阅读说明：本技术 一种光模块及校准单位定义方法 (Optical module and calibration unit definition method ) 是由 张玉娜 石良 李振东 李世琦 于 2021-08-18 设计创作，主要内容包括：本申请提供的光模块及校准单位定义方法中,光模块包括MCU,MCU包括第一寄存器、第二寄存器和第三寄存器,第一寄存器、第二寄存器和第三寄存器分别用于存储激光器偏置电流校准单位、发射光功率校准单位和接收光功率校准单位,用户可以根据光模块产品的规则自定义相应的激光器偏置电流校准单位、发射光功率校准单位和接收光功率校准单位,并将自定义后的激光器偏置电流校准单位、发射光功率校准单位和接收光功率校准单位存储至相应的寄存器内,等待上位机读取。本申请通过启用SFF-8472里用户可写区的各寄存器来指示光模块进行校准时所用的单位,实现在当前SFF-8472的框架下兼容各类规格范围的光模块产品。(In the optical module and calibration unit defining method provided by the application, the optical module includes an MCU, the MCU includes a first register, a second register and a third register, the first register, the second register and the third register are respectively used for storing a laser bias current calibration unit, a transmitting optical power calibration unit and a receiving optical power calibration unit, a user can customize the corresponding laser bias current calibration unit, transmitting optical power calibration unit and receiving optical power calibration unit according to the rules of an optical module product, and store the customized laser bias current calibration unit, transmitting optical power calibration unit and receiving optical power calibration unit into the corresponding registers to wait for an upper computer to read. The unit used for calibrating the optical module is indicated by starting each register of the user writable area in the SFF-8472, so that optical module products in various specification ranges are compatible under the current SFF-8472 framework.)

1. A light module, comprising:

the circuit board is provided with a golden finger at one end;

MCU, set up on the circuit board, including I2C interface, I2C interface is connected with I2C pin electricity on the golden finger, includes:

the device comprises a first register, a second register and a third register, wherein the first register is used for storing a laser bias current calibration unit indicating value, the laser bias current calibration unit indicating value is customized by a user and can be read by an upper computer and is used for calibrating a laser bias current sampling value;

a second register for storing an emitted light power calibration unit indication value, wherein the emitted light power calibration unit indication value is customized by a user and can be read by an upper computer, and is used for calibrating the emitted light power sampling value;

and the third register is used for storing a received optical power calibration unit indicating value, wherein the received optical power calibration unit indicating value is customized by a user and can be read by an upper computer, and the third register is used for calibrating a received optical power sampling value.

2. The light module of claim 1, wherein the MCU further comprises:

the fourth register is used for storing the laser bias current sampling value;

a fifth register for storing a transmitted optical power sample value;

and the sixth register is used for storing the received optical power sampling value.

3. The optical module of claim 1, wherein the first register, the second register, and the third register are registers in a user-writable area.

4. The optical module according to claim 2, wherein the stored data in the first register, the second register, the third register, the fourth register, the fifth register, and the sixth register is read by an upper computer;

the upper computer reads the laser bias current sampling value and the laser bias current calibration unit indicating value from the fourth register and the first register respectively, and obtains a laser bias current report value based on a first formula;

the upper computer reads the emission light power sampling value and the emission light power calibration unit indicating value from the fifth register and the second register respectively, and obtains an emission light power report value based on a second formula;

and the upper computer reads the received optical power sampling value and the received optical power calibration unit indicating value from the sixth register and the third register respectively, and acquires a received optical power report value based on a third formula.

5. The optical module of claim 4, wherein the upper computer reads the laser bias current sampling value and the laser bias current calibration unit indication value from the fourth register and the first register, respectively, and obtains a laser bias current report value based on a first formula, comprising:

and acquiring a laser BIAS current reported value according to TxBias (TX _ BIAS _ AD) TX _ BIAS _ U (0.001), wherein TxBias is the laser BIAS current reported value, TX _ BIAS _ AD is a laser BIAS current sampling value, and TX _ BIAS _ U is a first laser BIAS current calibration unit or a second laser BIAS current calibration unit indicated value.

