阅读说明：本技术 相位板、摄像头模组及电子设备 (Phase plate, camera module and electronic equipment ) 是由 谭耀成 韦怡 陈嘉伟 张海裕 高玉婵 吴青峻 李响 于 2021-08-13 设计创作，主要内容包括：本申请涉及一种相位板、摄像头模组及电子设备,该相位板包括透明基底,以及位于透明基底一侧的相位层,相位层包括设置于透明基底表面的微结构层,以及位于微结构层远离透明基底一侧的减反膜。其中,相位层满足相位分布函数。利用相位板的微结构层来对光线进行相位调制,可以增大微距拍摄时的景深。但是,却因为在透镜前增加了相位板,降低了光线的透过率。为了提高光线的透过率,在透明基底的一侧设置相位层,相位层包括设置于透明基底表面的微结构层,以及位于微结构层远离透明基底一侧的减反膜,就可以一方面通过微结构层来对光线进行相位调制,可以增大微距拍摄时的景深,另一方面通过减反膜来提高光线的透过率,提高所拍摄出的图像的清晰度。(The application relates to a phase plate, camera module and electronic equipment, this phase plate includes transparent basement to and be located the phase place layer of transparent basement one side, the phase place layer is including setting up in the micro-structure layer on transparent basement surface, and be located the anti-reflection coating that transparent basement one side was kept away from to the micro-structure layer. Wherein the phase layer satisfies the phase distribution function. The microstructure layer of the phase plate is used for carrying out phase modulation on light, so that the depth of field during macro shooting can be increased. However, the transmittance of light is reduced by adding a phase plate in front of the lens. In order to improve the transmittance of light, a phase layer is arranged on one side of the transparent substrate and comprises a microstructure layer arranged on the surface of the transparent substrate and an antireflection film positioned on one side of the microstructure layer away from the transparent substrate, so that on one hand, the light can be subjected to phase modulation through the microstructure layer, the depth of field during macro photography can be increased, on the other hand, the transmittance of the light is improved through the antireflection film, and the definition of a photographed image is improved.)

1. The phase plate is characterized by comprising a transparent substrate and a phase layer positioned on one side of the transparent substrate, wherein the phase layer comprises a microstructure layer arranged on the surface of the transparent substrate and an antireflection film positioned on one side, far away from the transparent substrate, of the microstructure layer;

the phase distribution function of the phase layer is: z ═ a (x)³+y³)；

Wherein a is the surface type coefficient of the phase layer; x, y are cartesian coordinates of the phase layer, respectively, and z is a thickness of the phase layer in the optical axis direction at a position of coordinate (x, y).

2. The phase plate of claim 1, wherein the microstructure layer has a thickness h in the direction of the optical axis₁The calculation formula of (2) is as follows: h is₁＝z–d；

Wherein z is a thickness of the phase layer in the optical axis direction at a position of coordinates (x, y); d is the equivalent height of the antireflection film;

the calculation formula of the equivalent height d of the antireflection film is as follows:

wherein λ is_{Reference to}For presetting the reference wavelength of visible light, n (lambda)_{Reference to}) Refractive index of the phase plate to the preset visible light, n₀(λ_{Reference to}) The refractive index of the environment medium to the preset visible light is set;for adding phase to the antireflective film, the antireflective film comprises multiple thin, n layers deposited sequentially on the microstructure layer_iIs the refractive index of the ith film in the antireflection film to the preset visible light, /)_iThe thickness of the ith film in the antireflection film is 1, 2, … … k.

3. The phase plate of claim 2, wherein the thickness h1 of the microstructure layer along the optical axis is in the range of 2 μm ≦ h₁≤20μm。

4. The phase plate of claim 2, wherein the thickness h2 of the anti-reflection film along the optical axis is in the range of 0.1 μm ≦ h₂≤1μm。

5. A phase plate according to claim 2, wherein the thickness h3 of the transparent substrate in the direction of the optical axis is in the range 0.15mm ≦ h₃≤1.5mm。

6. The phase plate of claim 1, wherein the transparent substrate is glass or resin.

7. The phase plate of claim 1, wherein a side of the transparent substrate facing away from the microstructure layer is planar, spherical or aspherical.

8. The phase plate as claimed in claim 1, wherein the transparent substrate has a transmittance of less than 0.5% in the wavelength range of 725-1100nm, and an infrared cut-off filter is coated on the side of the transparent substrate away from the microstructure layer; or a near-infrared absorption pigment layer is coated on one side of the transparent substrate, which is far away from the microstructure layer, and an infrared cut-off filter film is coated on one side of the near-infrared absorption pigment layer, which is far away from the microstructure layer; or the phase plate also comprises an infrared cut-off filter attached to one side of the transparent substrate far away from the microstructure layer.

