阅读说明：本技术 一种宽幅打印头拼接封装方法及宽幅打印头封装结构 (Splicing and packaging method for wide printing head and wide printing head packaging structure ) 是由 王伟 徐飞 张华� 付伟欣 于 2020-05-27 设计创作，主要内容包括：本发明提供一种宽幅打印头拼接封装方法及宽幅打印头封装结构,该方法包括以下步骤：提供一基座；将至少两个打印头芯片沿X方向依次粘贴于基座上表面不同位置,其中,后一步粘贴的打印头芯片与前一步粘贴的打印头芯片在Y方向上至少有一部分重合,X方向与Y方向均平行于基座的上表面,且X方向与Y方向相互垂直。本发明将多个打印头芯片全部贴装在一个基座上,可以降低相对位置偏差,提高水平度,通过增加预固化步骤并选择与芯片CTE系数更为接近的基座,可以进一步改善位置偏差和水平度。并且相对于传统将每个打印头芯片分别贴在不同的小基座上然后再组装的方案,本发明将多个打印头芯片全部贴装在一个基座上的封装方案效率更高,成本更低。(The invention provides a splicing and packaging method of a wide printing head and a packaging structure of the wide printing head, wherein the method comprises the following steps: providing a base; and at least two printing head chips are sequentially adhered to different positions of the upper surface of the base along the X direction, wherein at least one part of the printing head chip adhered in the next step is overlapped with at least one part of the printing head chip adhered in the previous step in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are mutually vertical. The invention mounts a plurality of print head chips on a base, reduces relative position deviation, improves levelness, and further improves position deviation and levelness by adding a pre-curing step and selecting a base with a coefficient closer to the CTE of the chip. Compared with the traditional scheme that each printing head chip is respectively attached to different small bases and then assembled, the packaging scheme that the plurality of printing head chips are all attached to one base is higher in efficiency and lower in cost.)

1. A splicing and packaging method for a wide printing head is characterized by comprising the following steps:

providing a base;

the printing method comprises the following steps of sequentially pasting at least two printing head chips on different positions of the upper surface of a base along the X direction, wherein at least one part of the printing head chip pasted in the next step is overlapped with at least one part of the printing head chip pasted in the previous step in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are perpendicular to each other.

2. The wide format print head splice packaging method of claim 1, wherein: and the printing head chip is adhered to the upper surface of the base through glue.

3. The wide format printhead splice packaging method of claim 2, wherein: the method further comprises the step of performing a thermal curing process to cure the glue between the printhead chip and the base.

4. The wide format print head splice packaging method of claim 3, wherein: the glue comprises a UV thermosetting glue, and before the step of thermally curing, the method further comprises the step of turning on a UV lamp to pre-cure the glue between the printing head chip and the base.

5. The wide format printhead die attach packaging method of claim 4, wherein attaching the printhead die to the upper surface of the base comprises:

glue is spot-coated at a preset position on the upper surface of the base;

and adsorbing the printing head chip by using a suction device, pressing the printing head chip to a preset position on the upper surface of the base, and starting to execute the step of pre-curing while the suction device presses the printing head chip to the upper surface of the base.

6. The wide format print head splice packaging method of claim 1, wherein: the printing head chip is electrically connected with the flexible circuit board, and the flexible circuit board is provided with an external circuit interface.

7. The wide format print head splice packaging method of claim 6, wherein: the flexible circuit board is adhered to the upper surface of the base through double-sided adhesive tape or glue.

8. The wide format print head splice packaging method of claim 6, wherein: different printing head chips are respectively and electrically connected with the independent flexible circuit board, or at least two printing head chips share one flexible circuit board.

9. The wide format print head splice packaging method of claim 6, wherein: and electrically connecting the printing head chip with the flexible circuit board in a routing mode or a bonding pad hot-pressing bonding mode.

10. The wide format print head splice packaging method of claim 1, wherein: the base is made of at least one of ceramic, stainless steel and plastic.

11. A broad width printing head packaging structure is characterized in that: the method comprises the following steps:

a base seat, a plurality of fixing holes and a plurality of fixing holes,

at least two print head chips are sequentially pasted on different positions of the upper surface of the base along the X direction, at least one part of each of the adjacent two print head chips is overlapped in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular.

12. The wide format printhead package structure of claim 11, wherein: and the printing head chip and the base are bonded by adopting UV thermosetting glue.

13. The wide format printhead package structure of claim 11, wherein: the wide printing head packaging structure further comprises a flexible circuit board, the flexible circuit board is adhered to the upper surface of the base, the printing head chip is electrically connected with the flexible circuit board, and the flexible circuit board is provided with an external circuit interface.

14. The wide format printhead package structure of claim 13, wherein: different printing head chips are respectively and electrically connected with the independent flexible circuit board, or at least two printing head chips share one flexible circuit board.

15. The wide format printhead package structure of claim 11, wherein: the base is made of at least one of ceramic, stainless steel and plastic.

Technical Field

The invention belongs to the field of industrial and consumer printing, and relates to a splicing and packaging method of a wide printing head and a packaging structure of the wide printing head.

