阅读说明：本技术 一种测试芯片封装助焊剂不同温度下助焊效果实验装置 (Experimental device for testing soldering flux assisting effect of chip packaging at different temperatures ) 是由 阎勇峰 王明 于 2021-05-17 设计创作，主要内容包括：本发明属于助焊效果实验装置技术领域,尤其是一种测试芯片封装助焊剂不同温度下助焊效果实验装置,针对目前的助焊效果实验装置,无法保证芯片在真空环境下进行,使得空气中的灰尘或污垢存在于实验环境中,对实验造成影响,且在实验时,不方便对不同大小的芯片进行固定的问题。现提出如下方案,其包括移动底座,所述移动底座的顶端固定有实验箱,实验箱内固定有两个放置板,放置板上均开设有通气孔。本发明夹持机构中,通过夹持板、滑块、移动块、弹簧二的设置下,可对多个芯片进行夹持紧固,避免移动运输时松动,保证芯片输送的稳定性,同时可对不同大小的芯片进行夹持紧固,使用范围广。(The invention belongs to the technical field of soldering assisting effect experiment devices, and particularly relates to a soldering assisting effect experiment device for testing soldering flux of a chip package at different temperatures. The following scheme is proposed at present, and it is including removing the base, the top of removing the base is fixed with the experimental box, and the experimental box internal fixation has two to place the board, places and all seted up the air vent on the board. According to the clamping mechanism, the plurality of chips can be clamped and fastened through the arrangement of the clamping plate, the sliding block, the moving block and the second spring, looseness during moving and transportation is avoided, stability of chip conveying is guaranteed, meanwhile, chips of different sizes can be clamped and fastened, and the application range is wide.)

1. An experimental device for testing the soldering assisting effect of chip packaging soldering flux at different temperatures comprises a movable base (1) and is characterized in that an experiment box (2) is fixed at the top end of the movable base (1), two placing plates (3) are fixed in the experiment box (2), vent holes are formed in the placing plates (3), clamping mechanisms (10) mounted on the placing plates (3) are arranged on two sides of the vent holes, anti-collision mechanisms (8) are mounted on two side walls of the experiment box (2), a sealing door (4) is hinged to the front end face of the experiment box (2), a locking mechanism (11) is connected between the sealing door (4) and the experiment box (2), a supporting mechanism (9) is mounted at the bottom end of the experiment box (2), each anti-collision mechanism (8) comprises an anti-collision plate (801), two symmetrical hinged plate I (802) are hinged to one side wall of the experiment box (2) on the anti-collision plate (801), the other end of the first hinge plate (802) is hinged with a sliding seat (803), a side wall of the experiment box (2) is provided with a sliding groove matched with the sliding seat (803), sliding rods (804) are fixed in the sliding groove, the sliding seats (803) are sleeved outside the corresponding sliding rods (804) in a sliding way, a first spring (805) is connected between one end of each sliding seat (803) and the end part of the corresponding sliding groove, and the first spring (805) is sleeved on the corresponding sliding rod (804) in a movable way.

2. The experimental device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein a vacuum pump (21) is fixed at the top end of the experiment box (2), a first connecting pipe is connected to an air inlet of the vacuum pump (21), one end of the first connecting pipe extends into the experiment box (2), a second connecting pipe is connected to an air outlet of the vacuum pump (21), an exhaust hood is connected to one end of the second connecting pipe, and two symmetrical inner cavities are formed in the inner bottom wall of the experiment box (2).

3. The experimental device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 2, wherein fans (5) are fixed on the inner bottom walls of the inner cavities, heating plates (6) and semiconductor refrigerating components (7) which are fixedly connected in the corresponding inner cavities are respectively arranged above the fans (5), a plurality of through holes are formed in the heating plates (6) and the semiconductor refrigerating components (7), and temperature sensors (22) are fixed on the inner top walls of the experimental box (2).

4. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein the supporting mechanism (9) comprises a bottom supporting plate (901) movably connected to the bottom of the experiment box (2), the top end of the bottom supporting plate (901) is hinged with two symmetrical second hinged plates (902), and the other ends of the second hinged plates (902) are hinged with guide seats (903).

5. The experimental device for testing the soldering effect of the chip packaging soldering flux at different temperatures as claimed in claim 1, wherein the bottom end of the experimental box (2) is provided with guide grooves matched with the two guide bases (903), the two guide bases (903) are spirally connected with a bidirectional screw rod (904), the bidirectional screw rod (904) is rotatably connected in the guide grooves, and one end of the bidirectional screw rod (904) extends to the outer side of the experimental box (2) and is fixedly connected with a knob block.

