阅读说明：本技术 电子装置的制造方法及粘着性膜 (Method for manufacturing electronic device and adhesive film ) 是由 林下英司 于 2020-03-18 设计创作，主要内容包括：一种电子装置的制造方法,其包括下述工序：工序(A),准备结构体(100),所述结构体具备电子部件(70)以及粘贴于电子部件(70)的粘着性膜(50)；以及工序(B),以粘贴于粘着性膜(50)的状态,通过切割刀对电子部件(70)进行切割,粘着性膜(50)依次具备基材层(10)、中间层(20)和粘着性树脂层(30),在将基材层(10)的厚度设为X-(1),将中间层(20)的厚度设为X-(2)时,满足X-(2)＞X-(1)的关系。(A method for manufacturing an electronic device, comprising the steps of: a step (A) for preparing a structure (100) that is provided with an electronic component (70) and an adhesive film (50) that is adhered to the electronic component (70); and a step (B) in which the electronic component (70) is cut by a dicing blade while the electronic component is stuck to the adhesive film (50), wherein the adhesive film (50) comprises a base material layer (10), an intermediate layer (20), and an adhesive resin layer (30) in this order, and the thickness of the base material layer (10) is defined as X 1 X represents the thickness of the intermediate layer (20) 2 When, X is satisfied 2 ＞X 1 The relationship (2) of (c).)

1. A method for manufacturing an electronic device, comprising the steps of:

a step (A) of preparing a structure having an electronic component and an adhesive film to be bonded to the electronic component, an

A step (B) of cutting the electronic component with a dicing blade in a state of being stuck to the adhesive film,

the adhesive film comprises a base material layer, an intermediate layer and an adhesive resin layer in this order,

the thickness of the base material layer is X₁Setting the thickness of the intermediate layer as X₂When the temperature of the water is higher than the set temperature,

satisfy X₂＞X₁The relationship (2) of (c).

2. The method of manufacturing an electronic device according to claim 1,

thickness (X) of the substrate layer₁) Is 1 to 100 μm in diameter,

thickness (X) of the intermediate layer₂) Is 10 to 500 μm.

3. The method of manufacturing an electronic device according to claim 1 or 2,

the front end of the cutting knife is in a shape that the front end is narrow and the rear end is thick.

4. The method of manufacturing an electronic device according to claim 3,

when the diameter of the front end of the cutting knife is set to be R, X is satisfied₂The relationship > R.

5. The method for manufacturing an electronic device according to any one of claims 1 to 4,

the storage elastic modulus E 'of the base material layer at 85 ℃ is 50MPa to 10GPa, and the storage elastic modulus E' of the intermediate layer at 85 ℃ is 1MPa to less than 50 MPa.

6. The method for manufacturing an electronic device according to any one of claims 1 to 5,

the intermediate layer comprises a thermoplastic resin.

7. The method of manufacturing an electronic device according to claim 6,

the thermoplastic resin includes one or more resins selected from the group consisting of ethylene-alpha-olefin copolymers and ethylene-vinyl ester copolymers.

8. The method of manufacturing an electronic device according to claim 7,

the ethylene-vinyl ester copolymer comprises an ethylene-vinyl acetate copolymer.

9. The method for manufacturing an electronic device according to any one of claims 1 to 8,

the method further comprises, after the step (B), a step (C): the electronic component after dicing is subjected to characteristic evaluation in a state of being stuck to the adhesive film in a temperature environment of 0 ℃ or less or 50 ℃ or more.

10. The method for manufacturing an electronic device according to any one of claims 1 to 9,

the method further comprises, after the step (B), a step (D): picking up the electronic component after dicing from the adhesive film.

11. An adhesive film used in a dicing step of an electronic component,

the adhesive film comprises a base material layer, an intermediate layer and an adhesive resin layer in this order,

the thickness of the base material layer is X₁Setting the thickness of the intermediate layer as X₂When the temperature of the water is higher than the set temperature,

satisfy X₂＞X₁The relationship (2) of (c).

12. The adhesive film according to claim 11,

thickness (X) of the substrate layer₁) Is 1 to 100 μm in diameter,

thickness (X) of the intermediate layer₂) Is 10 to 500 μm.

13. The adhesive film according to claim 11 or 12,

the storage elastic modulus E 'of the base material layer at 85 ℃ is 50MPa to 10GPa, and the storage elastic modulus E' of the intermediate layer at 85 ℃ is 1MPa to less than 50 MPa.

14. The adhesive film according to any one of claims 11 to 13,

the intermediate layer comprises a thermoplastic resin.

15. The adhesive film according to claim 14,

the thermoplastic resin includes one or more resins selected from the group consisting of ethylene-alpha-olefin copolymers and ethylene-vinyl ester copolymers.

16. The adhesive film according to claim 15,

the ethylene-vinyl ester copolymer comprises an ethylene-vinyl acetate copolymer.

Technical Field

The invention relates to a method for manufacturing an electronic device and an adhesive film.