6. The optical module of claim 4, wherein the upper computer reads the sampled value of the transmitted optical power and the calibration unit indicator value of the transmitted optical power from the fifth register and the second register, respectively, and obtains a reported value of the transmitted optical power based on a second formula, comprising:

and obtaining an emission light power report value according to the TxPower (10 Log 10) (TX _ PWR _ AD TX _ PWR _ U0.0001), wherein TxPower is the emission light power report value, TX _ PWR _ AD is the emission light power sampling value, and TX _ PWR _ U is the emission light power calibration unit indication value.

7. The optical module according to claim 4, wherein the upper computer reads the received optical power sampling value and the received optical power calibration unit from the sixth register and the third register, respectively, and obtains a received optical power report value based on a third formula, including:

and acquiring a received optical power report value according to RxPower ═ 10 Log10(RX _ PWR _ AD RX _ PWR _ U _ 0.0001), wherein RxPower is the received optical power report value, RX _ PWR _ AD is the received optical power sampled value, and RX _ PWR _ U is the received optical power calibration unit indicated value.

8. A calibration unit definition method, the method comprising:

storing a laser bias current calibration unit indicated value into a first register based on the optical module product specification, wherein the laser bias current calibration unit indicated value is read by an upper computer and is used for calibrating a laser bias current sampling value;

storing the emitted light power calibration unit indicated value into a second register based on the product specification of the optical module, wherein the emitted light power calibration unit indicated value is read by an upper computer and is used for calibrating the emitted light power sampling value;

and storing the received optical power calibration unit indicated value into a third register based on the optical module product specification, wherein the received optical power calibration unit indicated value is read by an upper computer and is used for calibrating the received optical power sampling value.

9. The calibration unit defining method according to claim 8, wherein the first register, the second register, and the third register are registers in a user-writable area.

10. The calibration unit definition method of claim 8, further comprising:

acquiring a laser BIAS current reported value according to TxBias, wherein TxBias is the laser BIAS current reported value, TX _ BIAS _ AD is the laser BIAS current sampling value, and TX _ BIAS _ U is a laser BIAS current calibration unit indicated value stored in the first register;

acquiring an emitted light power reported value according to TxPower (10 Log 10) (TX _ PWR _ AD TX _ PWR _ U0.0001), where TxPower is the emitted light power reported value, TX _ PWR _ AD is the emitted light power sampled value, and TX _ PWR _ U is the emitted light power calibration unit indicated value stored in the second register;

and acquiring a received optical power reported value according to RxPower ═ 10 Log10(RX _ PWR _ AD RX _ PWR _ U _ 0.0001), wherein RxPower is the received optical power reported value, RX _ PWR _ AD is the received optical power sampled value, and RX _ PWR _ U is the received optical power calibration unit indicated value stored in the third register.

Technical Field

The present application relates to the field of optical communication technologies, and in particular, to an optical module and a calibration unit defining method.

Background

The unit for calibrating the bias current, the transmitting power and the receiving power of the laser in an optical module communication protocol such as the SFF-8472 protocol is default, that is, the bias current is 2uA, and the transmitting power and the receiving power are 0.1 uW. Therefore, the monitoring range of the bias current is only 0-131 mA, and the monitoring range of the transmitting power and the receiving power is only-40-8.2 dBm. With the advent of high-specification products, the above range has not been able to cover the practical range of applications.

Disclosure of Invention

The application provides an optical module and a calibration unit definition method, which are used for adding definition description of a calibration unit of laser bias current, emitted optical power and received optical power on the basis of the existing SFF-8472 protocol.

In one aspect, the present application provides an optical module, comprising:

the circuit board is provided with a golden finger at one end;

MCU, set up on the circuit board, including I2C interface, I2C interface is connected with I2C pin electricity on the golden finger, includes:

the device comprises a first register, a second register and a third register, wherein the first register is used for storing a laser bias current calibration unit indicating value, the laser bias current calibration unit indicating value is customized by a user and can be read by an upper computer and is used for calibrating a laser bias current sampling value;

a second register for storing an emitted light power calibration unit indication value, wherein the emitted light power calibration unit indication value is customized by a user and can be read by an upper computer, and is used for calibrating the emitted light power sampling value;

and the third register is used for storing a received optical power calibration unit indicating value, wherein the received optical power calibration unit indicating value is customized by a user and can be read by an upper computer, and the third register is used for calibrating a received optical power sampling value.