9. The utility model provides a camera module which characterized in that includes:

a phase plate of any of claims 1 to 8;

a photosensitive element;

an optical lens located on an object side of the photosensitive element, the optical lens at least including, from the object side to an image side along an optical axis:

a first lens element with positive refractive power, a second lens element with negative refractive power, a third lens element with positive refractive power, and a fourth lens element with negative refractive power;

the optical lens satisfies the following conditional expression:

0.15mm^-1≤|tan(HFOV)|/TTL≤0.35mm^-1，-40≤f₂/f≤-10；

wherein tan (HFOV) is a tangent value of a half of a maximum field angle of the optical lens, TTL is a distance on an optical axis from an object side surface of an optical element which is closest to the object side and has refractive power to an image plane of the optical lens, and f₂Is the effective focal length of the second lens, and f is the effective focal length of the optical lens.

10. The camera module according to claim 9, wherein the optical lens satisfies the following conditional expression:

1.0<f₁/f≤2.0；

wherein f1 is the effective focal length of the first lens, and f is the effective focal length of the optical lens.

11. An electronic device, characterized by comprising the camera module of any one of claims 9 to 10.

Technical Field

The present application relates to the field of optical technologies, and in particular, to a phase plate, a camera module, and an electronic apparatus.

Background

With the increasing requirements of consumers on the photographing function of electronic devices such as mobile phones, tablet computers and smart watches, electronic devices equipped with macro lenses are on the market.

A conventional macro lens generally employs a plurality of refractive lenses, so that the magnification of the lens can be improved by the refractive lenses, so that an electronic device can capture an image with high magnification through the macro lens. However, when taking a picture using a macro lens, the depth of field of the macro lens is becoming smaller as the imaging magnification is increased. The depth of field refers to the depth of the scene image within a clear range.

Because the depth of field of the macro lens is smaller, the depth clear range of the scenery image is smaller when the macro lens is adopted for shooting. Therefore, only a subject falling within a small depth of field can be clearly photographed when photographing using the macro lens, resulting in a large part of the subject in the photographed image being unclear. Thus, it is difficult to capture an overall clearer image.

Disclosure of Invention

The embodiment of the application provides a phase plate, a camera module and electronic equipment, can improve the definition of the image of shooing.

In one aspect, the present application provides a phase plate, including a transparent substrate, and a phase layer located on one side of the transparent substrate, where the phase layer includes a microstructure layer disposed on a surface of the transparent substrate, and an antireflection film located on one side of the microstructure layer away from the transparent substrate;

the phase distribution function of the phase layer is: z ═ a (x)³+y³)；

Wherein a is the surface type coefficient of the phase layer; x, y are cartesian coordinates of the phase layer, respectively, and z is a thickness of the phase layer in the optical axis direction at a position of coordinate (x, y).

On the other hand, this application provides a camera module, includes:

the phase plate as described above;

a photosensitive element;

an optical lens located on an object side of the photosensitive element, the optical lens at least including, from the object side to an image side along an optical axis:

a first lens element with positive refractive power, a second lens element with negative refractive power, a third lens element with positive refractive power, a fourth lens element with negative refractive power;

the optical lens satisfies the following conditional expression:

0.15mm^-1≤|tan(HFOV)|/TTL≤0.35mm^-1，-40≤f₂/f≤-10；

wherein tan (HFOV) is a tangent value of a half of a maximum field angle of the optical lens, TTL is a distance on an optical axis from an object side surface of an optical element which is closest to the object side and has refractive power to an image plane of the optical lens, and f₂Is the effective focal length of the second lens, and f is the effective focal length of the optical lens.

In another aspect, the present application provides an electronic device, which includes the camera module as described above.

