阅读说明：本技术 半导体工艺腔室 (Semiconductor process chamber ) 是由 李进 于 2021-08-30 设计创作，主要内容包括：本申请公开一种半导体工艺腔室,其包括腔体,所述腔体设有内腔,所述内腔设有顶部开口和侧部开口；内衬体,所述内衬体设置于所述内腔中,所述内衬的顶端与所述顶部开口连接,所述内衬体设有传片口,所述传片口与所述侧部开口相对设置；内门,所述内门包括门体和驱动组件,所述驱动组件用于驱动所述门体沿所述腔体的轴向运动,并选择性地控制所述门体嵌入所述传片口内或者避让所述传片口。上述技术方案能够解决目前工艺腔室内容易产生横向气流,对气体的流动均匀性产生不利影响,进而造成晶圆的刻蚀均匀性受到影响的问题。(The application discloses a semiconductor process chamber, which comprises a cavity, wherein the cavity is provided with an inner cavity, and the inner cavity is provided with a top opening and a side opening; the inner lining body is arranged in the inner cavity, the top end of the inner lining is connected with the top opening, the inner lining body is provided with a sheet conveying port, and the sheet conveying port is opposite to the side opening; the inner door comprises a door body and a driving assembly, wherein the driving assembly is used for driving the door body to move along the axial direction of the cavity and selectively controlling the door body to be embedded into the sheet conveying opening or avoid the sheet conveying opening. By the technical scheme, the problem that the etching uniformity of the wafer is influenced due to the fact that the transverse airflow is easily generated in the existing process chamber and the flowing uniformity of the gas is adversely affected can be solved.)

1. A semiconductor processing chamber applied to semiconductor processing equipment is characterized by comprising:

the cavity is provided with an inner cavity, and the inner cavity is provided with a top opening and a side opening;

the inner lining body is arranged in the inner cavity, the top end of the inner lining is connected with the top opening, the inner lining body is provided with a sheet conveying port, and the sheet conveying port is opposite to the side opening;

the inner door comprises a door body and a driving assembly, wherein the driving assembly is used for driving the door body to move along the axial direction of the cavity and selectively controlling the door body to be embedded into the sheet conveying opening or avoid the sheet conveying opening.

2. The semiconductor process chamber of claim 1, wherein the driving assembly comprises a first driving assembly and a second driving assembly, the driving ends of the first driving assembly and the second driving assembly are both connected with the door body, the first driving assembly is used for driving the door body to move along the axial direction of the cavity, and the second driving assembly is used for driving the door body to move along the distribution directions of the side opening and the wafer conveying opening.

3. The semiconductor processing chamber according to claim 2, wherein the door body is provided with a plurality of fitting holes, a cross section of the fitting hole perpendicular to the axial direction of the cavity is a long hole, the long hole extends along a distribution direction of the side opening and the wafer transfer port, the driving end of the first driving assembly is movable along the extending direction of the long hole, and the driving end of the second driving assembly is movable within the fitting hole along the extending direction of the long hole and along the axial direction of the cavity.

4. The semiconductor processing chamber of claim 3, wherein the first drive assembly comprises a first drive shaft and a first drive portion, the first drive portion driving the first drive shaft to move along an axial direction of the chamber body;

the driving end of the first driving shaft extends into the matching hole, the first driving shaft is a cylindrical structural part, and the size of the matching hole in the axial direction of the cavity is equal to or larger than two times of the diameter of the first driving shaft.

5. The semiconductor process chamber of claim 4, wherein the driving end of the first driving shaft is provided with two limiting bosses spaced along an axial direction of the cavity, and the two limiting bosses are respectively limited and arranged at two opposite ends of the matching hole along the axial direction of the cavity.

6. The semiconductor processing chamber of claim 4, wherein the first driving assembly further comprises at least two adapters, one end of the first driving shaft is fixed on the adapters, the other end of the first driving shaft is matched with the matching hole, and the first driving portion is used for driving the adapters to move along the axial direction of the cavity.

7. The semiconductor processing chamber of claim 6, wherein the second drive assembly comprises a second drive portion and a second drive shaft, the second drive portion disposed on the adapter portion, the drive end of the second drive shaft extending into the mating aperture; and under the condition that the first driving part drives the door body to move in place along the axial direction of the cavity, the second driving part drives the door body to move along the distribution directions of the side opening and the sheet conveying opening.

8. The semiconductor processing chamber according to any one of claims 3 to 7, wherein a driving end of the second driving portion is provided with a first inclined surface and a second inclined surface, the first inclined surface and the second inclined surface are located on two opposite sides of the mating hole in the axial direction, the first inclined surface and the second inclined surface face two opposite ends of the mating hole in the extending direction, and the first inclined surface and the second inclined surface are arranged in parallel.

9. The semiconductor processing chamber of claim 1, wherein the inner liner comprises a liner ring wall and a substrate wall, a top of the liner ring wall is connected to the chamber, a bottom of the liner ring wall is connected to the substrate wall, the liner ring wall and the substrate wall are both provided with notches, and the notches on the liner ring wall and the substrate wall are communicated to form the wafer transfer port;

the substrate wall is provided with a mounting hole used for being matched with the base, and the substrate wall is provided with a plurality of grid holes distributed circumferentially;

the door body comprises a plugging portion, the plugging portion is matched with the sheet conveying opening, and a grid hole is formed in the bottom of the plugging portion.

10. The semiconductor process chamber according to claim 9, wherein the door further comprises a baffle fixed to a side of the blocking portion facing the side opening, and the baffle extends out of the blocking portion.