6. The device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein the clamping mechanism (10) comprises two clamping plates (1001), sliding blocks (1002) are fixed at the bottom ends of the clamping plates (1001), and sliding grooves matched with the sliding blocks (1002) are formed in the top ends of the placing plates (3).

7. The experimental device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to claim 6, wherein sliding columns (1003) are fixed in the sliding grooves, the sliding blocks (1002) are sleeved on the outer sides of the corresponding sliding columns (1003) in a sliding manner, a second spring (1004) is connected between one end of each sliding block (1002) and the end of the corresponding sliding groove, and the second springs (1004) are movably sleeved on the outer sides of the corresponding sliding columns (1003).

8. The experimental device for testing the soldering assisting effect of the chip packaging soldering flux at different temperatures according to claim 1, wherein the locking mechanism (11) comprises a first fixing block (1101) fixed on one side wall of the experimental box (2), a second fixing block (1107) is fixed on one side wall of the sealing door (4), a fixing cylinder (1102) is fixed at one end of the first fixing block (1101), which is far away from the second fixing block (1107), a movable block (1103) is slidably connected in the fixing cylinder (1102), a pull rod (1104) is fixed at one end of the movable block (1103), and the pull rod (1104) is slidably connected on the first fixing block (1101) and the fixing cylinder (1102).

9. The experimental device for testing the soldering assisting effect of the chip packaging soldering flux at different temperatures according to claim 8, wherein a spring III (1105) is connected between one end of the movable block (1103) and the inner wall of one side of the fixed cylinder (1102), the spring III (1105) is movably sleeved on the outer side of the pull rod (1104), the rotating block (1106) is rotatably sleeved on the outer side of the pull rod (1104), a fixed block II (1107) is movably sleeved on the outer side of the pull rod (1104), a penetrating groove (1108) matched with the rotating block (1106) is formed in the fixed block II (1107), and a pull ring (1109) is further fixed at one end of the pull rod (1104).

Technical Field

The invention relates to the technical field of air soldering assisting effect experiment devices, in particular to an experiment device for testing the soldering assisting effect of a chip packaging soldering flux at different temperatures.

Background

When a chip packaging soldering flux soldering effect experiment is carried out, a plurality of chips using soldering flux are generally placed in an environment with higher temperature or lower temperature for experiment, so that experimental data in different temperature environments can be obtained.

The current helps and welds effect experimental apparatus can't guarantee that the chip goes on under vacuum environment for dust or dirt in the air are honored and exist easily in experimental environment, cause the influence to the experiment, and when the experiment, inconvenient chip to equidimension not fixes, and application range is little, for this reason we have designed a test chip encapsulation scaling powder and have helped under the different temperature and weld effect experimental apparatus.

Disclosure of Invention

The invention provides an experimental device for testing the soldering assisting effect of a chip packaging soldering flux at different temperatures, which solves the problems that the existing soldering assisting effect experimental device cannot ensure that a chip is carried out in a vacuum environment, so that dust or dirt in air exists in the experimental environment to influence the experiment, and the chips with different sizes are inconvenient to fix during the experiment.

In order to achieve the purpose, the invention adopts the following technical scheme:

an experimental device for testing the soldering assisting effect of chip packaging soldering flux at different temperatures comprises a movable base, wherein an experimental box is fixed at the top end of the movable base, two placing plates are fixed in the experimental box, air vents are formed in the placing plates, clamping mechanisms arranged on the placing plates are arranged on two sides of each air vent, anti-collision mechanisms are arranged on two side walls of the experimental box, a sealing door is hinged to the front end face of the experimental box, a locking mechanism is connected between the sealing door and the experimental box, a supporting mechanism is arranged at the bottom end of the experimental box, each anti-collision mechanism comprises an anti-collision plate, two symmetrical first hinge plates are hinged to one side wall of the anti-collision plate, the other ends of the first hinge plates are hinged to a sliding seat, sliding grooves matched with the sliding seats are formed in one side wall of the experimental box, sliding rods are fixed in the sliding grooves, and the sliding seats are sleeved outside the corresponding sliding rods, one end of each sliding seat is connected with a first spring between the end part of the corresponding sliding groove, and the first springs are movably sleeved on the corresponding sliding rods.