Background

In a manufacturing process of an electronic device, there is a process of cutting an electronic component such as a semiconductor substrate into a plurality of electronic components.

In the dicing step, for example, the electronic component is diced to obtain a plurality of electronic components in a state where the electronic component is attached to the adhesive film.

As a technique related to an adhesive film used in such a dicing step, for example, a technique described in patent document 1 (japanese patent application laid-open No. 2019-16634) is cited.

Patent document 1 describes a dicing tape having a laminated structure including a base material and an adhesive layer, wherein a 1 st tensile stress is generated at a strain value of 20% in a tensile test performed on a dicing tape test piece having a width of 20mm under conditions of an initial inter-chuck distance of 100mm, a 23 ℃ and a tensile speed of 10 mm/min, a 2 nd tensile stress is generated at a strain value of 20% in a tensile test performed on a dicing tape test piece having a width of 20mm under conditions of an initial inter-chuck distance of 100mm, a 23 ℃ and a tensile speed of 1000 mm/min, and a value of a ratio of the 2 nd tensile stress to the 1 st tensile stress is 1.4 or more.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2019-16634

Disclosure of Invention

Problems to be solved by the invention

According to the studies of the present inventors, the following problems have been found in the conventional method for manufacturing an electronic device.

First, the cutting blade used in the cutting step is not generally flat but is formed into a narrow-front and thick-rear shape (tapered shape) such as a semicircular shape, a semi-elliptical shape, or a V-shape. Therefore, as shown in fig. 4(a), in the step of dicing the electronic component 70A into a plurality of electronic components 70A using the dicing blade 60, when the tip of the dicing blade 60 is cut into the interface between the electronic component 70A and the adhesive film 50A, the side surface of the electronic component 70A after dicing may not be linear.

Therefore, as shown in fig. 4(b), the front end of the cutter 60 needs to be cut into the adhesive film 50A. By doing so, the electronic component 70A having a linear good side surface can be obtained.

However, in order to cut the front end of the cutting blade into the adhesive film, the thickness of the adhesive film needs to be increased. It was found that if the thickness of the adhesive film is increased, the flexibility of the adhesive film is reduced, and as a result, it becomes difficult to deform the film to which the electronic component is attached, and it becomes difficult to satisfactorily pick up the electronic component after dicing.

That is, the present inventors have found that in a conventional method for manufacturing an electronic device, there is room for improvement from the viewpoint of achieving both of the pickup properties of an electronic component having a linear and good side surface and an electronic component after dicing.

The present invention has been made in view of the above circumstances, and provides a method for manufacturing an electronic device, which can obtain an electronic component having a linear and good side surface and can pick up a cut electronic component with good accuracy, and an adhesive film.

Means for solving the problems

The present inventors have made extensive studies to achieve the above object. As a result, the present inventors have found that the use of an adhesive film comprising a substrate layer, an intermediate layer and an adhesive resin layer in this order and further having the intermediate layer thicker than the substrate layer can achieve both the pickup properties of an electronic component having a linear and good side surface and an electronic component after dicing, and have completed the present invention.

According to the present invention, a method for manufacturing an electronic device and an adhesive film described below are provided.

[1]

A method for manufacturing an electronic device, comprising the steps of:

a step (A) of preparing a structure having an electronic component and an adhesive film to be bonded to the electronic component, and

a step (B) of cutting the electronic component with a cutter in a state of being stuck to the adhesive film,

the adhesive film comprises a base material layer, an intermediate layer and an adhesive resin layer in this order,

the thickness of the substrate layer is X₁The thickness of the intermediate layer is X₂When the temperature of the water is higher than the set temperature,

satisfy X₂＞X₁The relationship (2) of (c).

[2]

The method of manufacturing an electronic device according to item [1] above,

thickness (X) of the substrate layer₁) Is 1 to 100 μm in diameter,

thickness (X) of the intermediate layer₂) Is 10 to 500 μm.

[3]

The method of manufacturing an electronic device according to the above [1] or [2],

the front end of the cutting knife is in a shape of being narrow in front and thick in back.

[4]

The method of manufacturing an electronic device according to item [3] above,

when the diameter of the front end of the cutting knife is set to be R, X is satisfied₂The relationship > R.

[5]

The method of manufacturing an electronic device according to any one of the above [1] to [4],

the storage elastic modulus E 'of the base material layer at 85 ℃ is 50MPa to 10GPa, and the storage elastic modulus E' of the intermediate layer at 85 ℃ is 1MPa to less than 50 MPa.

[6]

The method of manufacturing an electronic device according to any one of the above [1] to [5],

the intermediate layer contains a thermoplastic resin.

[7]

The method of manufacturing an electronic device according to item [6] above,

the thermoplastic resin includes one or more resins selected from the group consisting of ethylene- α -olefin copolymers and ethylene-vinyl ester copolymers.

[8]

The method of manufacturing an electronic device according to item [7] above,

the ethylene-vinyl ester copolymer comprises an ethylene-vinyl acetate copolymer.

