阅读说明：本技术 显示面板制作设备和显示面板制作方法 (Display panel manufacturing equipment and display panel manufacturing method ) 是由 苑立阁 李楚 陈新亮 于 2021-07-28 设计创作，主要内容包括：本发明公开了一种显示面板制作设备和显示面板制作方法。该制作设备包括：激光剥离平台,所述激光剥离平台用于承载待处理显示面板；掩膜模块,所述掩膜模块设置在所述激光剥离平台的边缘；掩膜版,所述掩膜版具有与所述掩膜模块固定设置的第一位置,且具有对所述待处理显示面板的绑定区进行遮挡的第二位置。通过掩膜版的遮挡操作保护了待处理显示面板中的绑定区,进而提高了最终得到的显示面板的良率。(The invention discloses a display panel manufacturing device and a display panel manufacturing method. The manufacturing apparatus includes: the laser stripping platform is used for bearing a display panel to be processed; the mask module is arranged at the edge of the laser stripping platform; the mask plate is provided with a first position fixedly arranged with the mask module and a second position for shielding the binding region of the display panel to be processed. The shielding operation of the mask plate protects the binding area in the display panel to be processed, and the yield of the finally obtained display panel is improved.)

1. A display panel manufacturing apparatus, comprising:

the laser stripping platform is used for bearing a display panel to be processed;

the mask module is arranged at the edge of the laser stripping platform;

the mask plate is provided with a first position fixedly arranged with the mask module and a second position for shielding the binding region of the display panel to be processed.

2. The reticle of claim 1, wherein the reticle is positioned opposite the laser lift off stage when the reticle is in the first position; and/or

The mask is driven by the laser stripping platform to move from the first position to the second position, and when the mask is located at the second position, the mask is separated from the mask module.

3. The laser lift-off platform of claim 1, wherein the display panel to be processed comprises a display area and the bonding area disposed at an edge of the display area, the bonding area being disposed with at least one of a printed circuit board and a chip on film.

4. The reticle of claim 3, wherein the reticle comprises:

the mask plate comprises a mask plate body, wherein a hollow area is arranged in the middle of the mask plate body, a shielding part is arranged on the mask plate body close to the hollow area, a convex supporting block and a limiting block are respectively arranged on the surface of one side of the mask plate body, and the supporting block is positioned between the limiting block and the shielding part.

5. The mask according to claim 4, wherein when the mask is located at the first position, the limiting block is used for being clamped and matched with the mask module; and/or

When the mask is located at the second position, the supporting block is used for being abutted to one side, provided with the display panel to be processed, of the laser peeling platform, and the shielding part is used for shielding the binding area of the display panel to be processed, which is arranged on the laser peeling platform.

6. The mask module of claim 4, wherein the mask module comprises:

the transverse driving mechanism is used for driving the limiting groove to move;

the limiting groove is provided with a third position far away from the laser stripping platform, and is driven by the transverse driving mechanism to move from the third position to a fourth position close to the laser stripping platform, and when the limiting groove is located at the fourth position, the limiting groove and the limiting block are arranged oppositely.

7. The laser lift off platform of claim 1, wherein the laser lift off platform has a fifth position proximate to the mask module and has a sixth position distal from the mask module.

8. A method for manufacturing a display panel by using the display panel manufacturing apparatus according to any one of claims 1 to 7, comprising the steps of:

providing a display panel to be processed, wherein the display panel to be processed comprises a display area and a binding area arranged at the edge of the display area;

arranging the display surface to be processed on the laser stripping platform;

shielding the binding region by using the mask;

and carrying out laser stripping treatment on the display area in the display panel to be treated.

9. The method for manufacturing a display panel according to claim 8, wherein the step of masking the bonding area with a mask comprises:

moving the laser lift-off platform to be below a mask module;

lifting the laser stripping platform to enable the mask to be abutted against the laser stripping platform so that the mask is located at a second position for shielding the binding region;

and driving the mask module to move to a third position far away from the laser stripping platform, and moving the laser stripping platform so as to enable the mask plate and the display panel to be processed to move to the laser stripping position.

