阅读说明：本技术 一种高集成度的集成电路封装装置及其使用方法 (High-integration integrated circuit packaging device and using method thereof ) 是由 顾汉玉 王泽山 季伟 袁泉 于 2021-08-16 设计创作，主要内容包括：本发明提供一种高集成度的集成电路封装装置,包括：下安装板、上模具、引线框架、塑封通道、加热压入腔、下夹持机构、上夹持机构、驱动机构、同步机构和混合机构,所述下安装板顶部固定有下模具,所述下模具上表面对称开设有第一定位槽,所述第一定位槽中部开设有下模腔,所述下模具的四角对称开设有第三定位孔,所述上模具设置在下模具上表面,所述上模具下表面对称开设有第二定位槽,所述第二定位槽中部开设有上模腔。本发明可大大提高良品率和树脂压入速度,提高工作效率,而提高压入速度又可防止塑封料硬化粘度变高托起小岛,进一步提高良品率,并且可提高融化速度,从而提高封装效率。(The invention provides a high-integration integrated circuit packaging device, comprising: lower mounting panel, last mould, lead frame, plastic envelope passageway, heating impress the chamber, lower fixture, go up fixture, actuating mechanism, lazytongs and hybrid mechanism, the mounting panel top is fixed with the bed die down, first locating groove has been seted up to bed die upper surface symmetry, the bed die cavity has been seted up at first locating groove middle part, the third locating hole has been seted up to the four corners symmetry of bed die down, it sets up at the bed die upper surface to go up the mould, the second constant head tank has been seted up to last mould lower surface symmetry, the die cavity has been seted up at second constant head tank middle part. The invention can greatly improve the yield and the resin press-in speed, improve the working efficiency, improve the press-in speed, prevent the hardening viscosity of the plastic package material from becoming high, support the island, further improve the yield, and improve the melting speed, thereby improving the packaging efficiency.)

1. An integrated circuit packaging apparatus with high integration density, comprising:

the die comprises a lower mounting plate (1), wherein a lower die (2) is fixed at the top of the lower mounting plate (1), a first positioning groove (3) is symmetrically formed in the upper surface of the lower die (2), a lower die cavity (4) is formed in the middle of the first positioning groove (3), and third positioning holes (10) are symmetrically formed in four corners of the lower die (2);

the upper die (11) is arranged on the upper surface of the lower die (2), second positioning grooves (12) are symmetrically formed in the lower surface of the upper die (11), an upper die cavity (13) is formed in the middle of each second positioning groove (12), second positioning columns (14) are symmetrically fixed at the bottoms of the upper die (11), and the second positioning columns (14) are inserted into the third positioning holes (10);

the lead frame (15), the lead frame (15) is placed between the first positioning groove (3) and the second positioning groove (12), a small island (16) is fixed in the middle of the lead frame (15), a chip (17) is pasted on the surface of the small island (16), and a gold thread (18) is welded between the chip (17) and the lead frame (15);

the plastic package channel (19) is formed in the middle of the upper surface of the lower die (2), two ends of the plastic package channel (19) are communicated with flow channels (20), and the flow channels (20) are respectively communicated with the two lower die cavities (4);

the heating press-in cavity (21), the heating press-in cavity (21) is fixed in the middle of the upper die (11), and the bottom of the heating press-in cavity (21) is communicated with the plastic packaging channel (19);

the lower clamping mechanisms (5) are symmetrically arranged inside the lower die (2);

the upper clamping mechanisms (6) are symmetrically arranged inside the upper die (11) and are matched with the lower clamping mechanism (5) to clamp the gold wires (18);

the driving mechanism (7), the said driving mechanism (7) is installed in the bottom of the lower mould (2);

the synchronous mechanisms (8) are symmetrically arranged at two ends of the upper die (11) and the lower die (2), and two ends of the synchronous mechanisms (8) are respectively connected with the upper clamping mechanism (6) and the lower clamping mechanism (5);

and the mixing mechanism (9), wherein the mixing mechanism (9) is arranged at one end of the lower die (2) close to the plastic package channel (19).

2. The highly integrated circuit packaging apparatus according to claim 1, wherein the lower clamping mechanism (5) comprises:

the first groove (51), the first groove (51) is formed in the bottom of the lower die (2), and first sliding holes (52) are symmetrically formed in the top of the first groove (51);

the first L-shaped grooves (53) are symmetrically formed in the inner wall of the lower die cavity (4), and the first L-shaped grooves (53) are communicated with the first sliding holes (52);

the first L-shaped pressing plate (54) is connected to the inner wall of the first L-shaped groove (53) in a sliding mode, first sliding rods (55) are symmetrically fixed to the bottom of the first L-shaped pressing plate (54), and the first sliding rods (55) are connected with the first sliding holes (52) in a sliding mode;

the first sliding plate (56) is fixed at one end, away from the first L-shaped pressing plate (54), of the first sliding rods (55), and the first sliding plate (56) is in sliding connection with the first groove (51).

