阅读说明：本技术 一种电路板及通讯设备 (Circuit board and communication equipment ) 是由 王治有 程庆雷 于 2021-09-01 设计创作，主要内容包括：本申请实施例涉及电气连接技术领域,特别涉及一种电路板,第一导电结构包围天线焊盘以及第二导电结构、并与天线焊盘以及第二导电结构之间均留有间距,第一导电结构设有内侧以及外侧,内侧为第一导电结构靠近天线焊盘的一侧,外侧为第一导电结构远离天线焊盘的一侧,内侧设有朝向外侧凹陷的第一凹槽；第二导电结构与天线焊盘以及第一焊接点电连接；第一导线与地焊盘以及第一导电结构电连接；地焊盘与第一导电结构之间具有间隔；第一焊接点以及第二焊接点均位于第一凹槽内。本申请实施例还提供一种通讯设备,包括上述的电路板。本申请实施例提供的电路板及通讯设备,在天线焊盘与地焊盘上刷锡时,可避免天线焊盘与地焊盘上锡汇聚。(The embodiment of the application relates to the technical field of electrical connection, in particular to a circuit board, wherein a first conductive structure surrounds an antenna pad and a second conductive structure and has a distance with the antenna pad and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is one side of the first conductive structure close to the antenna pad, the outer side is one side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side; the second conductive structure is electrically connected with the antenna bonding pad and the first welding point; the first conducting wire is electrically connected with the ground pad and the first conducting structure; a space is arranged between the ground pad and the first conductive structure; the first welding point and the second welding point are both positioned in the first groove. The embodiment of the application also provides communication equipment which comprises the circuit board. According to the circuit board and the communication equipment, when tin is brushed on the antenna bonding pad and the ground bonding pad, the tin can be prevented from gathering on the antenna bonding pad and the ground bonding pad.)

1. A circuit board, comprising: the antenna comprises a first conductive structure, a second conductive structure, a first lead, a ground pad, an antenna pad and an antenna pedestal pad which are arranged on the same layer, wherein the antenna pedestal pad comprises a first welding point and a second welding point;

the first conductive structure surrounds the antenna pad and the second conductive structure, and a space is reserved between the first conductive structure and the antenna pad and between the first conductive structure and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is the side of the first conductive structure close to the antenna pad, the outer side is the side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side;

the second conductive structure is electrically connected with the antenna pad and the first welding point;

the first conducting wire is electrically connected with the ground pad and the first conducting structure;

a space is arranged between the ground pad and the first conductive structure;

the first welding point and the second welding point are both located in the first groove, and the second welding point is connected with the edge of the first groove.

2. The circuit board of claim 1, wherein the first conductive structure further surrounds the ground pad.

3. The circuit board of claim 2, wherein the inner side is further provided with a second groove recessed toward the outer side; the ground pad and the first wire are located in the second groove.

4. The circuit board of claim 1, wherein the outer side further has a second groove recessed toward the inner side, and the ground pad and the first conductive line are located in the second groove.

5. The circuit board according to claim 3 or 4, wherein the number of the ground pads is plural, and the number of the first wires is N times the number of the ground pads, wherein each of the ground pads is connected to N first wires, each of the first wires is connected to the first conductive structure, and N is a positive integer.

6. The circuit board of claim 5, wherein the number of the ground pads is four, and four of the ground pads and the antenna mount pads surround the antenna pads.

7. The circuit board of claim 5, wherein the number of the first wires is three times the number of the ground pads; each of the ground pads is connected to three of the first wires; the second groove is a rectangular groove, the rectangular groove comprises three side edges, and each side edge of the rectangular groove is connected with one first lead respectively.

8. The circuit board of any of claims 1-4, wherein the second conductive structure comprises a second wire, a third wire, and an impedance matching pad;

the second wire is electrically connected to the antenna bonding pad and the impedance matching bonding pad, and the third wire is electrically connected to the impedance matching bonding pad and the first bonding pad, wherein the impedance matching bonding pad is used for being fixed to an electrical element for adjusting antenna impedance.

9. The circuit board of any of claims 1-4, wherein the shape of the ground pad is the same as the shape of the antenna pad.

10. A communication device, comprising: the circuit board of any one of claims 1-9.

Technical Field

The embodiment of the application relates to the technical field of electrical connection, in particular to a circuit board and communication equipment.

Background

At present, in a circuit board for electrically connecting with an antenna, a conductive structure surrounding an antenna pad is often disposed, and a part of the conductive structure is used as a ground pad to improve the signal transmission performance of the antenna, wherein a space is left between the antenna pad and the conductive structure to prevent the antenna pad from being electrically connected with the conductive structure.