11. The semiconductor processing chamber of claim 9, further comprising an adapter ring secured to the chamber body and sealingly engaged with a top opening of the chamber body;

the top surface of cavity is equipped with the step face, the top of liner ring wall is equipped with outer edge, outer edge the axial overlap joint of cavity in the step face, outer edge orientation one side of adaptation ring is equipped with heavy platform, the adaptation ring is equipped with protruding edge, protruding edge the axial of cavity is stretched into heavy platform.

Technical Field

The application belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor process chamber.

Background

The wafer processing technology is various, generally needs to be carried out in a process chamber of semiconductor process equipment, in order to ensure higher process effect, the process chamber generally needs to have better sealing performance, and the flow direction of airflow in the process chamber needs to be controlled.

Disclosure of Invention

The application discloses semiconductor process chamber can solve the problem that the flow uniformity of gas is adversely affected because transverse airflow is easily generated in the existing process chamber, and further the etching uniformity of a wafer is affected.

In order to solve the above problem, the embodiments of the present application are implemented as follows:

the embodiment of the application provides a semiconductor process chamber, which is applied to semiconductor process equipment, and comprises:

the cavity is provided with an inner cavity, and the inner cavity is provided with a top opening and a side opening;

the inner lining body is arranged in the inner cavity, the top end of the inner lining is connected with the top opening, the inner lining body is provided with a sheet conveying port, and the sheet conveying port is opposite to the side opening;

the inner door comprises a door body and a driving assembly, wherein the driving assembly is used for driving the door body to move along the axial direction of the cavity and selectively controlling the door body to be embedded into the sheet conveying opening or avoid the sheet conveying opening.

The embodiment of the application provides a semiconductor process chamber, and the semiconductor process chamber includes cavity, interior lining body and interior door, and the cavity is equipped with the inner chamber, and the inner chamber is equipped with open-top and lateral part opening, and interior lining body sets up in the inner chamber, and the top and the open-top of interior lining body are connected, and the biography piece mouth and the lateral part opening of interior lining body set up relatively to guarantee that the wafer can be passed into the cavity through passing the piece mouth and is spread in the cavity. The inner door includes the door body and drive assembly, drive assembly can drive the axial motion of the door body along the cavity, and selectively control the embedding of the door body and pass in the piece mouth, thereby provide the shutoff effect for passing the piece mouth with the help of the door body of inner door, this can guarantee the door body and pass and do not have the gap between the piece mouth basically, thereby prevent that the gas in the interior bushing body from passing the piece mouth and flowing, and then can prevent gas from the door body and pass the gap between the piece mouth along the axial of cavity from basically, also can greatly reduce the probability that gas flows along the axial direction of perpendicular to cavity, promote the homogeneity of flowing of gas in the inner chamber. Meanwhile, the driving assembly in the inner door can also move along the axial direction of the cavity body through the driving door body, so that the door body can move from the position embedded into the wafer conveying opening to the position avoiding the wafer conveying opening, and the wafer can be guaranteed to be normally conveyed into the cavity body and can be normally conveyed out of the cavity body.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic diagram of a prior art semiconductor processing chamber;

FIG. 2 is a schematic diagram of a semiconductor processing chamber according to an embodiment of the present disclosure;

FIG. 3 is an enlarged view of a portion of the structure of FIG. 2;

FIG. 4 is an enlarged view of another portion of the structure of FIG. 2;

FIG. 5 is a schematic view of a liner in a semiconductor processing chamber according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of a liner in another orientation in a semiconductor processing chamber disclosed in an embodiment of the present application;

FIG. 7 is a schematic view of a liner in another orientation in a semiconductor processing chamber according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of an inner door of a semiconductor processing chamber according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of an inner door in another orientation in a semiconductor processing chamber as disclosed in an embodiment of the present application;

FIG. 10 is a schematic view of an inner door in another orientation in a semiconductor processing chamber disclosed in an embodiment of the present application;

FIG. 11 is an enlarged view of a portion of the structure of FIG. 10;

FIG. 12 is a schematic cross-sectional view of an inner door in a semiconductor processing chamber disclosed in an embodiment of the present application;

FIG. 13 is an enlarged view of a portion of the structure of FIG. 11;

FIG. 14 is a schematic cross-sectional view of an inner door in another position in a semiconductor processing chamber as disclosed in an embodiment of the present application;

FIG. 15 is an enlarged view of a portion of the structure of FIG. 14;

fig. 16 is a schematic structural diagram of a door body in a semiconductor process chamber disclosed in an embodiment of the present application.

Description of reference numerals:

100-cavity, 110-cavity, 120-side opening, 100' -cavity,

200-adaptor ring, 200' -adaptor ring,

310-inner liner, 311-chip transfer port, 312-grid hole, 313-liner ring wall, 314-liner bottom wall, 315-mounting hole, 320-outer edge, 310' -inner liner,

400-inner door, 410-door body, 411-blocking part, 412-baffle, 412 a-matching hole, 420-mounting part, 431-first driving part, 432-first driving shaft, 432 a-limit boss, 433-gasket, 441-second driving part, 442-second driving shaft, 442 a-first inclined surface, 442 b-second inclined surface, 443-bracket, 450-switching part, 400' -inner door,

510-base, 510 '-base, 520-dielectric window, 520' -dielectric window, 530-gasket, 540-inductive coil.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

In the process of solving the above technical problems, the inventor provides the following technical solution, as shown in fig. 1, the process chamber includes a chamber 100 ', an inner liner 310', an inner door 400 'and a susceptor 510', the chamber 100 'is provided with an adapter ring 200' and a dielectric window 520 ', the susceptor 510' is disposed in the chamber 100 ', the inner liner 310' is provided with a wafer transferring port, a wafer can be transferred into the chamber 100 'or transferred out of the chamber 100' through the wafer transferring port, the bottom of the inner liner 310 'is provided with a gate hole, and under the action of the air-extracting device, the gas in the chamber 100' can flow downward through the gate hole. In order to improve the sealing performance of the chamber 100 ', an inner door 400' is disposed outside the liner body 310 'to seal the sheet conveying opening through the inner door 400'. However, the applicant found that the circumferential gap exists between the inner door 400 'and the inner liner 310' in the above solution, which causes the gap between the inner door 400 'and the inner liner 310' to generate a lateral gas flow, which still adversely affects the flow uniformity of the gas, and thus the etching uniformity of the wafer is affected.

