阅读说明：本技术 一种应用双u型钣金的xyz三向减振结构 (XYZ three-direction vibration reduction structure applying double U-shaped metal plates ) 是由 潘玉刚 于 2021-08-23 设计创作，主要内容包括：本发明公开了一种应用双U型钣金的XYZ三向减振结构,包括缓冲板和隔振板,缓冲板包括缓冲板Ⅰ和缓冲板Ⅱ,缓冲板Ⅰ与缓冲板Ⅱ通过螺栓连接固定,隔振板安设在缓冲板Ⅰ上,与现有技术相比,本发明的有益效果是：该结构安设在微电子封装设备的底部,可实现X轴、Y轴以及Z轴三个方向的振幅,经过系列测试可将Z向振动振幅控制在22微米摄偏差以内,当加装特定发泡软材,可降低至14微米以内,可将Y向振动振幅控制在34微米摄偏差以内,当加装特定发泡软材,可降低至18微米以内,可将X向振动振幅控制在37微米摄偏差以内,当加装特定发泡软材,可降低至21微米以内。(The invention discloses an XYZ three-dimensional vibration damping structure applying double U-shaped metal plates, which comprises a buffer plate and a vibration isolation plate, wherein the buffer plate comprises a buffer plate I and a buffer plate II, the buffer plate I and the buffer plate II are fixedly connected through bolts, and the vibration isolation plate is arranged on the buffer plate I, compared with the prior art, the vibration damping structure has the beneficial effects that: the structure is arranged at the bottom of the microelectronic packaging equipment, can realize the amplitude in three directions of an X axis, a Y axis and a Z axis, can control the vibration amplitude in the Z direction within 22 microns shooting deviation through series tests, can reduce the vibration amplitude in the Y direction within 14 microns when a specific foaming soft material is added, can control the vibration amplitude in the Y direction within 34 microns shooting deviation, can reduce the vibration amplitude in the X direction within 18 microns when the specific foaming soft material is added, and can reduce the vibration amplitude in the X direction within 37 microns shooting deviation to within 21 microns when the specific foaming soft material is added.)

1. The utility model provides an use XYZ three-dimensional damping structure of two U type panel beating, includes buffer board and vibration isolation board, its characterized in that: the buffer board includes buffer board I and buffer board II, and buffer board I passes through bolted connection with buffer board II to be fixed, and buffer board II is located I bottoms of buffer board, and the vibration isolation board is installed on buffer board I.

2. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 1, wherein: buffer board I and buffer board II are the sheet metal component, and the sheet metal component both ends are the two U type structures of symmetry.

3. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 2, wherein: buffer board I and buffer board II are gone up including flat plate portion and U type portion, and U type portion is the structure that the flat plate portion both ends were bent and are formed, and U type portion is located flat plate portion both sides, forms non-confined sheet metal construction.

4. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 3, wherein: a positioning hole I is formed in one side, far away from the flat plate portion, of the U-shaped portion on the buffer plate I, and correspondingly, a positioning hole II is formed in the flat plate portion of the buffer plate II.

5. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 4, wherein: pass locating hole I and locating hole II through bolt I, realize buffer board I and buffer board II location.

6. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 5, wherein: after the buffer plate I and the buffer plate II are positioned, the U-shaped part of the buffer plate I is perpendicular to the U-shaped part of the buffer plate II.

7. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 3, wherein: the flat plate part of the buffer plate I is provided with a positioning hole III, and the bolt II is arranged in the positioning hole III to form connection with external equipment.

8. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 3, wherein: a positioning hole IV is formed in one side, far away from the flat plate portion, of the U-shaped portion on the buffer plate II, correspondingly, a positioning hole V is formed in the vibration isolation plate, and a bolt III penetrates through the positioning hole IV and the positioning hole V to form positioning of the buffer plate II and the vibration isolation plate.

9. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 3, wherein: after the buffer plate I is fixed with the buffer plate II, the buffer plate II is fixed with the vibration isolation plate to form an empty groove, and a foaming soft material can be arranged in the empty groove to improve the vibration damping performance.

10. The XYZ three-way damping structure applied to double U-shaped sheet metal according to claim 1, wherein: the material elastic coefficient on the buffer plate I is 12500-.

Technical Field

The invention relates to an XYZ three-direction vibration damping structure applying double U-shaped metal plates, in particular to a microelectronic packaging equipment assembly.

Background

In a microelectronic packaging device, the corresponding process requirements can be met only by ensuring high accuracy, but in the existing product, a fixed structure is a simple integral structure, the product can be unstably fixed in the work process due to the structure, product displacement is caused due to XY operation vibration of the device, and further the liquid distribution processing quality is poor and the product safety is influenced.

