阅读说明：本技术 一种改善5g手机散热模组散热性能的结构及其制作方法 (Structure for improving heat dissipation performance of 5G mobile phone heat dissipation module and manufacturing method thereof ) 是由 李建卫 陈宇 于 2021-08-16 设计创作，主要内容包括：本发明公开了一种改善5G手机散热模组散热性能的结构,包括手机散热模组,手机散热模组包括散热组件和铜片,散热组件贴设于手机壳体内侧面上,铜片设置于发热源对应位置；一种改善5G手机散热模组散热性能的结构的制作方法,手机散热模组的制作方法如下所示：步骤1、准备铜片和散热组件；步骤2、将铜片加工成适合均温单体能与发热源接触的厚度；步骤3、通过锡膏回流焊将铜片焊接于热源对应在散热组件的位置上,以铜片替代导热垫；步骤4、将散热组件贴设于手机壳体内侧面上；本发明结构优于导热垫的导热性,能有效的将发热源中的热导到均热单体,达到提升散热组件的目的,从而提高手机运行的速度,且能适用更多的散热场景。(The invention discloses a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module, which comprises a mobile phone heat dissipation module, wherein the mobile phone heat dissipation module comprises a heat dissipation component and a copper sheet, the heat dissipation component is attached to the inner side surface of a mobile phone shell, and the copper sheet is arranged at a position corresponding to a heating source; a manufacturing method of a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module comprises the following steps: step 1, preparing a copper sheet and a heat dissipation assembly; step 2, processing the copper sheet into a thickness suitable for the uniform temperature single body to be contacted with a heating source; step 3, welding the copper sheet on the position of the heat source corresponding to the heat dissipation assembly through solder paste reflow soldering, and replacing the heat conduction pad with the copper sheet; step 4, attaching the heat dissipation assembly to the inner side face of the mobile phone shell; the structure of the invention is superior to the thermal conductivity of the thermal conductive pad, and can effectively conduct the heat in the heating source to the soaking monomer, thereby achieving the purpose of improving the radiating component, further improving the running speed of the mobile phone, and being applicable to more radiating scenes.)

1. The utility model provides an improve 5G cell-phone heat dissipation module heat dispersion's structure, includes cell-phone heat dissipation module (1), its characterized in that: the mobile phone heat dissipation module (1) comprises a heat dissipation assembly (2) and a copper sheet (3), wherein the heat dissipation assembly (2) is attached to the inner side face of the mobile phone shell, and the copper sheet (3) is arranged at a position corresponding to a heating source.

2. A manufacturing method of a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module is characterized in that: the manufacturing method of the mobile phone heat dissipation module (1) is as follows:

step 1, preparing a copper sheet (3) and a heat dissipation assembly (2);

step 2, processing the copper sheet (3) into a thickness suitable for the uniform-temperature single body to be contacted with a heating source;

step 3, welding the copper sheet (3) on the position of the heat source corresponding to the heat dissipation assembly (2) through solder paste reflow soldering, and replacing the heat conduction pad with the copper sheet (3);

and 4, attaching the heat dissipation assembly (2) to the inner side surface of the mobile phone shell.

3. The method for manufacturing the structure for improving the heat dissipation performance of the heat dissipation module of the 5G mobile phone according to claim 2, wherein: the thermal resistance of the copper sheet (3) is smaller than that of the heat conducting pad.

4. The method for manufacturing the structure for improving the heat dissipation performance of the heat dissipation module of the 5G mobile phone according to claim 2, wherein: the thickness of the copper sheet (3) is 0.5mm-5 mm.

5. The method for manufacturing the structure for improving the heat dissipation performance of the heat dissipation module of the 5G mobile phone according to claim 2, wherein: the size of the copper sheet is the same as that of the heating source.

Technical Field

The invention relates to the technical field of mobile phone heat dissipation, in particular to a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module and a manufacturing method thereof.

Background

With the increasing and more powerful functions of the 5G mobile phone, more and more electronic devices are arranged in the mobile phone, the power consumption is continuously improved, the requirement on the performance of the mobile phone is higher and higher, the heat generated by the mobile phone is more and more increased while the power is improved, and the heat is concentrated on the electronic devices to seriously influence the performance of the mobile phone; in the development of mobile phones, mobile phone manufacturers also adopt a plurality of methods to realize uniform temperature heat dissipation, and a mobile phone end heat dissipation component is produced; the heat dissipation assembly is in contact with the heating source to take away heat and then uniformly dissipate the heat, the heat dissipation assembly is in contact with the heating source generally through direct contact or through a heat conduction pad, the thermal resistance of the existing heat conduction pad is large, and the heat conduction pad is too thick in some structures, so that the contact is uneven and the contact thermal resistance is increased.