10. The method for manufacturing a display panel according to claim 9, wherein after the step of performing the laser lift-off process on the display area in the display panel to be processed, the method further comprises:

moving the laser stripping platform, and moving the display panel to be processed and the mask plate which are subjected to laser stripping processing to the position above the mask module;

driving a mask module to move to a fourth position close to the laser stripping platform so that the mask module and the mask plate are oppositely arranged;

and lowering the laser stripping platform to enable the mask plate to return to the first position fixedly arranged with the mask module.

Technical Field

The invention relates to the technical field of display, in particular to display panel manufacturing equipment and a display panel manufacturing method.

Background

In recent years, display technology has been rapidly developed, in which the display with flexible and bendable deformation is greatly improved from the screen size to the display quality. At present, the manufacturing method of the display panel is as follows: coating the whole polyimide on carrier glass to form a flexible substrate, forming a display function layer on the flexible substrate, binding (Bonding) an electric electronic element and an optical electronic element, stripping a flexible display device (comprising the flexible substrate and the display function layer) from the carrier glass by laser stripping, and performing thin film packaging to form a required display panel; however, in the process of laser lift-off, the Printed Circuit Board (PCB) and/or Chip On Film (COF) in the bonding region are easily affected by the laser, so that the yield of the finally obtained display panel is not high.

Therefore, how to reduce the influence on the printed circuit board and/or the flip-chip film in the bonding region during the laser lift-off process, thereby improving the yield of the display panel, is a problem to be solved urgently.

Disclosure of Invention

The invention mainly aims to provide a method and equipment for manufacturing a display panel, and aims to solve the problem that the yield of a target display panel is low.

To achieve the above object, the present invention provides a display panel manufacturing apparatus, including: the laser stripping platform is used for bearing a display panel to be processed; the mask module is arranged at the edge of the laser stripping platform; the mask plate is provided with a first position fixedly arranged with the mask module and a second position for shielding the binding region of the display panel to be processed.

According to the specific embodiment of the invention, when the mask is located at the first position, the mask is arranged opposite to the laser lift-off platform.

According to the specific embodiment of the invention, the mask is driven by the laser lift-off platform to move from the first position to the second position, and when the mask is located at the second position, the mask is separated from the mask module.

According to an embodiment of the present invention, the display panel to be processed includes a display area and the bonding area disposed at an edge of the display area, and the bonding area is disposed with at least one of a printed circuit board and a chip on film.

According to a specific embodiment of the present invention, the mask includes: the mask plate comprises a mask plate body, wherein a hollow area is arranged in the middle of the mask plate body, a shielding part is arranged on the mask plate body close to the hollow area, a convex supporting block and a limiting block are respectively arranged on the surface of one side of the mask plate body, and the supporting block is positioned between the limiting block and the shielding part.

According to the specific embodiment of the invention, when the mask is located at the first position, the limit block is used for being in clamping fit with the mask module.

According to a specific embodiment of the present invention, when the mask is located at the second position, the supporting block is used for abutting against one side of the laser lift-off platform, where the display panel to be processed is disposed, and the shielding portion is used for shielding the binding region of the display panel to be processed, which is disposed on the laser lift-off platform.

According to a specific embodiment of the present invention, the mask module includes: the transverse driving mechanism is used for driving the limiting groove to move; the limiting groove is provided with a third position far away from the laser stripping platform, and is driven by the transverse driving mechanism to move from the third position to a fourth position close to the laser stripping platform, and when the limiting groove is located at the fourth position, the limiting groove and the limiting block are arranged oppositely.

According to a specific embodiment of the present invention, the laser lift-off platform has a fifth position close to the mask module and has a sixth position remote from the mask module.

In another aspect of the present invention, the present invention provides a method of manufacturing a display panel using the display panel manufacturing apparatus described above, the manufacturing method including the steps of: providing a display panel to be processed, wherein the display panel to be processed comprises a display area and a binding area arranged at the edge of the display area; arranging the display surface to be processed on the laser stripping platform; shielding the binding region by using the mask; and carrying out laser stripping treatment on the display area in the display panel to be treated.