[9]

The method of manufacturing an electronic device according to any one of the above [1] to [8],

the method further comprises, after the step (B), a step (C): the electronic component after dicing is subjected to characteristic evaluation in a state of being stuck to the adhesive film in a temperature environment of 0 ℃ or lower or 50 ℃ or higher.

[10]

The method of manufacturing an electronic device according to any one of the above [1] to [9],

the method further comprises, after the step (B), a step (D): the electronic component after dicing is picked up from the adhesive film.

[11]

An adhesive film used in a dicing step of an electronic component,

the adhesive film comprises a base material layer, an intermediate layer and an adhesive resin layer in this order,

the thickness of the substrate layer is X₁The thickness of the intermediate layer is X₂When the temperature of the water is higher than the set temperature,

satisfy X₂＞X₁The relationship (2) of (c).

[12]

The adhesive film according to the above [11],

thickness (X) of the substrate layer₁) Is 1 to 100 μm in diameter,

thickness (X) of the intermediate layer₂) Is 10 to 500 μm.

[13]

The adhesive film according to the above [11] or [12],

the storage elastic modulus E 'of the base material layer at 85 ℃ is 50MPa to 10GPa, and the storage elastic modulus E' of the intermediate layer at 85 ℃ is 1MPa to less than 50 MPa.

[14]

The adhesive film according to any one of the above [11] to [13],

the intermediate layer contains a thermoplastic resin.

[15]

The adhesive film according to the above [14],

the thermoplastic resin includes one or more resins selected from the group consisting of ethylene- α -olefin copolymers and ethylene-vinyl ester copolymers.

[16]

The adhesive film according to the above [15],

the ethylene-vinyl ester copolymer comprises an ethylene-vinyl acetate copolymer.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to provide a method for manufacturing an electronic device and an adhesive film, which can obtain an electronic component having a linear and good side surface and can pick up a cut electronic component with good accuracy.

Drawings

Fig. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive film according to an embodiment of the present invention.

Fig. 2 is a sectional view schematically showing an example of a method of manufacturing an electronic device according to an embodiment of the present invention.

Fig. 3 is a sectional view schematically showing an example of a method of manufacturing an electronic device according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view schematically showing an example of a state in which a dicing blade is used to cut into an electronic component.

Fig. 5 is a sectional view schematically showing an example of the tip diameter R of the cutting blade.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate. The drawing is a schematic view, and does not match the actual size ratio. In addition, "a to B" in the numerical range means a to B, unless otherwise specified. In the present embodiment, "(meth) acrylic" refers to acrylic acid, methacrylic acid, or both acrylic acid and methacrylic acid.

1. Adhesive film

The adhesive film 50 according to the present embodiment will be described below.

Fig. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive film 50 according to an embodiment of the present invention.

As shown in fig. 1, the adhesive film 50 according to the present embodiment is an adhesive film for temporarily fixing an electronic component in a dicing step of the electronic component, and includes a base layer 10, an intermediate layer 20, and an adhesive resin layer 30 in this order.

In the adhesive film 50 according to the present embodiment, the thickness of the base material layer 10 is X₁X is the thickness of the intermediate layer 20₂When, X is satisfied₂＞X₁The relationship (2) of (c).

The present inventors have made extensive studies to realize an adhesive film that can achieve both pickup properties of an electronic component having a linear and good side surface and an electronic component after dicing. As a result, by providing the intermediate layer 20 between the base material layer 10 and the adhesive resin layer 30 and making the thickness of the intermediate layer 20 larger than the thickness of the base material layer 10, the thickness of the entire adhesive film 50 can be increased without increasing the thickness of the base material layer 10 having poor stretchability and flexibility, and as a result, as shown in fig. 4(c), the front end of the dicing blade can be sufficiently cut, and the flexibility of the adhesive film 50 on the adhesive resin layer 30 side to which the electronic component is fixed can be improved. That is, the present inventors have found for the first time that the intermediate layer 20 is provided between the base layer 10 and the adhesive resin layer 30, and the thickness of the intermediate layer 20 is made larger than the thickness of the base layer 10, whereby the pickup properties of the electronic component having a linear good side surface and the electronic component after dicing can be achieved at the same time.

Thus, according to the adhesive film 50 of the present embodiment, the electronic component 70 having the linear and good side surface can be obtained, and the electronic component 70 after dicing can be picked up with good accuracy.

The thickness of the entire adhesive film 50 according to the present embodiment is preferably 25 μm to 500 μm, more preferably 30 μm to 400 μm, and still more preferably 30 μm to 300 μm in view of the balance between the mechanical properties and the handling properties.

The adhesive film 50 according to the present embodiment can be used for temporarily fixing an electronic component when the electronic component is cut in a manufacturing process of the electronic device. That is, the adhesive film 50 according to the present embodiment can be suitably used as a dicing tape in the dicing step of the electronic component.