3. The highly integrated circuit package device according to claim 2, wherein the upper clamping mechanism (6) comprises:

the second groove (61), the second groove (61) is formed in the upper die (11), and second sliding holes (62) are symmetrically formed in the bottom of the inner wall of the second groove (61);

the second L-shaped groove (63) is symmetrically formed in the inner wall of the upper die cavity (13), and the second L-shaped groove (63) is communicated with the second sliding hole (62);

the second L-shaped pressing plate (64) is connected to the inner wall of the second L-shaped groove (63) in a sliding mode, second sliding rods (65) are symmetrically fixed to the bottom of the second L-shaped pressing plate (64), and the second sliding rods (65) are connected with the second sliding holes (62) in a sliding mode;

the second sliding plates (66) are fixed at one ends of the second sliding rods (65) far away from the second L-shaped pressing plate (64), and the second sliding plates (66) are in sliding connection with the second grooves (61).

4. The highly integrated circuit package device according to claim 2, wherein the driving mechanism (7) comprises:

the fixing cover (71), the fixing cover (71) is fixed at the bottom of the first groove (51) through a bolt, and the middle part of the fixing cover (71) is rotatably connected with a threaded rod (72) through a bearing;

the threaded sleeve (73), the threaded sleeve (73) is inlaid and fixed in the middle of the first sliding plate (56), and the threaded sleeve (73) is in threaded connection with the threaded rod (72);

the double-end motor (74), double-end motor (74) are fixed in bed die (2) bottom, the output of double-end motor (74) is fixed with first bevel gear (75), threaded rod (72) bottom is fixed with second bevel gear (76), and first bevel gear (75) and second bevel gear (76) meshing connection.

5. A high integration integrated circuit package device according to claim 3, wherein said synchronization mechanism (8) comprises:

the first sliding groove (81) is formed in one side of the first groove (51), one end of the first sliding groove (81) is provided with a second sliding groove (82), and the second sliding groove (82) is communicated with the outside;

the third sliding groove (83) is formed in one side of the second groove (61), a fourth sliding groove (84) is formed in one end of the third sliding groove (83), and the fourth sliding groove (84) is communicated with the outside;

the first connecting rod (85) is fixed at one end of the first sliding plate (56), the first connecting rod (85) is connected with the first sliding chute (81) in a sliding mode, a push rod (86) is fixed at one end of the first connecting rod (85), and the push rod (86) is connected with the second sliding chute (82) in a sliding mode;

the second connecting rod (87), the second connecting rod (87) is fixed at one end of the second sliding plate (66), the second connecting rod (87) is connected with the third sliding chute (83) in a sliding mode, a first rack (88) is fixed at one end of the second connecting rod (87), and the first rack (88) is connected with the fourth sliding chute (84) in a sliding mode;

the second rack (89) is connected to one end of the inner wall of the fourth sliding chute (84) in a sliding manner;

the flat gear (810) is rotatably connected to the inner wall of the fourth sliding chute (84) through a bearing, and the first rack (88) and the second rack (89) are meshed and connected with the flat gear (810);

and the spring (811) is fixed on the inner wall of the fourth sliding groove (84), and the bottom of the spring (811) is fixedly connected with the top of the second rack (89).

6. The integrated circuit packaging arrangement of high integration according to claim 4, characterized in that the mixing mechanism (9) comprises:

the driving groove (91) is formed in the middle of the lower surface of the lower die (2), a sliding hole (92) is formed in the middle of the driving groove (91), and the sliding hole (92) is communicated with the plastic packaging channel (19);

the third sliding rod (93), the third sliding rod (93) is connected to the inner wall of the sliding hole (92) in a sliding mode, and a hexagonal groove is formed in the middle of the third sliding rod (93);

the driving motor (94), the driving motor (94) is fixed on the inner wall of the driving groove (91), the output end of the driving motor (94) is fixed with a hexagonal column (95), and the hexagonal column (95) is connected with the inner wall of the hexagonal groove in a sliding manner;

the electric push rod (96) is fixed on the inner wall of the driving groove (91), a third connecting rod (97) is fixed at the output end of the electric push rod (96), and the third connecting rod (97) is rotatably connected with the lower end of the third sliding rod (93) through a bearing;

the stirring rods (98), the stirring rods (98) are symmetrically fixed at the top of the third sliding rod (93);

hide groove (99), hide groove (99) symmetry and set up at plastic envelope passageway (19) inner wall, and puddler (98) and hide groove (99) grafting.

7. The high-integration integrated circuit packaging device according to claim 5, wherein the positioning strips (22) are symmetrically fixed on outer sides of the top bar (86) and the second rack (89), the inner walls of the second sliding groove (82) and the fourth sliding groove (84) are symmetrically provided with limiting grooves (23) matched with the positioning strips (22), and the positioning strips (22) are slidably connected with the limiting grooves (23).