The source of the XY operation vibration is caused by the diffusion of the weight inertia energy of the XZ mechanism to the base when the XZ mechanism works at high-speed point position motion (3G acceleration, 2m/s speed), so a matched structure for improving the vibration reduction effect is urgently needed to be proposed.

Disclosure of Invention

In view of the above problems in the prior art, an object of the present invention is to provide an XYZ three-directional damping structure using a double U-shaped sheet metal, and to develop a structure that is stable in product fixation and is not affected by vibration of a base without additional measures for damping the base, so as to meet the positioning consistency during fine fluid processing.

In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:

the utility model provides an use XYZ three-dimensional damping structure of two U type panel beating, includes buffer board and vibration isolation board, and the buffer board includes buffer board I and buffer board II, and buffer board I passes through bolted connection with buffer board II to be fixed, and buffer board II is located I bottoms of buffer board, and the vibration isolation board is installed on buffer board I.

Preferably, buffer board I and buffer board II are the sheet metal component, and the sheet metal component both ends are the two U type structures of symmetry, and two U type interlocking fixed knot construct plays the technological effect of damping.

Preferably, buffer board I and buffer board II are gone up including dull and stereotyped portion and U type portion, and U type portion is the structure that the dull and stereotyped portion both ends formed of bending, and U type portion lies in dull and stereotyped portion both sides, forms non-closed sheet metal construction, and double U type interlocking structure can cushion to the vibration that XYZ three-dimensional passed and filter.

Preferably, the U-shaped portion of the buffer plate I is provided with a positioning hole I at a side far away from the flat plate portion, and correspondingly, the flat plate portion of the buffer plate II is provided with a positioning hole II.

Preferably, pass locating hole I and locating hole II through bolt I, realize buffer board I and buffer board II location, fixed knot constructs simply, easily installs.

Preferably, buffer board I and buffer board II location back, the U type portion of buffer board I and the U type portion mutually perpendicular of buffer board II, buffer board I to subducing X direction vibration and partial Z to the vibration.

Preferably, the flat plate part of the buffer plate I is provided with a positioning hole III, and the bolt II is arranged in the positioning hole III to form connection with external equipment and be used for being connected with the equipment base.

Preferably, a positioning hole IV is formed in one side, far away from the flat plate portion, of the U-shaped portion on the buffer plate II, a positioning hole V is correspondingly formed in the vibration isolation plate, and a bolt III penetrates through the positioning hole IV and the positioning hole V to form positioning of the buffer plate II and the vibration isolation plate.

Preferably, the buffer plate I and the buffer plate II are fixed, the buffer plate II and the vibration isolation plate are fixed to form an empty groove, a foaming soft material can be arranged in the empty groove, the vibration damping performance is improved, and a better vibration damping effect can be achieved after the foaming material is added.

Preferably, the elastic coefficient of the material on the buffer plate i is 12500-.

The invention has the beneficial effects that: the structure is arranged at the bottom of the microelectronic packaging equipment, can realize the amplitude in three directions of an X axis, a Y axis and a Z axis, can control the vibration amplitude in the Z direction within 22 microns shooting deviation through series tests, can reduce the vibration amplitude in the Y direction within 14 microns when a specific foaming soft material is added, can control the vibration amplitude in the Y direction within 34 microns shooting deviation, can reduce the vibration amplitude in the X direction within 18 microns when the specific foaming soft material is added, and can reduce the vibration amplitude in the X direction within 37 microns shooting deviation to within 21 microns when the specific foaming soft material is added.

Drawings

Fig. 1 is a schematic structural diagram of a preferred embodiment of an XYZ three-way damping structure applying a double U-shaped sheet metal provided by the invention;

fig. 2 is a schematic structural diagram of a preferred embodiment of an XYZ three-way damping structure applying a double U-shaped sheet metal provided by the invention;

fig. 3 is a schematic structural diagram of a preferred embodiment of an XYZ three-way damping structure applying a double U-shaped sheet metal provided by the invention;

fig. 4 is a schematic structural diagram of a preferred embodiment of an XYZ three-way damping structure applying a double U-shaped sheet metal provided by the invention.

Detailed Description

The invention will now be described more fully hereinafter with reference to the accompanying drawings and preferred embodiments.