The total light transmittance of the adhesive film 50 according to the present embodiment is preferably 80% or more, and more preferably 85% or more. By doing so, transparency can be imparted to the adhesive film 50. Further, by setting the total light transmittance of the adhesive film 50 to be equal to or higher than the lower limit value, the adhesive resin layer 30 can be irradiated with radiation more efficiently, and radiation irradiation efficiency can be improved. The total light transmittance of the adhesive film 50 can be measured according to JIS K7105 (1981).

Next, each layer constituting the adhesive film 50 according to the present embodiment will be described.

< substrate layer >

The base layer 10 is provided for the purpose of improving the properties of the adhesive film 50 such as handling properties, mechanical properties, and heat resistance. Here, in the present embodiment, the heat resistance means dimensional stability of the film or the resin layer at high temperature or low temperature. That is, the more excellent the heat resistance of the film or resin layer, the more difficult the film or resin layer is to be deformed or melted, such as expansion, shrinkage, or softening at high or low temperatures.

The base material layer 10 is not particularly limited as long as it has mechanical strength capable of withstanding an external force applied when the electronic component is cut, and examples thereof include resin films.

Further, the base material layer 10 preferably has heat resistance of the following degree: when the characteristics of the electronic component 70 are evaluated at high or low temperatures, the electronic component 70 is not deformed or melted to such an extent that the positional deviation thereof is caused.

Examples of the resin constituting the resin film include, for example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate and polybutylene naphthalate; polyamides such as nylon-6, nylon-66, and poly (m-xylylene adipamide); a polyimide; a polyetherimide; a polyamide-imide; a polycarbonate; modified polyphenylene ether; a polyacetal; a polyarylate; polysulfones; polyether sulfone; polyphenylene sulfide; polyether ether ketone; a fluorine-based resin; a liquid crystalline polymer; 1, 1-dichloroethylene resin; a polybenzimidazole; polybenzeneAzole; one or more selected from polymethylpentene, etc.

Among these, from the viewpoint of excellent balance among heat resistance, mechanical strength, transparency, price, and the like, one or two or more selected from polyimide, polyamide, and polyester are preferable, at least one selected from polyethylene terephthalate and polyethylene naphthalate is more preferable, and polyethylene naphthalate is further preferable.

The melting point of the base material layer 10 is preferably 200 ℃ or higher, and more preferably 220 ℃ or higher. Alternatively, the base material layer 10 preferably does not exhibit a melting point, more preferably has a decomposition temperature of 200 ℃ or higher, and still more preferably has a decomposition temperature of 220 ℃ or higher.

By using such a base material layer 10, deformation of the adhesive film 50 when the characteristics of the electronic component 70 are evaluated at high or low temperatures can be further suppressed.

The base layer 10 may be a single layer or two or more layers.

The resin film for forming the base layer 10 may be a stretched film, or may be a film stretched in a uniaxial direction or a biaxial direction.

In the adhesive film 50 according to the present embodiment, the storage elastic modulus E' of the base layer 10 at 85 ℃ is preferably 50MPa or more, more preferably 100MPa or more, further preferably 200MPa or more, and preferably 10GPa or less, and more preferably 5GPa or less, from the viewpoint of improving the properties such as the handling property, mechanical properties, and heat resistance of the adhesive film 50.

The storage elastic modulus E' of the base material layer 10 at 85 ℃ can be controlled within the above range by controlling the kinds and blending ratios of the components constituting the base material layer 10, for example.

The thickness (X) of the base layer 10 is set so that the adhesive film 50 has better properties such as handling properties, mechanical properties, and heat resistance₁) Preferably 1 μm or more, more preferably 2 μm or more, further preferably 3 μm or more, further more preferably 5 μm or more, and particularly preferably 10m or more.

The thickness (X) of the base layer 10 is set so that the in-plane expansion of the adhesive film 50 is more favorable₁) Preferably 100 μm or less, more preferably 75 μm or less, further preferably 50 μm or less, further more preferably 40 μm or less, and particularly preferably 30 μm or less.

The base material layer 10 may be surface-treated in order to improve adhesion to other layers. Specifically, corona treatment, plasma treatment, undercoating (under coat) treatment, primer coat (primer coat) treatment, and the like may be performed.

< intermediate layer >

The intermediate layer 20 is provided to adjust the thickness of the adhesive film 50 to a range in which the adhesive film can cut into the tip of the dicing blade while maintaining the flexibility of the adhesive film 50 on the adhesive resin layer 30 side.

That is, by providing the intermediate layer 20, it is possible to achieve both of the pickup property of the electronic component having the linear good side surface and the pickup property of the electronic component after dicing.

The resin constituting the intermediate layer 20 is not particularly limited as long as the flexibility of the adhesive film 50 on the adhesive resin layer 30 side can be satisfactorily maintained even if the thickness of the intermediate layer 20 is increased, and for example, a thermoplastic resin is preferable.

