阅读说明：本技术 一种芯片替换板、封装体以及用电设备 (Chip replacement board, packaging body and power consumption equipment ) 是由 何幸 卢彩昆 于 2021-08-03 设计创作，主要内容包括：本发明涉及一种芯片替换板、封装体以及用电设备。该芯片替换板用于替换目标电路板上适配的第一芯片,目标电路板上设有适配于第一芯片的芯片安装区域,芯片安装区域的焊盘与第一芯片的引脚一一对应,芯片替换板包括：基板,基板的尺寸与芯片安装区域匹配；第二芯片,设置在基板上,第二芯片至少能提供第一芯片的全部功能；引脚组,包括多个设置在基板上的引脚,引脚组中的引脚与第一芯片的引脚一一对应,以使引脚组中的引脚与芯片安装区域的焊盘匹配,且引脚组中的引脚与第二芯片的目标引脚电性连接,以使引脚组中的引脚与对应的第一芯片的引脚功能相同。本发明降低了目标电路板的制造成本。(The invention relates to a chip replacement board, a packaging body and electric equipment. This chip replacement board is used for replacing the first chip of adaptation on the target circuit board, is equipped with the chip mounting area in the first chip of adaptation on the target circuit board, and the pad of chip mounting area and the pin one-to-one of first chip, the chip replacement board includes: the size of the substrate is matched with that of the chip mounting area; the second chip is arranged on the substrate and can at least provide all functions of the first chip; and the pins in the pin group are in one-to-one correspondence with the pins of the first chip so as to be matched with bonding pads in the chip mounting area, and the pins in the pin group are electrically connected with target pins of the second chip so as to ensure that the pins in the pin group have the same functions as the corresponding pins of the first chip. The invention reduces the manufacturing cost of the target circuit board.)

1. The utility model provides a chip replacement board which characterized in that for the first chip of replacement adaptation on the target circuit board, be equipped with the adaptation on the target circuit board in the chip installation region of first chip, the pad of chip installation region with the pin one-to-one of first chip, chip replacement board includes:

a substrate having a size matching the chip mounting region;

a second chip disposed on the substrate, the second chip capable of providing at least all of the functions of the first chip;

and the pins in the pin group are in one-to-one correspondence with the pins of the first chip so that the pins in the pin group are matched with the bonding pads of the chip mounting area, and the pins in the pin group are electrically connected with the target pins of the second chip so that the pins in the pin group have the same functions as the corresponding pins of the first chip.

2. The chip replacement board according to claim 1, wherein the pin groups include a first pin group, a second pin group, a third pin group, and a fourth pin group, and the target pins include a first pin type, a second pin type, a third pin type, and a fourth pin type;

the first pin group is electrically connected with the first class pins and is used for inputting touch key signals and analog signals to the second chip;

the second pin group is electrically connected with the second type pins and is used for inputting digital signals to the second chip and outputting the digital signals generated by the second chip;

the third pin group is electrically connected with the third type pins and used for receiving a power supply signal and providing the power supply signal for the second chip;

the fourth pin group is electrically connected with the fourth type pins and used for connecting the second chip with a ground end.

3. The chip replacement board according to claim 2, wherein the substrate is further provided with a power conversion module, the power conversion module is electrically connected between the third pin group and the third type pin, and the power conversion module is configured to convert a power signal provided by the third pin group into a power signal matched with a second chip.

4. The chip replacement board according to claim 1, wherein the second chip further comprises a fifth type of pin for receiving a clock signal with a predetermined frequency, the substrate is further provided with a crystal oscillator module, the crystal oscillator module is electrically connected to the fifth type of pin, and the crystal oscillator module is configured to provide the clock signal with the predetermined frequency to the second chip through the fifth type of pin.

5. The chip replacement board according to claim 2, wherein a decoupling capacitor is further disposed on the chip replacement board, and the decoupling capacitor is electrically connected between the fourth pin group and the fourth type pin.