8. The high-integration integrated circuit packaging device according to claim 1, wherein three corners of the lead frame (15) are provided with first positioning holes (24), the inner wall of the first positioning groove (3) is provided with second positioning holes (25) at equal intervals to match with the first positioning holes (24), the inner wall of the second positioning groove (12) is fixed with first positioning posts (26) at equal intervals to match with the second positioning holes (25), and the first positioning posts (26) penetrate through the first positioning holes (24) to be inserted into the second positioning holes (25).

9. The highly integrated circuit package arrangement of claim 6, wherein the dual head motor (74) and the drive motor (94) are each a geared motor.

10. A method for using a high integration density integrated circuit package device, the method comprising the steps of:

s1, firstly, placing the lead frame (15) in the first positioning groove (3), then driving the upper die (11) to close the die downwards, and inserting the first positioning column (26) into the second positioning hole (25) through the first positioning hole (24) to position the lead frame (15);

s2, placing the resin block in a heating press-in cavity (21), heating and melting, driving a third slide bar (93) to rise through an electric push rod (96) in the melting process, enabling a stirring rod (98) to upwards slide out of a hidden groove (99), then driving a motor (94) to rotate, driving the third slide bar (93) to rotate through a hexagonal column (95), further driving the stirring rod (98) to stir the melted resin, improving the melting speed, and after stirring is completed, withdrawing the stirring rod (98) into the hidden groove (99);

s3, before plastic package, the first bevel gear (75) is driven to rotate by the rotation of the double-head motor (74), and then the screw rod (72) can be driven to rotate by the driven bevel gear, and then the first sliding plate (56) can be driven to lift by the screw sleeve (73), the first L-shaped pressing plate (54) is driven to slowly lift by the first sliding rod (55), and in the process of lifting the first sliding plate (56), the top rod (86) is driven by the first connecting rod to slide upwards, thereby pushing the second rack (89) to lift up, enabling the second rack (89) to drive the flat gear (810) to rotate, enabling the first rack (88) to slide downwards, and then the second connecting rod (87) drives the second sliding plate (66) to descend, so that the second L-shaped pressing plate (64) can be driven to press down through the second sliding rod (65), the gold thread (18) is clamped and fixed by the first L-shaped pressing plate (54) and the second L-shaped pressing plate (64);

s4, extruding and heating the melted resin pressed into the cavity (21) through a hydraulic cylinder, so that the resin flows into the lower die cavity (4) and the upper die cavity (13) through a runner (20) in the plastic packaging channel (19);

s5, after the upper die cavity (13) and the lower die cavity (4) are filled, the first L-shaped pressing plate (54) is driven to slowly retract through the double-head motor (74), the second L-shaped pressing plate (64) extrudes the second rack (89) to descend under the elastic force of the spring (811), the second L-shaped pressing plate (64) is driven to retract upwards, and at the moment, the resin is continuously pressed in until the space in the upper die cavity (13) and the space in the lower die cavity (4) are filled;

and S6, maintaining the pressure of the hydraulic cylinder for a period of time, and taking out the product after the resin is solidified.

Technical Field

The invention relates to the technical field of integrated circuit manufacturing, in particular to an integrated circuit packaging device with high integration level and a using method thereof.

Background

The integrated circuit is an indispensable control assembly of the existing intelligent equipment, in the production process of the integrated circuit, a chip is connected with a lead frame through a gold thread, then the chip is placed in a die, molten resin is pressed into a die cavity through a hydraulic cylinder, the chip is wrapped by the resin, and pins on the lead frame are exposed outside;

because the diameter of gold thread is very little, and when resin is injected into the die cavity, the flowing resin very easily breaks the gold thread, and in order to solve the problem of gold thread fracture, people need to reduce the speed that the resin is impressed, reach the purpose of not breaking the gold thread by slowing down the flow speed, but this will lead to the encapsulation speed to become slow, and if the resin speed of impressing is too low, lead to the molding compound hardening viscosity to rise easily, hold up the little island that draws the frame line easily, the edge contacts with the gold thread, cause the short circuit.

Therefore, it is desirable to provide a highly integrated circuit package device and a method for using the same to solve the above-mentioned problems.

Disclosure of Invention

To solve the above technical problems, the present invention provides an integrated circuit package device with high integration and a method for using the same.

