the containing portion 5, is rotatably connected to the supporting portion 1, a transmission gear 12 is fixedly disposed on the supporting column 11, the first driving portion 2 includes a motor 21 fixedly disposed on one side of the supporting portion, and a driving gear 23 connected to an output end of the motor 21 through a rotating shaft 22, and the driving gear 23 is engaged with the transmission gear 12.

Drive pivot 22 through motor 21 and rotate, and then drive gear 23 and rotate, utilize the meshing effect between drive gear 23 and the drive gear 12 to drive support column 11 and rotate, and then drive and hold portion 5 and rotate to shift different semiconductor device to detection portion 4 one side, realize semiconductor device's continuous detection.

In another embodiment, the first driving part 2 may further include a driving motor fixedly disposed at one side of the supporting part 1, a driving pulley connected to an output end of the driving motor, and a driven pulley fixedly disposed on the supporting pillar 11, and the driving pulley and the driven pulley are connected by a driving belt.

Drive driving pulley through driving motor and rotate, utilize the transmission of drive belt to drive driven pulley and rotate, and then drive support column 11 and hold portion 5 and rotate.

Referring to fig. 1 and 2, in one embodiment, a plurality of second slots 52 are formed on an edge of one side of the accommodating portion 5, the size of the second slots 52 matches with that of the semiconductor device, and the depth of the second slots 52 is smaller than the thickness of the semiconductor device.

Through the setting of second draw-in groove 52, so that hold semiconductor device, make the drive semiconductor device that can be smooth when holding portion 5 and rotate, guarantee that probe 41 can be smooth slide to semiconductor device one side by holding portion 5 one side, realize the detection of semiconductor device thickness, it should be noted that, because second draw-in groove 52 exists, probe 41 is by holding when portion 5 one side is excessive to semiconductor device one side, its displacement volume no longer reflects semiconductor device's thickness, need on the basis of displacement volume with the degree of depth of second draw-in groove 52 can reflect semiconductor device's true thickness.

Referring to fig. 2, in an embodiment, a plurality of guide blocks 53 are further disposed on one side of the containing portion 5, the guide blocks 53 are correspondingly disposed on one side of the second engaging groove 52, and a slope is disposed on one side of the guide blocks 53 away from the containing portion 5.

Through the setting of guide block 53 and domatic for probe 41 can be by holding smooth transition of portion 5 one side to semiconductor device one side, and then guarantee the emergence displacement that probe 41 can be smooth.

Referring to fig. 3, in an embodiment, a ball 45 is movably embedded in an end of the probe 41 away from the supporting cylinder 42, and friction between the probe 41 and the containing part 5 and between the probe and the semiconductor device can be reduced by the ball 45, so as to prevent abrasion among the probe 41, the containing part 5 and the semiconductor device, thereby improving measurement accuracy.

Referring to fig. 1 and 2, in an embodiment, a plurality of first clamping grooves 51 correspondingly communicated with the second clamping grooves 52 are formed in the edge of the other side of the containing portion 5, the discharging portion 6 includes a push plate 62 and a push rod 61, the push plate 62 is movably disposed inside the first clamping grooves 51, an inner cavity is formed inside the containing portion 5, one end of the push rod 61 is fixedly connected with the push plate 62, the other end of the push rod 61 extends into the inner cavity and is in telescopic fit with the containing portion 5, the second driving portion 3 includes a fan 31 and a pipeline 32, the fan 31 is disposed inside the supporting column 11, one end of the pipeline 32 is communicated with the inner cavity, and the other end of the pipeline 32 extends into the supporting column 11 and is communicated with an output end of the fan 31.

Carry the air in to pipeline 32 through fan 31, the air gets into and then promotes push rod 61 and removes to the inner chamber outside in the inner chamber to drive push pedal 62 along the inside removal of first draw-in groove 51, push pedal 62 removes to can promote the semiconductor device who is located second draw-in groove 52 inside, with ejecting from holding portion 5 edge with semiconductor device, realize semiconductor device's unloading.

Referring to fig. 1, in an embodiment, a second elastic member 63 for supporting the push rod 61 is further disposed inside the inner cavity, an exhaust pipe is connected to a side wall of the pipeline 32, a first electromagnetic valve is disposed on the pipeline 32, a second electromagnetic valve is disposed on the exhaust pipe, and both the first electromagnetic valve and the second electromagnetic valve are electrically connected to the controller.

After the current semiconductor device is detected by the thickness of the detection part 4, the controller can control the first electromagnetic valve to be opened, the second electromagnetic valve is closed, the air output by the fan 31 can enter the inner cavity through the pipeline 32 at the moment, so as to drive the push rod 61 and the push plate 62 to move, so as to push the semiconductor device out from the edge of the containing part 5, then the controller controls the first electromagnetic valve to be closed, the second electromagnetic valve is opened, the air in the inner cavity can be discharged through the exhaust pipe, the push rod 61 can be pulled by the second elastic part 63, so that the push rod 61 moves towards the inner cavity, so as to drive the push plate 62 to move reversely, so as to realize the resetting of the push plate 62, and further facilitate the next pushing of the semiconductor device.

In another embodiment, the discharging unit 6 may further include a top plate hinged inside the first engaging groove 51, and the second driving unit 3 may further include a cylinder disposed inside the first engaging groove 51, wherein an output end of the cylinder is connected to the top plate, and the cylinder is electrically connected to the controller.

One end of the top plate is controlled to be turned upwards through the controller so as to drive the semiconductor device positioned in the second clamping groove 52 to be turned over, and the semiconductor device is turned out from the edge of the containing part 5.

In one embodiment, the first elastic element 43 and the second elastic element 63 are springs or elastic sheets, which are not limited herein.

In one embodiment, the containing part 5 is a circular plate-shaped structure or a disc-shaped ring-shaped structure, and the supporting part 1 is a supporting base or a supporting table, which is not limited herein.

In the above embodiment, the controller is of a model of V-ST10 or STM32F103ZGT6, the first solenoid valve and the second solenoid valve are ZCK series air solenoid valves, the displacement sensor is of a model of NS-WY01, the laser distance measuring sensor is of a model of VL53L0, and the display is of a model of LCD12864, which are commercially available and can be purchased by a person skilled in the art as required.

In the embodiment of the invention, during measurement, a plurality of semiconductor devices can be placed on one side of the containing part 5, the containing part 5 is driven to rotate by the first driving part 2, the containing part 5 can drive the semiconductor devices on one side to rotate when rotating, so that the semiconductor devices can move from the side of the detecting part 4, the thickness of the semiconductor devices is measured by the detecting part 4, and after the semiconductor devices are measured, the second driving part 3 can drive the unloading part 6 to move so as to eject the semiconductor devices from the edge of the containing part 5.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.