The application discloses phase place board, camera module and electronic equipment, this phase place board include transparent basement to and be located the phase place layer of transparent basement one side, the phase place layer is including setting up in the micro-structure layer on transparent basement surface, and is located the anti-reflection film that transparent basement one side was kept away from to the micro-structure layer. Wherein the phase layer satisfies the phase distribution function. The microstructure layer of the phase plate is used for carrying out phase modulation on light, so that the depth of field during macro shooting can be increased. However, the transmittance of light is reduced by adding a phase plate in front of the lens. In order to improve the transmittance of light, a phase layer is arranged on one side of the transparent substrate, and comprises a microstructure layer arranged on the surface of the transparent substrate and an antireflection film positioned on one side of the microstructure layer away from the transparent substrate, so that on one hand, the phase of the light can be modulated through the microstructure layer, the depth of field during macro photography can be increased, and on the other hand, the transmittance of the light can be improved through the antireflection film. Eventually, the sharpness of the captured image is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment;

fig. 2 is a schematic structural diagram of a camera module of an electronic device according to an embodiment;

FIG. 3 is a schematic diagram of a phase plate of a conventional camera module;

fig. 4 is a schematic structural diagram of a phase plate of a camera module in an electronic apparatus according to an embodiment;

FIG. 5 is a reflection spectrum of the anti-reflection film in one specific example;

FIG. 6 is a reflection spectrum of a reflection reducing film according to another embodiment;

fig. 7 is a schematic structural diagram of a camera module except for a lens barrel and a photosensitive element in an electronic device according to another embodiment;

fig. 8 is a schematic structural diagram of a camera module except for a lens barrel and a photosensitive element in an electronic device according to another embodiment;

fig. 9 is a schematic structural diagram of a camera module except for a lens barrel and a photosensitive element in an electronic device according to another embodiment;

FIG. 10 is a schematic diagram illustrating a light path in an optical lens according to an embodiment when an object distance of the optical lens is 2 mm;

fig. 11 is a schematic structural diagram of an electronic device according to an embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1, in some embodiments, the electronic device 10 is a smart phone, the electronic device 10 includes a camera module 100 and a housing 200, the camera module 100 is disposed in the housing 200, and the camera module 100 can be used to perform a shooting function. For example, in some embodiments, the camera module 100 can perform the function of a front camera, and a user can perform operations such as self-shooting, video call, and the like through the camera module 100. In other embodiments, the camera module 100 can perform a function of a rear camera, and a user can perform operations such as macro shooting and video recording through the camera module 100. In other embodiments, the electronic device 120 may be any terminal device such as a smart phone, a tablet computer, a PDA (Personal Digital Assistant), a wearable device (smart bracelet, smart watch, smart glasses, smart glove, smart sock, smart belt, etc.), a VR (virtual reality) device, a smart home, and an unmanned vehicle. . The present application takes the camera module 100 of a smart phone as an example for description, but it should be understood that the camera module 100 disclosed in the present application is also applicable to other types of electronic devices 11.

Referring to fig. 2, the camera module 100 includes an optical lens 110, a photosensitive element 120 and a phase plate 130. The optical lens 110 includes a lens barrel 111 and a lens 112. The lenses 112 and the phase plate 130 are fixed in the lens barrel 111, and it should be noted that the number of the lenses 112 may be 2 or more than 2, for example, in the camera module 100 shown in fig. 2, 4 lenses 112 are arranged in the lens barrel 111. In other embodiments, 5 or 6 lenses 112 may be further disposed in the lens barrel 111, and the number of the lenses 112 is not limited herein. It is noted that the lenses 112 may be convex lenses or concave lenses, wherein the convex lenses have a positive refractive power and the concave lenses have a negative refractive power. The number and arrangement of the lenses 112 in the lens barrel 111 can be adjusted to meet the shooting requirement. Taking 4 lenses 112 in the lens barrel 111 as an example, in the direction from the object side to the image side, a first lens, a second lens, a third lens and a fourth lens are arranged in the lens barrel 111 in the optical axis direction in sequence, wherein the first lens and the third lens have positive refractive power, and the second lens and the fourth lens have negative refractive power.

As shown in fig. 2, the lens barrel 111 has an abutting portion 111a, and the abutting portion 111a is annular to surround the light passing hole 111b of the lens barrel 111. The plurality of lenses 112 are disposed corresponding to the light passing holes 111b and are coaxially arranged in the optical axis direction of each other. The peripheral side of the phase plate 130 is abutted and positioned on the inner wall of the lens barrel 111, and is abutted and limited on the abutting part 111a together with the plurality of lenses 112, so that the assembling operation is extremely simple, the phase plate 130 can be stably positioned in the lens barrel 111 by the lenses 112 and the inner wall of the lens barrel 111, the optical performance consistency is good, and the assembling precision is high.

Fig. 3 is a schematic structural diagram of a phase plate of a conventional camera module. In a conventional method, an original phase plate 130 of a camera module includes a transparent substrate 131 and a microstructure layer 132 formed on one side of the transparent substrate 131. The microstructure layer 132 of the phase plate 130 is used to perform phase modulation on the light, so that the depth of field during macro photography can be increased. However, the original phase plate 130 is added in front of the lens of the camera module, so that the transmittance of light is reduced.

