阅读说明：本技术 一种散热模块的更换方法、装置、设备及存储介质 (Method, device and equipment for replacing heat dissipation module and storage medium ) 是由 张德慊 黄家安 于 2021-07-28 设计创作，主要内容包括：本发明公开了一种散热模块的更换方法、装置、设备及存储介质；在本方案中,可预先设置散热表,该散热表记载了风扇转速为第一预定值、热源模块的电源功耗为第二预定值时,不同环境温度下的理想热源模块温度及理想偏差值；本方案在确定散热模块是否需要更换时,同样需要将风扇转速设置为第一预定值,将热源模块的电源功耗设置为第二预定值,并根据当前环境温度从散热表中获取对应的目标热源模块温度及目标偏差值,若目标热源模块温度与实际热源模块温度的差值大于目标偏差值,则说明散热模块的散热效果已经无法达到预期效果,生成建议更换散热模块的提示信息,从而避免因散热模块更换不及时导致的芯片损坏问题。(The invention discloses a method, a device, equipment and a storage medium for replacing a heat dissipation module; in the scheme, a heat dissipation table can be preset, and the heat dissipation table records the ideal heat source module temperature and the ideal deviation value under different environmental temperatures when the rotating speed of the fan is a first preset value and the power consumption of the heat source module is a second preset value; according to the scheme, when whether the heat dissipation module needs to be replaced or not is determined, the rotating speed of the fan needs to be set to be the first preset value, the power consumption of the heat source module is set to be the second preset value, the corresponding target heat source module temperature and the target deviation value are obtained from the heat dissipation table according to the current environment temperature, if the difference value between the target heat source module temperature and the actual heat source module temperature is larger than the target deviation value, the fact that the heat dissipation effect of the heat dissipation module cannot achieve the expected effect is shown, prompt information for suggesting replacement of the heat dissipation module is generated, and therefore the problem of chip damage caused by the fact that the heat dissipation module is not replaced timely is avoided.)

1. A method for replacing a heat dissipation module, comprising:

setting the rotating speed of a fan to be a first preset value, setting the power consumption of a heat source module to be a second preset value, and acquiring the current environment temperature;

acquiring a target heat source module temperature and a target deviation value corresponding to the current environment temperature from a heat dissipation table according to the current environment temperature;

calculating the difference value between the target heat source module temperature and the actual heat source module temperature;

judging whether the difference value is larger than the target deviation value;

and if so, generating prompt information for recommending to replace the heat dissipation module.

2. The replacement method according to claim 1, wherein the construction process of the heat dissipation table comprises:

setting a fan speed in a heat treatment chamber to the first predetermined value, and setting a power consumption of a power source of the heat source module in the heat treatment chamber to the second predetermined value;

setting the environment temperature of the heat treatment chamber to each target environment temperature in an environment temperature range in sequence, setting the temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to the target environment temperature when the heat treatment chamber is at each target environment temperature, and setting a target deviation value corresponding to the target environment temperature according to the specification attribute of the heat dissipation module;

and constructing the heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

3. The replacement method according to claim 1, wherein after generating the prompt message suggesting replacement of the heat dissipation module, the method further comprises:

and sending the prompt information to a specified user through a preset contact way.

4. The method of claim 1, wherein if the difference is not greater than the target deviation value, the method further comprises:

prompt information that the heat dissipation module does not need to be replaced is generated.

5. The replacement method according to any one of claims 1 to 4, wherein if the difference is greater than the target deviation value, the replacement method further comprises:

judging whether the difference value between the difference value and the target deviation value is larger than a preset threshold value or not;

if yes, early warning information is sent out.

6. A heat dissipation module replacement device, comprising:

the setting module is used for setting the rotating speed of the fan to be a first preset value and setting the power consumption of the heat source module to be a second preset value;

the first acquisition module is used for acquiring the current ambient temperature;

the second obtaining module is used for obtaining a target heat source module temperature and a target deviation value corresponding to the current environment temperature from a heat dissipation table according to the current environment temperature;

the calculating module is used for calculating the difference value between the target heat source module temperature and the actual heat source module temperature;

the first judgment module is used for judging whether the difference value is larger than the target deviation value or not;

and the first generation module is used for generating prompt information for recommending the replacement of the heat dissipation module when the difference value is larger than the target deviation value.

