阅读说明：本技术 图像显示器及其电路承载与控制模块 (Image display and circuit bearing and control module thereof ) 是由 廖建硕 于 2020-07-10 设计创作，主要内容包括：本发明公开一种图像显示器及其电路承载与控制模块。电路承载与控制模块包括一电路基板结构以及一控制基板结构。电路基板结构包括一承载基板、设置在承载基板上的一电路布局层以及电性连接于电路布局层且贯穿承载基板的多个导电贯穿体。控制基板结构包括设置在电路基板结构的下方的一电路基板以及设置在电路基板上的一电路控制芯片。由此,以使得控制基板结构能被放置在电路基板结构的下方,且控制基板结构能通过多个导电贯穿体以电性连接于电路基板结构。(The invention discloses an image display and a circuit bearing and control module thereof. The circuit bearing and control module comprises a circuit substrate structure and a control substrate structure. The circuit substrate structure comprises a bearing substrate, a circuit layout layer arranged on the bearing substrate and a plurality of conductive through bodies which are electrically connected with the circuit layout layer and penetrate through the bearing substrate. The control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate. Therefore, the control substrate structure can be placed below the circuit substrate structure, and the control substrate structure can be electrically connected with the circuit substrate structure through the plurality of conductive penetrating bodies.)

1. A circuit carrying and control module, comprising:

the circuit substrate structure comprises a bearing substrate, a circuit layout layer arranged on the bearing substrate and a plurality of conductive penetrating bodies which are electrically connected with the circuit layout layer and penetrate through the bearing substrate; and

the control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate.

2. The circuit carrying and control module according to claim 1, further comprising:

another circuit substrate structure, the another circuit substrate structure includes another carrying substrate, another circuit layout layer disposed on the another carrying substrate, and another plurality of conductive through-bodies electrically connected to the another circuit layout layer and penetrating the another carrying substrate; and

another control substrate structure, said another control substrate structure including another circuit substrate disposed below said another circuit substrate structure and another circuit control chip disposed on said another circuit substrate;

the circuit substrate structure and the control substrate structure are arranged in a shell, and one side end of the bearing substrate is close to or contacted with an inner surface of the shell, so that an unoccupied gap is formed between the side end of the bearing substrate and the inner surface of the shell;

the other circuit substrate structure and the other control substrate structure are both arranged in the shell, and one side end of the other bearing substrate is close to or contacted with the other inner surface of the shell, so that another non-occupied object gap is formed between the side end of the other bearing substrate and the inner surface of the shell.

3. The circuit carrier and control module as claimed in claim 2, wherein each of the conductive vias has a top bonding pad and a bottom bonding pad corresponding to the top bonding pad, and the circuit layout layer and the circuit substrate are electrically connected to the top bonding pad and the bottom bonding pad, respectively; the circuit substrate comprises a plurality of conductive contacts which are respectively and electrically connected with the plurality of conductive penetrating bodies, and the plurality of conductive contacts of the circuit substrate are respectively and electrically connected with the plurality of bottom end welding areas of the plurality of conductive penetrating bodies through an anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate cannot pass through the non-occupied object gap; wherein each of the other conductive vias has another top land and another bottom land corresponding to the another top land, and the another circuit layout layer and the another circuit substrate are electrically connected to the another top land and the another bottom land, respectively; wherein the other circuit substrate comprises another conductive contacts electrically connected to the other conductive vias, respectively, and the other conductive contacts of the other circuit substrate are electrically connected to the other bottom pads of the other conductive vias through another anisotropic conductive film, respectively; the other circuit substrate is a hard circuit board or a flexible circuit board, and the other circuit substrate does not pass through the other unoccupied object gap.

4. A circuit carrying and control module, comprising:

the first circuit substrate structure comprises a first bearing substrate, a first circuit layout layer and a plurality of first conductive penetrating bodies, wherein the first circuit layout layer is arranged on the upper surface of the first bearing substrate, and the plurality of first conductive penetrating bodies are electrically connected to the first circuit layout layer and penetrate through the first bearing substrate;

a first control substrate structure including a first circuit substrate disposed below a lower surface of the first carrier substrate and a first circuit control chip disposed on the first circuit substrate;

a second circuit substrate structure, wherein the second circuit substrate structure includes a second carrier substrate, a second circuit layout layer disposed on an upper surface of the second carrier substrate, and a plurality of second conductive vias electrically connected to the second circuit layout layer and penetrating the second carrier substrate; and

