阅读说明：本技术 散热模块与电子装置 (Heat dissipation module and electronic device ) 是由 黄瀚梁 廖文能 谢铮玟 陈宗廷 陈伟今 于 2020-05-21 设计创作，主要内容包括：一种散热模块,设置于电子装置。电子装置具有热源。散热模块包括管路、磁产生器、工作流体以及多个磁性微粒。管路具有加热区与冷却区。热源热接触加热区以将热量传送至加热区。磁产生器配置于管路外且对应至加热区旁。工作流体填充于管路。磁性微粒活动地配置于工作流体。当加热区沿重力方向是位于冷却区之上时,行经加热区的磁性微粒因吸热且温度升高而磁损耗,并藉由重力移至冷却区。在冷却区的磁性微粒因散热且温度降低而磁恢复,并被磁产生器磁吸回加热区。磁性微粒在管路中的行进形成循环。(A heat dissipation module is arranged in an electronic device. The electronic device has a heat source. The heat dissipation module comprises a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. The pipeline is provided with a heating area and a cooling area. The heat source is in thermal contact with the heating zone to transfer heat to the heating zone. The magnetic generator is arranged outside the pipeline and corresponds to the heating area. The working fluid is filled in the pipeline. The magnetic particles are movably disposed in the working fluid. When the heating zone is located above the cooling zone along the gravity direction, the magnetic particles passing through the heating zone are magnetically lost due to heat absorption and temperature rise, and move to the cooling zone by gravity. The magnetic particles in the cooling zone are magnetically recovered due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator. The travel of the magnetic particles in the conduit forms a loop.)

1. A heat dissipation module is disposed in an electronic device, the electronic device having a heat source, the heat dissipation module comprising:

the heat source is in thermal contact with the heating area so as to transfer the heat generated by the heat source to the heating area;

a magnetic generator, which is configured outside the pipeline and corresponds to the side of the heating area;

a working fluid filled in the pipeline; and

and a plurality of magnetic particles movably disposed in the working fluid, wherein when the heating region is located above the cooling region along a gravity direction, the magnetic particles passing through the heating region are magnetically lost due to heat absorption and temperature rise, and move to the cooling region by gravity, and the magnetic particles in the cooling region are magnetically recovered due to heat dissipation and temperature drop, and are magnetically attracted back to the heating region by the magnetic generator, so that the magnetic particles travel in the pipeline to form a circulation.

2. The heat dissipating module of claim 1, wherein the circuit is a loop circuit, and the heating region and the cooling region are on opposite sides of the loop circuit.

3. The heat dissipation module of claim 1, wherein when the magnetic particles are magnetically lost, the magnetic attraction force of the magnetic generator to the magnetic particles is less than the gravitational potential energy of the magnetic particles.

4. The thermal module of claim 1, which is a two-phase flow thermal module.

5. The heat dissipation module of claim 1, wherein when the cooling region is located above the heating region along the gravity direction, the working fluid absorbs heat in the heating region to change from a liquid state to a gas state and moves to the cooling region, and the working fluid dissipates heat in the cooling region to change from the gas state to the liquid state and flows to the heating region, so that the working fluid travels in the pipeline to form another circulation.

6. The heat dissipating module of claim 1, wherein the magnetic particles are respectively coated with a profile and a surface roughness that prevent the magnetic particles from converging.

7. The heat dissipation module of claim 1, wherein the magnetic generator comprises an electromagnet, a permanent magnet, or a combination thereof.

8. An electronic device, comprising:

a body, in which a heat source is arranged;

a pipeline, disposed in the body, the pipeline having a heating zone and a cooling zone, the heat source being in thermal contact with the heating zone so as to transfer heat generated by the heat source to the heating zone;

a magnetic generator, which is configured outside the pipeline and corresponds to the side of the heating area;

a working fluid filled in the pipeline; and

and a plurality of magnetic particles movably arranged in the working fluid, wherein when the heating area is positioned above the cooling area along the gravity direction, the magnetic particles passing through the heating area are magnetically lost due to heat absorption and temperature rise, and move to the cooling area by gravity, and the magnetic particles in the cooling area are magnetically recovered due to heat dissipation and temperature drop, and are magnetically attracted back to the heating area by the magnetic generator, so that the magnetic particles travel in the pipeline to form a cycle.