7. The changing device of claim 6, further comprising a building module;

wherein the building block comprises:

a first setting unit for setting a rotation speed of a fan in a heat treatment chamber to the first predetermined value, and setting a power consumption of a power source of the heat source module in the heat treatment chamber to the second predetermined value;

a second setting unit for sequentially setting the ambient temperature of the heat treatment chamber to each target ambient temperature in an ambient temperature range;

a third setting unit, configured to set a temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to a target ambient temperature when the heat treatment chamber is at each target ambient temperature, and set a target deviation value corresponding to the target ambient temperature according to a specification attribute of the heat dissipation module;

and the construction unit is used for constructing the heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

8. The changing device of claim 6, further comprising:

and the sending module is used for sending the prompt information to a specified user through a preset contact way after generating the prompt information for recommending the replacement of the heat dissipation module.

9. An electronic device, comprising:

a memory for storing a computer program;

a processor for implementing the steps of the method for replacing a heat dissipation module as claimed in any one of claims 1 to 5 when executing the computer program.

10. A computer-readable storage medium, characterized in that a computer program is stored thereon, which, when being executed by a processor, carries out the steps of the method for replacing a heat dissipation module as defined in any one of claims 1 to 5.

Technical Field

The present invention relates to the field of heat dissipation module replacement technologies, and in particular, to a method, an apparatus, a device, and a storage medium for replacing a heat dissipation module.

Background

At present, a heat dissipation module is often added in the design of a chip with high heat and high energy consumption, and the heat source of the chip is taken away by the heat dissipation module through contact. Common heat dissipation modules include thermal grease, heat sinks, and the like. However, the heat dissipation module often has poor heat dissipation due to aging, dust covering, and other problems after a long operation time, so that the heat dissipation of the chip cannot be expected, and the chip is finally damaged.

Therefore, how to detect out in advance whether the heat dissipation module needs to be replaced, and avoid the chip damage in time is a problem that needs to be solved by the technical personnel in the field.

Disclosure of Invention

The invention aims to provide a method, a device, equipment and a storage medium for replacing a heat dissipation module so as to avoid the problem of chip damage caused by untimely replacement of the heat dissipation module.

In order to achieve the above object, the present invention provides a method for replacing a heat dissipation module, comprising:

setting the rotating speed of a fan to be a first preset value, setting the power consumption of a heat source module to be a second preset value, and acquiring the current environment temperature;

acquiring a target heat source module temperature and a target deviation value corresponding to the current environment temperature from a heat dissipation table according to the current environment temperature;

calculating the difference value between the target heat source module temperature and the actual heat source module temperature;

judging whether the difference value is larger than the target deviation value;

and if so, generating prompt information for recommending to replace the heat dissipation module.

Wherein, the construction process of the heat dissipation table comprises the following steps:

setting a fan speed in a heat treatment chamber to the first predetermined value, and setting a power consumption of a power source of the heat source module in the heat treatment chamber to the second predetermined value;

setting the environment temperature of the heat treatment chamber to each target environment temperature in an environment temperature range in sequence, setting the temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to the target environment temperature when the heat treatment chamber is at each target environment temperature, and setting a target deviation value corresponding to the target environment temperature according to the specification attribute of the heat dissipation module;

and constructing the heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

Wherein, after the prompt message for suggesting to replace the heat dissipation module is generated, the method further comprises:

and sending the prompt information to a specified user through a preset contact way.

Wherein if the difference is not greater than the target deviation value, the method further comprises:

prompt information that the heat dissipation module does not need to be replaced is generated.

Wherein if the difference is greater than the target deviation value, the replacement method further comprises:

judging whether the difference value between the difference value and the target deviation value is larger than a preset threshold value or not;

if yes, early warning information is sent out.