In another aspect, the present application provides a signal polarity defining method, including:

storing a laser bias current calibration unit indicated value into a first register based on the optical module product specification, wherein the laser bias current calibration unit indicated value is read by an upper computer and is used for calibrating a laser bias current sampling value;

storing the emitted light power calibration unit indicated value into a second register based on the product specification of the optical module, wherein the emitted light power calibration unit indicated value is read by an upper computer and is used for calibrating the emitted light power sampling value;

and storing the received optical power calibration unit indicated value into a third register based on the optical module product specification, wherein the received optical power calibration unit indicated value is read by an upper computer and is used for calibrating the received optical power sampling value.

Has the advantages that:

in the optical module and calibration unit defining method provided by the application, the optical module includes an MCU, the MCU includes a first register, a second register and a third register, the first register, the second register and the third register are respectively used for storing a laser bias current calibration unit indicating value, a transmitted light power calibration unit indicating value and a received light power calibration unit indicating value, a user can customize a corresponding laser bias current calibration unit indicating value, a transmitted light power calibration unit indicating value and a received light power calibration unit indicating value according to rules of an optical module product, and store the customized laser bias current calibration unit indicating value, transmitted light power calibration unit indicating value and received light power calibration unit indicating value into corresponding registers, and wait for an upper computer to read.

The unit used when the optical module is calibrated is indicated by starting each register of the user writable area in the SFF-8472, the value of the registers is read by the equipment MAC through I2C to confirm the unit and correspondingly convert the unit, and the optical module product which is compatible with various specification ranges under the current SFF-8472 framework is realized.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic view of an interaction relationship between an optical module and an upper computer according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically: the electrical port of the optical module is inserted into an electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to the embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, a circuit board 300, an unlocking handle 203, a light emission sub-module 206, and a light reception sub-module 207.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 for external optical fiber access to connect the tosa 206 and the rosa 207 inside the optical module; optoelectronic devices such as the circuit board 300, the tosa 206, and the rosa 207 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the transmitter sub-module 206, the receiver sub-module 207 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.

The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.

The tosa 206 and the rosa 207 are respectively configured to transmit an optical signal and receive an optical signal. The tosa 206 and the rosa 207 may also be combined together to form an integrated optical transceiver. The tosa 206 includes a light emitting chip and a backlight detector, and the rosa 207 includes a light receiving chip.

The circuit board 300 is located in a package cavity formed by the upper shell 201 and the lower shell 202, and circuit traces, electronic elements (such as capacitors, resistors, triodes and MOS transistors) and chips (such as a microprocessor MCU, a laser driving chip, a limiting amplifier, a clock data recovery CDR, a power management chip and a data processing chip DSP) are disposed on the circuit board 300.

In the embodiment of the application, the transimpedance amplifier is closely associated with the light receiving chip. The transimpedance amplifier chip can be independently packaged on the circuit board 300, and the light receiving chip and the transimpedance amplifier are electrically connected with the circuit board 300 through the independent package; the transimpedance amplifier and the light receiving chip can be packaged together in an independent package body, such as the same coaxial tube shell TO or the same square cavity; the light receiving chip and the transimpedance amplifier can be arranged on the surface of the circuit board without adopting an independent packaging body; the light receiving chip can be independently packaged, the trans-impedance amplifier is arranged on the circuit board, and the quality of a received signal can meet certain relatively low requirements.

The chip on the circuit board can be an all-in-one chip, for example, a laser driving chip and an MCU chip are fused into a chip, and a laser driving chip, a limiting amplification chip and an MCU chip are also fused into a chip, wherein the chip is the integration of the circuit, but the functions of all the circuits do not disappear due to the integration, and only the integration of the circuit forms occurs. Therefore, when the circuit board is provided with three independent chips, namely the MCU, the laser driving chip and the amplitude limiting amplification chip, the scheme is equivalent to that of arranging a single chip with three functions in one on the circuit.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like. The circuit board 300 is a carrier of main electrical components of the optical module, and the electrical components not arranged on the circuit board are finally electrically connected with the circuit board, and the electrical connector on the circuit board 300 realizes the electrical connection between the optical module and the host computer thereof.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; when the tosa 206 and the rosa 207 are located on the circuit board, the rigid circuit board can also provide a smooth load; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