a second control substrate structure, wherein the second control substrate structure comprises a second circuit substrate arranged below a lower surface of the second bearing substrate and a second circuit control chip arranged on the second circuit substrate;

the first circuit substrate structure and the first control substrate structure are both arranged in a shell, and a first side end of the first bearing substrate is close to or in contact with a first inner surface of the shell, so that a first unoccupied gap is formed between the first side end of the first bearing substrate and the first inner surface of the shell;

the second circuit substrate structure and the second control substrate structure are both arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied-object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell;

a second side end of the first carrier substrate and a second side end of the second carrier substrate are close to each other or contact each other, so that a third non-occupied-object gap is formed between the second side end of the first carrier substrate and the second side end of the second carrier substrate.

5. The circuit carrier and control module as claimed in claim 4, wherein each of the first conductive vias has a first top land and a first bottom land corresponding to the first top land, and the first circuit layout layer and the first circuit substrate are electrically connected to the first top land and the first bottom land, respectively; the first circuit substrate comprises a plurality of first conductive contacts electrically connected to the plurality of first conductive vias, respectively, and the plurality of first conductive contacts of the first circuit substrate are electrically connected to the plurality of first bottom end bonding pads of the plurality of first conductive vias through a first anisotropic conductive film, respectively; the first circuit substrate is a hard circuit board or a flexible circuit board, and the first circuit substrate does not pass through the first unoccupied object gap; each second conductive penetrating body is provided with a second top end welding area and a second bottom end welding area corresponding to the second top end welding area, and the second circuit layout layer and the second circuit substrate are respectively and electrically connected with the second top end welding area and the second bottom end welding area; the second circuit substrate includes a plurality of second conductive contacts electrically connected to the plurality of second conductive vias, respectively, and the plurality of second conductive contacts of the second circuit substrate are electrically connected to the plurality of second bottom end bonding pads of the plurality of second conductive vias through a second anisotropic conductive film, respectively; the second circuit substrate is a rigid circuit board or a flexible circuit board, and the second circuit substrate does not pass through the second unoccupied gap.

6. An image display device comprising a circuit carrying and controlling module and an image display module electrically connected to the circuit carrying and controlling module, wherein the circuit carrying and controlling module comprises:

the circuit substrate structure comprises a bearing substrate, a circuit layout layer arranged on the bearing substrate and a plurality of conductive penetrating bodies which are electrically connected with the circuit layout layer and penetrate through the bearing substrate; and

the control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate;

the image display module is electrically connected to the circuit layout layer of the circuit substrate structure.

7. The image display of claim 6, wherein the circuit carrier and control module further comprises:

another circuit substrate structure, the another circuit substrate structure includes another carrying substrate, another circuit layout layer disposed on the another carrying substrate, and another plurality of conductive through-bodies electrically connected to the another circuit layout layer and penetrating the another carrying substrate; and

another control substrate structure, said another control substrate structure including another circuit substrate disposed below said another circuit substrate structure and another circuit control chip disposed on said another circuit substrate;

the circuit substrate structure and the control substrate structure are arranged in a shell, and one side end of the bearing substrate is close to or contacted with an inner surface of the shell, so that an unoccupied gap is formed between the side end of the bearing substrate and the inner surface of the shell;

the other circuit substrate structure and the other control substrate structure are both arranged in the shell, and one side end of the other bearing substrate is close to or contacted with the other inner surface of the shell, so that another non-occupied object gap is formed between the side end of the other bearing substrate and the inner surface of the shell.

8. A display device as claimed in claim 7, wherein each of the conductive vias has a top bonding pad and a bottom bonding pad corresponding to the top bonding pad, and the circuit layout layer and the circuit substrate are electrically connected to the top bonding pad and the bottom bonding pad, respectively; the circuit substrate comprises a plurality of conductive contacts which are respectively and electrically connected with the plurality of conductive penetrating bodies, and the plurality of conductive contacts of the circuit substrate are respectively and electrically connected with the plurality of bottom end welding areas of the plurality of conductive penetrating bodies through an anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate cannot pass through the non-occupied object gap; wherein each of the other conductive vias has another top land and another bottom land corresponding to the another top land, and the another circuit layout layer and the another circuit substrate are electrically connected to the another top land and the another bottom land, respectively; wherein the other circuit substrate comprises another conductive contacts electrically connected to the other conductive vias, respectively, and the other conductive contacts of the other circuit substrate are electrically connected to the other bottom pads of the other conductive vias through another anisotropic conductive film, respectively; the other circuit substrate is a hard circuit board or a flexible circuit board, and the other circuit substrate does not pass through the other unoccupied object gap.

