阅读说明：本技术 一种介质滤波器、介质谐振器及通信设备 (Dielectric filter, dielectric resonator and communication equipment ) 是由 王伟曳 于 2020-05-18 设计创作，主要内容包括：本申请公开了一种介质滤波器、介质谐振器及通信设备。该介质滤波器包括：至少一介质本体,设有相互垂直的第一方向和第二方向,介质本体形成有沿主耦合路径依次耦合的至少两个介质谐振腔,其中,介质谐振腔沿第一方向且相背设置的第一表面和第二表面均设有凹槽；金属层,覆盖在介质本体的表面。通过这种方式,能够提高介质滤波器的远端带外抑制性能,缩小介质滤波器及通信设备的体积。(The application discloses a dielectric filter, a dielectric resonator and a communication device. The dielectric filter includes: the dielectric resonator comprises at least one dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, at least two dielectric resonant cavities which are sequentially coupled along a main coupling path are formed in the dielectric body, and grooves are formed in a first surface and a second surface of each dielectric resonant cavity which are arranged along the first direction and back to back; and the metal layer covers the surface of the medium body. By the method, the far-end out-of-band rejection performance of the dielectric filter can be improved, and the volumes of the dielectric filter and the communication equipment can be reduced.)

1. A dielectric resonator, characterized in that the dielectric resonator comprises:

the dielectric resonator comprises a dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, the dielectric body forms a dielectric resonator, and grooves are formed in a first surface and a second surface of the dielectric body which are arranged along the first direction and are opposite to each other;

and the metal layer covers the surface of the medium body.

2. A dielectric filter, characterized in that the dielectric filter comprises:

the dielectric resonator comprises at least one dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, at least two dielectric resonant cavities which are sequentially coupled along a main coupling path are formed in the dielectric body, and grooves are formed in a first surface and a second surface of each dielectric resonant cavity which are arranged along the first direction and are opposite to each other;

and the metal layer covers the surface of the medium body.

3. The dielectric filter of claim 2, wherein the dielectric body is made of a ceramic material, and the dielectric constant of the dielectric body is greater than or equal to 78.

4. A dielectric filter according to claim 2, wherein the projections of the dielectric resonators in the second direction are arranged in an H-shape.

5. The dielectric filter of claim 2, wherein the dielectric body is provided with a coupling hole, the coupling hole penetrates through the dielectric body along a third direction, and the third direction is perpendicular to the first direction and the second direction.

6. A dielectric filter according to claim 2, wherein the at least two dielectric resonators are arranged in a "straight" pattern along the first direction.

7. A dielectric filter as recited in any of claims 2-6, wherein the at least one dielectric body comprises: the first medium body and the second medium body are spliced along the second direction, and a metal layer is arranged at the splicing position of the first medium body and the second medium body;

the first dielectric body forms part of the at least two dielectric resonant cavities, and the second dielectric body forms another part of the at least two dielectric resonant cavities.

8. A dielectric filter as recited in claim 7, wherein the grooves of the dielectric resonator cavities of the first dielectric body are aligned with the grooves of the second dielectric resonator cavities of the second dielectric body.

9. A dielectric filter as recited in claim 7, wherein the metal layer at the splice of the first dielectric body and the second dielectric body is provided with a coupling window between a last stage dielectric resonator in the first dielectric body along the main coupling path and a first stage dielectric resonator in the second dielectric body along the main coupling path.

10. A communication device, characterized in that the communication device comprises an antenna and a radio frequency unit connected to the antenna, the radio frequency unit comprising a dielectric filter according to any of claims 2-9 for filtering radio frequency signals.

Technical Field

The present application relates to the field of communications technologies, and in particular, to a dielectric filter, a dielectric resonator, and a communication device.

Background

In a 5G mobile communication system, a Small Cell (Small Cell) can solve the problems of signal coverage blind spots, insufficient capacity of hot spot areas and difficult site selection of a macro base station, is an important component of a 5G networking, has the advantages of miniaturization, low transmitting power, good controllability, intellectualization and flexible networking, and can be used in the 5G networking in a large scale. The filter is used as a key device in the small base station, and the size requirement of the filter is higher and higher due to the characteristics of the small base station, and meanwhile, in the 5G mobile communication system, the small base station uses the MIMO technology to improve the channel capacity, and more filters are used to improve the channel capacity, so that the size requirement of the filter is stricter.