Therefore, a structure for improving the heat dissipation performance of a heat dissipation module of a 5G mobile phone and a manufacturing method thereof are a problem to be solved urgently.

Disclosure of Invention

The invention aims to solve the technical problems that the heat dissipation component in the prior art takes away heat through contact with a heating source and then uniformly dissipates the heat, the heat dissipation component is generally in direct contact with the heating source or in contact with the heating source through a heat conduction pad, the heat resistance of the conventional heat conduction pad is larger, and the contact heat resistance is increased due to nonuniform contact caused by the fact that the heat conduction pad is too thick in some structures.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: the utility model provides an improve 5G cell-phone heat dissipation module heat dispersion's structure, includes the cell-phone heat dissipation module, the cell-phone heat dissipation module includes radiator unit and copper sheet, radiator unit pastes on locating cell-phone casing medial surface, the copper sheet sets up in the source of generating heat and corresponds the position.

A manufacturing method of a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module comprises the following steps:

step 1, preparing a copper sheet and a heat dissipation assembly;

step 2, processing the copper sheet into a thickness suitable for the uniform temperature single body to be contacted with a heating source;

step 3, welding the copper sheet on the position of the heat source corresponding to the heat dissipation assembly through solder paste reflow soldering, and replacing the heat conduction pad with the copper sheet;

and 4, attaching the heat dissipation assembly to the inner side surface of the mobile phone shell.

Furthermore, the thermal resistance of the copper sheet is smaller than that of the heat conducting pad.

Furthermore, the thickness of the copper sheet is 0.5mm-5 mm.

Furthermore, the size of the copper sheet is the same as that of the heating source.

Compared with the prior art, the invention has the advantages that: the structure of the invention is superior to the thermal conductivity of the thermal conductive pad, and the invention can effectively conduct the heat in the heating source to the soaking monomer, thereby achieving the purpose of improving the radiating component, further improving the running speed of the mobile phone and being suitable for more radiating scenes; the shape and size of the invention can be adjusted according to the size and number of the heating sources; the invention has reasonable design and is worth popularizing.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation module of a mobile phone according to the present invention.

As shown in the figure: 1. cell-phone heat dissipation module, 2, radiator unit, 3, copper sheet.

Detailed Description

The following describes a structure for improving heat dissipation performance of a heat dissipation module of a 5G mobile phone and a method for manufacturing the same in detail with reference to the accompanying drawings.

The present invention will be described in detail with reference to fig. 1.

The utility model provides an improve 5G cell-phone heat dissipation module heat dispersion's structure, includes cell-phone heat dissipation module 1, cell-phone heat dissipation module 1 includes radiator unit 2 and copper sheet 3, radiator unit 2 pastes and locates on the cell-phone casing medial surface, copper sheet 3 sets up in the corresponding position in source of generating heat.

A manufacturing method of a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module 1 is as follows:

step 1, preparing a copper sheet 3 and a heat dissipation assembly 2;

step 2, processing the copper sheet 3 into a thickness suitable for the uniform temperature single body to be contacted with a heating source;

step 3, soldering the copper sheet 3 on the position of the heat source corresponding to the heat dissipation assembly 2 through solder paste reflow soldering, and replacing the heat conduction pad with the copper sheet 3;

and 4, attaching the heat dissipation assembly 2 to the inner side surface of the mobile phone shell or the middle frame of the mobile phone.

The thermal resistance of the copper sheet 3 is smaller than that of the heat conducting pad.

The thickness of the copper sheet 3 is 0.5mm-5 mm.

The copper sheet 3 is the same as the heating source in size.

The invention relates to a structure for improving the heat dissipation performance of a 5G mobile phone heat dissipation module and a manufacturing method thereof, which comprises the following specific implementation processes: firstly, preparing a copper sheet 3 and a heat dissipation assembly 2; the copper sheet 3 is processed into a thickness suitable for the contact between the temperature-equalizing single body and the heating source; soldering the copper sheet 3 on the position of the heat source corresponding to the heat dissipation assembly 2 by solder paste reflow soldering; and the heat dissipation assembly is attached to the inner side surface of the mobile phone shell or the middle frame of the mobile phone.

The structure of the invention is superior to the thermal conductivity of the thermal conductive pad, and the invention can effectively conduct the heat in the heating source to the soaking monomer, thereby achieving the purpose of improving the radiating component, further improving the running speed of the mobile phone and being suitable for more radiating scenes; the shape and size of the invention can be adjusted according to the size and number of the heating sources; the invention has reasonable design and is worth popularizing.

The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the invention as defined by the appended claims.