In order to improve the sharpness of the captured image, in one embodiment, a phase plate 230 is provided, and as shown in fig. 4, the phase plate 230 includes a transparent substrate 231, and a phase layer 232 on one side of the transparent substrate. The phase layer 232 includes a micro-structure layer 232a disposed on the surface of the transparent substrate 231, and an anti-reflection film 232b disposed on a side of the micro-structure layer 232a away from the transparent substrate 231. On the one hand, the light can be phase-modulated by the micro-structural layer 232a, and the depth of field can be increased during macro photography. On the other hand, the light transmittance is improved by the antireflection film 232 b. Eventually, the sharpness of the captured image is improved.

Wherein, the phase distribution function of the phase layer 232 is: z ═ a (x)³+y³)；

Wherein a is the surface form coefficient of the phase layer 232; x, y are cartesian coordinates of the phase layer 232, respectively, and z is the thickness of the phase layer 232 in the optical axis direction at the position of the coordinate (x, y).

Furthermore, the value range of a is more than or equal to 0.025 and less than or equal to 0.035. Within this range, for example, a is 0.025, 0.027, 0.030, 0.033 or 0.035, the phase plate has a more significant effect of extending the depth of field when the optical lens is photographed at a macro distance, specifically, even when the object distance is 2mm to 4mm, the optical lens still can clearly image an object with an uneven surface.

In one embodiment, the thickness h1 of the micro-structured layer 232a in the optical axis direction is calculated by the formula:

h₁＝z–d； (1-1)

wherein z is a thickness of the phase layer in the optical axis direction at a position of coordinates (x, y); d is the equivalent height of the antireflective film. It is to be noted here that the equivalent height d of the antireflection film is not the thickness h of the antireflection film 232b in the optical axis direction₂。

The calculation formula of the equivalent height d of the antireflection film 232b is:

wherein λ is_{Reference to}For presetting the reference wavelength of visible light, n (lambda)_{Reference to}) For phase plates with a predetermined refractive index of visible light, n₀(λ_{Reference to}) The refractive index of the environment medium to the preset visible light is set;for additional phasing of the antireflective film, the antireflective film comprises a plurality of thin, n layers deposited sequentially on a microstructured layer_iTo reduce the refractive index of the i-th film in the reflective film to a predetermined visible light,/_iIn order to reduce the thickness of the ith film in the antireflection film, i is 1, 2, … … k.

Specifically, the thickness h of the microstructure layer 232a is calculated₁Then, the difference between the thickness z of the phase layer 232 at the position with coordinates (x, y) along the optical axis direction and the equivalent height d of the antireflection film 232b may be calculated to obtain the thickness h of the microstructure layer 232a₁。

Specifically, since the antireflection film 232b is coated on the side of the microstructure layer 232a away from the transparent substrate 231, the height of the phase plate 230 coated with the antireflection film 232b is increased compared to the phase plate 130 not coated with the antireflection film 232 b. Further, the phase plate 230 coated with the antireflection film 232b generates an additional phase when modulating the phase of light compared to the phase plate 130 not coated with the antireflection film 232b, so that the phase modulation is deviated. Therefore, to offset this additional phase, the equivalent height d of the antireflection film 232b is first calculated, and then the difference between the thickness z of the phase layer 232 in the optical axis direction at the position of the coordinate (x, y) and the equivalent height d of the antireflection film 232b is calculated to obtain the thickness h of the microstructure layer 232a in the optical axis direction₁. Thereby, according to the thickness h₁The micro-structured layer 232a formed on one side of the transparent substrate 231 can preferably cancel the additional phase.

Of course, when calculating the difference between the thickness z of the phase layer 232 at the position with the coordinate (x, y) along the optical axis direction and the equivalent height d of the reflection reducing film 232b, the difference may be calculated by multiplying the thickness z of the phase layer 232 at the position with the coordinate (x, y) along the optical axis direction by different coefficients, multiplying the equivalent height d of the reflection reducing film 232b by different coefficients, and calculating the difference between the two.

In the embodiment of the present application, the thickness h of the micro-structure layer 232a is calculated₁Then, the difference between the thickness z of the phase layer 232 at the position with coordinates (x, y) along the optical axis direction and the equivalent height d of the antireflection film 232b may be calculated to obtain the microstructure layer232a thickness h₁. Thereby, according to the thickness h₁The micro-structured layer 232a formed on one side of the transparent substrate 231 can preferably cancel the additional phase.