In view of the above, as shown in fig. 2 to 16, the present invention discloses a semiconductor process chamber that may be applied to semiconductor process equipment, and as shown in fig. 2, the semiconductor process chamber includes a chamber body 100, an inner liner 310, and an inner door 400.

As shown in fig. 2 to 4, the chamber 100 is an essential part of a semiconductor process chamber, and may serve as a mounting base. The shape and size of the chamber 100 may be determined according to practical requirements, and is not limited herein. The chamber 100 has an inner cavity 110 to provide a space for processing a wafer, and the inner cavity 110 has a top opening and a side opening 120, wherein the top opening is a space for communicating the chamber 100 with the outside, and during the assembling process, components such as an adapter ring 200 and a dielectric window 520 can be disposed on the top opening to ensure that the chamber 100 can communicate with the outside as required. The adaptor ring 200 can be stably fixed to the chamber 100 by a connector such as a bolt, and the adaptor ring 200 and the dielectric window 520 are hermetically connected to the top opening of the chamber 100, so that the top opening of the chamber 100 is closed. The side opening 120 is a space corresponding to the inner liner 310 of the chamber 100, and ensures that the wafer can be transferred into the inner chamber 110 and out of the inner chamber 110 through the side opening 120. In order to ensure the condition of forming the vacuum chamber in the inner cavity 110, a valve cover (not shown) or the like may be disposed at the side opening 120 to close the side opening 120 during the non-sheet-transferring operation.

As shown in FIG. 2, the inner liner 310 is disposed in the inner cavity 110, and the top end of the inner liner 310 is connected to the top opening of the chamber 100, so that the process gas introduced from the top opening can be introduced into the cavity of the inner liner 310. As shown in fig. 2 and 5, the inner liner 310 is provided with a wafer transferring port 311, the wafer transferring port 311 is disposed opposite to the side opening 120, the shape and size of the wafer transferring port 311 can be correspondingly set based on the shape and size of the side opening 120, and the sizes of the side opening 120 and the wafer transferring port 311 are both larger than the size of the wafer processed by the semiconductor processing chamber provided in the embodiment of the present application, so as to ensure that the wafer transferring operation can be performed normally.

The bottom of the inner liner 310 is provided with the gate hole 312 for exhausting, as described above, the semiconductor process chamber further includes the inner door 400, the sheet conveying opening 311 can be blocked by the inner door 400, so that when the gas flows out from the gate hole 312 at the bottom of the inner liner 310 to form a vertical gas flow, the gas can be prevented from flowing from the sheet conveying opening 311 to the inside and outside of the inner cavity 110 as much as possible by the blocking effect provided by the inner door 400 embedded in the sheet conveying opening 311, thereby reducing the probability of generating a transverse gas flow perpendicular to the axial direction of the cavity 100, and improving the uniformity of the gas in the inner liner 310.

The inner door 400 includes a door body 410 and a driving assembly, and as shown in fig. 2, the door body 410 is disposed in the inner cavity 110. The driving assembly is mounted in the cavity 100, and the door body 410 is connected with the driving assembly, so that the driving assembly has the capability of driving the door body 410 to move along the axial direction of the cavity 100, and selectively controls the door body 410 to be embedded into the sheet conveying opening 311 or to avoid the sheet conveying opening 311. In detail, the door 410 may be controlled to avoid the wafer transferring opening 311 by manual control of an operator or by means of a preset program when a wafer needs to be transferred in or out, and after the wafer is transferred in or out, the door 410 is controlled to be embedded into the wafer transferring opening 311, that is, the door 410 may be switched between a first state of being embedded into the wafer transferring opening 311 and a second state of being avoided from the wafer transferring opening 311.

Specifically, the driving assembly may include a linear motor, a hydraulic cylinder, an air cylinder, or other driving devices, and by controlling the installation position, the orientation, and the like of the driving assembly, the driving assembly may have the capability of driving the door 410 to move along the axial direction of the cavity 100. The driving assembly can be installed in the inner cavity 110, and the driving assembly and the door body 410 can be fixedly connected with each other by welding or connecting pieces, or the driving assembly and the door body 410 can form a limiting relation in the axial direction of the cavity 100 by means of a limiting structure, which can also ensure that the driving assembly can drive the door body 410 to move along the axial direction of the cavity 100.

The embodiment of the present application provides a semiconductor process chamber, which includes a chamber 100, an inner liner 310 and an inner door 400, wherein the chamber 100 has an inner cavity 110, the inner cavity 110 has a top opening and a side opening 120, the inner liner 310 is disposed in the inner cavity 110, a top end of the inner liner 310 is connected to the top opening, and a wafer transfer port 311 of the inner liner 310 is disposed opposite to the side opening 120, so as to ensure that a wafer can be transferred into the chamber 100 through the wafer transfer port 311 and transferred out of the chamber 100. The inner door 400 comprises a door body 410 and a driving assembly, the driving assembly can drive the door body 410 to move along the axial direction of the cavity 100, and selectively control the door body 410 to be embedded into the sheet conveying port 311, so that the door body 410 of the inner door 400 provides a blocking effect for the sheet conveying port 311, and it can be ensured that no gap exists between the door body 410 and the sheet conveying port 311, so that gas in the inner lining body 310 is prevented from flowing out from the sheet conveying port 311, and further gas can be prevented from flowing from the gap between the door body 410 and the sheet conveying port 311 along the axial direction of the cavity 100, and the probability that the gas flows along the direction perpendicular to the axial direction of the cavity 100 can be greatly reduced, and the flowing uniformity of the gas in the inner cavity 110 can be improved. Meanwhile, the driving assembly in the inner door 400 can also drive the door body 410 to move along the axial direction of the cavity 100, so that the door body 410 can move from the position embedded into the wafer conveying opening 311 to the position avoiding the wafer conveying opening 311, and the wafer can be normally conveyed into the cavity 100 and can be normally conveyed out of the cavity 100.