To meet these increasingly demanding requirements of volume and performance, higher technologies are urgently needed to achieve. The dielectric filter can be smaller in size than a metal cavity filter, and has higher power capacity compared with a surface acoustic wave filter and an LTCC filter. However, the far-end out-of-band rejection of the current dielectric filter is poor, and a low-pass filter needs to be additionally added to solve the problem.

Disclosure of Invention

The technical problem that this application mainly solved provides a dielectric filter, dielectric resonator and communication equipment to improve the far-end outband rejection performance of dielectric filter, reduce the volume of dielectric filter and communication equipment.

In order to solve the technical problem, the application adopts a technical scheme that: a dielectric filter is provided. The dielectric filter includes: the dielectric resonator comprises at least one dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, at least two dielectric resonant cavities which are sequentially coupled along a main coupling path are formed in the dielectric body, and grooves are formed in a first surface and a second surface of each dielectric resonant cavity which are arranged along the first direction and are opposite to each other; and the metal layer covers the surface of the medium body.

Optionally, the dielectric body is made of a ceramic material, and a dielectric constant of the dielectric body is greater than or equal to 78. The dielectric resonator is prepared by filling high-dielectric-constant ceramic, so that a microwave wavelength compression effect can be generated, the effective size of the resonator can be greatly compressed, the overall size of the dielectric filter is miniaturized, and meanwhile, the ceramic and other materials are easy to mold, so that the batch production with lower cost can be realized, and the dielectric filter is highly matched with the technical requirements of 5G micro base stations (Small Cells) and MIMO systems.

Optionally, a projection of the medium resonant cavity towards the second direction is arranged in an H shape. The grooves on the first surface of the medium body and the grooves on the second surface of the medium body are symmetrically arranged, so that the medium body is convenient to process.

Optionally, a coupling hole is disposed on the dielectric body, and the coupling hole penetrates through the dielectric body along a third direction, where the third direction is perpendicular to the first direction and the second direction, respectively. The resonant frequency between the two dielectric resonant cavities is adjusted through the coupling hole.

Optionally, the at least two dielectric resonant cavities are arranged in a line along the first direction. The arrangement mode has the advantages of simple structure, simple process and lower cost.

Optionally, the at least one media body comprises: the first medium body and the second medium body are spliced along the second direction, and a metal layer is arranged at the splicing position of the first medium body and the second medium body; the first dielectric body forms part of the at least two dielectric resonant cavities, and the second dielectric body forms another part of the at least two dielectric resonant cavities. The first dielectric body and the second dielectric body are spliced along the second direction, so that the size of the dielectric filter along the first direction can be reduced, and the size of the dielectric filter is favorably reduced.

Optionally, the groove of the dielectric resonant cavity of the first dielectric body is aligned with the groove of the second dielectric resonant cavity of the second dielectric body. The grooves of the medium resonant cavity of the first medium body are aligned with the grooves of the second medium resonant cavity of the second medium body, so that the processing technology of the medium filter can be simplified, and the cost is saved.

Optionally, a coupling window is disposed in the metal layer at the joint of the first dielectric body and the second dielectric body, and the coupling window is located between the last-stage dielectric resonator in the first dielectric body along the main coupling path and the first-stage dielectric resonator in the second dielectric body along the main coupling path. The coupling window is arranged on the metal layer at the splicing position of the first medium body and the second medium body, so that electromagnetic signal transmission between the first medium body and the second medium body can be realized.

In order to solve the above technical problem, another technical solution adopted by the present application is: a dielectric resonator is provided. The dielectric resonator includes: the dielectric resonator comprises a dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, the dielectric body forms a dielectric resonator, and grooves are formed in a first surface and a second surface of the dielectric body which are arranged along the first direction and are opposite to each other; and the metal layer covers the surface of the medium body.

Optionally, the dielectric body is made of a ceramic material, and a dielectric constant of the dielectric body is greater than or equal to 78. The dielectric resonator is prepared by filling the high-dielectric-constant ceramic in the resonant cavity, so that a microwave wavelength compression effect can be generated, the effective size of the resonant cavity can be greatly compressed, the overall size of the dielectric resonator is miniaturized, and meanwhile, the batch production with lower cost can be realized due to the fact that the ceramic and other materials are easy to mold, so that the dielectric resonator is highly matched with the technical requirements of 5G micro base stations (Small Cells) and MIMO systems.

In order to solve the above technical problem, the present application adopts another technical solution: a communication device is provided. The communication equipment comprises an antenna and a radio frequency unit connected with the antenna, wherein the radio frequency unit comprises the dielectric filter and is used for filtering radio frequency signals.