6. The chip replacement board according to claim 2, wherein the pin group comprises pins No. 1 to 10 disposed in order in a first direction on a first side of the substrate, and pins No. 11 to 20 disposed in order in a second direction on a second side of the substrate; the first side of the substrate is opposite to the second side of the substrate, and the first direction is opposite to the second direction;

the first pin group comprises No. 2 pins, No. 4 pins, No. 6-No. 8 pins and No. 18-No. 20 pins;

the second pin group comprises a No. 1 pin, a No. 3 pin, a No. 5 pin and No. 11 to No. 17 pins;

the third pin group comprises a No. 10 pin;

the fourth pin group comprises a No. 9 pin.

7. A package characterized in that the chip replacement board according to any one of claims 1 to 6 is provided inside the package, the package having a size matching the substrate of the chip replacement board, and the package is provided with openings through which the lead groups of the chip replacement board protrude outside.

8. An electric device comprises a target circuit board, wherein a chip mounting area adapted to a first chip is arranged on the target circuit board; the first chip is a main control chip of the electric equipment, and the bonding pads of the chip mounting area correspond to the pins of the first chip one by one, wherein the chip mounting area is provided with the chip replacing board according to any one of claims 1-6, and the pin groups of the chip replacing board are welded with the bonding pads of the chip mounting area in a one-to-one correspondence manner; or the chip mounting region is provided with the package body as claimed in claim 7, and the pin groups of the chip replacement board in the package body are soldered with the pads of the chip mounting region in a one-to-one correspondence manner.

9. The powered device of claim 8, wherein the powered device comprises a household appliance.

10. The consumer device according to claim 9, wherein the household appliance comprises: fruit juice machine, cooking machine, electric rice cooker or ice cream machine.

Technical Field

The invention relates to the field of chips, in particular to a chip replacement board, a packaging body and electric equipment.

Background

With the development of chip technology, various industries need to rely on chips as control cores of products to realize intellectualization. However, as the demand for chips increases, some chips are in short supply. In the prior art, the period is long and the cost is high when a chip adaptive to a product circuit board is newly researched or a new chip is adopted to redesign the product circuit board.

Disclosure of Invention

In view of the above, it is necessary to provide a chip replacement board and a package that can replace a chip on a target circuit board of an electric device, and an electric device including the chip replacement board or the package.

In one aspect, an embodiment of the present invention provides a chip replacement board for replacing a first chip adapted on a target circuit board, where the target circuit board is provided with a chip mounting area adapted to the first chip, pads of the chip mounting area correspond to pins of the first chip one to one, and the chip replacement board includes: the size of the substrate is matched with that of the chip mounting area; the second chip is arranged on the substrate and can at least provide all functions of the first chip; and the pins in the pin group are in one-to-one correspondence with the pins of the first chip so as to be matched with bonding pads in the chip mounting area, and the pins in the pin group are electrically connected with target pins of the second chip so as to ensure that the pins in the pin group have the same functions as the corresponding pins of the first chip.

In one embodiment, the pin groups include a first pin group, a second pin group, a third pin group and a fourth pin group, and the target pins include a first pin, a second pin, a third pin and a fourth pin; the first pin group is electrically connected with the first type of pins and used for inputting touch key signals and analog signals to the second chip; the second pin group is electrically connected with the second type pins and used for inputting digital signals to the second chip and outputting the digital signals generated by the second chip; the third pin group is electrically connected with the third type pins and used for receiving the power supply signal and providing the power supply signal for the second chip; the fourth pin group is electrically connected with the fourth type pin and used for connecting the second chip with the ground end.

In one embodiment, the substrate is further provided with a power conversion module, the power conversion module is electrically connected between the third pin group and the third type of pins, and the power conversion module is used for converting a power signal provided by the third pin group into a power signal matched with the second chip.

In one embodiment, the second chip further includes a fifth type of pin for receiving a clock signal with a predetermined frequency, the substrate is further provided with a crystal oscillator module, the crystal oscillator module is electrically connected to the fifth type of pin, and the crystal oscillator module is configured to provide the clock signal with the predetermined frequency to the second chip through the fifth type of pin.

In one embodiment, a decoupling capacitor is further disposed on the chip replacement board, and the decoupling capacitor is electrically connected between the fourth pin group and the fourth type pin.

