阅读说明：本技术 图像显示器及其拼接式电路承载与控制模块 (Image display and splicing type circuit bearing and control module thereof ) 是由 廖建硕 于 2020-07-10 设计创作，主要内容包括：本发明公开一种图像显示器及其拼接式电路承载与控制模块。拼接式电路承载与控制模块包括第一电路基板结构、控制基板结构、第二电路基板结构、绝缘连接结构以及导电连接结构。第一电路基板结构包括第一承载基板、第一电路布局层以及多个第一导电贯穿体。控制基板结构包括电路基板以及电路控制芯片。第二电路基板结构包括第二承载基板以及第二电路布局层。绝缘连接结构连接于第一承载基板与第二承载基板之间。导电连接结构电性连接于第一电路布局层与第二电路布局层之间。借此,以使得控制基板结构能被放置在第一电路基板结构的下方,且控制基板结构能通过多个第一导电贯穿体以电性连接于第一电路基板结构与第二电路基板结构。(The invention discloses an image display and a splicing type circuit bearing and controlling module thereof. The spliced circuit bearing and control module comprises a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulation connection structure and a conductive connection structure. The first circuit substrate structure comprises a first bearing substrate, a first circuit layout layer and a plurality of first conductive penetrating bodies. The control substrate structure comprises a circuit substrate and a circuit control chip. The second circuit substrate structure comprises a second bearing substrate and a second circuit layout layer. The insulating connection structure is connected between the first bearing substrate and the second bearing substrate. The conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer. Therefore, the control substrate structure can be placed below the first circuit substrate structure, and the control substrate structure can be electrically connected with the first circuit substrate structure and the second circuit substrate structure through the plurality of first conductive penetrating bodies.)

1. A tiled circuitry load-bearing and control module, comprising:

the first circuit substrate structure comprises a first bearing substrate, a first circuit layout layer and a plurality of first conductive penetrating bodies, wherein the first circuit layout layer is arranged on the upper surface of the first bearing substrate, and the plurality of first conductive penetrating bodies are electrically connected to the first circuit layout layer and penetrate through the first bearing substrate;

the control substrate structure comprises a circuit substrate arranged below the lower surface of the first bearing substrate and a circuit control chip arranged on the circuit substrate;

a second circuit substrate structure, the second circuit substrate structure including a second carrier substrate and a second circuit layout layer disposed on an upper surface of the second carrier substrate;

the insulating connecting structure is connected between the first bearing substrate and the second bearing substrate; and

and the conductive connection structure is arranged on the first bearing substrate, the second bearing substrate and the insulating connection structure and is electrically connected between the first circuit layout layer and the second circuit layout layer.

2. The tiled circuit carrier and control module of claim 1 wherein the first circuit substrate structure and the control substrate structure are both disposed within a housing and a first lateral end of the first carrier substrate is proximate to or in contact with a first interior surface of the housing such that a first dead-man gap is formed between the first lateral end of the first carrier substrate and the first interior surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure includes an insulating connection layer connected between a second side end of the first carrier substrate and a second side end of the second carrier substrate, and the upper surface of the first carrier substrate, the upper surface of the second carrier substrate, and an upper surface of the insulating connection layer are aligned with each other.

3. The tiled circuitry carrier and control module of claim 1 wherein each of the first conductive vias has a first top bonding pad and a first bottom bonding pad corresponding to the first top bonding pad, and the first circuit layout layer and the circuit substrate are electrically connected to the first top bonding pad and the first bottom bonding pad, respectively; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

4. A tiled circuitry load-bearing and control module, comprising:

the first circuit substrate structure comprises a first bearing substrate, a first circuit layout layer and a plurality of first conductive penetrating bodies, wherein the first circuit layout layer is arranged on the first bearing substrate, and the plurality of first conductive penetrating bodies are electrically connected to the first circuit layout layer and penetrate through the first bearing substrate;

the control substrate structure comprises a circuit substrate and a circuit control chip, wherein the circuit substrate is electrically connected with the first conductive penetrating bodies, and the circuit control chip is arranged on the circuit substrate;

a second circuit substrate structure, the second circuit substrate structure including a second carrier substrate and a second circuit layout layer disposed on the second carrier substrate;

the insulating connecting structure is connected between the first bearing substrate and the second bearing substrate; and

and the conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer.