The beneficial effect of this application is: different from the prior art, the dielectric filter of the embodiment of the present application includes: the dielectric resonator comprises at least one dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, at least two dielectric resonant cavities which are sequentially coupled along a main coupling path are formed in the dielectric body, and grooves are formed in a first surface and a second surface of each dielectric resonant cavity which are arranged along the first direction and back to back; and the metal layer covers the surface of the medium body. In this way, the first surface and the second surface of the dielectric resonant cavity of the dielectric filter, which are arranged along the first direction and back to back, are provided with the grooves, so that the dielectric resonant cavity is of a double-ridge waveguide structure, the frequency of a higher-order mode of the dielectric waveguide can be effectively increased, the far-end out-of-band rejection of the dielectric filter is obviously superior to that of a conventional dielectric waveguide filter, the requirement can be met without adding an additional low-pass filter, the far-end out-of-band rejection performance of the dielectric filter can be improved, and the volumes of the dielectric filter and the communication equipment are reduced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a dielectric resonator according to the present application;

FIG. 2 is a schematic structural diagram of an embodiment of a dielectric filter of the present application;

FIG. 3 is a schematic structural diagram of another embodiment of a dielectric filter according to the present application;

fig. 4 is a schematic diagram of a simulated structure of a conventional dielectric filter;

FIG. 5 is a schematic diagram of a simulated structure of a dielectric filter according to the present application;

fig. 6 is a schematic structural diagram of an embodiment of the communication device of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first" and "second" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The dielectric filter and the communication equipment can be used for a 5G communication system. The dielectric filter using the prior art usually uses ceramic with a dielectric constant of 20, and has a large volume and poor far-end out-of-band rejection, and in order to meet the requirement of a customer for far-end rejection, a low-pass filter needs to be additionally added, which results in increased system noise and reduced sensitivity, and meanwhile, the use of the low-pass filter increases the volume and the cost.

In order to solve the above problem, the present application first proposes a dielectric resonator, as shown in fig. 1, fig. 1 is a schematic structural diagram of an embodiment of the dielectric resonator of the present application. The dielectric resonator 10 of the present embodiment includes: the dielectric resonator comprises a dielectric body 12 and a metal layer (not shown), wherein the dielectric body 12 is provided with a first direction x and a second direction y which are perpendicular to each other, the dielectric body 12 forms a dielectric resonator, and a first surface (not shown in the figure) and a second surface (not shown in the figure) of the dielectric body 12 which are arranged along the first direction x and are opposite to each other are both provided with a groove 13; the metal layer overlies the surface of the dielectric body 12.

The metal layer 12 can prevent leakage of electromagnetic signals in the dielectric resonant cavity.

Different from the prior art, the first surface (not shown) and the second surface (not shown) of the dielectric body 12 of the dielectric resonator 10 of the embodiment, which are arranged along the first direction x and are opposite to each other, are both provided with the grooves 13, so that the dielectric resonator 10 is of a double-ridge waveguide structure, the frequency of the higher-order mode of the dielectric waveguide can be effectively increased, and the far-end out-of-band rejection of the dielectric resonator 10 is obviously superior to that of a conventional dielectric waveguide resonator.

Optionally, the material of the dielectric body 12 of this embodiment is a ceramic material, and the dielectric constant of the dielectric body 12 is greater than or equal to 78. The dielectric resonator 10 of this embodiment can generate a microwave wavelength compression effect because its resonant cavity is made of ceramic filling with a high dielectric constant, and can greatly compress the effective size of the resonant cavity, so that the overall size of the dielectric resonator 10 is miniaturized, and meanwhile, because materials such as ceramic are easy to mold, batch production with a lower cost can be realized, so the dielectric resonator 10 is highly matched with the technical requirements of 5G micro base stations (Small Cells) and MIMO systems.

In other embodiments, the material of the dielectric body may also be other materials with high dielectric constant and low loss, such as glass, quartz crystal, or titanate.

The material of the metal layer of the present embodiment may be silver, copper, aluminum, titanium, tin, gold, or the like. In this embodiment, the dielectric body 12 may be formed by using a specific mold, and then a metal layer may be formed on the surface of the dielectric body 12 by electroplating, spraying or welding. Optionally, the thickness of the metal layer is greater than or equal to the skin depth.