9. The electronic device of claim 8, wherein the circuit is a circuit, and the heating region and the cooling region are on opposite sides of the circuit.

10. The electronic device of claim 8, wherein when the magnetic particles are magnetically lost, the magnetic attraction of the magnetic generator to the magnetic particles is less than the gravitational potential energy of the magnetic particles.

11. The electronic device of claim 8, wherein the heat dissipation module is a two-phase flow heat dissipation module.

12. The electronic device of claim 8, wherein when the cooling region is located above the heating region along the gravity direction, the working fluid absorbs heat in the heating region to change from a liquid state to a gas state and moves to the cooling region, and the working fluid dissipates heat in the cooling region to change from the gas state to the liquid state and flows to the heating region, so that the working fluid forms another circulation along the pipeline.

13. The electronic device of claim 8, wherein the magnetic particles are respectively present in an overcoat layer having a profile and a surface roughness that prevent aggregation with each other.

14. The electronic device of claim 8, wherein the magnetic generator comprises an electromagnet, a permanent magnet, or a combination thereof.

15. The electronic device of claim 8, wherein the magnetic particles are magnetized by the magnetic generator again when moving from the cooling region to the magnetic region.

16. The electronic device of claim 8, wherein the magnetic generator is an electromagnet, the electronic device further comprising: and the control unit is electrically connected with the electromagnet so as to control the magnetic field generated by the magnetic generator to the pipeline.

17. The electronic device of claim 16, wherein the control unit is the heat source.

Technical Field

The invention relates to a heat dissipation module and an electronic device.

Background

In recent years, with the development of the scientific and technological industry, products such as notebook computers, personal digital assistants, smart phones and the like frequently appear in daily life. Some electronic components mounted inside these electronic devices usually generate heat energy during operation, and the accumulated heat energy will affect the operation performance of the electronic devices if it cannot be removed smoothly. Therefore, a heat dissipation module or a heat dissipation element, such as a heat dissipation fan, a heat dissipation material or a heat dissipation pipe, is usually disposed inside the electronic device to assist in dissipating heat generated by the electronic element to the outside of the electronic device.

In the heat dissipation module, the heat dissipation fan can effectively dissipate heat energy to the outside, but the heat dissipation fan has large power consumption, heavier weight and larger required space, so that the heat dissipation fan is not beneficial to being applied to an electronic device which pursues a light and thin design, and noise is easily generated to influence the additional communication function of the electronic device. In addition, in order to dissipate heat by convection, the housing of the electronic device needs to be provided with an opening, which also reduces the mechanical strength of the electronic device.

On the other hand, the heat dissipation material can absorb the heat energy of the electronic element to reduce the surface temperature, and the cost and the required space are low, so the heat dissipation material can be widely applied to the electronic device, but the heat energy is difficult to further dissipate to the outside through other components, and the heat dissipation effect is limited. Furthermore, the heat pipe can transfer the heat energy of the electronic component to another plate, but it lacks convection effect, so the heat dissipation effect is limited.

Accordingly, the conventional heat dissipation pipe may further cooperate with the evaporator and the condenser to form a loop, and the phase-change heat transfer medium that can be converted between two phases (e.g., liquid and gas) by absorbing or releasing heat energy may circulate in the heat dissipation pipe to absorb heat energy in the evaporator and release heat energy in the condenser, thereby transferring heat energy from the electronic component to the outside. However, the heat transfer medium flows in the loop only through its own phase change, and the flowing effect is poor, so that the heat dissipation effect is limited.

Disclosure of Invention

The invention provides a heat dissipation module and an electronic device, which form a heat dissipation cycle by changing the magnetism of magnetic particles along with the change of heat absorption and heat dissipation.