5. The tiled circuit carrier and control module of claim 4 wherein the first circuit substrate structure and the control substrate structure are both disposed within a housing and a first lateral end of the first carrier substrate is proximate to or in contact with a first interior surface of the housing such that a first dead-man gap is formed between the first lateral end of the first carrier substrate and the first interior surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure comprises an insulating connection layer connected between a second side end of the first bearing substrate and a second side end of the second bearing substrate, and the upper surface of the first bearing substrate, the upper surface of the second bearing substrate and an upper surface of the insulating connection layer are aligned with each other; the conductive connection structure comprises a conductive connection layer electrically connected between the first circuit layout layer and the second circuit layout layer, and the conductive connection layer is arranged on the upper surface of the first bearing substrate, the upper surface of the second bearing substrate and the upper surface of the insulating connection layer; each first conductive penetrating body is provided with a first top end welding area and a first bottom end welding area corresponding to the first top end welding area, and the first circuit layout layer and the circuit substrate are respectively and electrically connected with the first top end welding area and the first bottom end welding area; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

6. An image display device, comprising a tiled circuitry carrying and control module and an image display module electrically connected to the tiled circuitry carrying and control module, wherein the tiled circuitry carrying and control module comprises:

the first circuit substrate structure comprises a first bearing substrate, a first circuit layout layer and a plurality of first conductive penetrating bodies, wherein the first circuit layout layer is arranged on the upper surface of the first bearing substrate, and the plurality of first conductive penetrating bodies are electrically connected to the first circuit layout layer and penetrate through the first bearing substrate;

the control substrate structure comprises a circuit substrate arranged below the lower surface of the first bearing substrate and a circuit control chip arranged on the circuit substrate;

a second circuit substrate structure, the second circuit substrate structure including a second carrier substrate and a second circuit layout layer disposed on an upper surface of the second carrier substrate;

the insulating connecting structure is connected between the first bearing substrate and the second bearing substrate; and

a conductive connection structure disposed on the first carrier substrate, the second carrier substrate and the insulating connection structure and electrically connected between the first circuit layout layer and the second circuit layout layer;

the image display module is electrically connected to the first circuit layout layer and the second circuit layout layer.

7. A display device as claimed in claim 6, wherein the first circuit substrate structure and the control substrate structure are disposed in a housing, and a first side end of the first carrier substrate is close to or in contact with a first inner surface of the housing, so that a first unoccupied gap is formed between the first side end of the first carrier substrate and the first inner surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure includes an insulating connection layer connected between a second side end of the first carrier substrate and a second side end of the second carrier substrate, and the upper surface of the first carrier substrate, the upper surface of the second carrier substrate, and an upper surface of the insulating connection layer are aligned with each other.

8. A display device as claimed in claim 6, wherein each of the first conductive vias has a first top bonding pad and a first bottom bonding pad corresponding to the first top bonding pad, and the first circuit layout layer and the circuit substrate are electrically connected to the first top bonding pad and the first bottom bonding pad, respectively; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

9. A display device as claimed in claim 6, wherein the image display module comprises an LED display module or an OLED display module disposed above the tiled circuitry carrier and control module.

10. An image display device as claimed in claim 6, wherein the image display module comprises an LCD display module disposed above the tiled circuitry carrying and control module and a backlight module disposed below the tiled circuitry carrying and control module.

Technical Field

The present invention relates to a display and a circuit carrying and control module thereof, and more particularly to an image display and a splicing type circuit carrying and control module thereof.

Background

In the prior art, a flexible circuit board carrying a circuit control chip occupies a part of the width of the image display.

Disclosure of Invention

The present invention provides an image display and a splicing circuit carrying and controlling module thereof, aiming at the defects of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a splicing circuit carrying and controlling module, which includes: the circuit board comprises a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulation connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer disposed on an upper surface of the first carrier substrate, and a plurality of first conductive vias electrically connected to the first circuit layout layer and penetrating through the first carrier substrate. The control substrate structure comprises a circuit substrate arranged below a lower surface of the first bearing substrate and a circuit control chip arranged on the circuit substrate. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer disposed on an upper surface of the second carrier substrate. The insulating connection structure is connected between the first bearing substrate and the second bearing substrate. The conductive connection structure is disposed on the first carrier substrate, the second carrier substrate and the insulating connection structure and electrically connected between the first circuit layout layer and the second circuit layout layer.

Furthermore, the first circuit substrate structure and the control substrate structure are both disposed in a housing, and a first side end of the first carrier substrate is close to or in contact with a first inner surface of the housing, so that a first unoccupied gap is formed between the first side end of the first carrier substrate and the first inner surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure includes an insulating connection layer connected between a second side end of the first carrier substrate and a second side end of the second carrier substrate, and the upper surface of the first carrier substrate, the upper surface of the second carrier substrate, and an upper surface of the insulating connection layer are aligned with each other.