According to the specific embodiment of the present invention, the step of shielding the bonding area by using a mask includes: moving the laser lift-off platform to be below a mask module; lifting the laser stripping platform to enable the mask to be abutted against the laser stripping platform so that the mask is located at a second position for shielding the binding region; and driving the mask module to move to a third position far away from the laser stripping platform, and moving the laser stripping platform so as to enable the mask plate and the display panel to be processed to move to the laser stripping position.

According to a specific embodiment of the present invention, after the step of performing the laser lift-off process on the display area in the display panel to be processed, the method further includes: moving the laser stripping platform, and moving the display panel to be processed and the mask plate which are subjected to laser stripping processing to the position above the mask module; driving a mask module to move to a fourth position close to the laser stripping platform so that the mask module and the mask plate are oppositely arranged; and lowering the laser stripping platform to enable the mask plate to return to the first position fixedly arranged with the mask module.

According to the display panel manufacturing equipment, the binding region in the display panel to be processed is shielded through the mask, the display region in the display panel to be processed after shielding operation is subjected to laser stripping processing, the binding region in the display panel to be processed is protected through the shielding operation of the mask, and the yield of the finally obtained display panel is improved.

Drawings

FIG. 1 is a schematic view of a display panel to be processed;

FIG. 2 is a top view of a mask blocking a display panel to be processed;

FIG. 3 is a schematic diagram of a display panel manufacturing apparatus;

FIG. 4 is a schematic illustration of the laser lift-off platform rising;

FIG. 5 is a schematic view of the lateral drive mechanism driving the retaining groove from the fourth position to the third position;

FIG. 6 is a schematic illustration of the laser lift off platform descending;

FIG. 7 is a flowchart illustrating a method for fabricating a display panel according to an embodiment of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				21	Display area	22	Chip on film
23	Printed circuit board	31	Mask plate
				41	Transverse driving mechanism	42	Limiting block
43	Shielding part	44	Limiting groove
				45	Supporting block	46	Binding region
48	Laser lift-off platform

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 to 6, the present invention provides a display panel manufacturing apparatus including a laser lift-off stage 48, a mask module, and a mask 31.

The laser stripping platform 48 is used for bearing a display panel to be processed; the mask module is arranged at the edge of the laser stripping platform 48; the mask 31 has a first position fixedly disposed with the mask module and a second position blocking the bonding area 46 of the display panel to be processed.

The display panel to be processed comprises a display area and a binding area arranged at the edge of the display area, wherein the binding area is provided with at least one of a printed circuit board and a chip on film. Specifically, referring to fig. 1, fig. 1 is a schematic diagram of a display panel to be processed, one end of a chip on film 22 is bound with a display area 21 of the display panel to be processed, the other end is bound with a printed circuit board 23, and the printed circuit board 23 and the chip on film 21 are only bound around the display panel to form a binding area 46 of the display panel to be processed.

The display panel manufacturing equipment can drive the laser stripping platform 48 to move up, down, left and right, the operation of shielding the mask plate 31 above the binding area 46 of the display panel to be processed is completed through movement, the operation of moving the mask plate 31 and the display panel to be processed to a preset laser stripping position is completed, and the operation of placing the mask plate 31 back into the mask module is completed.

As shown in fig. 3, the mask module includes a lateral driving mechanism 41 and a limiting groove 44, the lateral driving mechanism 41 is connected with the limiting groove 44, the lateral driving mechanism 41 is used for driving the limiting groove 44 to move, the limiting groove 44 has a third position far away from the laser peeling platform 48, and moves from the third position to a fourth position close to the laser peeling platform 48 under the driving of the lateral driving mechanism 41, when the limiting groove 44 is located at the fourth position, the limiting groove 44 is opposite to the limiting block 42; it should be noted that the opposite fingers may be arranged such that when the mask module is located at the fourth position, that is, the limiting groove 44 is located at the fourth position, the limiting block located in the mask 31 on the laser lift-off platform 48 is not clamped with the limiting groove 44, but is located above the limiting groove 44, or when the mask module is located at the fourth position, that is, when the limiting groove 44 is located at the fourth position, the limiting block located in the mask 31 on the laser lift-off platform 48 is clamped with the limiting groove 44; the mask module at least comprises two transverse driving mechanisms 41 and two limiting grooves 44, and when all the transverse driving mechanisms 41 receive a driving command, the corresponding limiting grooves 44 are driven to move simultaneously.