In one embodiment, the equivalent height d of the antireflection film 232b is determined based on the additional phase of the antireflection film 232b, the refractive index of the phase plate 130 for the predetermined visible light, and the refractive index of the ambient medium for the predetermined visible light; the wavelength of the visible light is preset as a preset reference wavelength.

Specifically, in practical applications, visible light with a preset reference wavelength may be selected from the visible light as the preset visible light. For example, the wavelength λ of the visible light is generally 390nm to 780nm, and if the wavelength λ is 550nm as the preset reference wavelength, the visible light with λ being 550nm is used as the preset visible light, and of course, the visible light with other wavelengths may be selected as the preset visible light from the wavelength λ of the visible light. Thus, for the predetermined visible light, the equivalent height d of the antireflection film 232b when the predetermined visible light is transmitted through the phase plate 230 coated with the antireflection film 232b can be calculated.

Specifically, the equivalent height d of the antireflection film 232b is determined based on the additional phase of the antireflection film 232b, the refractive index of the phase plate 230 with respect to visible light with λ 550nm, and the refractive index of the ambient medium with respect to visible light with λ 550 nm. Here, the phase plate 230 using different materials has different refractive indices for visible light with λ 550 nm.

In one embodiment, the transparent substrate 231 is made of H-K9L glass as the bulk material, and the microstructure layer 232a is made of photoresist as the bulk material. Wherein the H-K9L glass is a colorless transparent glass.

The side of the microstructure layer 232a away from the transparent substrate 231 is coated with an antireflection film 232b, and the parameters of each film of the antireflection film 232b are shown in the following table:

TABLE 1-1

Number of layers	1	2	3	4	5	6	7
								Material	SIO2	TIO2	SIO2	TIO2	SIO2	TIO2	SIO2
Thickness (nm)	150.5	23.42	38	60	25.0	43.23	98.

Wherein, when the reference wavelength λ is preset_{Reference to}At 550nm, the refractive index of SIO2 for visible light with λ 550nm is 1.46, and the refractive index of TIO2 for visible light with λ 550nm is 2.45. Wherein, H-K9L glass is adoptedThe phase plate 230 as a bulk material has a refractive index of 1.51 for visible light with λ 550nm, and the ambient medium has a refractive index of 1.0 for visible light with λ 550 nm.

The equivalent height d of the antireflection film 232b can be calculated according to the formula (1-2). Assuming that the thickness z of the phase layer in the optical axis direction at the position of the coordinate (x, y) is determined based on the phase distribution formula, i.e., (1-1), the thickness h of the micro-structure layer 232a in the optical axis direction is obtained by subtracting the equivalent height d of the antireflection film 232b from the thickness z of the phase layer in the optical axis direction at the position of the coordinate (x, y)₁。

The specially designed phase plate 230 including the antireflection film 232b is adopted in the camera module 100, and when macro photography is performed by the camera module 100, a reflection spectrogram of the antireflection film 232b is shown in fig. 5. Obviously, the reflectivity to visible light is greatly reduced by the camera module 100.

In another specific embodiment, the phase plate 230 comprises a transparent substrate 231 and a phase layer 232 on one side of the transparent substrate. The phase layer 232 includes a micro-structure layer 232a disposed on the surface of the transparent substrate 231, and an anti-reflection film 232b disposed on a side of the micro-structure layer 232a away from the transparent substrate 231. The transparent substrate 231 is made of PMMA, and the microstructure layer 232a is made of photoresist. In which PMMA is generally referred to as polymethyl methacrylate. Photoresist (Photoresist), also called Photoresist, refers to a resist material for etching a thin film, the solubility of which changes by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc.

The side of the microstructure layer 232a away from the transparent substrate 231 is coated with an antireflection film 232b, and the parameters of each film of the antireflection film 232b are shown in the following table:

tables 1 to 2

Number of layers	1	2	3	4
					Material	MGF2	AL2O3	H4	MGF2
Thickness (nm)	50.1	100	100	50

Wherein, when the reference wavelength λ is preset_{Reference to}At 550nm, the refractive index of MGF2 for visible light with λ 550nm is 1.38, the refractive index of AL2O3 for visible light with λ 550nm is 1.62, and the refractive index of H4 for visible light with λ 550nm is 2.04. The phase plate 230 using PMMA as a bulk material has a refractive index of 1.48 for visible light with λ 550nm, and the ambient medium has a refractive index of 1.0 for visible light with λ 550 nm.