In order to achieve the above object, the present invention further provides a replacing device for a heat dissipating module, comprising:

the setting module is used for setting the rotating speed of the fan to be a first preset value and setting the power consumption of the heat source module to be a second preset value;

the first acquisition module is used for acquiring the current ambient temperature;

the second obtaining module is used for obtaining a target heat source module temperature and a target deviation value corresponding to the current environment temperature from a heat dissipation table according to the current environment temperature;

the calculating module is used for calculating the difference value between the target heat source module temperature and the actual heat source module temperature;

the first judgment module is used for judging whether the difference value is larger than the target deviation value or not;

and the first generation module is used for generating prompt information for recommending the replacement of the heat dissipation module when the difference value is larger than the target deviation value.

Wherein, the device also comprises a construction module;

wherein the building block comprises:

a first setting unit for setting a rotation speed of a fan in a heat treatment chamber to the first predetermined value, and setting a power consumption of a power source of the heat source module in the heat treatment chamber to the second predetermined value;

a second setting unit for sequentially setting the ambient temperature of the heat treatment chamber to each target ambient temperature in an ambient temperature range;

a third setting unit, configured to set a temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to a target ambient temperature when the heat treatment chamber is at each target ambient temperature, and set a target deviation value corresponding to the target ambient temperature according to a specification attribute of the heat dissipation module;

and the construction unit is used for constructing the heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

Wherein, the device still includes:

and the sending module is used for sending the prompt information to a specified user through a preset contact way after generating the prompt information for recommending the replacement of the heat dissipation module.

To achieve the above object, the present invention further provides an electronic device comprising:

a memory for storing a computer program;

and the processor is used for realizing the steps of the replacing method of the heat dissipation module when executing the computer program.

To achieve the above object, the present invention further provides a computer-readable storage medium, on which a computer program is stored, the computer program, when being executed by a processor, implementing the steps of the method for replacing a heat dissipation module.

According to the scheme, the embodiment of the invention provides a method, a device, equipment and a storage medium for replacing a heat dissipation module; in the scheme, a heat dissipation table can be preset, and the heat dissipation table records the ideal heat source module temperature and the ideal deviation value under different environmental temperatures when the rotating speed of the fan is a first preset value and the power consumption of the heat source module is a second preset value; therefore, when determining whether the heat dissipation module needs to be replaced, the fan rotating speed also needs to be set to be a first preset value, the power consumption of the heat source module is set to be a second preset value, the corresponding target heat source module temperature and the target deviation value are obtained from the heat dissipation table according to the current environment temperature, if the difference value between the target heat source module temperature and the actual heat source module temperature is larger than the target deviation value, the fact that the heat dissipation effect of the heat dissipation module cannot reach the expected effect is indicated, prompt information for recommending replacement of the heat dissipation module is generated, through the method, the problem of chip damage caused by untimely replacement of the heat dissipation module can be solved, and energy consumption of other cooling modes can be reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a replacement system of a heat dissipation module according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a relationship between a fan speed and a heat source module temperature according to an embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating a relationship between a rotational speed of a fan and a temperature of a heat source module according to another embodiment of the present invention;

FIG. 4 is a schematic diagram illustrating a relationship between a rotational speed of a fan and a temperature of a heat source module according to another embodiment of the present invention;

FIG. 5 is a flowchart illustrating an overall process for constructing a heat dissipation table according to an embodiment of the present invention;

fig. 6 is a schematic flow chart illustrating a method for replacing a heat dissipation module according to an embodiment of the present invention;

fig. 7 is a schematic structural view of a replacing device of a heat dissipation module according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment of the invention discloses a method, a device, equipment and a storage medium for replacing a heat dissipation module, which are used for avoiding the problem of chip damage caused by untimely replacement of the heat dissipation module.

For convenience of understanding, a system architecture applicable to the technical solution of the present application is introduced below, referring to fig. 1, which is a schematic structural diagram of a replacement system of a heat dissipation module disclosed in an embodiment of the present invention, referring to fig. 1, the system specifically includes the following modules;

a Heat source module (Heat source module), which is a chip having a characteristic of easily generating a Heat source, such as: a CPU (central processing unit), a GPU (graphics processing unit), and the like.