As shown in fig. 2 and 3, the reticle 31 includes: the mask version body, mask version body middle have the fretwork region, and mask version body is close to the fretwork region and has shielding part 43, and the surface of mask version body one side has convex supporting shoe 45 and stopper 42 respectively, and supporting shoe 45 is located between stopper 42 and shielding part 43.

As shown in fig. 3, the mask 31 includes a limiting block 42, a supporting block 45 and a shielding portion 43 which are connected in sequence, the limiting block 42 is in a shape of a chamfered table, the supporting block 45 is a rectangular block, the shielding portion 43 is in a shape of a rectangular block with a hollow middle portion, the limiting block 42 is used for being in clamping fit with the mask, the supporting block 45 is used for being abutted against one side of the laser peeling platform 48 where the display panel to be processed is arranged, and the shielding portion 43 is used for shielding a binding region 46 of the display panel to be processed, which is arranged on the laser peeling platform 48;

further, the mask 31 has a first position fixedly arranged with the mask module, when the mask is located at the first position, the limiting block 42 in the mask is clamped with the limiting groove 44 in the mask module, the mask 31 is arranged opposite to the laser stripping platform 48, and at this time, the mask 31 is not abutted to the laser stripping platform 48;

further, when the mask 31 is located at the first position, two limiting grooves 44 in the mask module are located below the limiting blocks 42 in the mask 31, and the limiting grooves 44 are clamped with the limiting blocks 42, so that the mask 31 is fixed above the mask module, and at this time, the limiting grooves 44 of the mask module are located at the fourth position;

further, as shown in fig. 4, the mask 31 further has a second position that moves from the first position to a position separated from the mask module under the driving of the laser lift-off platform 48, when the mask 31 is located at the second position, the supporting block 45 in the mask 31 abuts against one side of the laser lift-off platform 48 where the display panel to be processed is disposed, and the blocking portion 43 in the mask 31 blocks the binding region 46 of the display panel to be processed disposed on the laser lift-off platform 48; when the mask 31 is at the second position, the limiting groove 44 in the mask module is at a third position far away from the laser lift-off platform 48.

Referring to fig. 2, fig. 2 is a top view of the mask 31 shielding the display panel to be processed, and the display panel manufacturing apparatus shields the mask 31 above the bonding region 46 of the display panel to be processed.

Referring to fig. 3, fig. 3 is a schematic diagram of a display panel manufacturing apparatus, which includes a mask module, a mask 31 and a laser lift-off platform 48, wherein the mask module includes: a limit groove 44 and a transverse driving mechanism 41; the mask includes: the limiting block 42, the supporting block 45 and the shielding part 43, wherein the limiting block 42 is in the shape of a chamfered table, the supporting block 45 is a rectangular block, and the shielding part 43 is in the shape of a rectangular plate with a hollow middle part; the shielding part 43 is used for covering the upper part of the printed circuit board 23 and the chip on film 22, namely the upper part of the binding area 46 of the display panel to be processed, and shielding laser from the printed circuit board 23 and the chip on film 22 so as to avoid laser irradiation; the supporting block 45 is used for stabilizing and supporting the mask 31 when the mask 31 moves along with the laser stripping platform 48; the limiting block 42 is used for being clamped with the limiting groove 44, so that when the laser stripping platform 48 is lifted, the mask 31 can be accurately shielded above the binding area 46 of the display panel to be processed, and the mask 31 and the laser stripping platform 48 can be separated after the laser stripping processing is completed.

In particular, as shown in fig. 5, the laser lift off platform has a fifth position close to the mask module, and as shown in fig. 6, the laser lift off platform has a sixth position remote from said mask module.