Optionally, the projection of the medium body 12 of this embodiment toward the second direction is an H-shaped groove, that is, the groove of the first surface of the medium body 12 and the groove of the second surface of the medium body 12 are symmetrically arranged, which is convenient for processing. In other embodiments, the depth of the two grooves may be different.

And the projection of the groove towards the second direction y is square, so that the processing is convenient.

In other embodiments, in order to adjust the resonant frequency of the dielectric resonator, a blind hole may be further formed in the surface of the groove along the first direction x, a metal layer is disposed in the blind hole, and the resonant frequency of the dielectric resonator is adjusted by polishing or thickening the metal layer in the blind hole; or an adjusting rod is arranged in the blind hole, and the resonant frequency of the dielectric resonator is adjusted by adjusting the depth of the adjusting rod in the blind hole.

The present application further provides a dielectric filter, as shown in fig. 2, fig. 2 is a schematic structural diagram of an embodiment of the dielectric filter of the present application. The dielectric filter 20 of the present embodiment includes: the dielectric resonator comprises at least one dielectric body 12 and a metal layer (not shown), wherein the dielectric body 12 is provided with a first direction x and a second direction y which are perpendicular to each other, the dielectric body 12 is formed with at least two dielectric resonators which are sequentially coupled along a main coupling path, and a first surface (not shown) and a second surface (not shown) of each dielectric resonator, which are arranged along the first direction x and are opposite to each other, are provided with grooves 13; the metal layer overlies the surface of the dielectric body 12.

The metal layer can avoid electromagnetic signal leakage in the dielectric resonant cavity.

The dielectric filter 20 of the present embodiment is formed by at least two dielectric resonators (not shown) arranged in cascade, and the structure of the dielectric resonator of the dielectric filter 20 is the same as that of the dielectric resonator 10.

In a specific production process, after at least two dielectric resonant cavities are formed in the dielectric body 12 of the dielectric filter 20, a metal layer is disposed on the surface of the dielectric body 12, that is, there is no metal layer between two dielectric resonant cavities arranged in series in the dielectric filter 20. The at least two dielectric resonant cavities adopt the same dielectric body 12, and a plurality of dielectric bodies are not required to be spliced, so that the process can be simplified, the cost can be saved, and the signal stability of the dielectric filter 20 can be improved.

Different from the prior art, the first surface (not shown) and the second surface (not shown) of the dielectric resonant cavity of the dielectric filter 20 of the embodiment are both provided with the grooves 13 along the first direction x and arranged oppositely, so that the dielectric resonant cavity is of a double-ridge waveguide structure, the frequency of the higher-order mode of the dielectric waveguide can be effectively increased, the far-end out-of-band rejection of the dielectric filter 20 is obviously superior to that of a conventional dielectric filter, and therefore, the requirement can be met without adding an additional low-pass filter, the far-end out-of-band rejection performance of the dielectric filter 20 can be improved, and the volumes of the dielectric filter 20 and the communication device can be reduced.

Optionally, the material of the dielectric body 12 of this embodiment is a ceramic material, and the dielectric constant of the dielectric body 12 is greater than or equal to 78. Because the dielectric resonator is prepared by filling high-dielectric-constant ceramic, a microwave wavelength compression effect can be generated, the effective size of the resonator can be greatly compressed, the overall size of the dielectric filter 20 is miniaturized, and meanwhile, because the ceramic and other materials are easy to mold, batch production with lower cost can be realized, so the dielectric filter 20 is highly matched with the technical requirements of 5G micro base stations (Small Cells) and MIMO systems.

In other embodiments, the material of the dielectric body may also be other materials with high dielectric constant and low loss, such as glass, quartz crystal, or titanate.

The material of the metal layer of the present embodiment may be silver, copper, aluminum, titanium, tin, gold, or the like. In this embodiment, the dielectric body 12 may be formed by using a specific mold, and then a metal layer may be formed on the surface of the dielectric body 12 by electroplating, spraying or welding. Optionally, the thickness of the metal layer is greater than or equal to the skin depth.

Optionally, as shown in fig. 2, the cross section of the dielectric resonant cavity of this embodiment in the second direction y is disposed in an H shape, that is, the groove on the first surface of the dielectric body 12 and the groove on the second surface of the dielectric body 12 are symmetrically disposed, which is convenient for processing. In other embodiments, the depth of the two grooves may be different.

The projection of the groove towards the second direction y is square, and the processing is convenient.