Furthermore, each first conductive through body has a first top bonding pad and a first bottom bonding pad corresponding to the first top bonding pad, and the first circuit layout layer and the circuit substrate are electrically connected to the first top bonding pad and the first bottom bonding pad, respectively; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a splicing circuit carrying and controlling module, which includes: the circuit board comprises a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulation connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer disposed on the first carrier substrate, and a plurality of first conductive vias electrically connected to the first circuit layout layer and penetrating through the first carrier substrate. The control substrate structure comprises a circuit substrate electrically connected with the first conductive penetrating bodies and a circuit control chip arranged on the circuit substrate. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer disposed on the second carrier substrate. The insulating connection structure is connected between the first bearing substrate and the second bearing substrate. The conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer.

Furthermore, the first circuit substrate structure and the control substrate structure are both disposed in a housing, and a first side end of the first carrier substrate is close to or in contact with a first inner surface of the housing, so that a first unoccupied gap is formed between the first side end of the first carrier substrate and the first inner surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure comprises an insulating connection layer connected between a second side end of the first bearing substrate and a second side end of the second bearing substrate, and the upper surface of the first bearing substrate, the upper surface of the second bearing substrate and an upper surface of the insulating connection layer are aligned with each other; the conductive connection structure comprises a conductive connection layer electrically connected between the first circuit layout layer and the second circuit layout layer, and the conductive connection layer is arranged on the upper surface of the first bearing substrate, the upper surface of the second bearing substrate and the upper surface of the insulating connection layer; each first conductive penetrating body is provided with a first top end welding area and a first bottom end welding area corresponding to the first top end welding area, and the first circuit layout layer and the circuit substrate are respectively and electrically connected with the first top end welding area and the first bottom end welding area; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

In order to solve the above technical problem, another technical solution of the present invention is to provide an image display device, which includes a tiled circuit carrying and controlling module and an image display module electrically connected to the tiled circuit carrying and controlling module. The tiled circuitry bears and control module includes: the circuit board comprises a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulation connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer disposed on an upper surface of the first carrier substrate, and a plurality of first conductive vias electrically connected to the first circuit layout layer and penetrating through the first carrier substrate. The control substrate structure comprises a circuit substrate arranged below a lower surface of the first bearing substrate and a circuit control chip arranged on the circuit substrate. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer disposed on an upper surface of the second carrier substrate. The insulating connection structure is connected between the first bearing substrate and the second bearing substrate. The conductive connection structure is disposed on the first carrier substrate, the second carrier substrate and the insulating connection structure and electrically connected between the first circuit layout layer and the second circuit layout layer. The image display module is electrically connected to the first circuit layout layer and the second circuit layout layer.

Furthermore, the first circuit substrate structure and the control substrate structure are both disposed in a housing, and a first side end of the first carrier substrate is close to or in contact with a first inner surface of the housing, so that a first unoccupied gap is formed between the first side end of the first carrier substrate and the first inner surface of the housing; the second circuit substrate structure is arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell; the insulating connection structure includes an insulating connection layer connected between a second side end of the first carrier substrate and a second side end of the second carrier substrate, and the upper surface of the first carrier substrate, the upper surface of the second carrier substrate, and an upper surface of the insulating connection layer are aligned with each other.

Furthermore, each first conductive through body has a first top bonding pad and a first bottom bonding pad corresponding to the first top bonding pad, and the first circuit layout layer and the circuit substrate are electrically connected to the first top bonding pad and the first bottom bonding pad, respectively; the circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, and the plurality of first conductive contacts of the circuit substrate are electrically connected to the plurality of first bottom-end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through the first unoccupied object gap.

Further, the image display module comprises an LED display module or an OLED display module arranged above the spliced circuit bearing and control module.

Furthermore, the image display module comprises an LCD display module arranged above the spliced circuit bearing and control module and a backlight module arranged below the spliced circuit bearing and control module.

One of the benefits of the image display and the tiled circuit carrying and controlling module thereof of the present invention is that the first circuit substrate structure includes a first carrying substrate, a first circuit layout layer disposed on the first carrying substrate, and a plurality of first conductive vias electrically connected to the first circuit layout layer and penetrating through the first carrying substrate, the controlling substrate structure includes a circuit substrate electrically connected to the plurality of first conductive vias and a circuit controlling chip disposed on the circuit substrate, the second circuit substrate structure includes a second carrying substrate and a second circuit layout layer disposed on the second carrying substrate, the insulating connecting structure is connected between the first carrying substrate and the second carrying substrate, and the conductive connecting structure is electrically connected to the first circuit layout layer and the second circuit layout layer The technical scheme of the method includes that the control substrate structure can be placed below the first circuit substrate structure, and the control substrate structure can be electrically connected with the first circuit substrate structure and the second circuit substrate structure through a plurality of first conductive penetrating bodies.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and not for purposes of limitation.