Referring to fig. 4-6, fig. 4 shows that when the laser lift-off platform 48 is lifted, the mask 31 originally fixed at the first position on the limiting groove is lifted together, so that the mask 31 abuts against the second position on the laser lift-off platform 48; fig. 5 shows that the display panel manufacturing apparatus drives the limiting groove 44 to move outward by using the transverse driving mechanism 41 in the mask module, and moves from the fourth position to the third position, so that the limiting block 42 in the mask 31 is not clamped by the limiting groove 44 when the laser lift-off platform 48 descends; fig. 7 represents a step of moving the reticle 31 and the display panel to be processed to a predetermined laser lift-off position to perform the laser lift-off process by lowering the laser lift-off stage 48 to move below the mask module. It should be noted that, after the display panel to be processed is subjected to the laser lift-off process, the step sequence of returning the mask to the first position by the laser lift-off platform 48 is from fig. 6 to fig. 4, as shown in fig. 6, the laser lift-off platform 48 is moved to the lower side of the mask module, as shown in fig. 6, the laser lift-off platform 48 is lifted to the upper side of the limiting groove 44 in the mask module, as shown in fig. 4, finally, the limiting groove 44 is moved to the lower side of the limiting block 42 in the mask 31 by the transverse driving mechanism 41 of the mask module, and then, the mask 31 can be returned to the first position fixedly set with the mask module by lowering the laser lift-off platform 48.

According to the display panel manufacturing equipment, the binding region in the display panel to be processed is shielded through the mask, the display region in the display panel to be processed after shielding operation is subjected to laser stripping processing, the binding region in the display panel to be processed is protected through the shielding operation of the mask, and the yield of the finally obtained display panel is improved.

On the basis of the display panel manufacturing equipment, the embodiment of the display panel manufacturing method is provided;

referring to fig. 7, fig. 7 is a schematic flow chart of an embodiment of a method for manufacturing a display panel according to the present invention, the method including:

step S10, providing a display panel to be processed, wherein the display panel to be processed comprises a display area and a binding area arranged at the edge of the display area;

step S20, arranging the display surface to be processed on the laser stripping platform;

step S30, shielding the binding area by using the mask;

step S40, performing laser lift-off processing on the display area in the display panel to be processed.

The display panel manufacturing method is applied to display panel manufacturing equipment of a display panel production mechanism, the display panel manufacturing equipment can be a terminal or PC equipment, and for convenience in description, the display panel manufacturing equipment is taken as an example for description; display panel preparation equipment provides including the display area and sets up through the material loading district the pending display panel in the binding district at display area edge, with pending display panel setting on laser peeling platform to strip the platform through removing the laser, with originally fixing the mask version on the mask module and low-lying on laser peeling platform, and make the mask version shelter from the binding district among the pending display panel on laser peeling platform, rethread removes the mask module, makes the mask version can follow the laser peeling platform removes to predetermineeing laser and strips the position, carries out laser to the display area in the pending display panel and strips the processing, rethread removes laser peeling platform and removes the mask module, makes the mask version fix on the mask module again. It should be noted that the bonding area in the display panel to be processed is provided with at least one of a Printed Circuit Board (PCB) and a Chip On Film (COF), where the PCB (printed Circuit board) is also called a printed Circuit board, and is an important electronic component, a support of the electronic component, a carrier for electrical interconnection of the electronic component, and a COF (Chip On Flex, or, Chip On Film), which is commonly called a Chip On Film, which is a technology for packaging a Chip and a flexible printed Circuit board (COF) that fixes an Integrated Circuit (IC) On a flexible printed Circuit board, and a flexible additional Circuit board is used as a carrier for packaging the Chip to combine the Chip with a flexible substrate Circuit, or a flexible additional Circuit board for a single-finger non-packaged Chip. The display area in the display panel to be processed comprises a carrier substrate, a flexible substrate and a display function layer which are sequentially stacked.

The display panel manufacturing method of the embodiment provides a display panel to be processed, wherein the display panel to be processed comprises a display area and a binding area arranged at the edge of the display area; arranging a display surface to be processed on a laser stripping platform; shielding the binding region by using a mask; and carrying out laser lift-off treatment on the display area in the display panel to be treated. According to the invention, the binding region in the display panel to be processed is shielded through the mask plate, the display region in the display panel to be processed after shielding operation is subjected to laser stripping treatment, the binding region in the display panel to be processed is protected through the shielding operation of the mask plate, and the yield of the finally obtained display panel is further improved.