However, when the antenna pad and the ground pad are brushed with tin, the tin on the antenna pad and the ground pad flows between the antenna pad and the ground pad, so that the tin brushed on the antenna pad and the ground pad is gathered, and the antenna pad and the ground pad are electrically connected.

Therefore, it is desirable to provide a circuit board and a communication device, which prevent the solder on the antenna pad and the ground pad from being collected when the solder is brushed on the antenna pad and the ground pad.

Disclosure of Invention

An object of the embodiment of the application is to provide a circuit board and a communication device, when brushing tin on an antenna pad and a ground pad, the tin on the antenna pad and the ground pad is prevented from gathering.

In order to solve the above problem, an embodiment of the present application provides a circuit board, including: the antenna comprises a first conductive structure, a second conductive structure, a first lead, a ground pad, an antenna pad and an antenna pedestal pad which are arranged on the same layer, wherein the antenna pedestal pad comprises a first welding point and a second welding point; the first conductive structure surrounds the antenna pad and the second conductive structure, and a space is reserved between the first conductive structure and the antenna pad and between the first conductive structure and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is the side of the first conductive structure close to the antenna pad, the outer side is the side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side; the second conductive structure is electrically connected with the antenna pad and the first welding point; the first conducting wire is electrically connected with the ground pad and the first conducting structure; a space is arranged between the ground pad and the first conductive structure; the first welding point and the second welding point are both located in the first groove, and the second welding point is connected with the edge of the first groove.

In addition, an embodiment of the present application further provides a communication device, including: the circuit board is provided.

The circuit board and the communication equipment that this application embodiment provided include: the antenna comprises a first conductive structure, a second conductive structure, a first lead, a ground pad, an antenna pad and an antenna pedestal pad which are arranged on the same layer, wherein the antenna pedestal pad comprises a first welding point and a second welding point; the first conductive structure surrounds the antenna pad and the second conductive structure, and a space is reserved between the first conductive structure and the antenna pad and between the first conductive structure and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is the side of the first conductive structure close to the antenna pad, the outer side is the side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side; the second conductive structure is electrically connected with the antenna bonding pad and the first welding point; the first conducting wire is electrically connected with the ground pad and the first conducting structure; a space is arranged between the ground pad and the first conductive structure; the first welding point and the second welding point are located in the first groove, and the second welding point is connected with the edge of the first groove, so that when tin is brushed on the antenna bonding pad and the ground bonding pad, the tin on the ground bonding pad can flow to a position between the ground bonding pad and the conductive structure, the quality of the tin on the ground bonding pad flowing to the position between the ground bonding pad and the antenna bonding pad is reduced, and the tin on the ground bonding pad and the antenna bonding pad is prevented from gathering.

In addition, the first conductive structure also surrounds the ground pad.

In addition, the inner side is also provided with a second groove which is sunken towards the outer side; the ground pad and the first wire are located in the second groove. Therefore, under the condition that the tin on the ground pad can flow to the position between the ground pad and the first conductive structure, the distance between the first conductive structure and the antenna pad can be reduced, and the signal transmission performance of the antenna connected with the circuit board provided by the embodiment is improved.

In addition, the outer side is further provided with a second groove which is sunken towards the inner side, and the ground pad and the first lead are located in the second groove.

In addition, the number of the ground pads is multiple, the number of the first wires is N times of the number of the ground pads, each ground pad is connected with the N first wires, each first wire is connected with the first conductive structure, and N is a positive integer. In this way, each ground pad is electrically connected with the first conductive structure through the N first wires, so that the stability of the electrical connection between the ground pad and the first conductive structure can be enhanced.

In addition, the number of the ground pads is four, and the four ground pads and the antenna pedestal pad surround the antenna pad. Therefore, the isolation of the antenna bonding pad can be further increased, and the signal transmission performance of the antenna connected with the circuit board provided by the embodiment is improved.

In addition, the number of the first wires is three times that of the ground pads; each of the ground pads is connected to three of the first wires; the second groove is a rectangular groove, the rectangular groove comprises three side edges, and each side edge of the rectangular groove is connected with one first lead respectively.

In addition, the second conductive structure includes a second wire, a third wire, and an impedance matching pad; the second wire is electrically connected to the antenna bonding pad and the impedance matching bonding pad, and the third wire is electrically connected to the impedance matching bonding pad and the first bonding pad, wherein the impedance matching bonding pad is used for being fixed to an electrical element for adjusting antenna impedance. Therefore, the impedance of the antenna can be adjusted through the electric element device fixed on the impedance matching pad, and the signal transmission performance of the antenna connected with the circuit board provided by the embodiment is improved.