A Heat source module temperature sensor (Heat source temperature sensor) for acquiring a temperature of the Heat source module.

Cooling modules (Cooling modules) that dissipate heat faster by actively bringing in a heat-dissipating medium, such as a fan or a water-Cooling device.

A Heat dissipation module (Heat dissipation module) that takes away a Heat source of the Heat source module, such as Heat paste, Heat sink, etc., through the contact Heat source module.

And a Power consumption sensor (Power consumption sensor) for reflecting the Power consumption of the heat source module, wherein the larger the Power consumption is, the more heat is generated, and the higher the temperature is.

An Ambient temperature sensor (Ambient temperature sensor) for reflecting an Ambient temperature.

A Monitor Management Module (MMC) responsible for reading the sensor, controlling the cooling module and the peripheral devices, such as BMC (Baseboard Management controller, Management chip on server) or RMC (Rack Management controller, Management chip on server cabinet), etc.

Referring to fig. 2, a relationship between a fan speed and a heat source module temperature according to an embodiment of the present invention is shown. Fig. 2 shows: the environment temperature and the power consumption of the heat source module are fixed, and the relationship between the fan rotating speed and the temperature of the heat source module is fixed, specifically, the higher the fan rotating speed is, the lower the temperature of the heat source module is, and vice versa, so that the fan rotating speed and the temperature of the heat source module are in a certain inverse relationship. Referring to fig. 3, a schematic diagram of a relationship between a fan speed and a heat source module temperature according to another embodiment of the present invention is provided, in fig. 3, a 0-An represents different ambient temperatures, a0< a1< … < An, and a curve in fig. 3 is used to represent: the relationship between the fan speed and the heat source module temperature is determined at different ambient temperatures, and specifically, the higher the ambient temperature is, the higher the temperature of the heat source module is at the same fan speed. Referring to fig. 4, a schematic diagram of a relationship between a rotational speed of a fan and a temperature of a heat source module according to another embodiment of the present invention is shown, in fig. 4, a power consumption of the heat source module is fixed, where L0 in the diagram indicates a linear relationship between a good heat dissipation efficiency of a heat dissipation module, L1 indicates a linear relationship between a poor heat dissipation efficiency of the heat dissipation module, and the rotational speed of the fan is fixed to X, the temperatures of the heat dissipation modules with good and poor heat dissipation efficiencies are Y0 and Y1, Y1> Y0, Y1-Y0 is Δ, and Δ is an offset value, which is used to determine comparison data of the heat dissipation efficiencies of the heat dissipation modules.

Therefore, based on the above analysis, the present application constructs a heat Dissipation table hdt (heat Dissipation table) so as to determine whether the heat Dissipation module needs to be replaced through the heat Dissipation table. Specifically, the construction process of the heat dissipation table specifically includes: setting a rotation speed of a fan in the heat treatment chamber to a first predetermined value, and setting power consumption of a power source of a heat source module in the heat treatment chamber to a second predetermined value; setting the environmental temperature of the heat treatment chamber to each target environmental temperature in the environmental temperature range in sequence, setting the temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to the target environmental temperature when the heat treatment chamber is at each target environmental temperature, and setting a target deviation value corresponding to the target environmental temperature according to the specification attribute of the heat dissipation module; and constructing a heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

Wherein, the heat treatment Chamber is Thermal Chamber, the object to be measured is put into the heat treatment Chamber, and the environmental temperature can be adjusted by using the device. Referring to table 1, a heat dissipation table is provided for the examples of the present application:

TABLE 1

Referring to fig. 5, an overall flowchart for constructing the heat dissipation meter according to the embodiment of the present invention is shown, when constructing the heat dissipation meter, products such as the heat dissipation module need to be formed into an object to be measured and placed in the thermal processing chamber, the rotation speed of the fan is fixed to a first predetermined value D rpm, the MMC sends a command, and the power consumption of the heat source module is fixed to a second predetermined value pwatt. Setting the environmental temperature range as (a0, a1, a2, …, An), sequentially raising the environmental temperature (Ambient temperature) of the heat treatment chamber to each target environmental temperature of (a0, a1, a2, …, An), wherein the corresponding heat source module temperature sampling temperature is (H0, H1, H2, …, Hn), (H0, H1, H2, …, Hn) is An Ideal heat source module temperature (Ideal heat source temperature), which indicates the heat source module temperature good for the heat dissipation module at the environmental temperature An, the power consumption Pwatt of the power supply and the rotating speed D rpm of the fan. The corresponding deviation values are (Δ 0,. DELTA.1,. DELTA.2, …,. DELTA.0). The delta Deviation Value (Deviation Value) is formulated according to the specification of the heat dissipation module, and is a standard Value for determining whether the heat dissipation module needs to be replaced. At An annular temperature An, if ((Hn — actual heat source module temperature) > < DELTA n), the heat dissipation module needs to be replaced. The Actual Heat source temperature (Actual Heat source temperature) is a temperature obtained by a Heat source temperature sensor.

Referring to fig. 6, a schematic flow chart of a method for replacing a heat dissipation module according to an embodiment of the present invention is shown, where the method specifically includes the following steps:

s101, setting the rotating speed of a fan to be a first preset value, and setting the power consumption of a heat source module to be a second preset value;

s102, acquiring the current environment temperature;

s103, acquiring a target heat source module temperature and a target deviation value corresponding to the current environment temperature from a heat dissipation table according to the current environment temperature;

s104, calculating the difference value between the target heat source module temperature and the actual heat source module temperature;

s105, judging whether the difference value is larger than the target deviation value;

if yes, executing S106; if not, executing S107;

s106, generating prompt information for suggesting replacement of the heat dissipation module;

and S107, generating prompt information without replacing the heat dissipation module.

In this embodiment, when detecting whether the heat dissipation module needs to be replaced, the rotation speed of the fan needs to be fixed to a first predetermined value D rpm, and a command is sent through the MMC to fix the power consumption of the heat source module to a second predetermined value pwatt. If the current ambient temperature is An, the target heat source module temperature corresponding to An is acquired from the table 1 as Hn, and the acquired target deviation value is Δ n. Reading the actual temperature of the heat source module, calculating the difference value between the target temperature Hn and the actual temperature of the heat source module, judging whether the difference value is larger than the target deviation value and is delta n, if so, recommending to replace the heat dissipation module, and if not, replacing the heat dissipation module. Further, after the scheme generates the prompt message for suggesting the replacement of the heat dissipation module, the prompt message can be sent to the appointed user through a preset contact way, so that the appointed user can replace the heat dissipation module in time, and the preset contact way can be as follows: the modes of short messages, mailboxes, etc. are not specifically limited herein.

In addition, after the difference value is judged to be larger than the target deviation value, whether the difference value between the difference value and the target deviation value is larger than a preset threshold value or not can be judged; if yes, the heat dissipation effect of the current heat source module is poor, and if the problem that the chip is damaged can be solved in time, early warning information can be sent out at the moment so that maintenance personnel can timely handle the problem.

In conclusion, according to the scheme, whether the heat dissipation module needs to be replaced or not can be known in advance, and the problem that the sudden chip is overheated is avoided. Moreover, the scheme of timely replacing the heat dissipation module provided by the scheme can also avoid energy consumption of other cooling modes, and more energy is consumed due to the active cooling mode, such as: the problem that the heat dissipation efficiency is not good is compensated by increasing the rotating speed of the fan, more energy consumption can be brought, the heat dissipation module is replaced in time through the scheme, the problem can be avoided, and the purpose of energy conservation is achieved. The scheme can be applied to the field of servers, vehicles, instruments and the like, is not limited herein, and can be applied to the fields needing heat dissipation.

In the following, the replacing device, the apparatus and the storage medium provided by the embodiments of the present invention are introduced, and the replacing device, the apparatus and the storage medium described below and the replacing method described above may be referred to each other.

