阅读说明：本技术 封装装置 (Packaging device ) 是由 瀬山耕平 歌野哲弥 于 2020-04-13 设计创作，主要内容包括：封装装置1包括：直动型的两个音圈马达38,动子38c相对于定子38b沿着轴线A往返移动；以及筒夹34A,安装于动子38c的端部侧,并且吸附保持半导体芯片101。多个音圈马达38沿着与轴线A交叉的方向相互远离,并且以轴线A相互平行的方式配置。筒夹34A以横跨设于两个动子38c的端部的卡盘39的方式安装。(The package device 1 includes: two voice coil motors 38 of a direct acting type, in which a mover 38c reciprocates along an axis a with respect to a stator 38 b; and a collet 34A attached to an end portion side of the mover 38c and configured to hold the semiconductor chip 101 by suction. The plurality of voice coil motors 38 are distant from each other in a direction intersecting the axis a, and are arranged in such a manner that the axes a are parallel to each other. The collet 34A is mounted so as to straddle chucks 39 provided at the ends of the two movers 38 c.)

1. A packaged device, comprising:

a plurality of motors of a direct-acting type, the movers of which reciprocate along an axis with respect to the stator; and

a chip holding portion mounted on an end portion side of the mover and holding a semiconductor chip by suction,

a plurality of the motors are arranged in such a manner that the axes are parallel to each other,

the chip holding portion is attached so as to straddle end portions of at least two of the movers.

2. The packaged device of claim 1, further comprising:

a control unit for supplying a control signal to the motor to control the position of the stator,

the motor has: a position information acquiring unit that acquires a position of the mover relative to the stator along the axis,

the control unit acquires representative position information from the position information acquiring unit of a representative motor selected from the plurality of motors, and controls the position of the mover of the plurality of motors using the representative position information.

3. The packaged device of claim 1 or 2, wherein the motor is a voice coil motor.

4. The enclosure of any one of claims 1 to 3, wherein the motor has: a chuck provided at an end of the mover and detachably connected to the chip holding portion,

the chuck includes:

a chuck mechanism that couples the chip holding portion to the chuck; and

and a chuck detection unit for detecting the presence or absence of the chip holding unit connected to the chuck.

5. The packaging device according to any one of claims 1 to 3, wherein the semiconductor chip has a chip-held surface held by the chip holding portion,

the chip holding portion has a chip holding surface for detachably holding the semiconductor chip,

the area of the chip holding portion is larger than the area of the held surface of the chip.

6. The packaged device according to claim 1, wherein the semiconductor chip has a chip-held surface held by the chip holding portion,

the chip holding portion has a chip holding surface for detachably holding the semiconductor chip,

the area of the chip holding portion is larger than the area of the held surface of the chip.

7. The package device according to claim 6, wherein the semiconductor chip has a chip-held surface held by the chip holding portion,

the packaging device further comprises: and a lift-up mechanism that pushes up the semiconductor chip toward the chip holding portion by pressing a surface opposite to the surface on which the chip is held.

Technical Field

The present invention relates to a packaging device.

Background

A semiconductor chip obtained by singulating a semiconductor wafer is a component of an electronic device. The manufacturing process of the electronic component performs an operation of picking up the semiconductor chip and an operation of disposing the semiconductor chip on the circuit board. Patent document 1 discloses a handling unit (handling unit) for an electronic component. The handling unit reverses the orientation of the two held semiconductor chips. Further, the handling unit also changes the arrangement direction of the two semiconductor chips.

Documents of the prior art

Patent document

Patent document 1: international publication No. 2017/119216

Disclosure of Invention

Problems to be solved by the invention

With the diversification of electronic devices, the shapes of semiconductor chips have been diversified. For example, the semiconductor chip has a rectangular parallelepiped shape, a thin plate shape, or the like. When the chip thickness is sufficient for the area of the chip main surface like a rectangular parallelepiped, the mechanical strength of the semiconductor chip is relatively high. In this case, handling of the semiconductor chip is easy. On the other hand, when the chip thickness is small relative to the area of the chip main surface like a thin plate, the mechanical strength of the semiconductor chip is likely to be reduced. In this case, the processing of the semiconductor chip requires attention.

In addition, the necessity of production of various species has been increasing in recent years. Therefore, it is desirable that the manufacturing apparatus can handle a variety of parts without specifying to handle a specific part. For example, the packaging device is required to handle not only a semiconductor chip having sufficient strength but also a semiconductor chip having low strength.