Based on the above embodiment, optionally, the driving assembly includes a first driving assembly and a second driving assembly, and the driving ends of the first driving assembly and the second driving assembly are both connected with the door body 410, so that the first driving assembly and the second driving assembly can both drive the door body 410 to move. The first driving assembly can drive the door body 410 to move along the axial direction of the cavity 100, and the second driving assembly can drive the door body 410 to move along the distribution directions of the side opening 120 and the sheet conveying opening 311. As described above, the side opening 120 and the sheet passing port 311 are oppositely disposed, and more specifically, the opposite direction or the distribution direction thereof is perpendicular to the axial direction of the cavity 100. In this embodiment, the door body 410 further has the capability of moving in the direction away from the side opening 120 along the distribution direction of the side opening 120 and the sheet conveying port 311, so that the door body 410 can further improve the sealing effect on the sheet conveying port 311 by having the capability of being embedded into the sheet conveying port 311, so as to further reduce the size of the gap between the sheet conveying port 311 and the door body 410, and further reduce the generation probability of the transverse airflow.

As described above, the driving assembly may be disposed within the inner cavity 110, and based on the above embodiment, more specifically, the first driving assembly and the second driving assembly may be disposed within the inner cavity 110 and both connected to the door 410. Specifically, the first driving assembly and the second driving assembly may each include a driving portion and a driving shaft, the driving portions of the first driving assembly and the second driving assembly may each be one of a linear motor, a hydraulic cylinder and a pneumatic cylinder, and the driving direction of the driving portion of the first driving assembly is perpendicular to the driving direction of the driving portion of the second driving assembly, so that the first driving assembly and the second driving assembly may respectively drive the door 410 to move in two directions perpendicular to each other relative to the cavity 100.

More specifically, one of the first and second drive assemblies may be mounted on the drive shaft of the other. Taking the second driving assembly installed on the driving shaft of the first driving assembly as an example, the second driving assembly can drive the door body 410 to move along the driving direction thereof, and the first driving assembly can drive the second driving assembly and the door body 410 to move together, so that the door body 410 can be driven by the first driving assembly and the second driving assembly respectively, and the door body 410 can move in different directions. Of course, there are many assembling relationships among the first driving assembly, the second driving assembly and the door 410, and the text is not described here one by one in consideration of brevity.

In another embodiment of the present application, the door body 410 is provided with a plurality of fitting holes 412a, a cross section of the fitting hole 412a perpendicular to the axial direction of the cavity 100 is a long hole, and the long hole extends along the distribution direction of the side opening 120 and the sheet transfer port 311. In short, the cross-sectional shape of the fitting hole 412a may be a kidney-shaped hole so that the structure fitted with the aforementioned fitting hole 412a can move in the fitting hole 412a in an axial direction perpendicular to the chamber 100. Based on the structure, the driving end of the first driving assembly can move along the extending direction of the elongated hole, and the driving end of the second driving assembly can move along the extending direction of the elongated hole and along the axial direction of the cavity in the matching hole.

In detail, the driving end of the first driving assembly and the door body 410 are limited in the axial direction of the cavity 100, so that the first driving assembly can drive the door body 410 to move in the axial direction of the cavity 100; in order to ensure that the second driving assembly has the capability of driving the door body 410 to move along the distribution direction of the side opening 120 and the sheet conveying opening 311, i.e., the extending direction of the elongated hole, the driving end of the second driving assembly can move relative to the door body 410 along the extending direction of the elongated hole, and the driving end of the second driving assembly can move relative to the matching hole 412a along the axial direction of the cavity 100.

Specifically, by forming an inclined surface structure on the hole wall of the mating hole and making the driving end of the second driving assembly and the inclined surface structure form an interconnected relationship, when the driving end of the second driving assembly moves along the axial direction of the cavity 100, the driving end of the second driving assembly is blocked by the inclined surface structure, the final motion track of the driving end of the second driving assembly is in a direction inclined with respect to both the axial direction of the cavity 100 and the extending direction of the elongated hole, and the motion track can be decomposed into a first motion track along the axial direction of the cavity 100 and a second motion track along the extending direction of the elongated hole, so that the second driving assembly can drive the door body 410 to move along the extending direction of the elongated hole, that is, the distribution directions of the side opening 120 and the sheet conveying opening 311. Correspondingly, in order to ensure that the first driving assembly does not interfere with the relative movement between the second driving assembly and the door body in the extending direction of the elongated hole, the driving end of the first driving assembly and the matching hole 412a need to have the capability of relative movement in the extending direction of the elongated hole, so that the first driving assembly and the door body 410 can move relative to each other when the second driving assembly drives the door body to move.

Alternatively, as shown in fig. 8 and 9, the first driving assembly includes a first driving part 431 and a first driving shaft 432 connected to each other, the door body 410 is connected to the first driving shaft 432, the first driving part 431 is installed on the cavity 100, the first driving part 431 drives the first driving shaft 432 to move along the axial direction of the cavity 100, the driving end of the first driving shaft 432 extends into the fitting hole 412a, the first driving shaft 432 is a cylindrical structural member, and as described above, the section of the fitting hole 412a perpendicular to the axial direction of the cavity 100 is a long hole, which may ensure that the first driving shaft 432 can move in the fitting hole 412a along the distribution direction of the side opening 120 and the tablet passing port 311.