In addition, the shape of the ground pad is the same as the shape of the antenna pad. Therefore, the process complexity of etching the ground bonding pad and the antenna bonding pad can be reduced.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present application.

Detailed Description

It will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in the various embodiments of the present application in order to provide a better understanding of the present application. However, the technical means claimed in the present application can be realized by various changes and modifications of the following embodiments.

An embodiment of the present application provides a circuit board, including: the antenna comprises a first conductive structure, a second conductive structure, a first lead, a ground pad, an antenna pad and an antenna pedestal pad which are arranged on the same layer, wherein the antenna pedestal pad comprises a first welding point and a second welding point; the first conductive structure surrounds the antenna pad and the second conductive structure, and a space is reserved between the first conductive structure and the antenna pad and between the first conductive structure and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is the side of the first conductive structure close to the antenna pad, the outer side is the side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side; the second conductive structure is electrically connected with the antenna bonding pad and the first welding point; the first conducting wire is electrically connected with the ground pad and the first conducting structure; a space is arranged between the ground pad and the first conductive structure; the first welding point and the second welding point are located in the first groove, and the second welding point is connected with the edge of the first groove, so that when tin is brushed on the antenna bonding pad and the ground bonding pad, the tin on the ground bonding pad can flow to a position between the ground bonding pad and the first conductive structure, the quality of the tin on the ground bonding pad flowing to the position between the ground bonding pad and the antenna bonding pad is reduced, and the tin on the ground bonding pad and the tin on the antenna bonding pad are prevented from gathering.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following describes each embodiment of the present application in detail with reference to the accompanying drawings.

Referring to fig. 1, a circuit board according to an embodiment of the present application includes: the first conductive structure 110, the second conductive structure 120, the first conductive line 130, the ground pad 140, the antenna pad 150, and the antenna pedestal pad 160 are disposed on the same layer, wherein the antenna pedestal pad 160 includes a first bonding point 161 and a second bonding point 162; the first conductive structure 110 surrounds the antenna pad 150 and the second conductive structure 120, and a space is left between the first conductive structure 110 and the antenna pad 150 and between the first conductive structure 110 and the second conductive structure 120, the first conductive structure 110 is provided with an inner side 111 and an outer side 112, the inner side 111 is a side of the first conductive structure 110 close to the antenna pad 150, the outer side 112 is a side of the first conductive structure 110 far away from the antenna pad 150, and the inner side 111 is provided with a first groove which is recessed towards the outer side 112; the second conductive structure 120 is electrically connected to the antenna pad 150 and the first bonding pad 161; the first conductive line 130 is electrically connected to the ground pad 140 and the first conductive structure 110; the ground pad 140 has a space from the first conductive structure 110; the first welding point 161 and the second welding point 162 are both located in the first groove, and the second welding point 162 is connected with the edge of the first groove.

Specifically, in the present embodiment, the first conductive structure 110 further surrounds the ground pad 140. It should be noted that, in other alternative embodiments, the first conductive structure may not surround the ground pad, and in this case, the first conductive structure is located between the antenna pad and the ground pad.

Further, the inner side 111 is also provided with a second groove recessed towards the outer side 112; the ground pad 140 and the first conductive line 130 are located in the second groove. Thus, under the condition that the tin on the ground pad 140 can flow to the space between the ground pad 140 and the first conductive structure 110, the distance between the first conductive structure 110 and the antenna pad 150 can be reduced, and the signal transmission performance of the antenna fixed with the circuit board is further improved.

In an embodiment, the first conductive structure is located between the ground pad and the antenna pad, the outer side of the first conductive structure is further provided with a second groove recessed towards the inner side, and the ground pad and the first wire are located in the second groove.

It should be noted that, in other alternative embodiments, the second groove may not be provided, and in this case, the ground pad may be directly disposed between the first conductive structure and the antenna pad.

Preferably, the number of the ground pads 140 is plural, and the number of the first conductive lines 130 is N times the number of the ground pads 140, wherein each ground pad 140 is connected to N first conductive lines 130, each first conductive line 130 is connected to the first conductive structure 110, and N is a positive integer. Thus, by electrically connecting each ground pad 140 to the first conductive structure 110 through the N first wires 130, the stability of the electrical connection between the ground pad and the first conductive structure can be enhanced.

It should be noted that, in other alternative embodiments, the number of the first conductive lines may also be the same as the number of the ground pads, and in this case, each ground pad is electrically connected to the first conductive structure through one first conductive line.