The equivalent height d of the antireflection film 232b can be calculated according to the formula (1-1). Assuming that the thickness z of the phase layer in the optical axis direction at the position of the coordinate (x, y) is determined based on the phase distribution formula (1-2), the thickness h of the micro-structure layer 232a in the optical axis direction is obtained by subtracting the equivalent height d of the antireflection film 232b from the thickness z of the phase layer in the optical axis direction at the position of the coordinate (x, y)₁。

The specially designed phase plate 230 including the antireflection film 232b is adopted in the camera module 100, and when macro photography is performed by the camera module 100, a reflection spectrogram of the antireflection film 232b is shown in fig. 6. Obviously, the reflectivity to visible light is greatly reduced by the camera module 100.

In the two specific embodiments, the phase plate 230 includes a transparent substrate 231 and a phase layer 232 on one side of the transparent substrate. The phase layer 232 includes a micro-structure layer 232a disposed on the surface of the transparent substrate 231, and an anti-reflection film 232b disposed on a side of the micro-structure layer 232a away from the transparent substrate 231. The microstructure layer 232a of the phase plate 230 is used to perform phase modulation on the light, so that the depth of field during macro photography can be increased. However, the transmittance of light is reduced by adding the phase plate 230 in front of the lens. In order to improve the light transmittance, an antireflection film 232b may be coated on the side of the microstructure layer 232a away from the transparent substrate 231, and the light transmittance is improved by the antireflection film 232 b.

Since the antireflection film 232b is coated on the side of the microstructure layer 232a away from the transparent substrate 231, the height of the phase plate 130 coated with the antireflection film 232b is increased compared to the phase plate 130 not coated with the antireflection film 232 b. Further, the phase plate 230 coated with the antireflection film 232b generates an additional phase when modulating the phase of light compared to the phase plate 130 not coated with the antireflection film 232b, so that the phase modulation is deviated. Therefore, to cancel the additional phase, the equivalent height d of the antireflection film 232b is calculated first, and then the thickness h of the microstructure layer 232a in the optical axis direction is calculated based on the equivalent height d of the antireflection film 232b₁. Thus, according to the thickness h₁The microstructure layer 232a and the antireflection film 232b are designed to constitute a phase layer 232 on one side of the transparent substrate. Therefore, the phase plate 230 including the transparent substrate 231 and the phase layer 232 on the transparent substrate side can increase the transmittance while canceling the additional phase, and increase the depth of field in macro photography. Eventually, the sharpness of the captured image is improved.

In a specific embodiment, shown in connection with FIG. 3, the thickness h of the transparent substrate in the direction of the optical axis₃The value range of (a) is not less than 0.15mm and not more than h₃≤1.5mm。

Generally, the camera module includes an independent infrared cut filter, which is a filter applied to filter the infrared band in the visible light. However, the use of the separate infrared cut filter increases the height of the camera module and increases the difficulty in assembling the camera module.

In one embodiment, as shown in fig. 7, a schematic structural diagram of the camera module 200 is shown, except for the lens barrel and the photosensitive element. The camera module 200 includes a plurality of lenses 210 and a phase plate 230, and the lenses 210 and the phase plate 230 are sequentially distributed on the left side of the image plane. The number of the lenses 210 may be 2 or more than 2, for example, in the camera module 200 shown in fig. 7, 4 lenses 210 are included. The phase plate 230 includes a transparent substrate 231 and a phase layer 232 on one side of the transparent substrate. The phase layer 232 includes a microstructure layer (not shown) disposed on the surface of the transparent substrate 231, and an anti-reflection film (not shown) disposed on a side of the microstructure layer away from the transparent substrate 231. The transmittance of light through the phase plate 230 may be increased by the antireflection film.

In order to reduce the height of the camera module and the assembly difficulty of the camera module, the transparent substrate 231 may be made of an infrared cut-off filter, so that the transparent substrate may have a transmittance of less than 0.5% in the wavelength range of 725-1100 nm. And an infrared cut filter 232c is coated on the side of the transparent substrate 231 away from the microstructure layer. The transparent substrate 231 made of the ir cut filter may be used to absorb infrared rays, and the ir cut filter 232c may be used to filter infrared rays. Therefore, the infrared band in the visible light can be filtered by using the transparent substrate 231 made of the infrared cut filter and the infrared cut filter film 232 c. Thus, the transparent substrate 231 can realize the function of the infrared cut-off filter, and the independent infrared cut-off filter does not need to be assembled in the camera module, so that the assembly difficulty of the camera module is reduced while the height of the camera module is reduced.