In order to ensure the fitting reliability between the door body 410 and the first driving shaft 432, in the case that the cross-section of the first driving shaft 432 is a circular structure, the size of the fitting hole 412a in the axial direction of the cavity 100 may be equal to or greater than twice the diameter of the first driving shaft 432, thereby preventing the overhang inclination condition from occurring and improving the driving stability of the door body 410.

As described above, the driving end of the first driving shaft 432 is connected to the door 410 to provide a driving force for the door 410 to move in the axial direction of the chamber 100. In order to prevent the first driving shaft 432 from interfering with the driving process of the second driving assembly, only the first driving shaft 432 and the door body 410 may be in a relatively fixed relationship in the axial direction of the chamber 100, and the first driving shaft 432 and the door body 410 may have a capability of moving relatively in a direction perpendicular to the axial direction of the chamber 100.

Based on the above embodiment, optionally, the driving end of the first driving shaft 432 is provided with two limiting bosses 432a arranged at intervals along the axial direction of the cavity 100, the two limiting bosses 432a are respectively and limitedly arranged at two opposite ends of the matching hole 412a along the axial direction of the cavity 100, that is, one limiting boss 432a is limitedly arranged at one end of the matching hole 412a, the other limiting boss 432a is limitedly arranged at the other end of the matching hole 412a along the axial direction of the cavity 100, so that the first driving shaft 432 can form a mutually limited matching relationship with the door body 410 in the axial direction of the cavity 100 through the two limiting bosses 432a, ensuring that the first driving shaft 432 can drive the door body 410 to move relative to the cavity 100 in the axial direction of the cavity 100, and in the case where the fitting hole 412a and the first driving shaft 432 are respectively configured as in the above-described embodiment, it is ensured that the first driving shaft 432 can move within the fitting hole 412 a.

Specifically, as described above, the cross section of the first driving shaft 432 may be a circular structure, and by making the size of the fitting hole 412a in the distribution direction of the side opening 120 and the sheet transfer port 311 larger than the diameter of the first driving shaft 432, that is, making the cross section of the fitting hole 412a kidney-shaped hole, it is possible to ensure that the first driving shaft 432 can move within the fitting hole 412 a. The first driving shaft 432 may include two detachably connected portions, and the two limiting bosses 432a are respectively disposed on the two portions of the first driving shaft 432, so that the two limiting bosses 432a are respectively located on two opposite sides of the mating hole 412a in a manner that two opposite ends of the mating hole 412a are respectively mounted, and it is ensured that the limiting bosses 432a and the door body 410 form a relatively fixed matching relationship in the axial direction of the cavity 100.

Further, a spacer 433 may be provided between the stopper boss 432a and the end surface of the fitting hole 412a, and fitting stability between the stopper boss 432a and the end surface of the fitting hole 412a may be improved by the spacer 433. The pad 433 may be a sheet-like structure made of plastic or the like.

As described above, the first driving assembly may be installed in the chamber 100, since the inner chamber 110 is generally required to be a vacuum environment or a near vacuum environment during the process, which requires high overall airtightness, and therefore, in another embodiment of the present application, the first driving part 431 of the first driving assembly is optionally disposed outside the chamber 100. In addition, in order to reduce the difficulty of installing the first driving part 431, the installation part 420 may be used to assist in installing the first driving part 431 on the chamber 100, in which case, the installation part 420 is disposed outside the chamber 100, and the first driving part 431 is also disposed outside the chamber 100, so as to reduce the selection criteria of the first driving component. In this case, the mounting part 420 still needs to be fixed with respect to the chamber 100, the first driving part 431 is fixedly coupled to the mounting part 420 with the driving side of the first driving part 431 disposed toward the chamber 100, and in this case, the first driving shaft 432 may be directly coupled to the first driving part 431. Since the door 410 is located in the inner cavity 110 of the cavity 100, in order to drive the door 410 to move relative to the cavity 100 along the axial direction of the cavity 100 through the first driving shaft 432, the driving end of the first driving shaft 432 extends into the cavity 100 from the outside of the cavity 100 and is connected with the door 410. Of course, a through hole is required to be formed in the cavity 100 at a position corresponding to the first driving shaft 432, so as to ensure that the first driving shaft 432 can extend into the inner cavity 110.

Also, to ensure that the process environment in the inner chamber 110 can be formed properly, the first driving shaft 432 is hermetically connected to the chamber 100. Specifically, the first drive shaft 432 may be provided with a sealing action by a sealing tube. More specifically, the sealing tube is sleeved outside the first driving shaft 432, and two opposite ends of the sealing tube can be respectively and hermetically connected to the surfaces of the chamber 100 and the mounting portion 420, so as to ensure that the sealing performance of the chamber 100 is not affected by the first driving shaft 432.

Optionally, in another embodiment of the present application, the first driving assembly may further include an adaptor 450 and an elastic sealing tube, the mounting portion 420 is fixed to the chamber 100, and the first driving portion 431 is disposed on a side of the mounting portion 420 facing away from the chamber 100. In this case, the driving side of the first driving portion 431 is disposed away from the cavity 100, and further, the output shaft of the first driving portion 431 is fixedly connected to the adaptor portion 450, so that the first driving portion 431 can drive the adaptor portion 450 to move along the axial direction of the cavity 100 relative to the cavity 100. Moreover, as described above, one end of the first driving shaft 432 is engaged with the engaging hole 412a of the door body 410, so that the first driving shaft 432 is connected to the door body 410, and meanwhile, by connecting the end of the first driving shaft 432 away from the door body 410 with the adapter 450, the first driving shaft 432 can be driven to move together in the process of the adapter 450 moving relative to the cavity 100, so as to drive the door body 410 to move along the axial direction of the cavity 100.