Specifically, in the present embodiment, the number of the ground pads 140 is four, and four ground pads 140 and the antenna pedestal pads 160 surround the antenna pads 150. Thus, the isolation of the antenna pads 150 can be further increased, and the signal transmission performance of the antenna connected to the circuit board provided by the present embodiment can be improved.

It should be noted that in other alternative embodiments, the number of ground pads may be different from four, such as: in one embodiment, the number of the ground pads is three, and the three ground pads and the antenna pedestal pad surround the antenna pad; in yet another embodiment, the number of ground pads is six, with six ground pads and antenna pedestal pads surrounding the antenna pads.

In addition, in the present embodiment, the number of the first conductive lines 130 is three times the number of the ground pads 140; each ground pad 140 is connected to three first conductive lines 130; the second groove is a rectangular groove, and the rectangular groove (i.e., the second groove) includes three sides, wherein the sides of each rectangular groove are connected to one first wire, respectively.

It should be noted that, in other alternative embodiments, the number of the first wires may not be three, and the second groove may not be a rectangular groove, such as: the number of the first wires is two, six, etc., and the shape of the second groove is a circular groove, a trapezoidal groove, etc., which is not limited in this embodiment.

Specifically, in the present embodiment, the first conductive lines 130 are linear conductive lines, so that the process complexity in forming the plurality of first conductive lines 130 can be reduced. It should be noted that in other alternative embodiments, the first conductive line may not be a straight line, such as: in one embodiment, the first conductive line is a curved conductive line; in yet another embodiment, the first conductive line is a zigzag conductive line.

More specifically, in the present embodiment, the extending direction of the first conductive line 130 is perpendicular to the side of the rectangular groove connected to the first conductive line 130.

Further, the second conductive structure 120 includes a second conductive line 121, a third conductive line 122, and an impedance matching pad 123; the second wire 121 is electrically connected to the antenna pad 150 and the impedance matching pad 123, and the third wire 122 is electrically connected to the impedance matching pad 123 and the first bonding pad 161, wherein the impedance matching pad 123 is fixed to an electrical component for adjusting the impedance of the antenna. Thus, the impedance of the antenna can be adjusted by the electrical components fixed on the impedance matching pad 123, and the signal transmission performance of the antenna connected to the circuit board provided in this embodiment is improved. Specifically, the electrical components fixed to the impedance matching pads 123 are used to implement pi impedance matching of the antenna.

Preferably, in the present embodiment, the shape of the ground pad 140 is the same as that of the antenna pad 150. Thus, the process complexity of etching the ground pad 140 and the antenna pad 150 can be reduced. It should be noted that in other alternative embodiments, the shape of the ground pad may be different from the shape of the antenna pad.

Specifically, in the present embodiment, the ground pad 140 and the antenna pad 150 are both rectangular in shape. In other modified embodiments, the shape of the ground pad and the antenna pad may not be rectangular, but in one embodiment, the shape of the ground pad and the antenna pad may be circular.

Further, in the present embodiment, the impedance matching pad 123 is also the same shape as the antenna pad 150. Thus, the process complexity of etching the impedance matching pad 123 and the antenna pad 150 can be reduced. In one embodiment, the impedance matching pads may also be shaped differently than the antenna pads.

An embodiment of the present application provides a communication device, including: an antenna; the antenna includes: the antenna comprises a first conductive structure, a second conductive structure, a first lead, a ground pad, an antenna pad and an antenna pedestal pad which are arranged on the same layer, wherein the antenna pedestal pad comprises a first welding point and a second welding point; the first conductive structure surrounds the antenna pad and the second conductive structure, and a space is reserved between the first conductive structure and the antenna pad and between the first conductive structure and the second conductive structure, the first conductive structure is provided with an inner side and an outer side, the inner side is the side of the first conductive structure close to the antenna pad, the outer side is the side of the first conductive structure far away from the antenna pad, and the inner side is provided with a first groove which is sunken towards the outer side; the second conductive structure is electrically connected with the antenna bonding pad and the first welding point; the first conducting wire is electrically connected with the ground pad and the first conducting structure; a space is arranged between the ground pad and the first conductive structure; the first welding point and the second welding point are both positioned in the first groove, and the second welding point is connected with the edge of the first groove.

In fact, the antenna included in the communication device provided in the second embodiment of the present application is the same as the antenna provided in the first embodiment of the present application, and therefore, the antenna included in the communication device provided in the second embodiment of the present application has the same beneficial effects as the antenna provided in the first embodiment of the present application, and is not described herein again.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the present application, and that various changes in form and details may be made therein without departing from the spirit and scope of the present application in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the application, and it is intended that the scope of the application be limited only by the claims appended hereto.