In one embodiment, as shown in fig. 8, a schematic structural diagram of the camera module 200 is shown, except for the lens barrel and the photosensitive element. In order to reduce the height of the camera module and the assembly difficulty of the camera module, the side of the transparent substrate 231 away from the microstructure layer is coated with an infrared absorption pigment layer 232d, and the side of the infrared absorption pigment layer 232d away from the microstructure layer is coated with an infrared cut-off filter film 232 c. The transparent substrate 231 may be spin-coated with cyan ink on the side thereof away from the microstructure layer to form the infrared absorbing pigment layer 232 d. The infrared absorption pigment layer 232d may be used to absorb infrared rays, and the infrared cut filter 232c may be used to filter infrared rays. Therefore, the infrared absorption pigment layer 232d and the infrared cut filter film 232c are added to filter the infrared band in the visible light. Thus, the transparent substrate 231 can realize the function of the infrared cut-off filter, and the independent infrared cut-off filter does not need to be assembled in the camera module, so that the assembly difficulty of the camera module is reduced while the height of the camera module is reduced.

In one embodiment, as shown in fig. 9, a schematic structural diagram of the camera module 100 is shown, except for the lens barrel and the photosensitive element. In order to reduce the height of the camera module and the assembly difficulty of the camera module, the infrared cut-off filter 233 may be attached (specifically, glued) to the side of the transparent substrate 231 away from the microstructure layer, that is, the phase plate further includes the infrared cut-off filter attached to the side of the transparent substrate away from the microstructure layer. So, when reducing the height of camera module, reduced the equipment degree of difficulty of camera module.

In one embodiment, as shown in FIG. 5, the thickness h of the micro-structured layer 232a in the optical axis direction₁The value range of (2 mu m) is less than or equal to h₁Less than or equal to 20 μm, such as 2 μm, 5 μm, 10 μm, 15 μm or 20 μm.

Further, the thickness h of the transparent substrate 231 in the optical axis direction₃The value range of (a) is not less than 0.15mm and not more than h₃Less than or equal to 1.5mm, such as 0.15mm, 0.5mm, 1.05mm, 1.15mm or 1.5 mm.

Further, for example, as shown in connection with fig. 9, in which the thickness h of the antireflection film 232b in the optical axis direction₂The value range of (1) is not less than h₂Less than 1 μm, such as 0.1 μm, 0.2 μm, 0.35 μm, 0.5 μm, 0.7 or 1 μm.

Further, the transparent substrate 231 is made of glass, or the transparent substrate 231 is made of resin.

Further, a side of the transparent substrate 231 facing away from the microstructure layer 232a is a plane, a spherical surface or an aspheric surface, and the shape of the transparent substrate 231 is not limited herein.

The embodiment of the application also provides a camera module, an optional structure schematic diagram of the camera module is shown in fig. 10, and the camera module comprises a phase plate, a photosensitive element and an optical lens. The optical lens is located at an object side of the photosensitive element (not shown), and includes a first lens element with positive refractive power, a second lens element with negative refractive power, a third lens element with positive refractive power, and a fourth lens element with negative refractive power. Along the optical axis of the optical lens, a Cover Glass (CG) L1, a phase plate L2, a first lens element L3 with positive refractive power, a second lens element L4 with negative refractive power, a third lens element L5 with positive refractive power, a fourth lens element L6 with negative refractive power, and an ir filter L7 are sequentially disposed from the object side to the image side. The common axis of each lens in the optical lens is the optical axis of the optical lens.

The object side S1 and the image side S2 of cover glass L1 are both flat, that is, cover glass L1 is flat glass. The cover glass L1 can achieve good waterproof and dustproof effects on the optical lens so as to protect the optical lens. The phase plate L2 can phase-modulate light to improve the depth of field of macro photography, so that even if the surface of an object is uneven, it can be clearly imaged. The ir filter L7 may be an ir cut filter for filtering out interference light and preventing the interference light from reaching the imaging surface S15 of the optical lens to affect normal imaging.

In some embodiments, the phase plate L2 has an object side S3 and an image side S4, both object side S3 and image side S4 being planar. The first lens element L3 has an object-side surface S5 and an image-side surface S6, wherein the object-side surface S5 is convex and the image-side surface S6 is convex. The second lens L4 has an object-side surface S7 and an image-side surface S8, and the object-side surface S7 is concave. The third lens element L5 has an object-side surface S9 and an image-side surface S10, wherein the object-side surface S9 is concave and the image-side surface S10 is convex. The fourth lens L6 has an object-side surface S11 and an image-side surface S12, and the image-side surface S12 is concave.