Preferably, the top of experimental box is fixed with the vacuum pump, and the air inlet of vacuum pump is connected with connecting pipe one, and in the one end of connecting pipe one extended to the experimental box, the air outlet department of vacuum pump was connected with connecting pipe two, and the one end of connecting pipe two is connected with the exhaust hood, offered two symmetrical inner chambers on the interior diapire of experimental box.

Preferably, all be fixed with the fan on the interior diapire of inner chamber, the top of fan is equipped with hot plate and the semiconductor refrigeration subassembly of rigid coupling in the inner chamber that corresponds respectively, has all seted up a plurality of through-holes on hot plate and the semiconductor refrigeration subassembly, is fixed with temperature sensor on the interior roof of experimental box.

Preferably, the supporting mechanism comprises a bottom supporting plate movably connected to the bottom of the experiment box, the top end of the bottom supporting plate is hinged with two symmetrical second hinged plates, and the other ends of the second hinged plates are hinged with guide seats.

Preferably, the bottom of experimental box all seted up with two guide holder matched with guide ways, the last screw drive of two guide holders is connected with two-way lead screw, and two-way lead screw rotates to be connected in the guide way, and the one end of two-way lead screw extends to the outside of experimental box to the rigid coupling has the knob piece.

Preferably, fixture includes two grip blocks, and the bottom of grip block all is fixed with the slider, places the top of board and all sets up the spout with slider matched with.

Preferably, sliding columns are fixed in the sliding grooves, the sliding blocks are sleeved on the outer sides of the corresponding sliding columns in a sliding mode, a second spring is connected between one end of each sliding block and the end portion of the corresponding sliding groove, and the second springs are movably sleeved on the outer sides of the corresponding sliding columns.

Preferably, locking mechanism is fixed with fixed block two on the lateral wall of sealing door including fixing fixed block one on experimental box lateral wall, and the one end that deviates from fixed block two on the fixed block one is fixed with a fixed section of thick bamboo, and sliding connection has the movable block in the fixed section of thick bamboo, and the one end of movable block is fixed with the pull rod, and the pull rod slides through connection on fixed block one and a fixed section of thick bamboo.

Preferably, a third spring is connected between one end of the movable block and the inner wall of one side of the fixed cylinder, the third spring is movably sleeved on the outer side of the pull rod, the rotating block is rotatably sleeved on the outer side of the pull rod, the second fixed block is movably sleeved on the outer side of the pull rod, a through groove matched with the rotating block is formed in the second fixed block, and a pull ring is further fixed at one end of the pull rod.

Compared with the prior art, the invention has the beneficial effects that:

1. in the anti-collision mechanism, under the arrangement of the anti-collision plate, the first hinge plate, the sliding seat, the sliding rod and the first spring, the force generated when the device is impacted by a foreign object can be buffered, and the impact force is prevented from causing chip loosening to influence the experimental process.

2. In the supporting mechanism, under the arrangement of the bottom supporting plate, the hinged plate II, the guide seats and the bidirectional screw rod, the bidirectional screw rod rotates through the twisting knob block, and the bidirectional screw rod is in spiral transmission connection with the two guide seats, so that the bottom supporting plate can support the ground, the stability of the experiment box when the experiment box is not moved is ensured, and random movement is avoided.

3. According to the clamping mechanism, the plurality of chips can be clamped and fastened through the arrangement of the clamping plate, the sliding block, the moving block and the second spring, looseness during moving and transportation is avoided, stability of chip conveying is guaranteed, meanwhile, chips of different sizes can be clamped and fastened, and the application range is wide.

4. According to the locking mechanism, the sealing door and the experiment box can be conveniently locked under the arrangement of the first fixed block, the first fixed cylinder, the movable block, the pull rod, the third spring, the rotating block, the second fixed block, the penetrating groove and the pull ring, so that the experiment can be perfectly carried out.

Drawings

FIG. 1 is a schematic structural diagram of an elevational view of an experimental apparatus for testing a soldering effect of a chip package soldering flux at different temperatures according to the present invention;

FIG. 2 is a schematic structural diagram of an unfolded sealing door of an experimental device for testing the soldering effect of the chip packaging flux at different temperatures according to the present invention;

FIG. 3 is an enlarged schematic structural diagram of a portion A of an experimental apparatus for testing the soldering effect of the chip packaging flux at different temperatures according to the present invention;

FIG. 4 is an enlarged schematic structural diagram of a soldering effect testing device at a position B for testing different temperatures of a chip packaging soldering flux according to the present invention;

fig. 5 is a schematic structural diagram of the development of a through groove of an experimental device for testing the soldering effect of the chip packaging soldering flux at different temperatures according to the present invention.