In one embodiment, the pin group comprises pins No. 1 to No. 10 arranged on the first side of the substrate in sequence according to a first direction, and pins No. 11 to No. 20 arranged on the second side of the substrate in sequence according to a second direction; the first side of the substrate is opposite to the second side of the substrate, and the first direction is opposite to the second direction; the first pin group comprises No. 2 pins, No. 4 pins, No. 6-No. 8 pins and No. 18-No. 20 pins; the second pin group comprises a No. 1 pin, a No. 3 pin, a No. 5 pin and No. 11 to No. 17 pins; the third pin group comprises a No. 10 pin; the fourth pin group includes pin number 9.

In another aspect, an embodiment of the present invention provides a package, wherein the chip replacement board is disposed inside the package, the size of the package matches with the substrate of the chip replacement board, and the package is provided with an opening through which the pin group of the chip replacement board protrudes outside.

In another aspect, an embodiment of the present invention provides an electrical device, including a target circuit board, where a chip mounting area adapted to a first chip is disposed on the target circuit board; the first chip is a main control chip of the electric equipment, bonding pads of a chip mounting area correspond to pins of the first chip one by one, the chip mounting area is provided with the chip replacing plate, and pin groups of the chip replacing plate are welded with the bonding pads of the chip mounting area in a one-to-one correspondence manner; or the chip mounting area is provided with the packaging body as described above, and the pin groups of the chip replacement board in the packaging body are welded with the bonding pads of the chip mounting area in a one-to-one correspondence mode.

In one embodiment, the powered device comprises a household appliance.

In one embodiment, a home appliance includes: fruit juice machine, cooking machine, electric rice cooker or ice cream machine.

After the chip replacement board is arranged in the mounting area of the first chip on the target circuit board, the second chip on the chip replacement board is matched with the pin group, so that the second chip can provide the same function as the pins of the first chip through the pins of the pin group in a one-to-one correspondence manner. The chip replacement board can replace the first chip on the target circuit board to control the target circuit board on the premise of not changing original elements and wiring structures of the target circuit board, the first chip can be perfectly replaced by the chip replacement board which takes the second chip with sufficient goods sources as a core and has the total cost lower than that of the first chip, and the cost of the target circuit board is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a partial schematic view of a target circuit board in one embodiment;

FIG. 2 is a schematic diagram of a chip replacement board according to an embodiment;

FIG. 3 is a schematic diagram of a chip replacement card being mounted on a target circuit board in one embodiment;

FIG. 4 is a schematic structural view of a chip replacement board according to another embodiment;

FIG. 5 is a schematic view showing a structure of a chip replacement board according to still another embodiment;

fig. 6 is a number diagram of a pin group according to an embodiment.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the present application. The first resistance and the second resistance are both resistances, but they are not the same resistance.

It is to be understood that "connection" in the following embodiments is to be understood as "electrical connection", "communication connection", and the like if the connected circuits, modules, units, and the like have communication of electrical signals or data with each other.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

As mentioned in the background, the chip field is difficult to chip-missing, and the inventor finds that the reason for this phenomenon is: with the updating of consumer electronics, the vigorous development of electric vehicles, and the like, many chip manufacturers focus on producing and selling chips with higher profit margin, resulting in insufficient chip supply in some fields. In the conventional technology, the model of a chip is selected when a product circuit board is designed, and the wiring, the layout and the like of the product circuit board are all adapted to the chip. When the chip supply is insufficient, the cycle time and cost are long whether the chips which are adapted to the product circuit board are newly developed or the chip models are newly selected and the product circuit board is newly designed.

Referring to fig. 1 to 3, a chip replacement board 10 for replacing a first chip adapted on a target circuit board 100 is provided in an embodiment of the present invention. The target circuit board 100 is provided with a chip mounting region 110 adapted to the first chip, and pads 130 of the chip mounting region 110 correspond to the leads of the first chip one to one. Specifically, the target circuit board 100 is a circuit board on an electrical device, and the target circuit board 100 reserves a chip mounting area 110 adapted to the first chip during design. The first chip may be disposed on the target circuit board 100 by soldering the leads of the first chip to the pads 130 of the chip mounting region 110 in one-to-one correspondence to achieve the intended function of the target circuit board 100. For example, the target circuit board 100 may be a master control board, a slave control board, an interface board, etc. of the powered device. In one embodiment, the first chip has an analog-to-digital conversion function, a synchronous serial port function, an LCD/LED driving function, a program EEPROM control function, and a touch key function to implement the intended functions of the target circuit board 100.