The respective steps will be described in detail below:

step S10, providing a display panel to be processed, wherein the display panel to be processed comprises a display area and a binding area arranged at the edge of the display area;

in this embodiment, when the display panel manufacturing apparatus detects a start instruction, after a series of preparation operations are performed on the display panel to be processed, the display panel to be processed is provided for the display panel manufacturing apparatus through the loading area, the display panel to be processed includes a display area and a binding area arranged at an edge of the display area, the binding area is provided with at least one of a printed circuit board and a chip on film, that is, the binding area can be provided with the printed circuit board and the chip on film at the same time, or with one of the printed circuit board and the chip on film, and if the printed circuit board and the chip on film in the binding area are directly irradiated by strong laser, components on the printed circuit board and integrated circuits on the chip on film can be damaged, resulting in disorder display of the display panel.

Step S20, arranging the display surface to be processed on the laser stripping platform;

in this embodiment, the display panel manufacturing apparatus sets and fixes the display panel to be processed on the laser lift-off platform.

Step S30, shielding the binding area by using a mask;

in this embodiment, the display panel manufacturing apparatus moves the laser lift-off platform upward, so that the mask originally fixed on the mask module is abutted to the laser lift-off platform through the supporting block in the mask, the shielding portion in the mask shields the binding region in the display panel to be processed,

specifically, step S30 further includes:

step a, moving the laser stripping platform to the position below a mask module;

in the step, after the display panel to be processed is arranged on the laser stripping platform by the display panel manufacturing equipment, the laser stripping platform is moved to a position below the mask module, and the position is located right below the mask module, so that when the laser stripping platform is lifted, the laser stripping platform can be accurately abutted to the mask.

B, lifting the laser stripping platform to enable the mask to be abutted against the laser stripping platform so as to enable the mask to be located at a second position for shielding the binding region;

in the step, the display panel manufacturing equipment lifts the laser stripping platform located below the mask module, so that a supporting block in a mask fixed on the mask module is abutted against the laser stripping platform to enable the mask to be located at a second position for shielding the binding area, and at the moment, a shielding part in the mask is located above the binding area in the display panel to be processed to shield the binding area in the display panel to be processed on the laser stripping platform; it should be noted that, the binding region is located at the edge of the display panel to be processed, rather than inside the display panel to be processed; the mask version body is provided with a hollow area in the middle, the mask version body is provided with a shielding part close to the hollow area, the surface of one side of the mask version body is respectively provided with a convex supporting block and a limiting block, the supporting block is positioned between the limiting block and the shielding part, the supporting block is used for being abutted against the laser stripping platform, so that the shielding part and the surface of the laser stripping platform form a certain space interval, the shielding part can be shielded above a binding area in a display panel to be processed and can not be directly pressed above the binding area, the printed circuit board and the chip on film in the binding area can be protected in a non-contact mode, the shielding part is in a rectangular plate block with the hollow middle, the hollow middle is hollowed out, so that the display area in the display panel to be processed can be irradiated by laser, the part which is not hollowed out is shielded above the binding area in the display panel to be processed, and the printed circuit board and the chip on film in the binding area can be prevented from being irradiated by laser, thereby protecting the printed circuit board and the chip on film in the binding region.

And c, driving a mask module to move to a third position far away from the laser stripping platform, and moving the laser stripping platform to enable the mask plate and the display panel to be processed to move to the laser stripping position.