9. A display device as claimed in claim 6, wherein the image display module comprises an LED display module or an OLED display module disposed above the circuit carrier and control module.

10. A display device as claimed in claim 6, wherein the image display module comprises an LCD display module disposed above the circuit carrier and control module and a backlight module disposed below the circuit carrier and control module.

Technical Field

The present invention relates to a display and a supporting and controlling module thereof, and more particularly to an image display and a circuit supporting and controlling module thereof.

Background

In the prior art, a flexible circuit board carrying a circuit control chip occupies a part of the width of the image display.

Disclosure of Invention

The present invention provides an image display and a circuit supporting and controlling module thereof, aiming at the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions of the present invention is to provide a circuit carrying and controlling module, which includes: a circuit substrate structure and a control substrate structure. The circuit substrate structure comprises a bearing substrate, a circuit layout layer arranged on the bearing substrate and a plurality of conductive through bodies which are electrically connected with the circuit layout layer and penetrate through the bearing substrate. The control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate.

Further, the circuit carrying and controlling module further comprises: another circuit substrate structure and another control substrate structure. The other circuit substrate structure comprises another bearing substrate, another circuit layout layer arranged on the other bearing substrate and another plurality of conductive penetrating bodies which are electrically connected with the other circuit layout layer and penetrate through the other bearing substrate. The other control substrate structure comprises another circuit substrate arranged below the other circuit substrate structure and another circuit control chip arranged on the other circuit substrate. The circuit substrate structure and the control substrate structure are both arranged in a shell, and one side end of the bearing substrate is close to or contacted with one inner surface of the shell, so that an unoccupied gap is formed between the side end of the bearing substrate and the inner surface of the shell. The other circuit substrate structure and the other control substrate structure are arranged in the shell, and one side end of the other bearing substrate is close to or contacted with the other inner surface of the shell, so that another unoccupied gap is formed between the side end of the other bearing substrate and the inner surface of the shell.

Furthermore, each conductive penetrating body is provided with a top welding area and a bottom welding area corresponding to the top welding area, and the circuit layout layer and the circuit substrate are respectively and electrically connected with the top welding area and the bottom welding area; the circuit substrate comprises a plurality of conductive contacts which are respectively and electrically connected with the plurality of conductive through bodies, and the plurality of conductive contacts of the circuit substrate are respectively and electrically connected with a plurality of bottom end welding areas of the plurality of conductive through bodies through an anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through a non-occupied object gap; wherein each of the other conductive through bodies has another top bonding pad and another bottom bonding pad corresponding to the other top bonding pad, and the other circuit layout layer and the other circuit substrate are electrically connected to the other top bonding pad and the other bottom bonding pad respectively; the other circuit substrate comprises another conductive contacts which are respectively and electrically connected with the other conductive through bodies, and the other conductive contacts of the other circuit substrate are respectively and electrically connected with the other bottom end welding areas of the other conductive through bodies through another anisotropic conductive film; the other circuit substrate is a hard circuit board or a flexible circuit board, and the other circuit substrate does not pass through another unoccupied object gap.

In order to solve the above technical problem, another technical solution of the present invention is to provide a circuit carrying and controlling module, which includes: the circuit board comprises a first circuit substrate structure, a first control substrate structure, a second circuit substrate structure and a second control substrate structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer disposed on an upper surface of the first carrier substrate, and a plurality of first conductive vias electrically connected to the first circuit layout layer and penetrating through the first carrier substrate. The first control substrate structure comprises a first circuit substrate arranged below a lower surface of the first bearing substrate and a first circuit control chip arranged on the first circuit substrate. The second circuit substrate structure includes a second carrier substrate, a second circuit layout layer disposed on an upper surface of the second carrier substrate, and a plurality of second conductive vias electrically connected to the second circuit layout layer and penetrating the second carrier substrate. The second control substrate structure comprises a second circuit substrate arranged below a lower surface of the second bearing substrate and a second circuit control chip arranged on the second circuit substrate. The first circuit substrate structure and the first control substrate structure are both arranged in a shell, and a first side end of the first bearing substrate is close to or in contact with a first inner surface of the shell, so that a first unoccupied gap is formed between the first side end of the first bearing substrate and the first inner surface of the shell. The second circuit substrate structure and the second control substrate structure are both arranged in the shell, and a first side end of the second bearing substrate is close to or in contact with a second inner surface of the shell, so that a second non-occupied object gap is formed between the first side end of the second bearing substrate and the second inner surface of the shell. The second side end of the first carrier substrate and the second side end of the second carrier substrate are close to each other or contact each other, so that a third non-occupied space is formed between the second side end of the first carrier substrate and the second side end of the second carrier substrate.