In the figure: 1. moving the base; 2. an experimental box; 21. a vacuum pump; 22. a temperature sensor; 3. placing the plate; 4. a sealing door; 5. a fan; 6. heating plates; 7. a semiconductor refrigeration assembly; 8. an anti-collision mechanism; 801. an anti-collision plate; 802. a first hinged plate; 803. a sliding seat; 804. a slide bar; 805. a first spring; 9. a support mechanism; 901. a bottom supporting plate; 902. a second hinge plate; 903. a guide seat; 904. a bidirectional screw rod; 10. a clamping mechanism; 1001. a clamping plate; 1002. a slider; 1003. a movable block; 1004. a second spring; 11. a locking mechanism; 1101. a first fixed block; 1102. a fixed cylinder; 1103. a movable block; 1104. a pull rod; 1105. a third spring; 1106. rotating the block; 1107. a second fixed block; 1108. a through groove; 1109. and (4) a pull ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-5, an experimental apparatus for testing the soldering assisting effect of a chip packaging flux at different temperatures comprises a mobile base 1, an experimental box 2, a vacuum pump 21, a temperature sensor 22, a placing plate 3, a sealing door 4, a fan 5, a heating plate 6, a semiconductor refrigerating assembly 7, an anti-collision mechanism 8, an anti-collision plate 801, a first hinge plate 802, a sliding seat 803, a sliding rod 804, a first spring 805, a supporting mechanism 9, a bottom supporting plate 901, a second hinge plate 902, a guide seat 903, a bidirectional screw 904, a clamping mechanism 10, a clamping plate 1001, a slider 1002, a moving block 1003, a second spring 1004, a locking mechanism 11, a first fixing block 1101, a fixing cylinder 1102, a moving block 1103, a pull rod 1104, a third spring 1105, a rotating block 1106, a second fixing block 1107, a through groove 1108 and a pull ring 1109, wherein the experimental box 2 is fixed at the top end of the mobile base 1, two placing plates 3 are fixed in the experimental box 2, and the placing plate 3 is provided with vent holes, the two side walls of the experiment box 2 are both provided with an anti-collision mechanism 8, the front end surface of the experiment box 2 is hinged with a sealing door 4, the anti-collision mechanism 8 comprises an anti-collision plate 801, one side wall of the anti-collision plate 801 facing the experiment box 2 is hinged with two symmetrical hinged plates 802, the other ends of the hinged plates 802 are hinged with sliding seats 803, one side wall of the experiment box 2 is provided with sliding grooves matched with the sliding seats 803, sliding rods 804 are fixed in the sliding grooves, the sliding seats 803 are sleeved outside the corresponding sliding rods 804 in a sliding way, a spring 805 is connected between one end of each sliding seat 803 and the end of the corresponding sliding groove, a spring 805 is movably sleeved on the corresponding sliding rod 804, the sliding seats 803 form an elastic structure through the spring 805 and the end of the corresponding sliding groove, under the arrangement of the anti-collision plate 801, the hinged plates 802, the sliding seats 803, the sliding rods 804 and the spring 805, the force of the device when being impacted by an external object can be buffered, the chip is prevented from loosening due to impact force, and the experimental process is prevented from being influenced;