Specifically, the adaptor 450 may be a block-shaped or plate-shaped structural member, and the first driving shaft 432 and the output shaft of the first driving portion 431 may be fixedly connected to the adaptor 450 by welding or connecting members. The cavity 100 is also required to be provided with a through hole corresponding to the first driving shaft 432 to ensure that the first driving shaft 432 can extend into the inner cavity 110. Correspondingly, in order to ensure that the inner cavity 110 still has a sealing capability, the elastic sealing tube is sleeved outside the first driving shaft 432, and two opposite ends of the elastic sealing tube are respectively connected with the cavity 100 and the adapter 450 in a sealing manner. Specifically, the elastic sealing tube may be a metal bellows, two ends of the elastic sealing tube may be respectively fixed and hermetically connected to the cavity 100 and the adapter 450 by welding, and with the aid of the elastic capacity and the sealing capacity of the elastic sealing tube, in the process that the first driving portion 431 drives the adapter 450 to move relative to the cavity 100, the elastic sealing tube may be ensured to always provide a better sealing effect for the cavity 100.

Optionally, the number of the first driving shafts 432 is at least two, and the two first driving shafts 432 are arranged at intervals, so that in the process that the first driving part 431 drives the door body 410 to move through the adapter part 450, the motion stability of the door body 410 can be improved under the combined action of the two first driving shafts 432.

Specifically, the mounting portion 420 is a plate-shaped structural member, and the mounting portion 420 is provided with a through hole, and a driving end of the first driving shaft 432 departing from the adapter portion 450 may sequentially pass through the through hole of the mounting portion 420 and the through hole of the cavity 100 and extend into the inner cavity 110. In this case, the through hole of the mounting portion 420 may provide a certain limiting and guiding function for the first driving shaft 432, thereby improving the driving accuracy and stability of the door body 410. In this embodiment, while the mounting portion 420 and the cavity 100 are fixedly connected, a sealing relationship may be formed by a sealing gasket, and further, the two opposite ends of the elastic sealing tube may be hermetically connected between the mounting portion 420 and the adaptor portion 450.

Similarly, the second driving assembly may include a second driving part 441 and a second driving shaft 442, the second driving part 441 may drive the second driving shaft 442 to move along the axial direction of the cavity 100, and the second driving shaft 442 is engaged with the engaging hole 412a of the door body 410. Optionally, the second driving portion 441 of the second driving assembly may also be installed at a side of the installation portion 420 away from the chamber 100, in this case, it is also necessary that the installation portion 420 is provided with a corresponding through hole corresponding to the driving shaft of the second driving portion 441, and the second driving shaft 442 of the second driving assembly sequentially passes through the through hole of the installation portion 420 and the through hole of the chamber 100 to extend into the chamber 100 so as to be matched with the door body 410. In the case where the first and second drive shafts 432, 442 are both cylindrical shafts, the through holes of the mounting portion 420 may be both cylindrical holes.

Correspondingly, when the second driving component is installed outside the cavity 100, a sealing structure is also required to be disposed at a position of the cavity 100 corresponding to the second driving component, so as to ensure that the inner cavity 110 has complete sealing performance. Specifically, a sealing member may be disposed between the second driving portion 441 and the mounting portion 420, and the sealing member is sleeved outside the second driving shaft 442, so as to ensure that the sealing performance of the cavity 100 is not substantially damaged by the arrangement of the second driving shaft 442. More specifically, the second driving portion 441 and the mounting portion 420 may be sealed by a hard sealing pipe, and opposite ends of the sealing member are respectively connected to the mounting portion 420 and the second driving portion 441 in a sealing manner, so as to provide a sealing function for the second driving assembly. Accordingly, the mounting portion 420 and the chamber 100 may be sealed by a gasket or the like, so as to ensure that the gap between the mounting portion 420 and the chamber 100 does not adversely affect the sealing state of the chamber 100.

As shown in fig. 12 and 14, in a case that the process chamber includes the adapter 450, optionally, the second driving portion 441 may also be mounted on the adapter 450, so that when the first driving portion 431 drives the adapter 450 to move, the second driving portion 441 can be driven to move together, so that the second driving portion 441, the first driving shaft 432 and the door 410 are kept in a relatively stationary state in the axial direction of the cavity 100, that is, the first driving portion 431 is used to drive the door 410 to move up and down, and the second driving portion 441 is used to drive the door to move in a translational manner, so that the fitting tightness between the door 410 and the sheet transfer port 311 is better. In addition, a bracket 443 may be further disposed between the second driving portion 441 and the adaptor portion 450, and the bracket 443 may provide the purpose of assisting the installation and enhancing the fixing effect for the second driving portion 441.

As described above, the inclined surface may be disposed in the engaging hole 412a of the door body 410 engaged with the second driving assembly to limit the moving path of the second driving shaft 442 by the inclined surface, so that the second driving shaft 442 may drive the door body 410 to move along the distribution direction of the side opening 120 and the sheet transfer opening 311 when moving along the axial direction of the cavity 100 relative to the door body 410.