The invention provides a high-integration integrated circuit packaging device, which comprises: the lower die comprises a lower mounting plate, an upper die, a lead frame, a plastic package channel, a heating press-in cavity, a lower clamping mechanism, an upper clamping mechanism, a driving mechanism, a synchronizing mechanism and a mixing mechanism, wherein a lower die is fixed at the top of the lower mounting plate, a first positioning groove is symmetrically formed in the upper surface of the lower die, a lower die cavity is formed in the middle of the first positioning groove, third positioning holes are symmetrically formed in four corners of the lower die, the upper die is arranged on the upper surface of the lower die, a second positioning groove is symmetrically formed in the lower surface of the upper die, an upper die cavity is formed in the middle of the second positioning groove, a second positioning column is symmetrically fixed at the bottom of the upper die and is spliced with the third positioning holes, the lead frame is placed between the first positioning groove and the second positioning groove, a small island is fixed in the middle of the lead frame, a chip is pasted on the surface of the small island, and a gold thread is welded between the chip and the lead frame, the plastic package channel is arranged in the middle of the upper surface of the lower die, two ends of the plastic package channel are communicated with runners, the runners are respectively communicated with the two lower die cavities, the heating press-in cavity is fixed in the middle of the upper die, the bottom of the heating press-in cavity is communicated with the plastic package channel, the lower clamping mechanisms are symmetrically installed inside the lower die, the upper clamping mechanisms are symmetrically installed inside the upper die, and are matched with the lower clamping mechanisms to clamp gold wires, the driving mechanism is installed at the bottom of the lower die, the synchronizing mechanisms are symmetrically installed at two ends of the upper die and the lower die, two ends of the synchronizing mechanisms are respectively connected with the upper clamping mechanisms and the lower clamping mechanisms, and the mixing mechanism is installed at one end, close to the plastic package channel, of the lower die.

Preferably, the lower clamping mechanism includes: first recess, first L shape groove, first L shape clamp plate and first slide, first recess is seted up in the bed die bottom, first slide opening has been seted up to first recess top symmetry, first L shape groove symmetry is seted up at bed die cavity inner wall, and first L shape groove and first slide opening intercommunication, first L shape clamp plate sliding connection is at first L shape inslot wall, first L shape clamp plate bottom symmetry is fixed with first slide bar, and first slide bar and first slide opening sliding connection, first slide is fixed a plurality of the one end of first L shape clamp plate is kept away from to first slide bar, and first slide and first recess sliding connection.

Preferably, the upper clamping mechanism includes: the second L-shaped pressing plate is connected to the inner wall of the second L-shaped groove in a sliding mode, a second sliding plate is connected to the bottom of the second L-shaped pressing plate in a sliding mode, a second sliding rod is symmetrically fixed to the bottom of the second L-shaped pressing plate and connected with the second sliding hole in a sliding mode, and the second sliding plate is fixed to one end, away from the second L-shaped pressing plate, of the second sliding rod and connected with the second sliding groove in a sliding mode.

Preferably, the drive mechanism includes: fixed lid, threaded sleeve and double-end motor, fixed lid passes through the bolt fastening in first recess bottom, fixed lid middle part is rotated through the bearing and is connected with the threaded rod, threaded sleeve inlays to be fixed at first slide middle part, and threaded sleeve and threaded rod threaded connection, double-end motor fixes in the bed die bottom, double-end motor's output is fixed with first bevel gear, the threaded rod bottom is fixed with second bevel gear, and first bevel gear is connected with second bevel gear meshing.

Preferably, the synchronization mechanism includes: the first sliding groove is arranged at one side of the first groove, the second sliding groove is arranged at one end of the first sliding groove, the second sliding groove is communicated with the outside, the third sliding groove is arranged at one side of the second groove, the fourth sliding groove is arranged at one end of the third sliding groove and is communicated with the outside, the first connecting rod is fixed at one end of the first sliding plate and is in sliding connection with the first sliding groove, the ejector rod is fixed at one end of the first connecting rod and is in sliding connection with the second sliding groove, the second connecting rod is fixed at one end of the second sliding plate and is in sliding connection with the third sliding groove, the first rack is fixed at one end of the second connecting rod and is in sliding connection with the fourth sliding groove, the second rack is in sliding connection with one end of the inner wall of the fourth sliding groove, the flat gear is rotatably connected to the inner wall of the fourth sliding groove through a bearing, the first rack and the second rack are meshed with the flat gear and connected, the spring is fixed to the inner wall of the fourth sliding groove, and the bottom of the spring is fixedly connected with the top of the second rack.

Preferably, the mixing mechanism comprises: driving groove, third slide bar, driving motor, electric putter, puddler and hidden groove, driving groove sets up at bed die lower surface middle part, the slide opening has been seted up at driving groove middle part, and slide opening and plastic envelope passageway intercommunication, third slide bar sliding connection is at the slide opening inner wall, and the hexagonal groove has been seted up at the third slide bar middle part, driving motor fixes at the driving groove inner wall, driving motor's output is fixed with the hexagonal post, and hexagonal post and hexagonal inslot wall sliding connection, electric putter fixes at the driving groove inner wall, electric putter's output is fixed with the third connecting rod, and the third connecting rod passes through the bearing and is connected with the rotation of third slide bar lower extreme, the puddler symmetry is fixed at third slide bar top, hidden groove symmetry is seted up at plastic envelope passageway inner wall, and the puddler pegs graft with hidden groove.