In the step, the display panel manufacturing equipment drives the limiting groove in the mask module to move to a third position far away from the laser stripping platform by driving the transverse driving mechanism in the mask module, so that the limiting groove in the mask module cannot limit the mask plate to move along with the laser stripping platform, and the laser stripping platform is moved, so that the mask plate on the laser stripping platform and the display panel to be processed move to the laser stripping position; the display panel manufacturing equipment lowers the laser stripping platform, and the mask plate can leave the first position fixedly arranged with the mask module along with the laser stripping platform; it should be noted that the third position is a position where the mask module moves away from the laser platform, and at this time, the limiting groove in the mask module also moves away from the limiting block in the mask plate, so that the mask plate is not hindered by the limiting groove when moving downward along with the laser lift-off platform; the first position is the position of the mask plate on the mask module when the mask plate is static, and the limiting block in the mask plate is clamped with the limiting groove in the mask module at the moment.

Step S40, performing laser lift-off processing on the display area in the display panel to be processed.

In the embodiment, the display panel manufacturing apparatus performs laser lift-off processing on a display area in the display panel to be processed, which is moved to the laser lift-off processing position; it should be noted that, the laser lift-off treatment requires the use of laser with the shortest wavelength (the laser with the wavelength of 308nm and 248nm is commonly used in the laser lift-off process), and since the excimer laser has the characteristics of short wavelength, high energy and high power, when the laser lift-off treatment is performed, the excimer laser is used for performing the laser lift-off treatment, and in addition to the laser with the above wavelength, the laser with different wavelengths can be used for performing the laser lift-off treatment according to specific situations; the method for carrying out laser lift-off operation on the display area in the display panel to be processed comprises the following steps: the interface between a carrier substrate (such as glass) and a flexible substrate (such as polyimide) is scanned by laser to break the adhesive force between the carrier substrate and the flexible substrate, and then the carrier substrate is removed through peeling treatment to form the flexible display panel (comprising the flexible substrate and the display function layer).

Further, step S40 is followed by:

d, moving the laser stripping platform, and moving the display panel to be processed and the mask plate which are subjected to laser stripping processing to the position above the mask module;

in the step, after the laser stripping treatment is carried out on the display panel to be treated, the display panel manufacturing equipment moves the laser stripping platform, the display panel to be treated and the mask plate which are subjected to the laser stripping treatment on the laser platform are moved to the position above the mask module, the limiting block in the mask plate is located on the motion track of the mask module at the moment, and when the limiting groove in the subsequent driving mask module moves towards the direction close to the laser stripping platform, the movement of the limiting groove is not hindered.

Step e, driving a mask module to move to a fourth position close to the laser stripping platform so as to enable the mask module to be arranged opposite to the mask plate;

in the step, the display panel manufacturing equipment drives the limiting groove in the mask module to move to a fourth position close to the laser stripping platform through the transverse driving mechanism in the mask module, so that the limiting groove in the mask module and the mask on the laser stripping platform are arranged oppositely, and the limiting block in the mask is located right above the limiting groove in the mask module at the moment or is clamped with the limiting groove in the mask module.

And f, lowering the laser stripping platform to enable the mask plate to return to the first position fixedly arranged with the mask module.

In this step, the display panel manufacturing apparatus lowers the laser lift-off platform, one case being: at the moment, the mask still descends along with the laser stripping platform, when the limiting block in the mask is clamped with the limiting groove in the mask module, the mask is fixed on the limiting groove of the mask module, the laser stripping platform descends continuously, the mask is convenient to separate, and the mask returns to the first position; the other situation is as follows: the limiting blocks in the mask plate are clamped with the limiting grooves in the mask module, and the laser stripping platform is directly reduced by the display panel manufacturing equipment at the moment.

The display panel manufacturing equipment of the embodiment provides a display panel to be processed comprising a display area and a binding area arranged at the edge of the display area through a feeding area, the display panel to be processed is arranged on a laser stripping platform, a mask originally fixed on a mask module is connected to the laser stripping platform in a low-pressure mode through moving the laser stripping platform, the mask shields the binding area in the display panel to be processed on the laser stripping platform, the mask can move to a preset laser stripping position along with the laser stripping platform through moving the mask module, the display area in the display panel to be processed is subjected to laser stripping treatment, the mask is fixed on the mask module again through moving the laser stripping platform and the mask module, and then the laser is prevented from irradiating a printed circuit board and/or a flip chip film in the binding area, the yield of the finally obtained display panel is improved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.

The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.