Furthermore, each first conductive penetrating body is provided with a first top welding area and a first bottom welding area corresponding to the first top welding area, and the first circuit layout layer and the first circuit substrate are respectively and electrically connected with the first top welding area and the first bottom welding area; the first circuit substrate comprises a plurality of first conductive contacts which are respectively and electrically connected with the plurality of first conductive penetrating bodies, and the plurality of first conductive contacts of the first circuit substrate are respectively and electrically connected with a plurality of first bottom end welding areas of the plurality of first conductive penetrating bodies through a first anisotropic conductive film; the first circuit substrate is a hard circuit board or a flexible circuit board, and the first circuit substrate does not pass through the first unoccupied object gap; each second conductive penetrating body is provided with a second top end welding area and a second bottom end welding area corresponding to the second top end welding area, and the second circuit layout layer and the second circuit substrate are respectively and electrically connected with the second top end welding area and the second bottom end welding area; the second circuit substrate comprises a plurality of second conductive contacts which are respectively and electrically connected with the plurality of second conductive penetrating bodies, and the plurality of second conductive contacts of the second circuit substrate are respectively and electrically connected with a plurality of second bottom end welding areas of the plurality of second conductive penetrating bodies through a second anisotropic conductive film; the second circuit substrate is a rigid circuit board or a flexible circuit board, and the second circuit substrate does not pass through the second unoccupied object gap.

In order to solve the above technical problem, another technical solution of the present invention is to provide an image display device, which includes a circuit supporting and controlling module and an image display module electrically connected to the circuit supporting and controlling module. The circuit bearing and control module comprises: a circuit substrate structure and a control substrate structure. The circuit substrate structure comprises a bearing substrate, a circuit layout layer arranged on the bearing substrate and a plurality of conductive through bodies which are electrically connected with the circuit layout layer and penetrate through the bearing substrate. The control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate. The image display module is electrically connected to the circuit layout layer of the circuit substrate structure.

Further, the circuit carrying and controlling module further comprises: another circuit substrate structure and another control substrate structure. The other circuit substrate structure comprises another bearing substrate, another circuit layout layer arranged on the other bearing substrate and another plurality of conductive penetrating bodies which are electrically connected with the other circuit layout layer and penetrate through the other bearing substrate. The other control substrate structure comprises another circuit substrate arranged below the other circuit substrate structure and another circuit control chip arranged on the other circuit substrate. The circuit substrate structure and the control substrate structure are both arranged in a shell, and one side end of the bearing substrate is close to or contacted with one inner surface of the shell, so that an unoccupied gap is formed between the side end of the bearing substrate and the inner surface of the shell. The other circuit substrate structure and the other control substrate structure are arranged in the shell, and one side end of the other bearing substrate is close to or contacted with the other inner surface of the shell, so that another unoccupied gap is formed between the side end of the other bearing substrate and the inner surface of the shell.

Furthermore, each conductive penetrating body is provided with a top welding area and a bottom welding area corresponding to the top welding area, and the circuit layout layer and the circuit substrate are respectively and electrically connected with the top welding area and the bottom welding area; the circuit substrate comprises a plurality of conductive contacts which are respectively and electrically connected with the plurality of conductive through bodies, and the plurality of conductive contacts of the circuit substrate are respectively and electrically connected with a plurality of bottom end welding areas of the plurality of conductive through bodies through an anisotropic conductive film; the circuit substrate is a hard circuit board or a flexible circuit board, and the circuit substrate does not pass through a non-occupied object gap; wherein each of the other conductive through bodies has another top bonding pad and another bottom bonding pad corresponding to the other top bonding pad, and the other circuit layout layer and the other circuit substrate are electrically connected to the other top bonding pad and the other bottom bonding pad respectively; the other circuit substrate comprises another conductive contacts which are respectively and electrically connected with the other conductive through bodies, and the other conductive contacts of the other circuit substrate are respectively and electrically connected with the other bottom end welding areas of the other conductive through bodies through another anisotropic conductive film; the other circuit substrate is a hard circuit board or a flexible circuit board, and the other circuit substrate does not pass through another unoccupied object gap.