The circuit board 300 has a gold finger 301 on the surface of the end, the gold finger is composed of a pin independent from each other, the circuit board 300 is inserted into the electric connector in the cage, and the gold finger is electrically connected with the upper computer. The upper computer and the optical module can adopt an I2C protocol to carry out information transmission through I2C pins. The upper computer can write information into the optical module, and particularly, the upper computer can write the information into a register of the optical module; the optical module cannot write information into the upper computer, when the optical module needs to provide the information to the upper computer, the optical module can write the information into a preset register in the optical module, the register is read by the upper computer, and the register of the optical module is generally integrated in an MCU of the optical module and can also be independently arranged on a circuit board 300 of the optical module.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The tosa 206 and the rosa 207 are respectively configured to transmit an optical signal and receive an optical signal. In this embodiment, the tosa 206 may be a coaxial TO package physically separated from the pcb and electrically connected TO the pcb by a flexible board; the rosa 207 is also in a coaxial TO package, physically separated from the circuit board, and electrically connected by a flexible board. In another common implementation, may be disposed on a surface of the circuit board 300; in addition, the tosa 206 and the rosa 207 may be combined together to form an integrated optical transceiver.

Fig. 5 is a schematic partial structure diagram of an optical module according to an embodiment of the present invention. As shown in fig. 5, in the optical module provided in this embodiment of the application, a row of gold fingers 301 is disposed on a surface of one end of a circuit board 300, an MCU302 is disposed on the circuit board 300, the row of gold fingers 301 is composed of one gold finger which is independent from each other, the circuit board 300 is inserted into an electrical connector in a cage, the gold fingers 301 are electrically connected to an upper computer, and the MCU302 is electrically connected to the gold fingers 301. The rosa 207 includes an APD, a transimpedance amplifier chip (TIA), a limiting amplifier chip (LA), and an MCU 302. The chip is essentially the integration of circuits, the circuits can be integrated into the chip, and part of functions in the chip can also be realized by the circuits on the circuit board. The functions of the chip can be realized by the chip, the circuit or the main chip combined with the peripheral circuit. Different functions can be integrated by the same chip, and the change of the circuit integration form still belongs to the protection scope of the invention.

In the process of receiving the optical signal, the optical receive sub-module 207 is internally provided with an optical receive chip, where a common optical receive chip may be an APD, and is configured to receive the optical signal sent by the external device and convert the optical signal sent by the external device into an electrical signal; an input pin of the transimpedance amplifier chip is connected with an output pin of the optical receive submodule 207, and is used for converting an electrical signal output by the optical receive submodule 207 into a voltage signal; the high-frequency signal input pin of the amplitude limiting amplification chip is connected with the output pin of the transimpedance amplification chip and is used for amplifying a first voltage signal output by the transimpedance amplification chip; an input pin of the clock data recovery chip is connected with a high-frequency signal output pin of the amplitude limiting amplification chip and used for shaping a voltage signal output by the amplitude limiting amplification chip, and an output pin of the clock data recovery chip is connected with the golden finger 301. The connecting finger 301 is connected with an upper computer, and then signals received by the optical module can be sent to the upper computer.

The unit for calibrating the bias current, the transmitting power and the receiving power of the laser in an optical module communication protocol such as the SFF-8472 protocol is default, that is, the bias current is 2uA, and the transmitting power and the receiving power are 0.1 uW. Therefore, the monitoring range of the bias current is only 0-131 mA, and the monitoring range of the transmitting power and the receiving power is only-40-8.2 dBm. With the advent of high-specification products, the above range has not been able to cover the practical range of applications.

The method provides a relevant scheme for defining each calibration unit, indicates the unit used for calibrating the optical module by starting each register in the user-writable area in the SFF-8472, and the device MAC reads the value of the registers through I2C to confirm the unit and perform corresponding conversion, so that the optical module products of various specification ranges are compatible under the framework of the current SFF-8472.

Because the present application is an extension of the existing SFF-8472 protocol, registers within the SFF-8472 protocol specification cannot be used in the present application, but registers outside the SFF-8472 protocol specification, such as registers in the user-writable area, are used, and it can be understood that, when the extension of the existing SFF-8472 protocol provided in the present application is absorbed by the protocol, the registers in the present application are included in the SFF-8472 protocol specification.

The following describes the related scheme defined for each calibration unit provided in the present application with reference to fig. 6.