The thermoplastic resin according to the present embodiment is not particularly limited as long as it can form the intermediate layer 20, and examples thereof include ethylene- α -olefin copolymers containing ethylene and α -olefins having 3 to 20 carbon atoms, high-density ethylene resins, low-density ethylene resins, medium-density ethylene resins, ultra-low-density ethylene resins, linear low-density polyethylene (LLDPE) resins, propylene (co) polymers, 1-butene (co) polymers, 4-methylpentene-1 (co) polymers, ethylene-cyclic olefin copolymers, ethylene- α -olefin-nonconjugated polyene copolymers, ethylene- α -olefin-conjugated polyene copolymers, ethylene-aromatic vinyl ester copolymers, ethylene-vinyl ester copolymers, and the like, Olefin resins such as ethylene- α -olefin-aromatic vinyl ester copolymers; ethylene- (meth) acrylate copolymers such as ethylene- (meth) acrylic acid ethyl ester copolymer, ethylene- (meth) acrylic acid methyl ester copolymer, ethylene- (meth) acrylic acid propyl ester copolymer, ethylene- (meth) acrylic acid butyl ester copolymer, ethylene- (meth) acrylic acid hexyl ester copolymer, ethylene- (meth) acrylic acid-2-hydroxyethyl ester copolymer, ethylene- (meth) acrylic acid-2-hydroxypropyl ester copolymer, and ethylene- (meth) acrylic acid glycidyl ester copolymer; ethylene-vinyl ester copolymers such as ethylene-vinyl acetate copolymers, ethylene-vinyl propionate copolymers, ethylene-vinyl butyrate copolymers, and ethylene-vinyl stearate copolymers; polyvinyl chloride; poly-1, 1-dichloroethylene; a polyolefin-based thermoplastic elastomer; polystyrene-based thermoplastic elastomers; a polyurethane-based thermoplastic elastomer; 1, 2-polybutadiene-based thermoplastic elastomer; a trans-polyisoprene-based thermoplastic elastomer; a chlorinated polyethylene-based thermoplastic elastomer; one or more selected from polyester elastomers and the like.

Among these, at least one selected from ethylene- α -olefin copolymers and ethylene-vinyl ester copolymers is preferable, at least one selected from ethylene- α -olefin copolymers and ethylene-vinyl acetate copolymers is more preferable, and ethylene-vinyl acetate copolymers are further preferable. In the present embodiment, the resins may be used alone or in combination.

The content of the vinyl acetate unit in the ethylene-vinyl acetate copolymer is preferably 10 mass% or more and 35 mass% or less, more preferably 12 mass% or more and 30 mass% or less, and further preferably 15 mass% or more and 25 mass% or less. When the vinyl acetate unit content is within this range, the balance of crosslinking properties, flexibility, weather resistance and transparency is further improved.

The vinyl acetate content can be measured according to JIS K6730.

The α -olefin of the ethylene- α -olefin copolymer comprising ethylene and an α -olefin having 3 to 20 carbon atoms, which is used as the thermoplastic resin in the present embodiment, can be usually 1 kind of α -olefin having 3 to 20 carbon atoms, or 2 or more kinds in combination. Among them, an α -olefin having 10 or less carbon atoms is preferable, and an α -olefin having 3 to 8 carbon atoms is particularly preferable. Examples of such α -olefins include propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-dimethyl-1-butene, 4-methyl-1-pentene, 1-octene, 1-decene, and 1-dodecene. Among these, propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene and 1-octene are preferable from the viewpoint of ease of obtaining. The ethylene- α -olefin copolymer may be a random copolymer or a block copolymer, and is preferably a random copolymer from the viewpoint of flexibility.

Thickness (X) of intermediate layer 20₂) The thickness of the adhesive film 50 is not particularly limited as long as it can be adjusted within a range in which the adhesive film can sufficiently cut into the tip of the dicing blade, and is, for example, preferably 10 μm or more, more preferably 20 μm or more, further preferably 30 μm or more, further more preferably 50 μm or more, and particularly preferably 60 μm or more.

The thickness (X) of the intermediate layer 20 is set so that the flexibility of the adhesive film 50 on the adhesive resin layer 30 side is more satisfactory₂) Preferably 500 μm or less, more preferably 400 μm or less, further preferably 300 μm or less, further more preferably 200 μm or less, further more preferably 150 μm or less, and particularly preferably 130 μm or less.

Here, when the diameter of the distal end of the cutter blade is R,satisfy X₂The relationship > R. By doing so, the tip of the dicing blade can be sufficiently cut into the adhesive film 50, and as a result, the side surface of the electronic component after dicing can be made more linear. In the present embodiment, the cutting blade tip diameter R is a distance from a portion Y1 where the side surface of the cutting blade becomes nonlinear to the cutting blade tip Y2 as shown in fig. 5.

In the adhesive film 50 according to the present embodiment, the storage elastic modulus E' of the intermediate layer 20 at 85 ℃ is preferably 1MPa or more, more preferably 10MPa or more, from the viewpoint of making the properties such as handling property, mechanical properties, and heat resistance of the adhesive film 50 better, and is preferably less than 50MPa from the viewpoint of making the flexibility of the adhesive film 50 on the adhesive resin layer 30 side better.