Further, the image display module comprises an LED display module or an OLED display module which is arranged above the circuit bearing and control module.

Further, the image display module comprises an LCD display module arranged above the circuit bearing and control module and a backlight module arranged below the circuit bearing and control module.

One of the benefits of the present invention is that the image display and the circuit supporting and controlling module thereof provided by the present invention can be implemented by a technical scheme that the circuit substrate structure comprises a supporting substrate, a circuit layout layer disposed on the supporting substrate, and a plurality of conductive through-bodies electrically connected to the circuit layout layer and penetrating through the supporting substrate, and the control substrate structure comprises a circuit substrate disposed under the circuit substrate structure and a circuit control chip disposed on the circuit substrate, so that the control substrate structure can be disposed under the circuit substrate structure, and the control substrate structure can be electrically connected to the circuit substrate structure through the plurality of conductive through-bodies.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and not for purposes of limitation.

Drawings

Fig. 1 is a schematic cross-sectional view illustrating a circuit carrying and control module disposed in a housing according to a first embodiment of the invention.

Fig. 2 is an enlarged schematic view of section II of fig. 1.

Fig. 3 is a schematic top view of a portion of a circuit carrying and control module according to a first embodiment of the present invention.

Fig. 4 is a bottom view of a circuit carrying and controlling module according to a first embodiment of the invention.

Fig. 5 is a schematic cross-sectional view illustrating a circuit carrier and control module disposed in a housing according to a second embodiment of the invention.

Fig. 6 is an enlarged schematic view of a VI portion of fig. 5.

Fig. 7 is a schematic top view of a portion of a circuit carrying and control module according to a second embodiment of the present invention.

Fig. 8 is a bottom view of a circuit carrier and control module according to a second embodiment of the invention.

Fig. 9 is a schematic cross-sectional view illustrating a circuit carrying and control module disposed in a housing according to a third embodiment of the invention.

Fig. 10 is a schematic cross-sectional view of an image display provided by a fourth embodiment of the invention.

Fig. 11 is a schematic cross-sectional view of an image display according to a fifth embodiment of the invention.

Fig. 12 is a schematic cross-sectional view of another image display device according to a fifth embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of an image display provided in a sixth embodiment of the invention.

Fig. 14 is a schematic cross-sectional view of an image display provided by a seventh embodiment of the invention.

Fig. 15 is a schematic cross-sectional view of another image display device according to a seventh embodiment of the invention.

Detailed Description

The following description is provided for the embodiments of the present disclosure relating to an image display and its circuit carrier and control module, and the advantages and effects of the present disclosure will be apparent to those skilled in the art from the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modifications and variations in various respects, all without departing from the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1 to 4, a first embodiment of the invention provides a circuit carrying and controlling module M, which includes: a first circuit-substrate configuration 1 (i.e. a circuit-substrate configuration) and a first control-substrate configuration 2 (i.e. a control-substrate configuration).

More specifically, referring to fig. 1 to 3, the first circuit substrate structure 1 includes a first carrier substrate 11 (i.e., a carrier substrate), a first circuit layout layer 12 (i.e., a circuit layout layer) disposed on an upper surface of the first carrier substrate 11, and a plurality of first conductive vias 13 (i.e., a plurality of conductive vias) electrically connected to the first circuit layout layer 12 and penetrating through the first carrier substrate 11. In addition, each of the first conductive vias 13 has a first top land 131 (i.e., a top land) and a first bottom land 132 (i.e., a bottom land) corresponding to the first top land 131, and the first top land 131 and the first bottom land 132 are respectively disposed at opposite ends of the first conductive via 13. The first carrier substrate 11 may be, for example, a silicon substrate, a glass substrate, or any circuit carrier substrate that can carry a circuit layer. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