In other embodiments, in order to adjust the resonant frequency of the dielectric resonant cavity, a blind hole may be further formed in the surface of the groove along the first direction x, a metal layer is disposed in the blind hole, and the resonant frequency of the dielectric resonant cavity is adjusted by polishing or thickening the metal layer in the blind hole; or an adjusting rod is arranged in the blind hole, and the resonant frequency of the medium resonant cavity is adjusted by adjusting the depth of the adjusting rod in the blind hole.

Optionally, as shown in fig. 2, a coupling hole 14 is disposed on the dielectric body, and the coupling hole 14 penetrates through the dielectric body along a third direction z, where the third direction z is perpendicular to the first direction x and the second direction y, respectively.

The coupling hole 14 is specifically located between two adjacent dielectric resonant cavities and is used for adjusting the resonant frequency of a signal between the two adjacent dielectric resonant cavities; arranging a metal layer in the coupling hole 14, and adjusting the resonant frequency between the two medium resonant cavities by polishing or thickening the metal layer of the coupling hole 14; or an adjusting rod is arranged in the coupling hole 14, and the resonant frequency between the two dielectric resonant cavities is adjusted by adjusting the depth of the adjusting rod in the coupling hole 14.

Alternatively, as shown in fig. 2, at least two dielectric filter cavities of the dielectric filter 20 are arranged in a line along the first direction x. The arrangement mode has the advantages of simple structure, simple process and lower cost.

Wherein, the at least two medium resonant cavities of the embodiment comprise six medium filter cavities A1-A6. In other embodiments, the dielectric filter 20 may further include 5 or 7 dielectric filter cavities, which is not limited in particular.

Optionally, as shown in fig. 2, the dielectric filter 20 further includes: an input port 15 and an output port 16, wherein the input port 15 is coupled with a first-stage dielectric resonant cavity on a main coupling path of the dielectric filter 20; the output port 16 is coupled to the last stage dielectric resonator on the main coupling path of the dielectric filter 20.

Specifically, the medium body 12 is provided with an input port 15 and an output port 16, and the input port 15 is coupled with the medium resonant cavity a 1; the output port 16 is coupled to the dielectric resonator a 6.

The input port 15 and the output port 16 may be in the form of a connector, or may be in the form of a pin and a circuit board.

As can be seen from the above analysis, the dielectric body 12 of the present embodiment is further provided with eight coupling holes 14, wherein the first coupling hole 14 is disposed between the input port 15 and the dielectric resonator a1, and the last coupling hole 14 is disposed between the output port 16 and the dielectric resonator a 6; to further improve the far-end out-of-band rejection performance of the dielectric filter 20, the eight coupling holes 14 are disposed in a wave shape along the first direction x.

In other embodiments, in order to improve the far-end out-of-band rejection performance of the dielectric filter, the depths of the grooves of the first surface and/or the second surface of the plurality of dielectric resonators may be different, that is, the grooves of the first surface and/or the grooves of the second surface of the plurality of dielectric resonators are not flush.

The present application further proposes a dielectric filter of another embodiment, as shown in fig. 3, fig. 3 is a schematic structural diagram of another embodiment of the dielectric filter of the present application. The dielectric filter 20 of the present embodiment is different from the dielectric filter 20 described above in that: the dielectric filter 20 of the present embodiment includes: the dielectric medium comprises a first dielectric body 21 and a second dielectric body 22, wherein the first dielectric body 21 and the second dielectric body 22 are spliced along a second direction y, and a metal layer 11 is arranged at the splicing position of the first dielectric body 21 and the second dielectric body 22; the first dielectric body 21 forms part of at least two dielectric resonators and the second dielectric body 22 forms another part of at least two dielectric resonators, wherein the recess 13 of the dielectric resonator of the first dielectric body 21 is aligned with the recess 14 of the second dielectric resonator of the second dielectric body 22. The first dielectric body 21 and the second dielectric body 22 are spliced along the second direction y, so that the size of the dielectric filter 20 along the first direction x can be reduced, the size of the dielectric filter 20 is reduced, and the groove 13 of the dielectric resonant cavity of the first dielectric body 21 and the groove 14 of the second dielectric resonant cavity of the second dielectric body 22 are aligned, so that the processing technology of the dielectric filter 20 can be simplified, and the cost is saved.

The first dielectric body 21 and the second dielectric body 22 may be formed by sintering after being formed by a mold, or may be formed by sintering after being formed by splicing the first dielectric body 21 and the second dielectric body 22, which is not limited specifically.