Drawings

Fig. 1 is a schematic cross-sectional view of a first circuit substrate structure of a tiled circuit carrier and control module according to a first embodiment of the invention.

Fig. 2 is an enlarged schematic view of section II of fig. 1.

Fig. 3 is a schematic top view of a portion of a first circuit substrate structure of a tiled circuit carrier and control module according to a first embodiment of the invention.

Fig. 4 is a schematic bottom view of a first circuit substrate structure of a tiled circuit carrier and control module according to a first embodiment of the invention.

Fig. 5 is a schematic cross-sectional view illustrating a second circuit substrate structure of a tiled circuit carrier and control module according to a first embodiment of the invention.

Fig. 6 is a schematic cross-sectional view of a tiled circuit carrier and control module according to a first embodiment of the invention.

Fig. 7 is a schematic cross-sectional view of an image display provided in a second embodiment of the invention.

Fig. 8 is a schematic cross-sectional view of an image display provided by a third embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of another image display device according to a third embodiment of the invention.

Detailed Description

The following description is provided for the embodiments of the present disclosure relating to an image display and its tiled circuit carrier and control module, and the advantages and effects of the present disclosure will be apparent to those skilled in the art from the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1 to 6, a first embodiment of the invention provides a tiled circuit carrying and control module M, which includes: a first circuit substrate structure 1, a control substrate structure 2, a second circuit substrate structure 3, an insulation connection structure 5 and a conductive connection structure 6.

More specifically, referring to fig. 1 to 3, the first circuit substrate structure 1 includes a first carrier substrate 11, a first circuit layout layer 12 disposed on an upper surface of the first carrier substrate 11, and a plurality of first conductive vias 13 electrically connected to the first circuit layout layer 12 and penetrating through the first carrier substrate 11. In addition, each first conductive through body 13 has a first top land 131 and a first bottom land 132 corresponding to the first top land 131, and the first top land 131 and the first bottom land 132 are respectively disposed on two opposite ends of the first conductive through body 13. The first carrier substrate 11 may be, for example, a silicon substrate, a glass substrate, or any circuit carrier substrate that can carry a circuit layer. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

More specifically, as shown in fig. 1, fig. 2 and fig. 4, the control substrate structure 2 includes a circuit substrate 21 disposed below a lower surface of the first carrier substrate 11 and a circuit control chip 22 (or signal control chip) disposed on the circuit substrate 21, and the circuit control chip 22 is electrically connected to the circuit substrate 21. In addition, the first circuit layout layer 12 and the circuit substrate 21 can be electrically connected to the first top end bonding pad 131 and the first bottom end bonding pad 132, respectively. For example, the circuit substrate 21 may be a rigid circuit board or a flexible circuit board, and the circuit substrate 21 includes a plurality of first conductive contacts 210 electrically connected to the plurality of first conductive vias 13, respectively. In addition, the first conductive contacts 210 of the circuit substrate 21 can be electrically connected to the first bottom land areas 132 of the first conductive vias 13 through a first anisotropic conductive film F1, and the first anisotropic conductive film F1 can be replaced by an anisotropic conductive adhesive, an electrical connector, a plurality of solder balls, or the like. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

More specifically, as shown in fig. 5, the second circuit substrate structure 3 includes a second carrier substrate 31 and a second circuit layout layer 32 disposed on an upper surface of the second carrier substrate 31. The second carrier substrate 31 may be, for example, a silicon substrate, a glass substrate, or any circuit carrier substrate that can carry a circuit layer. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

It should be noted that, referring to fig. 1, fig. 5 and fig. 6, when the first circuit substrate structure 1 and the control substrate structure 2 are both disposed in a housing C, a first side 1101 of the first carrier substrate 11 may be close to (or very close to) or contact (or directly contact or indirectly contact) a first inner surface C101 of the housing C, so that a first unoccupied gap G1 is formed between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C. In addition, when the second circuit substrate structure 3 is disposed in the housing C, a first side end 3101 of the second carrier substrate 31 may be close to (or very close to) or in contact with (or directly or indirectly contact with) a second inner surface C102 of the housing C, so that a second non-occupancy gap G2 is formed between the first side end 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C. Furthermore, since the control substrate structure 2 can be disposed under the first circuit substrate structure 1, and the control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 through the plurality of first conductive vias 13, the control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied object gap G1, so as to effectively reduce the distance or space between the first side end 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C, and further effectively reduce the overall size (or width) of the housing C of the electronic product using the splicing circuit carrier and control module M of the present invention.