More specifically, as shown in fig. 1, fig. 2 and fig. 4, the first control substrate structure 2 includes a first circuit substrate 21 (i.e., a circuit substrate) disposed below a lower surface of the first carrier substrate 11 and a first circuit control chip 22 (i.e., a circuit control chip or a signal control chip) disposed on the first circuit substrate 21, and the first circuit control chip 22 is electrically connected to the first circuit substrate 21. In addition, the first circuit layout layer 12 and the first circuit substrate 21 can be electrically connected to the first top end bonding pad 131 and the first bottom end bonding pad 132, respectively. For example, the first circuit substrate 21 may be a rigid circuit board or a flexible circuit board, and the first circuit substrate 21 includes a plurality of first conductive contacts 210 (i.e., a plurality of conductive contacts) electrically connected to the plurality of first conductive vias 13, respectively. In addition, the first conductive contacts 210 of the first circuit substrate 21 can be electrically connected to the first bottom lands 132 of the first conductive vias 13 through a first anisotropic conductive film F1 (i.e., an anisotropic conductive film), respectively, and the first anisotropic conductive film F1 can be replaced by an anisotropic conductive adhesive, an electrical connector, a plurality of solder balls, or the like. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

It should be noted that, as shown in fig. 1, when the first circuit substrate structure 1 and the first control substrate structure 2 are both disposed in a housing C, a first side 1101 of the first carrier substrate 11 may be close to (or very close to) or contact with (or directly contact with or indirectly contact with) a first inner surface C101 of the housing C, so that a first unoccupied gap G1 (i.e., an unoccupied gap) is formed between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C. In addition, since the first control substrate structure 2 can be disposed under the first circuit substrate structure 1, and the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 through the plurality of first conductive vias 13, the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1, so as to effectively reduce the distance or space between the first side end 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C, and further effectively reduce the overall size (or width) of the housing C of the electronic product using the circuit carrier and control module M of the present invention.

Second embodiment

Referring to fig. 5 to 8, a second embodiment of the invention provides a circuit carrying and controlling module M, which includes: a second circuit substrate structure 3 (i.e., another circuit substrate structure) and a second control substrate structure 4 (i.e., another control substrate structure).

More specifically, referring to fig. 5 to 7, the second circuit substrate structure 3 includes a second carrier substrate 31 (i.e., another carrier substrate), a second circuit layout layer 32 (i.e., another circuit layout layer) disposed on an upper surface of the second carrier substrate 31, and a plurality of second conductive vias 33 (i.e., another plurality of conductive vias) electrically connected to the second circuit layout layer 32 and penetrating through the second carrier substrate 31. In addition, each of the second conductive vias 33 has a second top land 331 (i.e., another top land) and a second bottom land 332 (i.e., another bottom land) corresponding to the second top land 331, and the second top land 331 and the second bottom land 332 are respectively disposed at opposite ends of the second conductive via 33. The second carrier substrate 31 may be, for example, a silicon substrate, a glass substrate, or any circuit carrier substrate that can carry a circuit layer. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

More specifically, referring to fig. 5, fig. 6 and fig. 8, the second control substrate structure 4 includes a second circuit substrate 41 (i.e. another circuit substrate) disposed below a lower surface of the second carrier substrate 31 and a second circuit control chip 42 (i.e. another circuit control chip or another signal control chip) disposed on the second circuit substrate 41, and the second circuit control chip 42 is electrically connected to the second circuit substrate 41. In addition, the second circuit layout layer 32 and the second circuit substrate 41 can be electrically connected to the second top land 331 and the second bottom land 332, respectively. For example, the second circuit substrate 41 may be a rigid circuit board or a flexible circuit board, and the second circuit substrate 41 includes a plurality of second conductive contacts 410 (i.e., another plurality of conductive contacts) electrically connected to the plurality of second conductive vias 33, respectively. In addition, the second conductive contacts 410 of the second circuit substrate 41 can be electrically connected to the second bottom lands 332 of the second conductive vias 33 through a second anisotropic conductive film F2 (i.e., another anisotropic conductive film), respectively, and the second anisotropic conductive film F2 can also be replaced by an anisotropic conductive adhesive, an electrical connector, a plurality of solder balls, or the like. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