Optionally, as shown in fig. 3, the metal layer 11 at the joint of the first dielectric body 21 and the second dielectric body 22 is provided with a coupling window 23, and the coupling window 23 is located between the last-stage dielectric resonator in the first dielectric body 21 along the main coupling path and the first-stage dielectric resonator in the second dielectric body 22 along the main coupling path.

Specifically, as shown in FIG. 3, the first media body 21 forms media filter cavity A1-A3 and the second media body 22 forms media filter cavity A4-A6. Coupling window 23 is located between media filter cavity A3 and media filter cavity a 4.

In the production process, the metal layers 11 are formed on the surface of the first dielectric body 21 formed with the dielectric filter cavities a1-A3 and the second dielectric body 22 formed with the dielectric filter cavities a4-a6, respectively (fig. 3 only shows the metal layers 11 at the joint of the first dielectric body 21 and the second dielectric body 22).

The coupling window 23 is arranged on the metal layer 11 at the joint of the first dielectric body 21 and the second dielectric body 22, that is, the metal layer is removed from the position of the coupling window 23, so that the electromagnetic signal transmission between the first dielectric body 21 and the second dielectric body 22 can be realized.

In other embodiments, a coupling window may be disposed on the metal layer 11 between the dielectric filter cavity a1 and the dielectric filter cavity a6 to achieve cross coupling between the dielectric filter cavity a1 and the dielectric filter cavity a6, or a coupling window may be disposed on the metal layer 11 between the dielectric filter cavity a2 and the dielectric filter cavity a5 to achieve cross coupling between the dielectric filter cavity a2 and the dielectric filter cavity a5 to enable the coupling zero of the dielectric filter 20.

As shown in fig. 4 and 5, fig. 4 is a schematic diagram of a simulated structure of a conventional dielectric filter; fig. 5 is a schematic diagram of a simulated structure of a dielectric filter according to the present application. Through the comparison of the two S parameter waveforms, the conventional dielectric waveguide filter has no attenuation at 4.8GHz under the condition of almost the same passband bandwidth, while the dielectric filter 20 of the embodiment has no attenuation at 5.8GHz, so that the dielectric filter 20 can obtain better far-end out-of-band rejection performance without adding a low-pass filter.

In addition, the dielectric filter 20 of the present application uses ceramic with high dielectric constant, and under the condition of the same order and index, the volume of the dielectric filter 20 of the present application is only about 40% of that of the conventional dielectric filter.

The present application further provides a communication device, as shown in fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the communication device of the present application. The communication device of the present embodiment includes an antenna 32 and a radio frequency unit 31 connected to the antenna 32, the radio frequency unit 31 includes a filter 10 as shown in the above-mentioned embodiment, and the filter 10 is used for filtering a radio frequency signal.

In other embodiments, the rf Unit 31 may be integrated with the Antenna 32 to form an Active Antenna Unit (AAU).

Different from the prior art, the dielectric filter of the embodiment of the present application includes: the dielectric resonator comprises at least one dielectric body, a first electrode and a second electrode, wherein the dielectric body is provided with a first direction and a second direction which are perpendicular to each other, at least two dielectric resonant cavities which are sequentially coupled along a main coupling path are formed in the dielectric body, and grooves are formed in a first surface and a second surface of each dielectric resonant cavity which are arranged along the first direction and back to back; and the metal layer covers the surface of the medium body. In this way, the first surface and the second surface of the dielectric resonant cavity of the dielectric filter provided in the embodiment of the present application, which are arranged along the first direction, are both provided with the grooves, so that the dielectric resonant cavity is of a double-ridge waveguide structure, the frequency of the higher-order mode of the dielectric waveguide can be effectively increased, the far-end out-of-band rejection of the dielectric filter is obviously superior to that of a conventional dielectric waveguide filter, and thus the requirement can be met without adding an additional low-pass filter, the far-end out-of-band rejection performance of the dielectric filter can be improved, and the volumes of the dielectric filter and the communication device can be reduced.

Compared with the traditional dielectric filter, the double-ridge dielectric filter has obvious advantages, and as the far-end out-of-band rejection is obviously improved, the requirement can be met without adding an additional low-pass filter, the insertion loss caused by using the low-pass filter is reduced, the system noise is reduced, and the receiving sensitivity is improved; meanwhile, as the microwave ceramic material with the dielectric constant larger than or equal to 78 is adopted, the volume is reduced to about 40 percent of that of the conventional dielectric filter, and filters with more channels can be placed under the condition of the same volume, so that the volume of a 5G system adopting the MIMO technology is smaller.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.