阅读说明：本技术 一种带有焊垫导通结构的电路板 (Circuit board with weld pad conduction structure ) 是由 石教猛 田绍安 于 2021-08-02 设计创作，主要内容包括：本发明涉及电路板技术领域,尤其是一种带有焊垫导通结构的电路板,包括电路板体,电路板体上设置有多个导通组件,多个导通组件均匀分布在电路板体上,导通组件包括通孔和盲孔,通孔和盲孔的内侧壁上均设置有金属层,通孔底端部设置有焊垫,通孔的内部开设有多个绝缘槽,金属层内侧壁上涂抹有阻焊油墨,通孔和盲孔内均填充有吸水介质层；通过设置为通孔、盲孔,不仅方便电路板的制作,提高电路板的制作效率,而且能够降低电路板的价格；通过设置吸水介质层,电路板体存放时,吸水介质层可吸收通孔和盲孔内进入水汽,从而提高防水性,当电路板体使用时,将吸水介质层取出即可。(The invention relates to the technical field of circuit boards, in particular to a circuit board with a welding pad conduction structure, which comprises a circuit board body, wherein a plurality of conduction assemblies are arranged on the circuit board body and are uniformly distributed on the circuit board body; through the arrangement of the through holes and the blind holes, the circuit board is convenient to manufacture, the manufacturing efficiency of the circuit board is improved, and the price of the circuit board can be reduced; through setting up the dielectric layer that absorbs water, when the circuit board body was deposited, the dielectric layer that absorbs water can absorb the entering steam in through-hole and the blind hole to improve waterproof nature, when the circuit board body used, it can to take out the dielectric layer that absorbs water.)

1. The utility model provides a circuit board with pad switches on structure, its characterized in that, includes circuit board body (1), be provided with a plurality of subassemblies that switch on circuit board body (1), it is a plurality of switch on subassembly evenly distributed is on circuit board body (1), the subassembly that switches on includes through-hole (2) and blind hole (3), all be provided with metal level (4) on the inside wall of through-hole (2) and blind hole (3), through-hole (2) bottom portion is provided with pad (5), a plurality of insulating chutes (6) have been seted up to the inside of through-hole (2), scribble on metal level (4) inside wall and hinder and weld printing ink (7), it has water-absorbing medium layer (9) all to fill in through-hole (2) and blind hole (3).

2. The circuit board with pad conducting structure according to claim 1, wherein the circuit board body (1) is formed by bonding multiple layers of circuit boards together by epoxy resin electronic sealant.

3. The circuit board with a solder pad conduction structure according to claim 1, wherein both ends of the through hole (2) penetrate through the circuit board body (1), and one end of the blind hole (3) penetrates through the circuit board body (1).

4. The circuit board with a pad conduction structure according to claim 1, wherein the circuit board body (1) has a buried hole (8) formed therein.

5. The circuit board with a pad via structure of claim 1, wherein the metal layer (4) is a copper layer, and the metal layer (4) is disposed on an inner sidewall of the via hole by electroplating.

Technical Field

The invention relates to the technical field of circuit boards, in particular to a circuit board with a welding pad conduction structure.

Background

In order to realize electrical connection between different layers of a multilayer PCB, it is usually necessary to open via holes in the multilayer board body of the PCB and form metal hole walls in the via holes. Furthermore, the electrical connections between the different layers may involve metal networks of various properties (e.g. signal transmission, through-flow, etc.) in the multilayer board body, and therefore, a via with a metal hole wall needs to be provided separately for each property of the metal network. Therefore, a plurality of through holes are formed in the multilayer board body of the PCB.

The via hole on the traditional PCB board comprises a through hole, a blind hole and a buried hole, wherein the through hole is the most common hole, penetrates through the whole circuit board body, is also the simplest hole to manufacture, and is low in price; the blind hole is used for connecting the outermost layer circuit of the PCB with the adjacent inner layer by a plating hole, the manufacture is slightly troublesome, and the depth of a drilled hole needs to be controlled; the buried holes are arranged in the circuit board body, and the circuit board needs to be locally bonded and drilled and then bonded and drilled with other circuit boards. Due to the existence of a large number of conducting holes, water vapor is easy to remain in the holes, and storage is difficult in an environment with high humidity, so that the circuit board with the welding pad conducting structure is provided.