It is noted that, as shown in fig. 5, when the second circuit substrate structure 3 and the second control substrate structure 4 are both disposed in the housing C, a first side end 3101 of the second carrier substrate 31 may be close to (or very close to) or in contact with (or directly in contact with or indirectly in contact with) a second inner surface C102 of the housing C, so that a second non-occupancy gap G2 (i.e. another non-occupancy gap) is formed between the first side end 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C. In addition, since the second control substrate structure 4 can be disposed under the second circuit substrate structure 3, and the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 through the plurality of second conductive vias 33, the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 without passing through the second unoccupied gap G2, so as to effectively reduce the distance or space between the first side end 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C, and further effectively reduce the overall size (or width) of the housing C of the electronic product using the circuit carrier and control module M of the present invention.

Third embodiment

Referring to fig. 9, a third embodiment of the invention provides a circuit carrying and controlling module M, which includes: a first circuit substrate structure 1, a first control substrate structure 2, a second circuit substrate structure 3 and a second control substrate structure 4. As can be seen from a comparison between fig. 9 and fig. 1 and 5, the greatest difference between the third embodiment of the present invention and the first and second embodiments is: in the third embodiment, a second side end 1102 of the first carrier substrate 11 and a second side end 3102 of the second carrier substrate 31 are close to each other (or very close to each other) or in contact with each other (or directly or indirectly in contact), so that a third unoccupied gap G3 (i.e. another unoccupied gap) is formed between the second side end 1102 of the first carrier substrate 11 and the second side end 3102 of the second carrier substrate 31.

It should be noted that, as shown in fig. 9, since the first control substrate structure 2 can be disposed under the first circuit substrate structure 1, and the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 through the plurality of first conductive vias 13, the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1 or the third unoccupied gap G3, so that the distance or space between the first side end 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the distance or space between the second side end 1102 of the first carrier substrate 11 and the second side end 3102 of the second carrier substrate 31 can be effectively reduced, thereby enabling the overall size (or width) of the housing C of the electronic product using the circuit carrier and control module M of the present invention to be effectively reduced.

It is to be noted that, as shown in fig. 9, since the second control substrate structure 4 can be disposed under the second circuit substrate structure 3, and the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 through the plurality of second conductive vias 33, the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 without passing through the second unoccupied gap G2 or the third unoccupied gap G3, so as to effectively reduce the distance or space between the first side end 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C, and effectively reduce the distance or space between the second side end 1102 of the first carrier substrate 11 and the second side end 3102 of the second carrier substrate 31, thereby effectively reducing the overall size (or width) of the housing C of the electronic product using the circuit carrier and control module M of the present invention.

Fourth embodiment

Referring to fig. 1 and 10, a fourth embodiment of the invention provides an image display Z, which includes a circuit supporting and controlling module M and an image display module D electrically connected to the circuit supporting and controlling module M. In addition, the circuit carrying and controlling module M includes a first circuit substrate structure 1 and a first control substrate structure 2 (same as the first embodiment, as shown in fig. 1), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1. For example, the image display module D includes an LED display module (D1-LED) or an OLED display module (D1-OLED) disposed above the circuit carrying and control module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the overall size (or width) of the housing C of the image display Z using the circuit supporting and controlling module M of the invention can be effectively reduced.

Fifth embodiment

Referring to fig. 1 and 11, a fifth embodiment of the invention provides an image display Z, which includes a circuit supporting and controlling module M and an image display module D electrically connected to the circuit supporting and controlling module M. In addition, the circuit carrying and controlling module M includes a first circuit substrate structure 1 and a first control substrate structure 2 (same as the first embodiment, as shown in fig. 1), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1. For example, the image display module D includes an LCD display module (D1-LCD) disposed above the circuit carrying and control module M and a backlight module D2 disposed below the circuit carrying and control module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the overall size (or width) of the housing C of the image display Z using the circuit supporting and controlling module M of the invention can be effectively reduced.