Preferably, the ejector rod and the outer side of the second rack are symmetrically fixed with positioning strips, the inner walls of the second sliding groove and the fourth sliding groove are symmetrically provided with limiting grooves matched with the positioning strips, and the positioning strips are connected with the limiting grooves in a sliding mode.

Preferably, first locating hole has all been seted up at the three angle of lead frame, first constant head tank inner wall equidistance is seted up with first locating hole matched with second locating hole, second constant head tank inner wall equidistance is fixed with the first locating column with second locating hole matched with, and first locating column passes first locating hole and pegs graft with the second locating hole.

Preferably, the double-head motor and the driving motor are both speed reducing motors.

A method of using a highly integrated circuit package device, the method of using comprising the steps of:

s1, firstly, placing the lead frame in a first positioning groove, then driving an upper die to close the die downwards, penetrating through a first positioning hole through a first positioning column and inserting into a second positioning hole, and positioning the lead frame;

s2, placing the resin block in a heating press-in cavity for heating and melting, driving a third slide bar to rise through an electric push rod in the melting process, enabling a stirring rod to slide out of the hidden groove upwards, then driving a motor to rotate, driving the third slide bar to rotate through a hexagonal column, further driving the stirring rod to stir the melted resin, improving the melting speed, and after stirring is completed, withdrawing the stirring rod into the hidden groove;

s3, before plastic package, the double-head motor rotates to drive the first bevel gear to rotate, the driven bevel gear drives the threaded rod to rotate, the threaded sleeve drives the first sliding plate to rise, the first sliding rod drives the first L-shaped pressing plate to rise slowly, and in the rising process of the first sliding plate, the first connecting rod drives the ejector rod to slide upwards to push the second rack to rise, so that the second rack drives the flat gear to rotate, the first rack slides downwards, the second connecting rod drives the second sliding plate to fall, and the second sliding rod drives the second L-shaped pressing plate to press downwards, so that the first L-shaped pressing plate and the second L-shaped pressing plate clamp the gold wires fixedly;

s4, extruding and heating the melted resin pressed into the cavity through a hydraulic cylinder, so that the resin flows into the lower die cavity and the upper die cavity through a runner in the plastic packaging channel;

s5, after the upper die cavity and the lower die cavity are filled with resin, driving the first L-shaped pressing plate to slowly retract through the double-head motor, and driving the second L-shaped pressing plate to descend under the extrusion of the second rack under the elastic force of the spring to drive the second L-shaped pressing plate to retract upwards, and then continuously pressing the resin until the spaces in the upper die cavity and the lower die cavity are filled with resin;

and S6, maintaining the pressure of the hydraulic cylinder for a period of time, and taking out the product after the resin is solidified.

Compared with the related art, the integrated circuit packaging device with high integration level and the use method thereof provided by the invention have the following beneficial effects:

the invention provides an integrated circuit packaging device with high integration level and a using method thereof:

1. when in plastic package, the two lower clamping mechanisms are driven to move upwards by the driving mechanism, in the process that the first sliding plate slides upwards, the second rack is pushed by the ejector rod, the first rack is driven to slide downwards by the flat gear meshed with the ejector rod, and the second sliding plate is driven to slide downwards, so that the first L-shaped pressing plate and the second L-shaped pressing plate are close to each other to clamp and support a gold wire, people can quickly press resin into the upper die cavity and the lower die cavity without easily breaking the gold wire, when the upper die cavity and the lower die cavity are to be filled with the resin, the first L-shaped pressing plate and the second L-shaped pressing plate are controlled to be retracted and continue to press the resin into the inner part, and because a large amount of resin exists in the upper die cavity and the lower die cavity, the impact on the gold wire cannot be caused in the subsequent resin pressing, the yield and the resin pressing speed are greatly improved, and the working efficiency is improved, the pressing speed is improved, the plastic packaging material can be prevented from hardening and viscosity increasing to support the island, and the yield is further improved;

2. when melting the resin block, rise through electric putter drive third slide bar for the puddler roll-off hides the groove upwards, then rotates through driving motor, drives the third slide bar through the hexagonal post and rotates, and then can drive the puddler and stir the resin that melts, improves and melts speed, thereby improves encapsulation efficiency.

Drawings

FIG. 1 is a schematic overall structure provided by the present invention;

FIG. 2 is a schematic overall cross-sectional structural view provided by the present invention;

FIG. 3 is a schematic view of the overall internal structure provided by the present invention;

FIG. 4 is a schematic structural diagram of a first groove provided in the present invention;

FIG. 5 is a schematic structural diagram of a plastic package channel provided in the present invention;

FIG. 6 is a schematic structural view of a lower mold according to the present invention;

FIG. 7 is a schematic structural view of a lower clamping mechanism according to the present invention;

FIG. 8 is a schematic structural diagram of a mixing mechanism provided in the present invention;

FIG. 9 is a schematic structural view of an upper clamping mechanism provided in the present invention;

FIG. 10 is a schematic structural view of a first slide hole provided in the present invention;

FIG. 11 is a schematic structural view of an upper mold according to the present invention;

FIG. 12 is a schematic structural view of a second slide hole provided in the present invention;

FIG. 13 is a schematic structural diagram of a synchronization mechanism provided in the present invention;

fig. 14 is a schematic structural diagram of a lead frame provided by the present invention.