Further, there is a demand for an increase in size of the semiconductor chip. When picking up the semiconductor chip having the increased size, it is necessary to suck the entire surface of the semiconductor chip with a collet (collet) in order to suppress damage to the semiconductor chip. When the entire surface of the semiconductor chip is sucked, a large collet is required. The large collet is due to the increased weight. Therefore, there is a problem that the thrust of the motor for moving the collet is insufficient.

The invention provides a packaging device capable of processing semiconductor chips with various shapes.

Means for solving the problems

The packaging device of an embodiment of the invention comprises: a plurality of motors of a direct-acting type, the movers of which reciprocate along an axis with respect to the stator; and a chip holding unit that is attached to an end portion side of the movers and that holds the semiconductor chip by suction, wherein the plurality of motors are arranged so that axes thereof are parallel to each other, and the chip holding unit is attached so as to straddle end portions of at least two of the movers.

The device includes two motors to which the chip holding portions are detachably attached. According to the structure, two forms different from each other can be selected. As a first mode, a mode may be selected in which one chip holding portion is mounted so as to straddle at least two motors. The chip holding portion disposed across the motors is driven by at least two motors. Thus, the chip holding portion can be larger than a chip holding portion driven by one motor. That is, the area of the holding surface of the chip holding portion can be increased. As a result, a larger semiconductor chip can be held. That is, the present invention can be applied to the transfer of thin semiconductor chips. In addition, the following form may be selected as the second form: chip holding portions are mounted on the respective motors. According to the above configuration, it is possible to handle the transfer of a small semiconductor chip. As a result, the package device capable of selecting the first form and the second form can handle semiconductor chips of various shapes.

In one embodiment, this may also be: the packaging apparatus may further include a control section that provides a control signal to the motor to perform position control of the stator. The motor may have a position information acquiring section that acquires a position of the mover with respect to the stator along the axis, and the control section may acquire representative position information from a position information acquiring section of a representative motor selected from the plurality of motors, and control the position of the mover of the plurality of motors using the representative position information. According to these configurations, the position of the mover of the representative motor can be controlled with high accuracy and ease. Therefore, the position of the chip holding portion can be controlled with high accuracy and ease.

In one embodiment, the motor may also be a voice coil motor (voice coil motor). According to the structure, a driving force to drive the chip holding portion can be preferably obtained.

In one embodiment, the motor may have a chuck provided at an end of the mover and detachably coupled to the chip holding portion. The chuck includes: a chuck mechanism for connecting the chip holding part to the chuck; and a chuck detection unit for detecting the presence or absence of the chip holding unit connected to the chuck. According to the chuck, the chip holding portion can be easily attached to and detached from the mover. Further, information indicating that the chip holding portion is mounted on the mover and information indicating that the chip holding portion is not mounted on the mover can be obtained.

In one embodiment, the semiconductor chip may have a chip-held surface held by the chip holding portion. The chip holding portion may have a chip holding surface for detachably holding the semiconductor chip. The area of the chip holding portion is larger than the area of the surface to be held. According to these structures, a thin semiconductor chip can be reliably held.

In one embodiment, the semiconductor chip may have a chip-held surface held by the chip holding portion. The packaging apparatus further includes a lift-up mechanism that pushes up the semiconductor chip toward the chip holding portion by pressing a surface opposite to the surface on which the chip is held. According to these configurations, the semiconductor chip can be reliably picked up by the chip holding portion.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the packaging device of the embodiment of the invention, semiconductor chips with various shapes can be processed.

Drawings

Fig. 1 is a diagram showing a package device according to an embodiment.

Fig. 2 is a diagram illustrating a first mode of the pickup head.

Fig. 3 is a diagram illustrating a second mode of the pickup head.

Fig. 4 part (a) and 4 part (b) of fig. 4 are diagrams for explaining the operation of the package device.

Fig. 5 part (a) and 5 part (b) of fig. 5 are diagrams for further explaining the operation of the package device.

Fig. 6 is a diagram for explaining the effect of the package device.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

As shown in fig. 1, the package device 1 mounts a semiconductor chip 101 on a substrate 110. The packaging apparatus 1 includes a bonding unit 10, a control unit 20 (control section), and a pickup unit 30. The pickup unit 30 picks up the semiconductor chip 101. The pickup unit 30 sucks the chip main surface 101a (chip-held surface) of the semiconductor chip 101. Then, the pickup unit 30 delivers the semiconductor chip 101 to the bonding unit 10. The bonding unit 10 bonds the received semiconductor chip 101 to the substrate 110. The control unit 20 controls the above-described actions of the pickup unit 30 and the engagement unit 10.