It is noted that, as shown in fig. 12, the first control substrate structure 2 may also extend along the side and the bottom of the backlight module D2 (that is, the first control substrate structure 2 is not necessarily disposed between the first circuit substrate structure 1 and the backlight module D2), and the first circuit control chip 22 of the first control substrate structure 2 can be disposed under the backlight module D2. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Sixth embodiment

Referring to fig. 9 and 13, a sixth embodiment of the invention provides an image display Z, which includes a circuit carrying and controlling module M and an image display module D electrically connected to the circuit carrying and controlling module M. In addition, the circuit carrying and controlling module M includes a first circuit substrate structure 1, a first control substrate structure 2, a second circuit substrate structure 3 and a second control substrate structure 4 (the same as the third embodiment, as shown in fig. 9), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1. For example, the image display module D includes an LED display module (D1-LED) or an OLED display module (D1-OLED) disposed above the circuit carrying and control module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1 or the third unoccupied gap G3, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the distance or space between the second side 1102 of the first carrier substrate 11 and the second side 3102 of the second carrier substrate 31 can be effectively reduced, so that the overall size (or width) of the housing C of the image display Z using the circuit carrier and control module M of the invention can be effectively reduced.

In addition, since the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 without passing through the second unoccupied gap G2 or the third unoccupied gap G3, the distance or space between the first side 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C can be effectively reduced, and the distance or space between the second side 1102 of the first carrier substrate 11 and the second side 3102 of the second carrier substrate 31 can be effectively reduced, so that the overall size (or width) of the housing C of the image display Z using the circuit carrier and control module M of the present invention can be effectively reduced.

Seventh embodiment

Referring to fig. 9 and 14, a seventh embodiment of the invention provides an image display Z, which includes a circuit supporting and controlling module M and an image display module D electrically connected to the circuit supporting and controlling module M. In addition, the circuit carrying and controlling module M includes a first circuit substrate structure 1, a first control substrate structure 2, a second circuit substrate structure 3 and a second control substrate structure 4 (the same as the third embodiment, as shown in fig. 9), and the image display module D is electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1. For example, the image display module D includes an LCD display module (D1-LCD) disposed above the circuit carrying and control module M and a backlight module D2 disposed below the circuit carrying and control module M. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Therefore, since the first control substrate structure 2 can be electrically connected to the first circuit layout layer 12 of the first circuit substrate structure 1 without passing through the first unoccupied gap G1 or the third unoccupied gap G3, the distance or space between the first side 1101 of the first carrier substrate 11 and the first inner surface C101 of the housing C can be effectively reduced, and the distance or space between the second side 1102 of the first carrier substrate 11 and the second side 3102 of the second carrier substrate 31 can be effectively reduced, so that the overall size (or width) of the housing C of the image display Z using the circuit carrier and control module M of the invention can be effectively reduced.

In addition, since the second control substrate structure 4 can be electrically connected to the second circuit layout layer 32 of the second circuit substrate structure 3 without passing through the second unoccupied gap G2 or the third unoccupied gap G3, the distance or space between the first side 3101 of the second carrier substrate 31 and the second inner surface C102 of the housing C can be effectively reduced, and the distance or space between the second side 1102 of the first carrier substrate 11 and the second side 3102 of the second carrier substrate 31 can be effectively reduced, so that the overall size (or width) of the housing C of the image display Z using the circuit carrier and control module M of the present invention can be effectively reduced.

It is noted that, as shown in fig. 15, the first control substrate structure 2 may also extend along one side and the bottom of the backlight module D2 (that is, the first control substrate structure 2 is not necessarily disposed between the first circuit substrate structure 1 and the backlight module D2), and the first circuit control chip 22 of the first control substrate structure 2 can be disposed under the backlight module D2. In addition, the second control substrate structure 4 may also extend along the other side and the bottom of the backlight module D2 (that is, the second control substrate structure 4 is not necessarily disposed between the second circuit substrate structure 3 and the backlight module D2), and the second circuit control chip 42 of the second control substrate structure 4 can be disposed under the backlight module D2. However, the above description is only one embodiment of the present invention, and is not intended to limit the present invention.

Advantageous effects of the embodiments

One of the benefits of the invention is that the image display Z and the circuit carrying and control module M thereof provided by the invention can be electrically connected to the circuit substrate structure through the technical scheme that the circuit substrate structure comprises a carrying substrate, a circuit layout layer arranged on the carrying substrate and a plurality of conductive through bodies electrically connected to the circuit layout layer and penetrating through the carrying substrate, and the control substrate structure comprises a circuit substrate arranged below the circuit substrate structure and a circuit control chip arranged on the circuit substrate, so that the control substrate structure can be placed below the circuit substrate structure, and the control substrate structure can be electrically connected to the circuit substrate structure through the plurality of conductive through bodies.

The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.