a vacuum pump 21 is fixed on the top end of the experiment box 2, an air inlet of the vacuum pump 21 is connected with a first connecting pipe, one end of the first connecting pipe extends into the experiment box 2, an air outlet of the vacuum pump 21 is connected with a second connecting pipe, one end of the second connecting pipe is connected with an exhaust hood, two symmetrical inner cavities are formed in the inner bottom wall of the experiment box 2, fans 5 are fixed on the inner bottom walls of the inner cavities, a heating plate 6 and a semiconductor refrigerating assembly 7 which are fixedly connected in the corresponding inner cavities are respectively arranged above the fans 5, a plurality of through holes are formed in the heating plate 6 and the semiconductor refrigerating assembly 7, a temperature sensor 22 is fixed on the inner top wall of the experiment box 2, the semiconductor refrigerating assembly 7 is a semiconductor refrigerating assembly 7 in the prior art and is of TEC1-07108, each chip which uses soldering flux for soldering assistance is placed on two placing plates 3, and is clamped by a clamping plate 1001, Under the setting of the sliding block 1002, the moving block 1003 and the second spring 1004, the clamping and fastening of a plurality of chips can be carried out, the looseness during moving and transportation is avoided, the stability of chip transportation is ensured, meanwhile, the clamping and fastening of chips with different sizes can be carried out, the application range is wide, in addition, the sealing door 4 is locked, the vacuum pump 21 is started, the vacuum pump 21 is enabled to discharge the air in the experiment box 2, the influence of dirt or dust in the air on the experiment of the chips is prevented, in addition, when the semiconductor refrigeration component 7 or the heating plate 6 is started, the inside of the experiment box 2 can be heated or refrigerated, the experiment environments with different temperatures can be manufactured, and the arrangement of the two fans 5 is matched, cold air or hot air can be rapidly and uniformly distributed in the experiment box 2, the experiment efficiency is improved, the signal PT100 of the temperature sensor 22 can monitor the temperature in the experiment box 2, the outer side wall of the test box 2 can be provided with a controller, and the input end of the controller is electrically connected with the output end of the temperature sensor 22.

Supporting mechanism 9 is installed to experimental box 2's bottom, supporting mechanism 9 includes swing joint at the end stay board 901 of experimental box 2 bottom, the top of end stay board 901 articulates there are two symmetrical articulated slab 902, the other end of articulated slab 902 all articulates there is guide holder 903, experimental box 2's bottom all seted up with two guide holder 903 matched with guide way, screw drive is connected with two-way lead screw 904 on two guide holder 903, two-way lead screw 904 rotates to be connected in the guide way, the one end of two-way lead screw 904 extends to experimental box 2's the outside, and the rigid coupling has the knob piece, the knob piece makes things convenient for operating personnel to wrench movement.

Under the setting of bottom bracing board 901, articulated slab two 902, guide holder 903, two-way lead screw 904, through the wrench movement knob piece for two-way lead screw 904 rotates, because two-way lead screw 904 and two guide holder 903 spiral transmission are connected, make bottom bracing board 901 support ground then, guarantee the stability of experimental box 2 when unmovable, avoid the activity at will.

The both sides of air vent all are equipped with the fixture 10 of installing on placing board 3, fixture 10 includes two grip blocks 1001, the bottom of grip block 1001 all is fixed with slider 1002, the top of placing board 3 all is seted up with slider 1002 matched with spout, all be fixed with traveller 1003 in the spout, the equal slip cap of slider 1002 is established in the traveller 1003 outside that corresponds, the one end of slider 1002 all with correspond be connected with two springs 1004 between the spout tip, the equal movable sleeve of two springs 1004 is established in the traveller 1003 outside that corresponds, the clamping face of grip block is provided with the silica gel protection pad 1001, avoid pressing from both sides badly to the chip.

A locking mechanism 11 is connected between the sealing door 4 and the experimental box 2, the locking mechanism 11 comprises a first fixed block 1101 fixed on one side wall of the experimental box 2, a second fixed block 1107 is fixed on one side wall of the sealing door 4, a fixed cylinder 1102 is fixed on one end of the first fixed block 1101, which is far away from the second fixed block 1107, a movable block 1103 is connected in the fixed cylinder 1102 in a sliding manner, a pull rod 1104 is fixed at one end of the movable block 1103, the pull rod 1104 is connected on the first fixed block 1101 and the fixed cylinder 1102 in a sliding and penetrating manner, a third spring 1105 is connected between one end of the movable block 1103 and one side inner wall of the fixed cylinder 1102, the third spring 1105 is movably sleeved on the outer side of the pull rod 1104, a rotating block 1106 is sleeved on the outer side of the pull rod 1104 in a rotating manner, the second fixed block 1107 is movably sleeved on the outer side of the pull rod 1104, a penetrating groove 1108 matched with the rotating block 1106 is formed in the second fixed on one end of the pull rod 1104, a pull ring 1109 is fixed at one end of the penetrating groove 1108, the cross-sectional area of the rotating block 1106 is larger than that of the rotating block 1106, under the setting of fixed block 1101, fixed cylinder 1102, movable block 1103, pull rod 1104, spring three 1105, turning block 1106, fixed block two 1107, through groove 1108 and pull ring 1109, can conveniently lock sealing door 4 and experimental box 2, guarantee that the experiment can go on perfectly.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.