< engagement unit >

The bonding unit 10 includes a guide rail 11, a bonding stage 12, and a bonding head 13.

The guide rail 11 is a base for reciprocating the bonding head 13 in a predetermined direction. The guide rail 11 extends, for example, from the pickup unit 30 to an area where the joining work is performed.

The bonding stage 12 mounts the supplied substrate 110. The semiconductor chip 101 is mounted on the substrate 110 placed on the bonding stage 12. The bonding stage 12 has, for example, a suction hole. The bonding stage 12 holds the substrate 110 by suction from below.

The bonding head 13 has a bonding body 14 and a bonding nozzle 15. The joint body 14 is coupled to the guide rail 11. The engaging body 14 reciprocates along the guide rail 11. The engaging body 14 contains a motor for driving the engaging mouth 15.

The bonding nozzle 15 detachably holds the semiconductor chip 101. For example, the joining nozzle 15 has a vacuum suction mechanism as a mounting and demounting mechanism. Further, the bonding nozzle 15 bonds the semiconductor chip 101 to the substrate 110. For example, the bonding nozzle 15 may have a heater or the like to supply heat to the semiconductor chip 101.

< pickup Unit >

The pickup unit 30 has a guide rail 31, a wafer handling mechanism 32, and a pickup head 33.

The guide rail 31 is a base for reciprocating the pickup head 33 in a predetermined direction. The guide rail 31 extends from, for example, an area where the picking work is performed to the joining unit 10.

The wafer handling mechanism 32 assists in the picking action. The wafer handling mechanism 32 has a wafer holder 32a and lift pins 32 b. The wafer holder 32a and the knock-up pin 32b move relative to each other. As a result, the wafer handling mechanism 32 can dispose the lift pins 32b on the back surface side of the semiconductor chip 101 to be picked up. For example, it may be provided that the wafer holder 32a is movable in the Y direction. The knock-up pin 32b is movable in the X direction. Further, the wafer holder 32a may be movable in the X direction and the Y direction. According to the above configuration, the lift-up pin 32b can be disposed on the back surface side of any of the plurality of semiconductor chips 101 two-dimensionally arranged. Then, the lift-up pins 32b lift up the semiconductor chip 101 toward the pickup head 33. That is, the knock-up pin 32b can reciprocate in the Z direction.

As shown in fig. 2, the pickup head 33 has two pickup motors 36A, 36B (motors), a motor base 37, and a collet 34A (chip holding portion). The pickup motor 36A and the pickup motor 36B are fixed to the motor base 37, respectively. The pickup motor 36A and the pickup motor 36B are disposed apart from each other in a direction (X direction) orthogonal to the axis line a. According to this configuration, the axis a of the pickup motor 36A is parallel with respect to the axis a of the pickup motor 36B. The interval from the pickup motor 36A to the pickup motor 36B is based on, for example, the size B1 of the semiconductor chip 101 and/or the arrangement interval B2 of the semiconductor chip 101, and the like.

The pickup motor 36B is configured only differently from the pickup motor 36A. The structure of the pickup motor 36B is common to that of the pickup motor 36A. The pickup motor 36A will be described in detail below, and the pickup motor 36B will not be described in detail.

The pickup motor 36A has a voice coil motor 38 and a chuck 39. The voice coil motor 38 is a so-called direct-acting linear motor. The voice coil motor 38 reciprocates the chuck 39 in the Z direction. The voice coil motor 38 has a motor case 38a, a stator 38b, and a mover 38 c. The motor case 38a houses the stator 38 b. The motor case 38a accommodates the base end side of the mover 38 c. The stator 38b includes a coil L. The mover 38c includes a magnet M. The magnet M is provided in a portion of the mover 38c facing the coil L. To the coil L, a power source 41 is connected. The coil L generates a force to drive the mover 38c in response to a current supplied from the power source 41.

Here, a connection structure of the coil L will be explained. The coil L of the pickup motor 36A and the coil L of the pickup motor 36B receive a current from a common power supply 41. That is, the coil L of the pickup motor 36A is electrically connected to the coil L of the pickup motor 36B. For example, two coils L may be connected in series. In addition, the two coils L may also be connected in parallel.