The storage elastic modulus E' of the intermediate layer 20 at 85 ℃ can be controlled within the above range by controlling the kinds and mixing ratios of the respective components constituting the intermediate layer 20, for example.

The intermediate layer 20 may be a layer capable of crosslinking from the viewpoint of improving the heat resistance of the adhesive film 50.

The method of crosslinking the intermediate layer 20 is not particularly limited as long as it is a method capable of crosslinking the resin constituting the intermediate layer 20, and examples thereof include crosslinking by a radical polymerization initiator; crosslinking by sulfur or a sulfur-based compound; crosslinking methods such as crosslinking by radiation such as ultraviolet rays, electron beams, and gamma rays. Among these, crosslinking by electron beams is preferable.

Crosslinking with a radical polymerization initiator can use a radical polymerization initiator used in crosslinking of the resin constituting the intermediate layer 20. As the radical polymerization initiator, known thermal radical polymerization initiators, photo radical polymerization initiators, and combinations thereof can be used.

When the intermediate layer 20 is crosslinked using sulfur or a sulfur-based compound, the intermediate layer 20 may be crosslinked by adding a vulcanization accelerator, a vulcanization accelerator aid, or the like.

In any of the crosslinking methods, a crosslinking assistant may be added to the intermediate layer 20 to crosslink the intermediate layer 20.

< adhesive resin layer >

The adhesive resin layer 30 is a layer that comes into contact with and adheres to the surface of the electronic component 70 when the adhesive film 50 is attached to the electronic component 70.

Examples of the adhesive constituting the adhesive resin layer 30 include (meth) acrylic adhesives, silicone adhesives, urethane adhesives, olefin adhesives, and styrene adhesives. Among these, a (meth) acrylic pressure-sensitive adhesive containing a (meth) acrylic polymer as a base polymer is preferable in terms of ease of adjustment of the adhesive strength.

As the adhesive constituting the adhesive resin layer 30, a radiation-crosslinking adhesive whose adhesive force is reduced by radiation can be used. Since the adhesive resin layer 30 made of the radiation-crosslinking adhesive is crosslinked by irradiation of radiation and the adhesive force is significantly reduced, the electronic component 70 can be easily picked up from the adhesive resin layer 30 in the picking-up step of the electronic component 70. Examples of the radiation include ultraviolet rays, electron beams, and infrared rays.

The radiation-crosslinkable adhesive is preferably an ultraviolet-crosslinkable adhesive.

Examples of the (meth) acrylic polymer contained in the (meth) acrylic adhesive include homopolymers of (meth) acrylate compounds, copolymers of (meth) acrylate compounds and comonomers, and the like. Examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, and glycidyl (meth) acrylate. These (meth) acrylate compounds may be used singly or in combination of two or more.

Examples of the comonomer constituting the (meth) acrylic copolymer include vinyl acetate, (meth) acrylonitrile, (meth) acrylamide, styrene, (meth) acrylic acid, itaconic acid, (meth) acrylamide, methylol (meth) acrylamide, and maleic anhydride. These comonomers may be used singly or in combination of two or more.

The radiation-crosslinkable adhesive includes, for example, an adhesive such as the above-mentioned (meth) acrylic adhesive, a crosslinkable compound (a component having a carbon-carbon double bond), and a photopolymerization initiator or a thermal polymerization initiator.

Examples of the crosslinkable compound include monomers, oligomers, and polymers having a carbon-carbon double bond in the molecule and capable of being crosslinked by radical polymerization. Examples of such crosslinkable compounds include esters of (meth) acrylic acid and a polyol, such as trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tetraethyleneglycol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate; an ester (meth) acrylate oligomer; isocyanurate or isocyanurate compound such as 2-propenylbis-3-butenyl cyanurate, 2-hydroxyethylbis (2- (meth) acryloyloxyethyl) isocyanurate, tris (2-methacryloyloxyethyl) isocyanurate, and the like.

In the case where the adhesive is a radiation-crosslinkable polymer having a carbon-carbon double bond in a side chain of the polymer, the crosslinkable compound may not be added.

The content of the crosslinkable compound is preferably 5 to 100 parts by mass, and more preferably 10 to 50 parts by mass, per 100 parts by mass of the adhesive. When the content of the crosslinkable compound is in the above range, the adjustment of the adhesive force is easier than in the case of less than the above range, and the reduction of the storage stability due to the excessively high sensitivity to heat or light is less likely to occur than in the case of more than the above range.

The photopolymerization initiator may be a compound which is cleaved by irradiation with radiation to generate radicals, and examples thereof include benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; aromatic ketones such as benzil, benzoin, benzophenone, and α -hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzil dimethyl ketal; polyvinyl benzophenone; thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone and diethylthioxanthone.

Examples of the thermal polymerization initiator include organic peroxide derivatives and azo polymerization initiators. The organic peroxide derivative is preferred in that nitrogen is not generated during heating. Examples of the thermal polymerization initiator include ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, diacyl peroxide, peroxyester, peroxydicarbonate, and the like.