In the embodiment of the application, a register outside the SFF-8472 protocol specification range is selected, for example, registers in a user-writable area are respectively defined as a first register, a second register and a third register, the first register, the second register and the third register are respectively used for storing a laser bias current calibration unit indicating value, a transmitting optical power calibration unit indicating value and a receiving optical power calibration unit indicating value, a user can customize a corresponding laser bias current calibration unit indicating value, a transmitting optical power calibration unit indicating value and a receiving optical power calibration unit indicating value according to rules of an optical module product, and the customized laser bias current calibration unit indicating value, transmitting optical power calibration unit indicating value and receiving optical power calibration unit indicating value are stored in the corresponding registers and are waited for being read by an upper computer.

The embodiment of the application also comprises a fourth register, a fifth register and a sixth register, wherein the fourth register, the fifth register and the sixth register are respectively used for storing the laser bias current sampling value, the emitted optical power sampling value and the received optical power sampling value.

It will be appreciated that the fourth, fifth and sixth registers are registers within the SFF-8472 protocol specification.

In the embodiment of the present application, the fourth register, the first register, the fifth register, the second register, the sixth register, and the third register may respectively select a2[100:101], a2[248] bit7:4, a2[102:103], a2[248] bit3:0, a2[104:105], and a2[249] bit7:4, and may also select other registers in the reserved bits of the memory cell.

A fourth register, such as A2[100:101], is used to store the laser bias current sample value.

A first register, such as a2[248] bit7:4, is used for storing a laser bias current calibration unit indication value, which is exemplified by specific data below, and in some embodiments, when the laser bias current calibration unit indication value is 2, the laser bias current calibration unit is 2uA, and when the laser bias current calibration unit indication value is 4, the laser bias current calibration unit is 4uA, and so on, a user can customize a specific laser bias current calibration unit according to the specification of the optical module product, and then store the customized laser bias current calibration unit in the form of an indication value into the first register, and wait for an upper computer to read. It should be noted that the calibration unit of the laser bias current may be more than two preset values, which may be not only 2uA and 4uA, but also other gears such as 6uA, 10uA, 14uA and the like if new products are subsequently provided.

A fifth register, such as A2[102:103], is used to store the transmitted optical power sample value.

A second register, such as a2[248] bit3:0, is used for the emitted light power calibration unit indicating value, in some embodiments, the emitted light power calibration unit indicating value is 1, which means the emitted light power calibration unit is 0.1uW, the emitted light power calibration unit indicating value is 2, which means the emitted light power calibration unit is 0.2uW, and so on, a user can customize a specific emitted light power calibration unit according to the specification of the light module product, and then store the customized emitted light power calibration unit in the second register in the form of an indicating value, and wait for the upper computer to read.

It should be noted that the emitted light power calibration unit may be more than two preset values, which may be not only 0.1uW and 0.2uW, but also other gears such as 0.3uW and 0.4uW if new products are subsequently provided.

A sixth register, such as A2[104:105], is used to store received optical power samples.

The third register, for example, a2[249] bit7:4 is used for receiving the optical power calibration unit indication value, in some embodiments, when the received optical power calibration unit indication value is 1, it indicates that the received optical power calibration unit is 0.1uW, when the received optical power calibration unit indication value is 2, it indicates that the received optical power calibration unit is 0.2uW, and so on, a user may customize a specific received optical power calibration unit according to the specification of the optical module product, and then store the customized received optical power calibration unit in the third register in the form of an indication value, and wait for the upper computer to read.

It should be noted that the received optical power calibration unit may be more than two preset values, which may be not only 0.1uW and 0.2uW, but also 0.3uW, 0.4uW and other gears if new products follow.

After storing the corresponding data in the corresponding register, waiting for the upper computer to read, specifically, the upper computer includes an MAC chip, the MAC chip in the upper computer reads the corresponding data from the corresponding register, then the MAC chip performs conversion according to a corresponding formula to obtain reported values of the laser bias current, the emitted optical power and the received optical power, the MAC chip reports the reported values to a processor of the upper computer, the processor performs subsequent monitoring or processing, wherein the specific process of reading and converting the MAC chip includes:

the upper computer reads a laser bias current sampling value and a laser bias current calibration unit indicating value from the fourth register and the first register respectively, and obtains a laser bias current reporting value based on a first formula;

the upper computer reads the emission light power sampling value and the emission light power calibration unit indicating value from the fifth register and the second register respectively, and acquires an emission light power report value based on a second formula;

and the upper computer reads the received optical power sampling value and the received optical power calibration unit indicating value from the sixth register and the third register respectively, and acquires a received optical power report value based on a third formula.