The front end of the mover 38c protrudes from the motor case 38 a. A chuck 39 is provided at the front end of the mover 38 c. Chuck 39 detachably holds collet 34A. The chuck 39 includes a chuck holding surface 39a, a chuck magnet 39b (chuck mechanism), and a chuck sensor 39c (chuck detection unit). As for the shape of the chuck holding surface 39a, for example, the plane is regarded as a rectangular plane. The chuck magnet 39b is embedded in the chuck 39. The chuck magnets 39b provide magnetic force to hold the collet 34A. The chuck sensor 39c provides information indicating that the collet 34A is mounted on the chuck holding surface 39 a. Further, the chuck sensor 39c provides information indicating that the collet 34A is not attached to the chuck holding surface 39 a. The chuck sensor 39c may also provide information indicating that the collet 34A is mounted on the chuck holding surface 39 a. The chuck sensor 39c may provide information indicating that the collet 34A is not attached to the chuck holding surface 39 a. This information is supplied to the control unit 20. The chuck mechanism is not limited to holding the collet 34A by the chuck magnets 39 b. The chuck mechanism may be a mechanism capable of holding the collet 34A, such as a mechanism for holding the collet 34A by vacuum or a mechanism for holding the collet 34A by grasping with a member such as a claw.

The voice coil motor 38 further has an encoder 38d (position information acquiring section). The encoder 38d obtains, for example, information regarding the relative position of the mover 38c with respect to the stator 38 b. The information also corresponds to the protrusion length of the mover 38 c. The information of the encoder 38d is supplied to the control unit 20.

That is, the output of the encoder 38d represents the position of the mover 38c along the axis relative to the stator 38 b. Therefore, the "positional information" described in the present embodiment indicates the position of the mover 38c along the axis with respect to the stator 38 b. Here, the packaging apparatus 1 has two pickup motors 36A, 36B. The pickup motor 36A and the pickup motor 36B each include a voice coil motor 38. Each voice coil motor 38 further includes an encoder 38 d. Thus, the packaging device 1 can use the position information obtained from the pickup motor 36A and the position information obtained from the pickup motor 36B.

The collet 34A is disposed across the pick-up motors 36A, 36B. Therefore, the protruding length of the mover 38c of the pickup motor 36A may be regarded as the same as the protruding length of the mover 38c of the pickup motor 36B. Thus, for example, the packaging device 1 may select either one of the position information obtained from the pickup motor 36A and the position information obtained from the pickup motor 36B as the representative position information. The representative position information may be calculated using both the position information obtained from the pickup motor 36A and the pickup motor 36B.

The collet 34A detachably holds the semiconductor chip 101. For example, the collet 34A has a vacuum suction mechanism as the attachment/detachment mechanism. Therefore, the collet 34A has a collet suction hole 34A as a vacuum suction mechanism. One end of the collet suction hole 34a is connected to a pressure source 42. The other end of the collet suction hole 34a is an opening provided in the collet suction surface 34S (chip holding surface). The collet suction surface 34S detachably holds the semiconductor chip 101. For example, when the chuck holding surface 39a has a square shape, the plane of the collet suction surface 34S is rectangular. The area of the collet suction surface 34S is larger than the area of the chuck holding surface 39 a. On the other hand, the weight of the collet 34A is smaller than the total weight of the individual collets 34B and 34C (see fig. 3) provided on the chuck holding surfaces 39 a.

The control unit 20 controls the action of the pickup unit 30. The operation of the pickup unit 30 described here includes a suction operation of sucking the semiconductor chip 101 to the collet 34A and a peeling operation of peeling the semiconductor chip 101 sucked to the collet 34A from the dicing tape 120. The attracting operation moves the mover 38c of the voice coil motor 38 in the negative Z direction. The stripping operation moves the mover 38c of the voice coil motor 38 in the positive Z direction. The motion of the mover 38c is based on information provided from the encoder 38 d. Here, the pickup unit 30 includes two pickup motors 36A, 36B. Thus, the pickup unit 30 includes two encoders 38 d. The control unit 20 selects, for example, the pickup motor 36A as a representative motor. That is, the encoder 38d of the pickup motor 36A is selected as the representative encoder. Also, the control unit 20 controls the action of the pickup unit 30 based on information supplied from the encoder 38d as a representative.