A cross-linking agent may be added to the adhesive. Examples of the crosslinking agent include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, and diglycerol polyglycidyl ether; aziridine compounds such as tetramethylolmethane-tris- β -aziridinyl propionate, trimethylolpropane-tris- β -aziridinyl propionate, N ' -diphenylmethane-4, 4 ' -bis (1-aziridinecarboxamide), and N, N ' -hexamethylene-1, 6-bis (1-aziridinecarboxamide); and isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, and polyisocyanate. From the viewpoint of improving the balance between the heat resistance and the adhesion of the adhesive resin layer 30, the content of the crosslinking agent is preferably 0.1 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic adhesive resin.

The thickness of the adhesive resin layer 30 is not particularly limited, and is, for example, preferably 1 μm to 100 μm, more preferably 3 μm to 50 μm, and still more preferably 5 μm to 40 μm.

The adhesive resin layer 30 can be formed by applying an adhesive coating liquid on the intermediate layer 20, for example.

As a method for applying the adhesive coating liquid, conventionally known coating methods such as a roll coating method, a reverse roll coating method, a gravure roll method, a bar coating method, a comma coating method, a die coating method, and the like can be used. The drying conditions of the applied adhesive are not particularly limited, but generally, it is preferable to dry the adhesive at a temperature of 80 to 200 ℃ for 10 seconds to 10 minutes. Further preferably, the drying is carried out at 80 to 170 ℃ for 15 seconds to 5 minutes. In order to sufficiently promote the crosslinking reaction between the crosslinking agent and the adhesive, the adhesive coating liquid may be heated at 40 to 80 ℃ for about 5 to 300 hours after the completion of drying.

< other layer >

The adhesive film 50 according to the present embodiment may further include a release film laminated on the adhesive resin layer 30. Examples of the release film include a polyester film subjected to a release treatment.

Specific examples of the adhesive film 50 according to the present embodiment include an adhesive film comprising a layer of a biaxially stretched polyethylene naphthalate film 25 μm/ethylene-vinyl acetate copolymer film (vinyl acetate unit content 19% by mass) 120 μm/ultraviolet ray-crosslinkable adhesive resin layer 30 μm, an adhesive film comprising a layer of a biaxially stretched polyethylene terephthalate film 50 μm/ethylene-vinyl acetate copolymer film (vinyl acetate unit content 19% by mass) 70 μm/ultraviolet ray-crosslinkable adhesive resin layer 30 μm, and the like.

< method for producing adhesive film >

Next, an example of a method for producing the adhesive film 50 according to the present embodiment will be described.

The adhesive film 50 according to the present embodiment can be obtained, for example, as follows: the intermediate layer 20 is formed by a lamination method by extrusion on one surface of the base layer 10, and the adhesive resin layer 30 is formed by applying an adhesive coating liquid on the intermediate layer 20 and drying it.

The substrate layer 10 and the intermediate layer 20 may be formed by coextrusion molding, or may be formed by laminating (laminating) the film-shaped substrate layer 10 and the film-shaped intermediate layer 20.

2. Method for manufacturing electronic device

Next, a method for manufacturing an electronic device according to the present embodiment will be described.

Fig. 2 and 3 are cross-sectional views schematically showing an example of a method of manufacturing an electronic device according to an embodiment of the present invention.

The method for manufacturing an electronic device according to the present embodiment includes at least the following 2 steps.

(A) A step of preparing a structure 100, the structure 100 including an electronic component 70 and an adhesive film 50 attached to the electronic component 70,

(B) cutting the electronic component 70 with a cutter in a state of being stuck on the adhesive film 50

In the method for manufacturing an electronic device according to the present embodiment, the following adhesive films are used as the adhesive film 50: the adhesive layer comprises the substrate layer 10, the intermediate layer 20 and the adhesive resin layer 30 in this order, and the thickness of the substrate layer 10 is X₁X is the thickness of the intermediate layer 20₂When, X is satisfied₂＞X₁The relationship (2) of (c).

Hereinafter, each step of the method for manufacturing an electronic device according to the present embodiment will be described.

(Process (A))

First, a structure 100 is prepared, the structure 100 including an electronic component 70 and an adhesive film 50 attached to the electronic component 70.

Such a structure can be obtained by, for example, attaching the electronic component 70 to the adhesive resin layer 30 of the adhesive film 50.

Examples of the electronic component 70 to be attached to the adhesive film 50 include a semiconductor substrate (e.g., a wafer) of silicon, germanium, gallium-arsenic, gallium-phosphorus, gallium-arsenic-aluminum, or the like; a mold array package substrate, a fan-out package substrate, a wafer level package substrate, and the like, in which a plurality of semiconductor chips are collectively sealed with a sealing resin.

In addition, as the semiconductor substrate, a semiconductor substrate having a circuit formed on a surface thereof is preferably used.

The adhesive film 50 may be applied manually, but is usually applied by an automatic applicator to which a roll-shaped surface protection film is attached.