Wherein, the host computer reads laser instrument bias current sampling value and laser instrument bias current calibration unit indicated value respectively from fourth register with in the first register to obtain laser instrument bias current report value based on first formula, include:

and acquiring a laser BIAS current reported value according to TxBias (TX _ BIAS _ AD) TX _ BIAS _ U (0.001), wherein TxBias is the laser BIAS current reported value, TX _ BIAS _ AD is a laser BIAS current sampling value, and TX _ BIAS _ U is a first laser BIAS current calibration unit or a second laser BIAS current calibration unit indicated value.

The upper computer reads the emission light power sampling value and the emission light power calibration unit indicating value from the fifth register and the second register respectively, and obtains an emission light power report value based on a second formula, and the method comprises the following steps:

and obtaining an emission light power report value according to the TxPower (10 Log 10) (TX _ PWR _ AD TX _ PWR _ U0.0001), wherein TxPower is the emission light power report value, TX _ PWR _ AD is the emission light power sampling value, and TX _ PWR _ U is the emission light power calibration unit indication value.

Wherein, the host computer reads respectively from sixth register and third register receiving optical power sampling value and receiving optical power calibration unit to obtain receiving optical power report value based on the third formula, include:

and acquiring a received optical power report value according to RxPower ═ 10 Log10(RX _ PWR _ AD RX _ PWR _ U _ 0.0001), wherein RxPower is the received optical power report value, RX _ PWR _ AD is the received optical power sampled value, and RX _ PWR _ U is the received optical power calibration unit indicated value.

The user can self-define a corresponding laser bias current calibration unit indicating value, a transmitting optical power calibration unit indicating value and a receiving optical power calibration unit indicating value according to the rule of an optical module product, and stores the self-defined laser bias current calibration unit indicating value, the transmitting optical power calibration unit indicating value and the receiving optical power calibration unit indicating value into corresponding registers to wait for the reading of an upper computer.

The unit used when the optical module is calibrated is indicated by starting each register of the user writable area in the SFF-8472, the value of the registers is read by the equipment MAC through I2C to confirm the unit and correspondingly convert the unit, and the optical module product which is compatible with various specification ranges under the current SFF-8472 framework is realized.

Based on the optical module, the application further provides a calibration unit definition method, specifically the method comprises:

storing a laser bias current calibration unit indicating value into a first register based on optical module product specifications;

storing the emitted light power calibration unit indication value into a second register based on the optical module product specification;

and storing the receiving optical power calibration unit indicating value into a third register based on the optical module product specification.

The user can self-define a corresponding laser bias current calibration unit indicating value, a transmitting optical power calibration unit indicating value and a receiving optical power calibration unit indicating value according to the rule of an optical module product, and stores the self-defined laser bias current calibration unit indicating value, the transmitting optical power calibration unit indicating value and the receiving optical power calibration unit indicating value into corresponding registers to wait for the reading of an upper computer.

Specifically, a laser BIAS current reporting value is obtained according to TxBias, wherein TxBias is the laser BIAS current reporting value, TX _ BIAS _ AD is the laser BIAS current sampling value, and TX _ BIAS _ U is the laser BIAS current calibration unit indication value;

obtaining an emitted light power reported value according to TxPower (10 Log 10) (TX _ PWR _ AD TX _ PWR _ U0.0001), where TxPower is the emitted light power reported value, TX _ PWR _ AD is the emitted light power sampled value, and TX _ PWR _ U is the emitted light power calibration unit indicated value;

and acquiring a received optical power report value according to RxPower ═ 10 Log10(RX _ PWR _ AD RX _ PWR _ U _ 0.0001), wherein RxPower is the received optical power report value, RX _ PWR _ AD is the received optical power sampled value, and RX _ PWR _ U is the received optical power calibration unit indicated value.

For the inexhaustible part of the calibration unit defining method provided in the embodiment of the present application, reference may be made to the optical module provided in the above embodiment.

The unit used when the optical module is calibrated is indicated by starting each register of the user writable area in the SFF-8472, the value of the registers is read by the equipment MAC through I2C to confirm the unit and correspondingly convert the unit, and the optical module product which is compatible with various specification ranges under the current SFF-8472 framework is realized.

Finally, it should be noted that: the embodiment is described in a progressive manner, and different parts can be mutually referred; in addition, the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.