Reference numbers in the figures: 1. a lower mounting plate; 2. a lower die; 3. a first positioning groove; 4. a lower die cavity; 10. a third positioning hole; 11. an upper die; 12. a second positioning groove; 13. an upper mold cavity; 14. a second positioning column; 15. a lead frame; 16. a small island; 17. a chip; 18. gold thread; 19. a plastic package channel; 20. a flow channel; 21. heating the press-in cavity; 22. a positioning bar; 23. a limiting groove; 24. a first positioning hole; 25. a second positioning hole; 26. a first positioning post;

5. a lower clamping mechanism; 51. a first groove; 52. a first slide hole; 53. a first L-shaped slot; 54. a first L-shaped platen; 55. a first slide bar; 56. a first slide plate;

6. an upper clamping mechanism; 61. a second groove; 62. a second slide hole; 63. a second L-shaped slot; 64. a second L-shaped platen; 65. a second slide bar; 66. a second slide plate;

7. a drive mechanism; 71. a fixed cover; 72. a threaded rod; 73. a threaded sleeve; 74. a double-headed motor; 75. a first bevel gear; 76. a second bevel gear;

8. a synchronization mechanism; 81. a first chute; 82. a second chute; 83. a third chute; 84. a fourth chute; 85. a first connecting rod; 86. a top rod; 87. a second connecting rod; 88. a first rack; 89. a second rack; 810. a flat gear; 811. a spring;

9. a mixing mechanism; 91. a drive slot; 92. a slide hole; 93. a third slide bar; 94. a drive motor; 95. a hexagonal column; 96. an electric push rod; 97. a third connecting rod; 98. a stirring rod; 99. the slot is hidden.

Detailed Description

The invention is further described with reference to the following figures and embodiments.

In the implementation process, as shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 10, fig. 11, fig. 12 and fig. 14, an integrated circuit packaging apparatus with high integration level includes: the device comprises a lower mounting plate 1, an upper die 11, a lead frame 15, a plastic package channel 19, a heating press-in cavity 21, a lower clamping mechanism 5, an upper clamping mechanism 6, a driving mechanism 7, a synchronizing mechanism 8 and a mixing mechanism 9, wherein the top of the lower mounting plate 1 is fixed with the lower die 2, the upper surface of the lower die 2 is symmetrically provided with a first positioning groove 3, the middle part of the first positioning groove 3 is provided with a lower die cavity 4, the four corners of the lower die 2 are symmetrically provided with third positioning holes 10, the upper die 11 is arranged on the upper surface of the lower die 2, the lower surface of the upper die 11 is symmetrically provided with a second positioning groove 12, the middle part of the second positioning groove 12 is provided with an upper die cavity 13, the bottom of the upper die 11 is symmetrically fixed with a second positioning column 14, the second positioning column 14 is spliced with the third positioning hole 10, the lead frame 15 is placed between the first positioning groove 3 and the second positioning groove 12, the middle part of the lead frame 15 is fixed with a small island 16, the surface of the small island 16 is pasted with a chip 17, a gold thread 18 is welded between the chip 17 and the lead frame 15, a plastic package channel 19 is arranged in the middle of the upper surface of the lower die 2, two ends of the plastic package channel 19 are communicated with runners 20, the runners 20 are respectively communicated with the two lower die cavities 4, a heating press-in cavity 21 is fixed in the middle of the upper die 11, the bottom of the heating press-in cavity 21 is communicated with the plastic package channel 19, the heating press-in cavity 21 is a cavity with a heating function and used for melting internal resin, the lower clamping mechanisms 5 are symmetrically arranged inside the lower die 2, the upper clamping mechanisms 6 are symmetrically arranged inside the upper die 11 and are matched with the lower clamping mechanisms 5 to clamp the gold thread 18, the driving mechanism 7 is arranged at the bottom of the lower die 2, the synchronizing mechanisms 8 are symmetrically arranged at two ends of the upper die 11 and the lower die 2, and two ends of the synchronizing mechanism 8 are respectively connected with the upper clamping mechanism 6 and the lower clamping mechanism 5, and the mixing mechanism 9 is arranged at one end of the lower die 2 close to the plastic package channel 19.