The temperature of the adhesive film 50 and the electronic component 70 at the time of bonding is not particularly limited, and is preferably 25 to 80 ℃.

The pressure of the adhesive film 50 and the electronic component 70 at the time of bonding is not particularly limited, and is preferably 0.3 to 0.5 MPa.

(Process (B))

Next, the electronic component 70 is cut by a dicing blade in a state of being stuck to the adhesive film 50, and a plurality of electronic components 70 are obtained.

Here, "dicing" refers to an operation of dividing the electronic component 70 to obtain a plurality of divided electronic components 70.

The cutting can be performed, for example, by using a cutter having a narrow front end and a thick rear end.

The electronic component 70 in the step (B) includes a plurality of divided electronic components 70 obtained by dicing.

(Process (C))

In the method for manufacturing an electronic device according to the present embodiment, after the step (B), a step (C): the properties of the electronic component 70 after dicing were evaluated in a state of being stuck to the adhesive film 50 in a temperature environment of 0 ℃ or lower or 50 ℃ or higher.

The characteristic evaluation of the electronic component 70 is, for example, an operation confirmation test of the electronic component 70, and can be performed using a probe card (probe card)92 having probe terminals 95 as shown in fig. 3 c.

For example, a probe terminal 95 connected to a tester (tester) through the probe card 92 is brought into contact with a terminal 75 of the electronic component 70. This allows the operation power, the operation test signal, and the like to be granted and received between the electronic component 70 and the detector, and the operating characteristics of the electronic component 70 can be determined.

The ambient temperature in step (C) is 0 ℃ or less or 50 ℃ or more, the lower limit is preferably 60 ℃ or more, more preferably 80 ℃ or more, and further preferably 85 ℃ or more, and the upper limit is preferably 200 ℃ or less, more preferably 180 ℃ or less, and further preferably 160 ℃ or less. By doing so, deterioration of the electronic component 70, which causes a defect in the electronic component 70, can be accelerated, and the defective product can be removed by causing an initial defect in the electronic component 70 at an early stage. This makes it possible to obtain the electronic component 70 having excellent reliability with high yield.

For example, the structure 100 may be placed in a constant temperature bath or an oven, or heated by a heater provided on the sample stage 90, thereby being able to be brought into the temperature environment.

(Process (D))

In the method for manufacturing an electronic device according to the present embodiment, after the step (B) or the step (C), a step (D): the cut electronic component 70 is picked up from the adhesive film 50.

By this pickup, the electronic component 70 can be peeled off from the adhesive film 50. The pickup of the electronic component 70 can be performed by a known method.

(Process (E))

In the method for manufacturing an electronic device according to the present embodiment, before the step (D), a step (E): the adhesive film 50 is irradiated with radiation to crosslink the adhesive resin layer 30, thereby reducing the adhesive force of the adhesive resin layer 30 to the electronic component 70.

By performing the step (E), the electronic component 70 can be easily picked up from the adhesive resin layer 30. In addition, it is possible to suppress the surface of the electronic component 70 from being contaminated by the adhesive component constituting the adhesive resin layer 30.

The radiation is irradiated, for example, from the surface of the adhesive film 50 opposite to the surface on the adhesive resin layer 30 side.

When ultraviolet rays are used as the radiation, the dose of the ultraviolet rays irradiated to the adhesive film 50 is preferably 100mJ/cm²Above, more preferably 350mJ/cm²The above.

If the dose of the ultraviolet ray is not less than the lower limit, the adhesive force of the adhesive resin layer 30 can be sufficiently reduced, and as a result, the generation of adhesive residue on the surface of the electronic component 70 can be further suppressed.

The upper limit of the dose of the ultraviolet ray irradiated to the adhesive film 50 is not particularly limited, and productivity is highFrom the viewpoint of (2), for example, it is 1500mJ/cm²Hereinafter, 1200mJ/cm is preferable²The following.

The ultraviolet irradiation can be performed using, for example, a high-pressure mercury lamp or an LED.

(other steps)

The method of manufacturing an electronic device according to the present embodiment may include steps other than those described above. As another step, a step known in a method for manufacturing an electronic device can be used.

For example, after the step (D), any step generally performed in the manufacturing process of an electronic device, such as a step of mounting the obtained electronic component 70 on a circuit board, a wire bonding step, and a sealing step, may be further performed.

Although the embodiments of the present invention have been described above, they are merely examples of the present invention, and various configurations other than the above-described configurations can be adopted.

The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like are included in the present invention within a range in which the object of the present invention can be achieved.

The present application claims priority based on japanese application laid-open No. 2019-067115, filed on 29/3/2019, the entire disclosure of which is incorporated herein.

Description of the symbols

10: substrate layer, 20: intermediate layer, 30: adhesive resin layer, 50: adhesive film, 50A: adhesive film, 60: cutting knife, 70: electronic component, 70A: electronic component, 75: terminal, 90: sample stage, 92: probe card, 95: probe terminal, 100: a structure.