The heat dissipation module is arranged on the electronic device. The electronic device has a heat source. The heat dissipation module comprises a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. The pipeline is provided with a heating area and a cooling area. The heat source is in thermal contact with the heating zone to transfer heat to the heating zone. The magnetic generator is arranged outside the pipeline and corresponds to the heating area. The working fluid is filled in the pipeline. The magnetic particles are movably disposed in the working fluid. When the heating zone is located above the cooling zone along the gravity direction, the magnetic particles passing through the heating zone are magnetically lost due to heat absorption and temperature rise, and move to the cooling zone by gravity. The magnetic particles in the cooling zone are magnetically recovered due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator. The travel of the magnetic particles in the conduit forms a loop.

The electronic device comprises a body, a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. A heat source is arranged in the machine body. The pipeline is configured in the machine body. The pipeline is provided with a heating area and a cooling area. The heat source is in thermal contact with the heating zone to transfer heat to the heating zone. The magnetic generator is arranged outside the pipeline and corresponds to the heating area. The working fluid is filled in the pipeline. The magnetic particles are movably disposed in the working fluid. When the heating zone is located above the cooling zone along the gravity direction, the magnetic particles passing through the heating zone are magnetically lost due to heat absorption and temperature rise, and move to the cooling zone by gravity. The magnetic particles in the cooling zone are magnetically recovered due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator. The travel of the magnetic particles in the conduit forms a loop.

Based on the above, the heat dissipation module and the electronic device using the same have the working fluid and the plurality of magnetic particles respectively disposed in the pipeline, so that the magnetic particles move in the pipeline through the working fluid, and the magnetic property of the magnetic particles changes along with the temperature, and the magnetic particles are disposed in cooperation with the corresponding components, so as to form a circulation in the pipeline.

When the heating area is above the cooling area along the gravity direction, the magnetic particles are magnetically lost due to heat absorption, so that the magnetic particles are not attracted by the magnetic generator and can not resist the gravity to move to the cooling area, and when the magnetic particles are cooled and the temperature is reduced and the magnetic particles are recovered, the magnetic particles can be magnetically attracted back to the heating area by the magnetic generator, so that the magnetic particles form circulation in the pipeline, and the heat dissipation effect is achieved. Therefore, the working fluid and the magnetic particles can provide the required heat dissipation effect according to different states.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the invention.

Fig. 2 is a hysteresis curve of magnetic particles at different temperatures.

Fig. 3 is a schematic view of the heat dissipation module in another state.

Fig. 4 is a schematic diagram of an electronic device and its internal heat dissipation module.

Wherein:

10: electronic device

11: a heat source;

12: a heat pipe;

100: a heat dissipation module;

110. 210: a pipeline;

112. 212, and (3): a heating zone;

113. 213: a cooling zone;

120: a magnetic generator;

130: magnetic fine particles;

140: a working fluid;

211: a magnetic generation region;

b: magnetic induction intensity;

f1, F2: a traveling flow path;

g: the direction of gravity;

h: magnetic field strength;

s1, S2: and (5) segmenting.

Detailed Description

Fig. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the invention. Fig. 2 is a hysteresis curve of magnetic particles at different temperatures. Referring to fig. 1 and fig. 2, in the present embodiment, the heat dissipation module 100 is suitable for an electronic device having a heat source 11, such as a processor chip or a display chip of the electronic device, the heat dissipation module 100 includes a pipeline 110, a magnetic generator 120, a working fluid 140, and a plurality of magnetic particles 130, wherein the pipeline 110 has a heating region 112 and a cooling region 113, and the heat source 11 is in thermal contact with the heating region 112, so that heat generated by the heat source 11 is transmitted to the heating region 112. The magnetic generator 120, which includes an electromagnet, a permanent magnet, or a combination thereof, is disposed outside the pipe 110 and corresponds to the heating area 112. The working fluid 140 is filled in the pipe 110, and the magnetic particles 130, for example, magnetic particles in the form of micro particles or magnetic particles in the form of nano particles, are movably disposed in the working fluid 140. The pipeline 110 and the working fluid 140 therein are virtualized to facilitate identification of the magnetic particles 130 in the working fluid 140. Furthermore, the pipe 110 is a loop pipe, and the magnetic particles 130 can smoothly move in the pipe 110 by using the working fluid 140 as a medium. The heating zone 112 and the cooling zone 113 are on opposite sides of the circuit pipe. The position of the magnetic generator 120 corresponding to the heat source 11 is not limited herein, and the magnetic particles 130 in the cooling region 113 can be magnetically attracted back to the heating region 112.