In another embodiment of the present application, as shown in fig. 15, a driving end of the second driving shaft 442 extends into the fitting hole 412a, and a driving end of the second driving shaft 442 facing away from the second driving portion 441 is provided with a first inclined surface 442a and a second inclined surface 442 b. The first inclined surface 442a and the second inclined surface 442b are spaced apart from each other along the axial direction of the cavity 100, so that a portion of the second driving shaft 442 located between the first inclined surface 442a and the second inclined surface 442b can be matched with a structure where the matching hole 412a of the door body 410 is located. Meanwhile, the first inclined surface 442a and the second inclined surface 442b are respectively located at two axially opposite sides of the mating hole 412a, and the first inclined surface 442a and the second inclined surface 442b are respectively located at two axially opposite ends of the mating hole 412a in the extending direction, in short, the first inclined surface 442a and the second inclined surface 442b are arranged at opposite positions, and the directions of the first inclined surface 442a and the second inclined surface 442b are opposite; also, the first and second inclined surfaces 442a and 442b are disposed in parallel.

When the technical scheme is adopted, in the process of driving the door body 410 to move relative to the inner lining body 310, the first driving part 431 is used for driving the door body 410 to move along the axial direction of the cavity 100, and when the first driving part 431 drives the door body 410 to move in place along the axial direction of the cavity 100, namely the door body 410 is in a state of facing the sheet conveying port 311, then the second driving part 441 drives the door body 410 to move along the distribution directions of the side opening 120 and the sheet conveying port 311, so that the embedded state between the door body 410 and the sheet conveying port 311 is more consistent, the size of a gap between the sheet conveying port 311 and the door body 410 is further reduced, and the uniformity of air flow is improved. Correspondingly, when the sheet conveying opening 311 needs to be opened, the second driving portion 441 drives the door body 410 to move towards the direction close to the side opening 120 along the distribution direction of the side opening 120 and the sheet conveying opening 311, so that the gap between the side walls of the sheet conveying opening 311 of the door body 410 is increased as much as possible, the difficulty of the door body 410 moving along the axial direction of the cavity 100 is reduced, and then the first driving portion 431 drives the door body 410 to move along the axial direction of the cavity 100.

Specifically, after the second driving shaft 442 and the fitting hole 412a of the door body 410 are assembled, the first inclined surface 442a and the second inclined surface 442b are both fitted with the hole wall of the fitting hole 412a, and when the second driving shaft 442 is driven by the second driving portion 441 and moves along the axial direction of the cavity 100, under the action of the first inclined surface 442a and the second inclined surface 442b, the door body 410 can be driven to move along the distribution direction of the sheet conveying opening 311 and the side opening 120 and along the direction perpendicular to the axial direction of the cavity 100, so that the effect of embedding the door body 410 into the sheet conveying opening 311 is better, the blocking effect of the door body 410 on the sheet conveying opening 311 is further improved, and the generation probability of transverse airflow in the inner cavity 110 is reduced.

Specifically, the inclination parameters of the first inclined surface 442a and the second inclined surface 442b may be determined according to actual conditions, such as the size of the door body 410 required to move in the direction perpendicular to the axial direction of the cavity 100, and the accuracy of the door body 410 and the sheet transfer port 311. In addition, the second driving shaft 442 may include at least two detachably connected portions, and the first inclined surface 442a and the second inclined surface 442b may be respectively located on the two portions, so that the two portions may be respectively installed in the fitting hole 412a through two opposite sides of the fitting hole 412a of the door body 410, and then, the two portions are connected to each other, so that the second driving shaft 442 and the fitting hole 412a of the door body 410 may form a fitting relationship.

Further, along the axial direction of the cavity 100, the side of the first inclined surface 442a departing from the second inclined surface 442b and the side of the second inclined surface 442b departing from the first inclined surface 442a are both provided with a limiting table, the limiting tables are both protruded from the second driving shaft 442 along the direction perpendicular to the axial direction of the cavity 100, and under the effect of the limiting tables on the two sides of the first inclined surface 442a and the second inclined surface 442b, a limiting effect can be provided for the driving range of the second driving portion 441, so as to ensure that the driving actions of the second driving portion 441 are all effectively driven.

Further, as shown in fig. 5 and 16, the inner liner 310 includes a liner ring wall 313 and a substrate wall 314, a top portion of the liner ring wall 313 is connected to the cavity 100, a bottom portion of the liner ring wall 313 is connected to the substrate wall 314, notches are provided on the liner ring wall 313 and the substrate wall 314, and the notches on the liner ring wall 313 and the substrate wall 314 are communicated to form a sheet transfer port 311, in this case, the door body 410 includes a blocking portion 411, and the blocking portion 411 is fitted to the sheet transfer port 311, that is, the blocking portion 411 can be inserted into the sheet transfer port 311 of the above structure, and when a portion of the sheet transfer port 311 is located on the substrate wall 314, the blocking portion 411 is inserted into the sheet transfer port 311 along the axial direction of the cavity 100, so that the fitting tightness between the blocking portion 411 and the sheet transfer port 311 can be relatively better.

Moreover, as shown in fig. 5, the bottom wall 314 is provided with a mounting hole 315 matching with the base 510, the base 510 is used for carrying the wafer, and a portion of the base 510 can extend into the inner liner 310 through the mounting hole 315, thereby ensuring that the wafer can be in the etching environment inside the inner liner 310. The substrate wall 314 is provided with a plurality of circumferentially distributed gate holes 312, so that the gas in the process chamber can be pumped out through the gate holes 312, correspondingly, the bottom of the blocking part 411 of the door body 410 is also provided with the gate holes 312, and the shape and the size of the gate holes 312 on the blocking part 411 can be correspondingly the same as those of the gate holes 312 on the substrate wall 314, thereby further improving the flow uniformity of the gas in the process chamber.