The criteria selected as the representative criteria may be set to satisfy a required condition. The control unit 20 may control the operation of the pickup unit 30 by using information supplied from the plurality of encoders 38 d. For example, the control unit 20 averages the information supplied from the respective encoders 38 d. The control unit 20 may control the operation of the pickup unit 30 using information obtained by averaging.

The pickup head 33 can select the first mode and the second mode according to the shape of the semiconductor chip 101 to be picked up. These forms are selected by replacing the collet 34A and the collet 34B mounted on the chuck 39.

The pickup head 33 may select the configuration shown in fig. 2 as the first configuration. The first mode is selected when the surface area of the semiconductor chip 101 is relatively large. The first mode is selected when the thickness of the semiconductor chip 101 is small (thin). In the first configuration, a collet 34A is used that spans across two pick-up motors 36A, 36B.

The pickup head 33 may be in the second mode as shown in fig. 3. The second mode is selected when the surface area of the semiconductor chip 101 is relatively small. In addition, the second form is selected when a large number of semiconductor chips 101 need to be carried per unit time. In the second mode, the collet 34B is attached to the pickup motor 36A, and the collet 34C is attached to the pickup motor 36B.

Hereinafter, the operation of the package device 1 will be described.

< pick action >

As shown in part (a) of fig. 4, the control unit 20 moves the pickup unit 30 to directly above the semiconductor chip 101 as a pickup object. Further, the control unit 20 arranges the lift-up pin 32b directly below the semiconductor chip 101.

Then, as shown in part (b) of fig. 4, the control unit 20 moves the knock-up pin 32b in the positive Z direction. By this operation, the lift-up pins 32b push up the chip back surface 101b of the semiconductor chip 101. As a result, the semiconductor chip 101 approaches the pickup head 33. Then, the control unit 20 moves the collet 34A in the negative Z direction. Then, the control unit 20 activates the adsorption mechanism. As a result, the pickup head 33 sucks the semiconductor chip 101.

Then, as shown in fig. 5 (a), the control unit 20 moves the collet 34A in the positive Z direction. By this action, the semiconductor chip 101 is peeled off from the dicing tape 120. Then, the control unit 20 moves the pickup head 33 toward the joining unit 10. In the movement, the control unit 20 rotates the orientation of the pickup head 33. The rotation angle is 180 degrees. By this action, the orientation of the semiconductor chip 101 is changed from downward to upward. The action is a so-called flip-chip action. Simultaneously with these operations, the control unit 20 moves the bonding head 13 toward the pickup unit 30.

Then, as shown in part (b) of fig. 5, the control unit 20 delivers the semiconductor chip 101 from the pickup head 33 to the bonding head 13. Then, the bonding head 13 bonds the semiconductor chip 101 to the substrate 110.

The operation and effect of the package 1 will be described below.

Packaging assembly 1 includes two voice coil motors 38 and collet 34A. The voice coil motor 38 is a linear motor of a linear type in which a mover 38c reciprocates along an axis a with respect to a stator 38 b. The collet 34A detachably holds the semiconductor chip 101. The voice coil motors 38 are distant from each other in a direction intersecting the axis a. Further, the axes a of the voice coil motor 38 are parallel to each other. The collet 34A is mounted so as to straddle a chuck 39 provided at an end of the plurality of movers 38 c.

The packaging device 1 includes two voice coil motors 38 that can mount and dismount the collet 34A. According to the structure, two forms different from each other can be selected. The following configuration may be selected as the first configuration: one collet 34A is mounted across both voice coil motors 38. The collet 34A disposed across the voice coil motors 38 is driven by the two voice coil motors 38. Thus, the collet 34A may be larger than, for example, the collets 34B, 34C that may be driven by a voice coil motor 38. That is, the area of the collet suction surface 34S of the collet 34A can be enlarged. As a result, the area of the chip main surface 101a of the semiconductor chip 101 that can be held is enlarged. Therefore, the method can be applied to the transportation of the thin semiconductor chip 101. In addition, the following form may be selected as the second form: the collet chuck 34B and the collet chuck 34C are attached to the respective voice coil motors 38. According to the second embodiment, it is possible to handle the transportation of the small semiconductor chip 101. As a result, the packaging device 1 capable of selecting the first and second embodiments can handle the transfer of semiconductor chips 101 having various shapes.