As shown in fig. 2, the magnetic particles 130 are made of neodymium iron boron magnet (NdFeB), for example, and the hysteresis curve in the second quadrant is shown, wherein the relationship between the magnetic field strength H (horizontal axis in the figure) and the magnetic induction strength B (vertical axis in the figure) is non-linear, but the change trend with temperature is obvious, that is, when the temperature is increased, the hysteresis force of the magnetic particles 130 is reduced, and conversely, the hysteresis force is increased due to the temperature reduction.

As such, as shown in fig. 1, when the heating region 112 is located above the cooling region 113 along the gravity direction G, the magnetic particles 130 passing through the heating region 112 absorb heat and the temperature rises to be magnetically lost, as shown by the cross-hatching of the magnetic particles 130. Then, the magnetic particles 130 with magnetic loss will be reduced to have magnetic attraction with the magnetic generator 120, and thus cannot resist the gravity, so that they move from top to bottom to the cooling region 113 by the gravity. That is, when the magnetic particles 130 are magnetically lost, the magnetic attraction force of the magnetic generator 120 to the magnetic particles 130 is smaller than the gravitational potential energy of the magnetic particles 130. Therefore, the magnetic particles 130 in the heating region 112 to reduce the hysteresis force will slide down to the cooling region 113 under the influence of gravity.

Then, the magnetic particles 130 in the cooling region 113 are magnetically restored due to heat dissipation and temperature reduction, i.e. the magnetic loss of the magnetic particles 130 of the embodiment is reversible. Thus, the hysteresis force of the magnetic particles 130 will gradually recover due to the gradual heat dissipation, and then be smoothly attracted by the magnetic generator 120 to move back to the heating region 112 again. Accordingly, the magnetic particles 130 will form a circulation flow path (flow path) F1 in the pipe 110.

Fig. 3 is a schematic view of the heat dissipation module in another state, and compared with fig. 1, fig. 3 shows a use state in which fig. 1 is upside down. Referring to fig. 3, in the present embodiment, the heat dissipation module 100 is, for example, a two-phase flow heat dissipation module, in the state of fig. 3, the cooling region 113 is located above the heating region 112 along the gravity direction G, so that the working fluid 140 absorbs heat in the heating region 112 and changes from a liquid state to a gas state and moves to the cooling region 113, and the working fluid 140 changes from the gas state to the liquid state in the cooling region 113 and flows back to the heating region 112 due to heat dissipation. In this manner, the working fluid 140 will form another circulating flow path F2 in the line 110. As is clear from fig. 3, in this state, the magnetic particles 130 remain in the heating region 112 and do not move along with the working fluid 140 because the gravitational potential energy of the magnetic particles 130 is greater than the molecular potential energy of the working fluid 140 due to heat absorption.

As can be clearly seen from fig. 1 and 3, the heat dissipation module 100 of the present embodiment can form different flow paths F1 and F2 through the working fluid 140 and the magnetic particles 130, so as to correspond to different positions of the heat source 11 or different heat dissipation requirements of the electronic device in different operation postures. In other words, the heat dissipation module 100 of the present embodiment provides a composite heat dissipation means, and switches the heat dissipation mode according to the gravity state.