The chip replacement board 10 includes a substrate 11, and a second chip 13 and a pin group 15 provided on the substrate 11. The substrate 11 is matched in size to the chip mounting region 110. Specifically, the matching of the size of the substrate 11 with the chip mounting area 110 means that the size of the substrate 11 is substantially equivalent to the chip mounting area 110, and the substrate 11 may not be the same as the size of the first chip, but it should be ensured that the substrate 11 does not affect the normal operation of the components and traces around the chip mounting area 110 and that the lead group 15 on the substrate 11 can be easily soldered to the pad 130 of the chip mounting area 110.

The second chip 13 can provide at least the full functionality of the first chip. It will be appreciated that the second chip 13 has at least the same signal receiving, processing and output capabilities as the first chip. That is, the second chip 13 can receive at least the same number of signals and the same signal properties as those received by the first chip, process the received signals with the processing capability equivalent to that of the first chip, and finally output the processing result matched with the first chip. The chip replacement board having the second chip 13 as a core can also realize the intended function of the target circuit board 100 after being soldered to the chip-mounted region of the target circuit board 100.

The lead group 15 includes a plurality of leads disposed on the substrate 11, and the leads in the lead group 15 correspond to the leads of the first chip one to one, so that the leads in the lead group 15 are matched with the pads 130 of the chip mounting region 110. Specifically, the pads 130 of the chip mounting region 110 are designed for the pin bonding of the first chip. In order to enable the pins of the pin group 15 to be normally soldered to the pads 130 of the chip mounting region 110, the number of the pins in the pin group 15 is the same as that of the first chip, and the pin arrangement manner of the pin group 15 is also matched with that of the first chip pins, so that the requirement of being normally soldered to the pads 130 of the chip mounting region 110 is satisfied. Common pin forms include gold fingers, stamp holes, etc., and the pin form of the pin group 15 may be different from that of the first chip, so long as it is ensured that each pin in the pin group 15 can be stably soldered to the pad 130 of the chip mounting area 110 and can normally work after being soldered.

The leads of the lead set 15 are electrically connected to the target leads of the second chip 13 (connection method not shown in the figure), so that the leads of the lead set 15 have the same function as the corresponding leads of the first chip. The target pins are pins on the second chip 13 that at least perform the same function as the pins of the first chip corresponding to the pins of the pin group 15. The first chip uses its own pins as a medium for transmitting and/or receiving signals with other components on the target circuit board 100, and each pin of the first chip is configured with a specific function to transmit and/or receive signals with specific properties. Since the definition and the arrangement of the pins of the second chip 13 are not completely the same as those of the first chip, in order to make the chip replacement board 10 work on the target circuit board 100 instead of the first chip without changing the original wiring structure of the target circuit board 100, the pins of the pin group 15 are electrically connected to the target pins corresponding to the second chip 13 through the pins of the pin group 15 of the chip replacement board 10, so that the pins of the pin group 15 have the same functions as the corresponding pins of the first chip.

It is worth mentioning that, in addition to the above requirements, the cost should be fully considered when selecting the pin form of the pin set 15, the material of the substrate 11, and the model of the second chip 13, and the whole chip replacement board 10 should be manufactured at a lower cost than or equal to the first chip.

After the chip replacement board 10 is disposed in the mounting area of the first chip on the target circuit board 100, the second chip 13 on the chip replacement board 10 is matched with the pin group 15, so that the second chip 13 can provide the same function as that of the first chip through the pins of the pin group 15. The chip replacement board 10 can replace the first chip on the target circuit board 100 to control the target circuit board 100 on the premise of not changing the original elements and wiring structure of the target circuit board 100, so that the first chip can be perfectly replaced by the chip replacement board 10 which takes the second chip 13 with sufficient goods source as the core and has the total cost lower than that of the first chip, and the cost of the target circuit board 100 is reduced.