In other words, the packaging device 1 has a structure in which the collet 34A, the collet 34B, and the collet 34C can be exchanged with each other. Therefore, the packaging device 1 can handle semiconductor chips 101 of various shapes. The collet 34A, the collet 34B, and the collet 34C are relatively easier to replace than the voice coil motor 38. That is, when the semiconductor chip 101 to be picked up is changed, a troublesome work such as a replacement work of the voice coil motor 38 is not performed.

The package device 1 can use all the pickup motors 36A, 36B of the pickup unit 30 even when the shape of the semiconductor chip 101 to be picked up is changed. For example, as shown in fig. 6, there is a case where the semiconductor chips 101 are larger than the interval of the pickup head 33. In this case, if the semiconductor chip 101 is picked up using only the pickup motor 36A, the semiconductor chip 101 cannot be picked up by the other pickup motor 36B adjacent to the pickup motor 36A. This is because the semiconductor chip 101 sucked in the collet 34B and the semiconductor chip 101 sucked in the collet 34C interfere with each other. Therefore, even if the pickup unit 30 has a plurality of pickup motors 36A, 36B, the pickup motor 36B cannot be operated. However, in the packaging apparatus 1 of the embodiment, by selecting the first mode, both the pickup motor 36A and the pickup motor 36B of the pickup unit 30 can be used.

The packaging device 1 comprises a control unit 20. The control unit 20 controls the position of the stator 38b by providing a control signal to the voice coil motor 38. The voice coil motor 38 has an encoder 38 d. The encoder 38d obtains the position of the mover 38c relative to the stator 38b along the axis. The control unit 20 acquires representative position information from the encoder 38d of the voice coil motor 38 as a representative selected from the plurality of voice coil motors 38. Also, the control unit 20 controls the position of the mover 38c of the voice coil motor 38 using the representative position information. With this configuration, the position of the mover 38c of the voice coil motor 38 can be controlled with high accuracy and ease. Therefore, the positions of the collet chucks 34A provided in the pickup motors 36A and 36B can be controlled with high accuracy and in a simple manner.

The mover 38c is provided with a chuck 39. The chuck 39 includes a chuck magnet 39b and a chuck sensor 39 c. The collet 34A is detachably connected to the chuck 39. The chuck magnet 39b connects the collet 34A to the chuck 39. The chuck sensor 39c detects the presence or absence of the collet 34A connected to the chuck 39. According to the above configuration, the collet 34A can be easily attached to and detached from the mover 38 c. Further, information indicating that the collet 34A is attached to the mover 38c and information indicating that the collet 34A is not attached to the mover 38c can be obtained.

The collet 34A has a collet suction surface 34S for detachably holding the semiconductor chip 101. The semiconductor chip 101 has a chip main surface 101a held by the collet suction surface 34S. The collet suction surface 34S has an area larger than the chip main surface 101 a. According to this structure, the semiconductor chip 101 having a small thickness can be reliably held.

The packaging device 1 further comprises a jacking pin 32 b. The lift-up pins 32b push the semiconductor chip 101 up to the collet 34A by pressing the chip back surface 101b on the opposite side to the chip main surface 101 a. According to this structure, the semiconductor chip 101 can be reliably picked up by the collet 34A.

The package device of the present disclosure is explained above. However, the package device of the present disclosure is not limited to the above-described embodiment, and may be implemented in various embodiments.

In the embodiment, the pickup unit 30 has two pickup heads 33. The number of the pickup heads 33 included in the pickup unit 30 is not limited to two. For example, the pickup unit 30 may also have four pickup heads 33. In this case, the pickup head 33 may be arranged linearly or two-dimensionally. The collet 34A may be disposed so as to extend over two pickup heads 33 out of the four pickup heads 33, or may be disposed so as to extend over the four pickup heads 33.

Description of the symbols

1: packaging device

10: joining unit

11: guide rail

12: joint platform

13: joint head

14: joint body

15: joint nozzle

20: control unit

30: pickup unit

31: guide rail

32: wafer handling mechanism

32 a: wafer holder

32 b: jacking pin

33: pick-up head

34A, 34B, 34C: collet clamp

34S: suction surface of collet

36A, 36B: pickup motor

37: motor base

38: voice coil motor

38 b: stator

38 c: mover

38 d: encoder for encoding a video signal

39: chuck with a locking mechanism

39 a: chuck holding surface

39 b: magnetic chuck

39 c: chuck sensor

101: semiconductor chip

101 a: chip main surface

101 b: chip back

110: substrate

120: cutting belt

L: coil

M: a magnet is provided.