Referring to fig. 7, a schematic structural diagram of a replacing device of a heat dissipation module according to an embodiment of the present invention includes:

the setting module 11 is used for setting the rotating speed of the fan to be a first preset value and setting the power consumption of the heat source module to be a second preset value;

a first obtaining module 12, configured to obtain a current ambient temperature;

a second obtaining module 13, configured to obtain, from a heat dissipation table according to the current environment temperature, a target heat source module temperature and a target deviation value corresponding to the current environment temperature;

a calculating module 14, configured to calculate a difference between the target heat source module temperature and an actual heat source module temperature;

a first judging module 15, configured to judge whether the difference is greater than the target deviation value;

and the first generating module 16 is configured to generate a prompt message suggesting that the heat dissipation module is replaced when the difference is greater than the target deviation value.

Wherein, this device still includes the construction module, and this construction module includes:

a first setting unit for setting a rotation speed of a fan in a heat treatment chamber to the first predetermined value, and setting a power consumption of a power source of the heat source module in the heat treatment chamber to the second predetermined value;

a second setting unit for sequentially setting the ambient temperature of the heat treatment chamber to each target ambient temperature in an ambient temperature range;

a third setting unit, configured to set a temperature of the heat source module in the heat treatment chamber to a target heat source module temperature corresponding to a target ambient temperature when the heat treatment chamber is at each target ambient temperature, and set a target deviation value corresponding to the target ambient temperature according to a specification attribute of the heat dissipation module;

and the construction unit is used for constructing the heat dissipation table according to the target heat source module temperature corresponding to each target environment temperature and the target deviation value.

Wherein, this device still includes:

and the sending module is used for sending the prompt information to a specified user through a preset contact way after generating the prompt information for recommending the replacement of the heat dissipation module.

Wherein the apparatus further comprises:

and the second generating module is used for generating prompt information without replacing the heat dissipation module when the difference value is not greater than the target deviation value.

Wherein the apparatus further comprises:

the second judgment module is used for judging whether the difference value between the difference value and the target deviation value is larger than a preset threshold value or not when the difference value is larger than the target deviation value; if yes, early warning information is sent out.

Referring to fig. 8, an electronic device according to an embodiment of the present invention includes:

a memory 21 for storing a computer program;

and the processor 22 is configured to implement the steps of the method for replacing the heat dissipation module according to the above method embodiment when executing the computer program.

In this embodiment, the device may be a terminal device and a server.

The device may include a memory 21, a processor 22, and a bus 23.

The memory 21 includes at least one type of readable storage medium, which includes a flash memory, a hard disk, a multimedia card, a card type memory (e.g., SD or DX memory, etc.), a magnetic memory, a magnetic disk, an optical disk, and the like. The memory 21 may in some embodiments be an internal storage unit of the device, for example a hard disk of the device. The memory 21 may also be an external storage device of the device in other embodiments, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) Card, Flash memory Card (Flash Card), etc. provided on the device. Further, the memory 21 may also include both an internal storage unit of the device and an external storage device. The memory 21 may be used not only to store application software installed in the device and various types of data such as program codes for executing the replacement method, etc., but also to temporarily store data that has been output or is to be output.

Processor 22, which in some embodiments may be a Central Processing Unit (CPU), controller, microcontroller, microprocessor or other data Processing chip, executes program code or processes data stored in memory 21, such as program code for performing replacement methods.

The bus 23 may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown in FIG. 8, but this is not intended to represent only one bus or type of bus.

Further, the device may further include a network interface 24, and the network interface 24 may optionally include a wired interface and/or a wireless interface (e.g., WI-FI interface, bluetooth interface, etc.), which are generally used to establish a communication connection between the device and other electronic devices.

Optionally, the device may further comprise a user interface 25, the user interface 25 may comprise a Display (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 25 may also comprise a standard wired interface, a wireless interface. Alternatively, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch device, or the like. The display, which may also be referred to as a display screen or display unit, is suitable for displaying information processed in the device and for displaying a visualized user interface.

Fig. 8 shows only the device with the components 21-25, and it will be understood by those skilled in the art that the structure shown in fig. 8 does not constitute a limitation of the device, and may comprise fewer or more components than those shown, or some components may be combined, or a different arrangement of components.

The embodiment of the present invention further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method for replacing a heat dissipation module in the above-mentioned method embodiment are implemented.

Wherein the storage medium may include: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.