More specifically, the sheet conveying port 311 is a fan-shaped structure, the axis of the sheet conveying port 311 coincides with the axis of the inner liner 310, the included angle range of the fan-shaped sheet conveying port 311 may be 75 ± 1 °, and the minimum width of the sheet conveying port 311 may be 20 to 25mm greater than the diameter of a wafer to be transported, for example, the diameter of the wafer is 300mm, and the minimum size of the sheet conveying port 311 may be 320 to 325 mm. As described above, the liner ring wall 313 and the liner bottom wall 314 are provided with a portion of the liner port 311, that is, the sheet transfer port 311 extends from the side portion to the bottom portion of the inner liner 310, and correspondingly, the blocking portion 411 should at least include the side portion and the bottom portion connected to each other and respectively correspond to the side surface and the bottom surface of the sheet transfer port 311, and based on the structural parameters of the sheet transfer port 311 in the inner liner 310, the specific parameters of the portion of the door body 410 corresponding to the sheet transfer port 311 can be correspondingly determined, so that when the door body 410 blocks the sheet transfer port 311, a complete and regular "new inner liner" can be formed.

Further, the door body 410 may further include a stopper 412, the stopper 412 may be fixed to a side of the blocking portion 411 facing the side opening 120, the stopper 412 may extend to the outside of the blocking portion 411, the blocking portion 411 may block the sheet conveying port 311 in a state where the door body 410 is fitted into the sheet conveying port 311, and the stopper 412 may block at least a part of a gap facing the side opening 120, of a gap between the blocking portion 411 and the inner liner 310. That is, in the door body 410, the blocking portion 411 is used for being embedded into the sheet conveying opening 311, and the baffle 412 is used for blocking a gap between the blocking portion 411 and the sheet conveying opening 311, so that the baffle 412 can be used as a second layer blocking part of the sheet conveying opening 311, and further the generation of transverse airflow is weakened, thereby reducing the interference of the transverse airflow on the air distributing effect of the air distributing grid 312, and being beneficial to improving the plasma distribution uniformity in the inner cavity 110.

Specifically, the baffle 412 and the blocking portion 411 may be formed in an integrated manner, and the shape and size of the blocking portion 411 are the same as those of the sheet conveying opening 311, so as to ensure that the blocking portion 411 can block the sheet conveying opening 311 and the size of the gap between the blocking portion and the sheet conveying opening is as small as possible. The baffle 412 is located outside the blocking portion 411 and extends from an edge of the blocking portion 411, and a size of a portion of the baffle 412 located outside the blocking portion 411 may be selected according to actual circumstances, and is not limited herein. More specifically, the baffle 412 may extend from the top of the blocking portion 411 near the top opening, and the baffle 412 may also extend from two sides of the blocking portion 411 adjacent to the top thereof, respectively, so as to provide a blocking effect for the top gap and the side gap in the gaps of the blocking portion 411 and the sheet conveying opening 311, so as to weaken the amplitude of the transverse gas flow to the maximum extent, and improve the distribution uniformity of the process gas and the plasma in the inner cavity 110. In addition, as described above, the door body 410 and the driving shaft of the driving unit may be engaged with each other through the engaging hole 412a, and in the case where the door body 410 includes the shutter 412 and the blocking portion 411, as shown in fig. 16, a part of the shutter 412 may be protruded to a side away from the blocking portion 411, and the engaging hole 412a may be formed in the protruded part.

As described above, the inner liner 310 is installed in the chamber body 100, and optionally, the inner liner 310 may be directly fixed to the wall of the chamber body 100 by a screw connection or the like. Also, the process chamber may further include an adaptor ring 200, the adaptor ring 200 is fixed on the chamber body 100, and the adaptor ring 200 is sealingly coupled with the top opening of the chamber body 100. Specifically, as shown in fig. 3, at least two sealing gaskets 530 are disposed between the adaptor ring 200 and the cavity 100, and each sealing gasket 530 is disposed concentrically, so that the sealing relationship between the adaptor ring 200 and the cavity 100 is more reliable under the action of the sealing gasket 530. In the assembly process of the process chamber, an inductive coil 540 is arranged between the outer edge of the adapter ring 200 and one side surface of the cavity 100 facing the adapter ring 200, so that the grounding effect of the adapter ring 200 is better by grounding the cavity 100.

Moreover, as shown in fig. 3, a step surface is arranged on the top surface of the cavity 100, an outer edge 320 is arranged at the top end of the liner ring wall 313, and the outer edge 320 is lapped on the step surface along the axial direction of the cavity 100; moreover, a sinking platform is arranged on one side of the outer edge 320 facing the adapting ring 200, and the adapting ring 200 is provided with a convex edge extending into the sinking platform along the axial direction of the cavity 100. Meanwhile, as described above, the adapter ring 200 and the cavity 100 are fixedly connected, and based on this, the inner liner 310 may be sandwiched between the cavity 100 and the adapter ring 200 in the axial direction of the cavity 100, and the inner liner 310 may also be sandwiched between the cavity 100 and the adapter ring 200 in the direction perpendicular to the axial direction of the cavity 100, so that the inner liner 310 may be fixed between the cavity 100 and the adapter ring 200 by respectively providing the cavity 100, the adapter ring 200, and the inner liner 310 with the above-mentioned structures, and thus, a connecting member providing a fixing function may not be separately provided for the inner liner 310, and the assembly workload of the semiconductor process chamber may be reduced. When the liner 310 and the cavity 100 form a stable relative fixed relationship, the door 410 can be correspondingly sealed at the sheet-conveying opening 311 by controlling the position change of the door 410. Moreover, in the present embodiment, as described above, the adaptor ring 200 directly seals the top opening of the chamber 100, so that no separate sealing member is required between the inner liner 310 and the chamber 100, and between the inner liner 310 and the adaptor ring 200, which can save the workload and reduce the cost, and on the other hand, can reduce the number of sealing points required for forming a vacuum environment in the process chamber, which can greatly reduce the probability of the sealing failure of the process chamber.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.