The optical lens satisfies the following conditional expression:

0.15mm^-1≤|tan(HFOV)|/TTL≤0.35mm^-1。

tan (hfov) is a tangent value of a half of a maximum field angle of the optical lens, and TTL is a distance on an optical axis from an object-side surface of the optical element closest to the object side and having refractive power to an image plane S15 of the optical lens. For example, the object-side surface S3 and the image-side surface S4 of the phase plate L2 are both planar, that is, when there is no refractive power, TTL is the distance on the optical axis from the object-side surface S5 of the first lens element L3 with positive refractive power to the image plane S15 of the optical lens, and for example, when at least one of the object-side surface S3 and the image-side surface S4 of the phase plate L2 is concave or convex, the phase plate L2 has refractive power, TTL is the distance on the optical axis from the object-side surface S3 of the phase plate L2 with refractive power to the image plane S15 of the optical lens. Controlling | tan (HFOV) |/TTL at 0.15mm^-1～0.35mm^-1For example, | tan (HFOV) |/TTL takes a value of 0.15mm^-1、0.17mm^-1、0.20mm^-1、0.25mm^-1、0.35mm^-1Or 0.35mm^-1. In this way, when the optical lens meets the condition of a large field angle (for example, the value of the FOV is 70 to 100 °), the TTL is moderate, so that the TTL is not too large to be detrimental to the miniaturization design of the optical lens, and the TTL is too small to meet the requirement of correcting the aberration of the optical lens by using a plurality of lenses, thereby easily causing adverse effects on the imaging quality.

Further, the optical lens satisfies the following conditional expression: -40. ltoreq. f₂The/f is less than or equal to-10; wherein f2 is the effective focal length of the second lens L4, and f is the effective focal length of the optical lens. F is more than or equal to-40₂The/f is less than or equal to minus 10, for example, the value of f2/f is minus 40, -35, -30, -25, -20, -15 or-10, the second lens L4 can effectively adapt to macro shooting of the optical lens (for example, the imaging object distance is 2 mm-4 mm), and simultaneously, the imaging quality of the optical lens is improved, so that the macro characteristic and the high imaging quality are both realized. Below the lower limit of the above conditional expression, the refractive power of the second lens element L4 is insufficient, which is not favorable for correcting the aberration of the optical lens system and results in the degradation of the image quality; exceeding the upper limit of the above conditional expressions, the effective focal length of the optical lens is too large, which is not favorable for realizing the macro characteristic.

To sum up, take picturesThe optical lens in the image head module is configured to satisfy the following conditional expression: 0.15mm^-1≤|tan(HFOV)|/TTL≤0.35mm^-1，-40≤f₂The/f is less than or equal to-10. The optical lens can clearly shoot objects with ultra-micro distance (millimeter magnitude), such as objects with 2 millimeters distance.

In some embodiments, the optical lens satisfies the following conditional expression: 1.0<f₁F is less than or equal to 2.0; wherein f1 is the effective focal length of the first lens L3, and f is the effective focal length of the optical lens. At 1.0<f₁In the range of/f ≦ 2.0, such as f₁The value of/f is 1.0, 1.2, 1.3, 1.5, 1.7, 1.9 or 2.0, and the first lens L3 can effectively adapt to macro shooting of the optical lens (for example, the imaging object distance is 2 mm-4 mm), and simultaneously improves the imaging quality of the optical lens, thereby taking the realization of the macro characteristic and the high imaging quality into consideration. Below the lower limit of the above conditional expression, the refractive power of the first lens element L3 is insufficient, which is not favorable for correcting the aberration of the optical lens system and results in the degradation of the image quality; exceeding the upper limit of the above conditional expression, the effective focal length of the first lens L3 is too large, which is disadvantageous for miniaturization of the optical lens.

In one embodiment, an electronic device is provided, which includes the camera module in the above embodiments.

Referring to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 11 may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer-readable storage media, input unit 503, display unit 504, sensor 505, audio circuitry 506, Wireless Fidelity (WiFi) module 507, processor 508 including one or more processing cores, and power supply 509. Those skilled in the art will appreciate that the configuration of electronic device 11 shown in FIG. 11 is not intended to be limiting of electronic device 11, and may include more or fewer components than shown, or some components in combination, or a different arrangement of components.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.