Referring to fig. 4, 6, 7, 10, and 13, the lower clamping mechanism 5 includes: the die comprises a first groove 51, a first L-shaped groove 53, a first L-shaped pressing plate 54 and a first sliding plate 56, wherein the first groove 51 is formed at the bottom of the lower die 2, first sliding holes 52 are symmetrically formed in the top of the first groove 51, the first L-shaped groove 53 is symmetrically formed in the inner wall of the lower die cavity 4, the first L-shaped groove 53 is communicated with the first sliding holes 52, the first L-shaped pressing plate 54 is slidably connected to the inner wall of the first L-shaped groove 53, first sliding rods 55 are symmetrically fixed at the bottom of the first L-shaped pressing plate 54, the first sliding rods 55 are slidably connected with the first sliding holes 52, the first sliding plate 56 is fixed at one end, far away from the first L-shaped pressing plate 54, of each first sliding rod 55, and the first sliding plate 56 is slidably connected with the first groove 51.

Referring to fig. 4, 9, 11, 12, and 13, the upper clamp mechanism 6 includes: the die comprises a second groove 61, a second L-shaped groove 63, a second L-shaped pressing plate 64 and a second sliding plate 66, wherein the second groove 61 is formed inside the upper die 11, second sliding holes 62 are symmetrically formed in the bottom of the inner wall of the second groove 61, the second L-shaped groove 63 is symmetrically formed in the inner wall of the upper die cavity 13, the second L-shaped groove 63 is communicated with the second sliding holes 62, the second L-shaped pressing plate 64 is slidably connected to the inner wall of the second L-shaped groove 63, second sliding rods 65 are symmetrically fixed to the bottom of the second L-shaped pressing plate 64, the second sliding rods 65 are slidably connected with the second sliding holes 62, the second sliding plate 66 is fixed to one end, away from the second L-shaped pressing plate 64, of the second sliding rod 65, and the second sliding plate 66 is slidably connected with the second groove 61.

Referring to fig. 7 and 13, the drive mechanism 7 includes: the fixed cover 71 is fixed at the bottom of the first groove 51 through a bolt, the middle of the fixed cover 71 is rotatably connected with a threaded rod 72 through a bearing, the threaded sleeve 73 is embedded and fixed at the middle of the first sliding plate 56, the threaded sleeve 73 is in threaded connection with the threaded rod 72, the double-headed motor 74 is fixed at the bottom of the lower die 2, a first bevel gear 75 is fixed at the output end of the double-headed motor 74, a second bevel gear 76 is fixed at the bottom of the threaded rod 72, and the first bevel gear 75 is in meshed connection with the second bevel gear 76;

referring to fig. 4, 5, 7, 9, 11, 12, and 13, the synchronization mechanism 8 includes: a first chute 81, a third chute 83, a first connecting rod 85, a second connecting rod 87, a second rack 89, a flat gear 810 and a spring 811, wherein the first chute 81 is arranged at one side of the first groove 51, one end of the first chute 81 is provided with the second chute 82, the second chute 82 is communicated with the outside, the third chute 83 is arranged at one side of the second groove 61, one end of the third chute 83 is provided with the fourth chute 84, the fourth chute 84 is communicated with the outside, the first connecting rod 85 is fixed at one end of the first sliding plate 56, the first connecting rod 85 is slidably connected with the first chute 81, one end of the first connecting rod 85 is fixed with a push rod 86, the push rod 86 is slidably connected with the second chute 82, the second connecting rod 87 is fixed at one end of the second sliding plate 66, the second connecting rod 87 is slidably connected with the third chute 83, one end of the second connecting rod 87 is fixed with the first rack 88, the first rack 88 is connected with the fourth chute 84 in a sliding manner, the second rack 89 is connected to one end of the inner wall of the fourth chute 84 in a sliding manner, the flat gear 810 is rotatably connected to the inner wall of the fourth chute 84 through a bearing, the first rack 88 and the second rack 89 are both meshed and connected with the flat gear 810, the spring 811 is fixed to the inner wall of the fourth chute 84, and the bottom of the spring 811 is fixedly connected with the top of the second rack 89;

when needing to be explained, the double-head motor 74 rotates to drive the first bevel gear 75 to rotate, and then the driven bevel gear drives the threaded rod 72 to rotate, and then the first sliding plate 56 can be driven to rise through the threaded sleeve 73, the first L-shaped pressing plate 54 is driven to slowly rise through the first sliding rod 55, and in the process of rising of the first sliding plate 56, the ejector rod 86 is driven to slide upwards through the first connecting rod, and then the second rack 89 is pushed to rise, so that the second rack 89 drives the flat gear 810 to rotate, the first rack 88 slides downwards, and then the second sliding plate 66 is driven to descend through the second connecting rod 87, so that the second L-shaped pressing plate 64 can be driven to press downwards through the second sliding rod 65, and the gold thread 18 is clamped and fixed by the first L-shaped pressing plate 54 and the second L-shaped pressing plate 64.