More specifically, referring to fig. 1, fig. 5 and fig. 6, the insulating connection structure 5 is connected between the first carrier substrate 11 and the second carrier substrate 31, and the conductive connection structure 6 is disposed on the first carrier substrate 11, the second carrier substrate 31 and the insulating connection structure 5 and electrically connected between the first circuit layout layer 12 and the second circuit layout layer 32. For example, the insulating connection structure 5 includes an insulating connection layer 50 connected between a second side end 1102 of the first carrier substrate 11 and a second side end 3102 of the second carrier substrate 31, and the upper surface 1100 of the first carrier substrate 11, the upper surface 3100 of the second carrier substrate 31 and an upper surface 5000 of the insulating connection layer 50 are aligned with each other. In addition, the conductive connection structure 6 includes a conductive connection layer 60 electrically connected between the first circuit layout layer 12 and the second circuit layout layer 32, and the conductive connection layer 60 is disposed on the upper surface 1100 of the first carrier substrate 11, the upper surface 3100 of the second carrier substrate 31, and the upper surface 5000 of the insulating connection layer 50. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Second embodiment

Referring to fig. 6 and 7, a second embodiment of the invention provides an image display Z, which includes a tiled circuit carrying and control module M and an image display module D electrically connected to the tiled circuit carrying and control module M. In addition, the tiled circuit carrying and controlling module M includes a first circuit substrate structure 1, a control substrate structure 2, a second circuit substrate structure 3, an insulating connection structure 5 and a conductive connection structure 6 (same as the first embodiment, as shown in fig. 6), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 and the second circuit layout layer 32 of the second circuit substrate structure 3. For example, the image display module D includes an LED display module (D1-LED) or an OLED display module (D1-OLED) disposed above the tiled electrical circuit carrying and control module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the overall size (or width) of the housing C of the image display Z using the tiled circuit carrier and control module M of the invention can be effectively reduced.

Third embodiment

Referring to fig. 6 and 8, a third embodiment of the invention provides an image display Z, which includes a tiled circuit carrying and control module M and an image display module D electrically connected to the tiled circuit carrying and control module M. In addition, the tiled circuit carrying and controlling module M includes a first circuit substrate structure 1, a control substrate structure 2, a second circuit substrate structure 3, an insulating connection structure 5 and a conductive connection structure 6 (same as the first embodiment, as shown in fig. 6), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 and the second circuit layout layer 32 of the second circuit substrate structure 3. For example, the image display module D includes an LCD display module (D1-LCD) disposed above the tiled LCD display module M and a backlight module D2 disposed below the tiled LCD display module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

It is noted that, as shown in fig. 9, the control substrate structure 2 may also extend along the side and bottom surfaces of the backlight module D2 (i.e., the control substrate structure 2 is not necessarily disposed between the circuit substrate structure 1 and the backlight module D2), and the circuit control chip 22 of the control substrate structure 2 can be disposed under the backlight module D2. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the overall size (or width) of the housing C of the image display Z using the tiled circuit carrier and control module M of the invention can be effectively reduced.

Advantageous effects of the embodiments

One of the advantages of the present invention is that the image display Z and the tiled circuit supporting and controlling module M thereof provided by the present invention can be implemented by "the first circuit substrate structure 1 includes a first supporting substrate 11, a first circuit layout layer 12 disposed on the first supporting substrate 11, and a plurality of first conductive vias 13 electrically connected to the first circuit layout layer 12 and penetrating through the first supporting substrate 11", "the control substrate structure 2 includes a circuit substrate 21 electrically connected to the plurality of first conductive vias 13 and a circuit control chip 22 disposed on the circuit substrate 21", "the second circuit substrate structure 3 includes a second supporting substrate 31 and a second circuit layout layer 32 disposed on the second supporting substrate 31", "the insulating connecting structure 5 is connected between the first supporting substrate 11 and the second supporting substrate 31", and "the conductive connecting structure 6 is electrically connected between the first circuit layout layer 12 and the second circuit layout layer 32 "to make the control substrate structure 2 capable of being placed under the first circuit substrate structure 1, and the control substrate structure 2 capable of being electrically connected to the first circuit substrate structure 1 and the second circuit substrate structure 3 through the plurality of first conductive vias 13.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.