In one embodiment, the pin groups 15 include a first pin group 15, a second pin group 15, a third pin group 15, and a fourth pin group 15, and the target pins include a first type pin, a second type pin, a third type pin, and a fourth type pin. It is understood that the pins of the first chip in this embodiment have at least four types on the target circuit board 100, which are divided by the pin functions. Therefore, the lead group 15 should have four corresponding lead groups 15, and in order to make the lead group 15 have the same function as the corresponding lead of the first chip, the target lead should have at least four types of leads same as the corresponding lead of the first chip. Specifically, the four types of pins of the first chip include a pin for inputting a touch key signal and an analog signal to the first chip, a pin for inputting a digital signal to the first chip and outputting a digital signal generated by the first chip, a pin for supplying a power supply signal to the first chip, and a pin for grounding the first chip.

In order that each pin group 15 has the above four functions, the first pin group 15 is electrically connected to the first type of pin, and the first pin group 15 is used for inputting a touch key signal and an analog signal to the second chip 13. That is, the first type pins of the second chip 13 have the function of receiving the touch key signal and the analog signal. It can be understood that the target circuit board 100 should be provided with a touch key module, which may be a capacitive type or a resistive type, and the touch key signal is a signal generated after the touch key module is triggered. At present, one or more keys are arranged on many electric devices, and a user can perform function selection, parameter configuration and the like on the electric devices by operating the keys to trigger a touch key module. In this embodiment, the target circuit board 100 is a circuit board of an electric device provided with a touch key. In addition, the touch key signal is also an analog signal, and the analog signals received by the first pin group 15 and the first pin of the second chip 13 refer to analog signals other than the touch key signal. The second pin group 15 is electrically connected to the second type pin, and the second pin group 15 is used for inputting a digital signal to the second chip 13 and outputting the digital signal generated by the second chip 13. I.e. the second class pin has the function of a digital signal IO. The third pin group 15 is electrically connected to the third type pin, and is configured to receive the power signal and provide the power signal for the second chip 13. The power module on the target circuit board 100 supplies power to the second chip 13 through the third pin group 15 and the third pin in sequence. The fourth pin group 15 is electrically connected to the fourth type of pin, and is configured to connect the second chip 13 to the ground end sequentially through the fourth type of pin and the fourth pin group 15.

In some embodiments, the various types of pins of the second chip 13 may have other functions, and only one of the functions that the various types of pins multiplex is selected to work in place of the first chip.

In one embodiment, the power module on the target circuit board 100 may provide the first chip with a matching power, but the power required by the second chip 13 and the first chip may not be the same. Therefore, in the present embodiment, referring to fig. 4, the substrate 11 is further provided with a power conversion module 17, the power conversion module 17 is electrically connected between the third pin group 15 and the third type pin, and the power conversion module 17 is configured to convert the power signal provided by the third pin group 15 into a power signal matched with the second chip 13. In one particular embodiment, the power conversion module 17 may be a DC/DC module.

In one embodiment, the second chip 13 needs an external crystal oscillator to provide a high-precision clock signal with a predetermined frequency in order to exert the full performance of the second chip 13. The second chip 13 further includes a fifth type pin for receiving a clock signal of a predetermined frequency. Referring to fig. 5, a crystal oscillator module 19 is further disposed on the substrate 11, the crystal oscillator module 19 is electrically connected to the fifth type of pins, and the crystal oscillator module 19 is configured to provide a clock signal with a predetermined frequency to the second chip 13 through the fifth type of pins.

In one embodiment, the chip replacement board 10 is further provided with a decoupling capacitor, and the decoupling capacitor is electrically connected between the fourth pin group 15 and the fourth type pin. Some of the fourth type pins of the second chip 13 are connected to ground through decoupling capacitors, so that interference can be reduced, and the second chip 13 can operate more stably.

In one embodiment, as shown in fig. 6, the first chip to be replaced in this embodiment is a 20-pin chip, the first chip is rectangular, 10 pins are respectively disposed on two long sides, pins No. 1 to 10 of the first chip are sequentially disposed on one long side along a first direction, and pins No. 11 to 20 are sequentially disposed on the other opposite long side along a second direction. The lead groups 15 are in one-to-one correspondence with the leads of the first chip to be maintained. As shown, the PIN group 15 includes PINs No. 1 to 10 (i.e., PINs 1 to PINs 10) sequentially disposed in a first direction at a first side of the substrate 11, and PINs No. 11 to 20 (i.e., PINs 11 to PINs 20) sequentially disposed in a second direction at a second side of the substrate 11. The first side of the substrate 11 is opposite to the second side of the substrate 11, and the first direction is opposite to the second direction.