Disclosure of Invention

The invention aims to solve the problem that water vapor is easy to remain in a hole due to the existence of a large number of through holes in a circuit board with a welding pad conduction structure in the prior art, and provides the circuit board with the welding pad conduction structure.

In order to achieve the purpose, the invention adopts the following technical scheme:

the design one kind has weld pad to switch on the circuit board of the structure, including the circuit board body, it is a plurality of to switch on the subassembly to be provided with on the circuit board body, it is a plurality of to switch on the subassembly evenly distributed on the circuit board body, it includes through-hole and blind hole to switch on the subassembly, all be provided with the metal level on the inside wall of through-hole and blind hole, through-hole bottom portion is provided with the weld pad, a plurality of insulated slots have been seted up to the inside of through-hole, scribble on the metal level inside wall and hinder and weld printing ink, it has the water-absorbing medium layer all to fill in through-hole and the blind hole.

Preferably, the circuit board body is formed by bonding a plurality of layers of circuit boards through epoxy resin electronic sealing glue.

Preferably, both ends of the through hole penetrate through the circuit board body, and one end of the blind hole penetrates through the circuit board body.

Preferably, the circuit board body is internally provided with a buried hole.

Preferably, the metal layer is a copper layer, and the metal layer is arranged on the inner side wall of the via hole in an electroplating mode.

The circuit board with the welding pad conducting structure has the advantages that: through the arrangement of the through holes and the blind holes, the circuit board is convenient to manufacture, the manufacturing efficiency of the circuit board is improved, and the price of the circuit board can be reduced; through setting up the dielectric layer that absorbs water, when the circuit board body was deposited, the dielectric layer that absorbs water can absorb the entering steam in through-hole and the blind hole to improve waterproof nature, when the circuit board body used, it can to take out the dielectric layer that absorbs water.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board with a pad conduction structure according to the present invention.

Fig. 2 is an enlarged schematic view of a through hole of a circuit board with a pad conduction structure according to the present invention.

In the figure: the circuit board comprises a circuit board body 1, a through hole 2, a blind hole 3, a metal layer 4, a welding pad 5, an insulation groove 6, solder resist ink 7, a buried hole 8 and a water-absorbing medium layer 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-2, a circuit board with weld pad conduction structure, including circuit board body 1, be provided with a plurality of subassemblies that switch on circuit board body 1, a plurality of subassemblies evenly distributed that switch on are on circuit board body 1, the subassembly that switches on includes through-hole 2 and blind hole 3, all be provided with metal level 4 on the inside wall of through-hole 2 and blind hole 3, through-hole 2 bottom portion is provided with weld pad 5, a plurality of insulation support 6 have been seted up to through-hole 2's inside, it hinders solder ink 7 to have smeared on the inside wall of metal level 4, it has water-absorbing medium layer 9 all to fill in through-hole 2 and the blind hole 3. The circuit board body 1 is formed by bonding a plurality of layers of circuit boards through epoxy resin electronic sealant. Both ends of the through hole 2 penetrate through the circuit board body 1, and one end of the blind hole 3 penetrates through the circuit board body 1. The circuit board body 1 is internally provided with a buried hole 8. The metal layer 4 is a copper layer, and the metal layer 4 is arranged on the inner side wall of the via hole in an electroplating mode. Through the arrangement of the through holes 2 and the blind holes 3, the circuit board is convenient to manufacture, the manufacturing efficiency of the circuit board is improved, and the price of the circuit board can be reduced; through setting up water-absorbing medium layer 9, when circuit board body 1 was deposited, water-absorbing medium layer 9 can absorb entering steam in through-hole 2 and the blind hole 3 to improve waterproof nature, when circuit board body 1 used, it can to take out water-absorbing medium layer 9.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.