It should be noted that the heat dissipation module 100 is not limited to the one shown in fig. 1 and fig. 3, and the heating area 112 is located directly above the cooling area 113, or the cooling area 113 is located directly above the heating area 112. For example, even if the electronic device is tilted, i.e., the heat dissipation module 100 of fig. 1 is tilted, the heating area 112 and the cooling area 113 are on opposite sides of the pipe 110, and thus there is a difference in height along the gravity direction G. If the heating area 112 is higher than the cooling area 113, it still can be achieved as shown in fig. 1, so that the magnetic particles 130 after heat absorption move to the cooling area 113 by gravity for heat dissipation.

In addition, in the present embodiment, the magnetic particles 130 are respectively coated with an outer coating (not shown) to have a contour and a surface roughness that can avoid converging with each other, i.e. they are spherical or have a streamline outer contour as shown in fig. 1 and 3 to facilitate their movement in the working fluid 140. This can effectively prevent the magnetic particles 130 from being aggregated with each other to cause agglomeration.

Fig. 4 is a schematic diagram of an electronic device and its internal heat dissipation module. Referring to fig. 4, the electronic device 10 is, for example, a tablet computer, and a heat source 11 and a heat dissipation module are disposed in the electronic device 10, and heat generated by the heat source 11 is transferred to the heat dissipation module through a heat pipe 12, and the heat dissipation module contacts with a body structure of the electronic device 10 and covers a large area of the electronic device 10, so that the pipeline 210 can be regarded as a cooling area far away from the heat source 11.

Here, the heat dissipation module has similar components as the previous embodiments, and therefore, the details of the same parts in this embodiment are not described again. Unlike the previous embodiments, the pipe 210 of the present embodiment includes the heating area 212, the cooling area 213 and the magnetic generating area 211, as mentioned above, the magnetic generator includes an electromagnet, a permanent magnet or a combination thereof, so as to make the magnetic particles in the cooling area 213 be attracted to the heating area 212 smoothly, it is expected that different types of magnetic generators are correspondingly disposed in different segments S1, S2 of the magnetic generating area 211, and the segments S1, S2 can generate different magnetic forces to form a magnetic force gradient.

For example, the heat source 11 of the present embodiment is also the control unit of the electronic device 10, which is electrically connected to the electromagnets (i.e. the magnetic generator 120 of the previous embodiment) corresponding to the segments S1, S2, so that the magnitude of the magnetic force provided and the generation frequency of the magnetic force can be adjusted at the segments S1, S2 as required, thereby smoothly guiding the magnetic particles back to the heating region 212.

In addition, if the control unit is corresponding to the embodiment shown in fig. 3, when the cooling region 113 is higher than the heating region 112 along the gravity direction G, that is, when the working fluid 140 is used as the heat dissipation means, the control unit can stop or stop the magnetic generator 120 accordingly. Otherwise, the control unit activates the magnetic generator 120. In other words, the control unit can correspondingly control the magnetic generator 120 according to the state of the heating area 112 and the cooling area 113 of the pipeline 110 in the thermal module 100 under the gravitational field.

In summary, in the above embodiments of the invention, the heat dissipation module and the electronic device using the heat dissipation module respectively configure the working fluid and the plurality of magnetic particles in the pipeline, so that the magnetic particles move in the pipeline through the working fluid, and the magnetic property of the magnetic particles changes with the temperature, and the magnetic particles are configured with the corresponding components to circulate in the pipeline.

When the heating area is above the cooling area along the gravity direction, the magnetic particles are magnetically lost due to heat absorption, so that the magnetic particles are not attracted by the magnetic generator and can not resist the gravity to move to the cooling area, and when the magnetic particles are cooled and the temperature is reduced and the magnetic particles are recovered, the magnetic particles can be magnetically attracted back to the heating area by the magnetic generator, so that the magnetic particles form circulation in the pipeline, and the heat dissipation effect is achieved. On the contrary, when the cooling zone is located above the heating zone along the gravity direction, the working fluid and another circulation formed by the working fluid are used as the current heat dissipation means. Therefore, the working fluid and the magnetic particles can provide the required heat dissipation effect according to different states.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.