The pins for inputting the touch key signal and the analog signal to the first chip on the first chip are No. 2 pin, No. 4 pin, No. 6 to No. 8 pin, and No. 18 to No. 20 pin, so the first pin group 15 of the chip substitution board includes No. 2 pin, No. 4 pin, No. 6 to No. 8 pin, and No. 18 to No. 20 pin. The pins on the first chip for inputting the digital signal to the first chip and outputting the digital signal generated by the first chip are pin No. 1, pin No. 3, pin No. 5, and pin No. 11 to 17, so the second pin group 15 of the chip substitution board includes pin No. 1, pin No. 3, pin No. 5, and pin No. 11 to 17. The pin for receiving and providing the power signal to the first chip on the first chip is pin No. 10, so the third pin group 15 of the chip replacement board includes pin No. 10. The pin on the first chip for grounding the first chip is pin No. 9, so the fourth pin group 15 of the chip replacement board includes pin No. 9.

The embodiment of the invention provides a package body, wherein the chip replacement board 10 in any embodiment is arranged in the package body, and the size of the package body is matched with the substrate 11 of the chip replacement board 10. It is understood that, in order to protect, fix, and seal the chip replacement board 10 and reduce the influence of the external environment on the chip replacement board 10, the chip replacement board 10 is packaged by using a packaging technology. The package obtained by the packaging process is provided with openings through which the lead group 15 of the chip replacement board 10 protrudes outside, and the lead group 15 of the chip replacement board 10 can be soldered to the pads 130 of the chip mounting region 110 on the target circuit board 100. In addition, since there are many choices of the packaging form and the packaging material, the chip replacement board 10 can be packaged by selecting an appropriate packaging form and packaging material in combination with cost, protection effect, and the like.

The embodiment of the invention provides an electric device, which comprises a target circuit board 100, wherein a chip mounting area 110 adapted to a first chip is arranged on the target circuit board 100. The first chip is a main control chip of the electric device, and the target circuit board 100 is a main control board of the electric device. The pads 130 of the chip mounting region 110 correspond to the leads of the first chip one to one, the chip mounting region 110 is provided with the chip replacement board 10 as in any one of the above embodiments, and the lead groups 15 of the chip replacement board 10 are soldered to the pads 130 of the chip mounting region 110 in one to one correspondence, so that the chip replacement board 10 controls the components in the target circuit board 100 in place of the first chip. Or the chip mounting region 110 is provided with the package body in any of the above embodiments, the pin groups 15 of the chip replacement board 10 in the package body are soldered to the pads 130 of the chip mounting region 110 in a one-to-one correspondence, so that the package body replaces the first chip to control the components in the target circuit board 100.

In one embodiment, the powered device comprises a household appliance. In one embodiment, the first chip has an analog-to-digital conversion function, a synchronous serial port function, an LCD/LED driving function, a program EEPROM control function, and a touch key function to implement the intended functions of the target circuit board 100. Specifically, the household appliance is provided with an LCD screen or an LED lamp to display state information, gears and the like of the household appliance, the first chip can access and execute a corresponding program burnt in a storage unit of the first chip through a synchronous serial port function and a program EEPROM control function, and the LCD screen on the target circuit board is driven to display related information of the household appliance in cooperation with the LCD/LED driving function. Still be equipped with the touch button on the domestic appliance, the user carries out domestic appliance's function selection, gear selection, operating duration setting etc. through operation touch button, first chip acquires the operation of user to the touch button through touch button function, and the corresponding procedure of burning record in the memory cell of cooperation first chip is controlled the component that is used for carrying out corresponding function on the target circuit board, use the fruit juice mixer as an example, first chip can be controlled the motor of fruit juice mixer according to user's operation and corresponding procedure, the realization is beaten the fruit.

In one embodiment, a home appliance includes: fruit juice machine, cooking machine, electric rice cooker or ice cream machine.

In the description herein, references to the description of "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.