Referring to fig. 4, 5, 8 and 10, the mixing mechanism 9 includes: the mold comprises a driving groove 91, a third sliding rod 93, a driving motor 94, an electric push rod 96, a stirring rod 98 and a hidden groove 99, wherein the driving groove 91 is formed in the middle of the lower surface of the lower mold 2, a sliding hole 92 is formed in the middle of the driving groove 91, the sliding hole 92 is communicated with the plastic package channel 19, the third sliding rod 93 is slidably connected to the inner wall of the sliding hole 92, a hexagonal groove is formed in the middle of the third sliding rod 93, the driving motor 94 is fixed on the inner wall of the driving groove 91, a hexagonal column 95 is fixed at the output end of the driving motor 94, the hexagonal column 95 is slidably connected with the inner wall of the hexagonal groove, the electric push rod 96 is fixed on the inner wall of the driving groove 91, a third connecting rod 97 is fixed at the output end of the electric push rod 96, the third connecting rod 97 is rotatably connected with the lower end of the third sliding rod 93 through a bearing, the stirring rod 98 is symmetrically fixed at the top of the third sliding rod 93, the hidden groove 99 is symmetrically formed on the inner wall of the plastic package channel 19, and puddler 98 and hidden groove 99 are pegged graft, through electric putter 96 drive third slide bar 93 rise for puddler 98 upwards slides out hidden groove 99, then rotates through driving motor 94, drives third slide bar 93 through hexagonal column 95 and rotates, and then can drive puddler 98 and stir the resin that melts, improves and melts the speed, and after the stirring, puddler 98 withdraws to hiding in the groove 99.

Referring to fig. 4, 7 and 13, the positioning bars 22 are symmetrically fixed on the outer sides of the ejector rod 86 and the second rack 89, the inner walls of the second sliding groove 82 and the fourth sliding groove 84 are symmetrically provided with limiting grooves 23 matched with the positioning bars 22, and the positioning bars 22 are slidably connected with the limiting grooves 23, so that the ejector rod 86 and the second rack 89 can be conveniently limited and guided.

Referring to fig. 6, 11 and 14, first locating hole 24 has all been seted up at three angles of lead frame 15, first locating groove 3 inner wall equidistance offer with first locating hole 24 matched with second locating hole 25, second locating groove 12 inner wall equidistance is fixed with first locating column 26 with second locating hole 25 matched with, and first locating column 26 passes first locating hole 24 and pegs graft with second locating hole 25, is convenient for when the plastic envelope, fixes a position lead frame 15.

The double-headed motor 74 and the drive motor 94 are each a reduction motor.

A method of using a highly integrated circuit package device, the method of using comprising the steps of:

s1, firstly, placing the lead frame 15 in the first positioning groove 3, then driving the upper die 11 to close the die downwards, and inserting the first positioning column 26 into the second positioning hole 25 through the first positioning hole 24 to position the lead frame 15;

s2, placing the resin block in the heating press-in cavity 21, heating and melting, driving the third slide bar 93 to rise through the electric push rod 96 in the melting process, enabling the stirring rod 98 to slide out of the hidden groove 99 upwards, then driving the motor 94 to rotate, driving the third slide bar 93 to rotate through the hexagonal column 95, further driving the stirring rod 98 to stir the melted resin, improving the melting speed, and after stirring is completed, withdrawing the stirring rod 98 into the hidden groove 99;

s3, before plastic package, the double-headed motor 74 rotates to drive the first bevel gear 75 to rotate, the driven bevel gear drives the threaded rod 72 to rotate, the threaded sleeve 73 drives the first sliding plate 56 to rise, the first sliding rod 55 drives the first L-shaped pressing plate 54 to slowly rise, and in the process of rising the first sliding plate 56, the first connecting rod drives the ejector rod 86 to slide upwards to jack the second rack 89 to rise, the second rack 89 drives the flat gear 810 to rotate, the first rack 88 slides downwards, the second connecting rod 87 drives the second sliding plate 66 to descend, the second sliding rod 65 drives the second L-shaped pressing plate 64 to press downwards, and the first L-shaped pressing plate 54 and the second L-shaped pressing plate 64 clamp and fix the gold wires 18;

s4, extruding and heating the melted resin pressed into the cavity 21 through a hydraulic cylinder, so that the resin flows into the lower die cavity 4 and the upper die cavity 13 through the runner 20 in the plastic package channel 19;

s5, after the upper die cavity 13 and the lower die cavity 4 are filled with resin, driving the first L-shaped pressing plate 54 to slowly retract through the double-head motor 74, pressing the second rack 89 to descend by the second L-shaped pressing plate 64 under the elastic force of the spring 811, driving the second L-shaped pressing plate 64 to upwardly retract to be flush with the top of the inner wall of the upper die cavity 13, and stopping, at the moment, continuously pressing the resin until the spaces in the upper die cavity 13 and the lower die cavity 4 are filled with resin;

and S6, maintaining the pressure of the hydraulic cylinder for a period of time, and taking out the product after the resin is solidified.

The circuits and controls involved in the present invention are prior art and will not be described in detail herein.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.