Fig. 1-4 are schematic diagrams of preferred embodiments of an XYZ three-way damping structure using a double U-shaped sheet metal provided by the invention. As shown in fig. 1-4, the XYZ three-directional vibration damping structure using a double-U-shaped sheet metal comprises a buffer plate 1 and a vibration isolation plate 2, wherein the buffer plate 1 comprises a buffer plate i 101 and a buffer plate ii 102, the buffer plate i 101 and the buffer plate ii 102 are fixedly connected through a bolt, the buffer plate ii 102 is located at the bottom of the buffer plate i 101, the vibration isolation plate 2 is arranged on the buffer plate i 101, the buffer plate i 101 and the buffer plate ii 102 are sheet metal parts, two ends of the sheet metal part 102 are symmetrical double-U-shaped structures, the buffer plate i 101 and the buffer plate ii 102 comprise a flat plate part 103 and a U-shaped part 104, the U-shaped part 104 is a structure formed by bending two ends of the flat plate part 101, the U-shaped part 104 is located at two sides of the flat plate part 103 to form a non-closed sheet metal structure, a positioning hole i 105 is arranged at one side of the U-shaped part 104 on the buffer plate i 101, which is far away from the flat plate part 103, correspondingly, a positioning hole ii 106 is arranged on the flat plate part 103 of the buffer plate ii 102, and passes through the positioning holes i 105 and ii 106 through a bolt i 3, positioning of a buffer plate I101 and a buffer plate II 102 is achieved, after the buffer plate I101 and the buffer plate II 102 are positioned, a U-shaped portion 104 of the buffer plate I101 and a U-shaped portion 104 of the buffer plate II 102 are perpendicular to each other, a positioning hole III 107 is formed in a flat plate portion 103 of the buffer plate I101, a bolt II 4 is installed in the positioning hole III 107 to be connected with external equipment, a positioning hole IV 108 is formed in one side, far away from the flat plate portion 103, of the U-shaped portion 104 of the buffer plate II 102, correspondingly, a positioning hole V201 is formed in a vibration isolation plate 2, the buffer plate II 102 and the vibration isolation plate 2 are positioned by penetrating the positioning hole IV 108 and the positioning hole V201 through a bolt III 5, after the buffer plate I101 and the buffer plate II 102 are fixed, after the buffer plate II 102 and the vibration isolation plate 2 are fixed, a hollow groove 109 is formed, a soft material can be foamed in the hollow groove 109, the vibration isolation performance is improved, the elastic coefficient of the material on the buffer plate I101 is 12500 kg/mm, tensile strength of 310-350Mpa, material elastic coefficient on the buffer plate ii 102 of 11500-11900kg/mm, tensile strength of 340-390Mpa, material elastic coefficient on the vibration isolation plate 2 of 7500-8500kg/mm, tensile strength of 430-470 Mpa.

The double-U-shaped interlocking structure is matched with the upper locking and the bottom bolt locking, and when the mass of the multilayer vibration isolation plate and products above the multilayer vibration isolation plate reaches 40-50% of the maximum bearing mass of the buffer plate structure, high-frequency vibration transmitted from the bottom locking 4 bolts in the XYZ directions is effectively reduced; the structure of the buffer plate II reduces the vibration in the X direction and the vibration in the Z direction; the structure of the buffer plate I reduces the Y-direction vibration and part of the Z-direction vibration. The vibration reduction effect of the double-U structure depends on the elastic coefficient and the thickness of the U-shaped metal plate bending finished product.

Through data testing: 1. vibration amplitude in the Z direction: the amplitude of the similar structure can reach about 120 microns deviation, and the structure can be controlled within 22 microns shooting deviation through series tests; the specific foaming soft material is added in a part of the hollow groove, and can be reduced to be within 14 microns.

2. Vibration amplitude in the X direction: the amplitude of the similar structure can reach 740 micrometers, the structure of the invention is only 34 micrometers without adding a foaming soft material, and the amplitude is about 18 micrometers after adding the foaming soft material.

3. Vibration amplitude in the X direction: the amplitude of the similar structure can reach 1290 micrometers, the structure of the invention is only 37 micrometers without adding the foaming soft material, and the amplitude is about 21 micrometers after adding the foaming soft material.

Compared with the prior art, the invention has the beneficial effects that: the structure is arranged at the bottom of the microelectronic packaging equipment, can realize the amplitude in three directions of an X axis, a Y axis and a Z axis, can control the vibration amplitude in the Z direction within 22 microns shooting deviation through series tests, can reduce the vibration amplitude in the Y direction within 14 microns when a specific foaming soft material is added, can control the vibration amplitude in the Y direction within 34 microns shooting deviation, can reduce the vibration amplitude in the X direction within 18 microns when the specific foaming soft material is added, and can reduce the vibration amplitude in the X direction within 37 microns shooting deviation to within 21 microns when the specific foaming soft material is added.

Finally, it must be said here that: the above embodiments are only used for further detailed description of the technical solutions of the present invention, and should not be understood as limiting the scope of the present invention, and the insubstantial modifications and adaptations made by those skilled in the art according to the above descriptions of the present invention are within the scope of the present invention.