Background

In recent years, with the progress of wide-format inkjet printing technology, the market of wide-format inkjet printing is rapidly developing, and the wide-format inkjet printing becomes an important technology in the fields of industrial printing and consumer printing. The demand of wide-format ink-jet printing in the application fields of advertisement, decoration, textile digital printing and the like is greatly increased. The wide printing needs to realize the wide printing by splicing and mounting the printing head chips, and the traditional packaging and splicing scheme is that the chips are firstly mounted on a module with a soft plate, and then the module is spliced and mounted to assemble the wide printing head. The wide splicing requires that the relative deviation of the spacing positions between the nozzles of the functional regions of the chip is smaller and better, otherwise, the printing effect of the splicing region is affected. However, the modules are spliced by using a clamp jig alignment scheme, and the relative position error and the levelness error between the chips are large. Due to the reason, the width printing chips are not accurately spliced, the printing effect is not ideal, and other subsequent software and hardware are needed for calibration, so that the wide printing production efficiency and the printing effect are limited.

Therefore, how to realize chip and chip high accuracy subsides dress, realize high-efficient, high accurate counterpoint with the relative position of function chip, realize that the wide width beats printer head chip seamless concatenation and levelness unanimously, let print quality seamless, become the important technical problem that the skilled person in the art needs a urgent need to solve.

Disclosure of Invention

In view of the above disadvantages of the prior art, an object of the present invention is to provide a method for splicing and packaging a wide print head and a structure for packaging a wide print head, which are used to solve the problems of poor printing effect and low production efficiency of wide print products in the prior art.

In order to achieve the above and other related objects, the present invention provides a method for splicing and packaging a wide print head, comprising the steps of:

providing a base;

the printing method comprises the following steps of sequentially pasting at least two printing head chips on different positions of the upper surface of a base along the X direction, wherein at least one part of the printing head chip pasted in the next step is overlapped with at least one part of the printing head chip pasted in the previous step in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are perpendicular to each other.

Optionally, the printhead die is affixed to the upper surface of the base by glue.

Optionally, a step of performing a thermal curing process to cure the glue between the printhead chip and the base is further included.

Optionally, the glue comprises a UV thermosetting glue, and before the thermal curing step, the method further comprises the step of turning on a UV lamp to pre-cure the glue between the print head chip and the base.

Optionally, the attaching the printhead chip to the upper surface of the base includes:

glue is spot-coated at a preset position on the upper surface of the base;

and adsorbing the printing head chip by using a suction device, pressing the printing head chip to a preset position on the upper surface of the base, and starting to execute the step of pre-curing while the suction device presses the printing head chip to the upper surface of the base.

Optionally, the method further includes the step of attaching a flexible circuit board to the upper surface of the base, and electrically connecting the print head chip and the flexible circuit board, where the flexible circuit board is provided with an external circuit interface.

Optionally, the flexible circuit board is adhered to the upper surface of the base through double-sided adhesive tape or glue.

Optionally, different printhead chips are electrically connected to the independent flexible printed circuit boards respectively, or at least two printhead chips share one flexible printed circuit board.

Optionally, the printhead chip is electrically connected to the flexible circuit board by a wire bonding method or a pad thermocompression bonding method.

Optionally, the material of the base includes at least one of ceramic, stainless steel and plastic.

The present invention also provides a wide format printhead package structure, comprising:

a base seat, a plurality of fixing holes and a plurality of fixing holes,

at least two print head chips are sequentially pasted on different positions of the upper surface of the base along the X direction, at least one part of each of the adjacent two print head chips is overlapped in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are mutually perpendicular.

Optionally, the printhead die and the base are bonded using a UV thermoset adhesive.

Optionally, the wide format print head packaging structure further includes a flexible circuit board, the flexible circuit board is adhered to the upper surface of the base, the print head chip is electrically connected to the flexible circuit board, and the flexible circuit board is provided with an external circuit interface.

Optionally, different printhead chips are electrically connected to the independent flexible printed circuit boards respectively, or at least two printhead chips share one flexible printed circuit board.

Optionally, the material of the base includes at least one of ceramic, stainless steel and plastic.

As described above, the wide printing head splicing and packaging method and the wide printing head packaging structure of the present invention completely mount a plurality of printing head chips on one base, and compared with the wide printing head on the market, the relative position deviation of the wide printing head is ± 25 microns, and the relative position horizontal degree deviation is greater than ± 100 microns, the wide printing head packaging structure of the present invention has smaller relative position deviation and better horizontal degree. In addition, the invention can further control the relative position deviation within +/-7 microns by adding a pre-curing step, and can further control the relative position levelness deviation within +/-50 microns by selecting a base with a coefficient closer to the CTE (coefficient of coefficient) of the chip. In addition, compared with the traditional scheme that each print head chip is respectively attached to different small bases and then assembled, the scheme that the plurality of print head chips are all attached to one base is higher in efficiency and lower in cost.

Drawings

Fig. 1 is a top view of a wide format printhead package structure of the present invention.

Fig. 2 is a side view of a wide format printhead package structure of the present invention in one embodiment.

Fig. 3 is a side view of another embodiment of a wide format printhead package structure of the present invention.

Description of the element reference numerals

1 base

2 first printhead chip

3 second printhead chip

4 third printhead chip

5 Flexible printed circuit board

6 external circuit interface

7 connecting wire

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Please refer to fig. 1 to 3. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.

Example one

The embodiment provides a splicing and packaging method for a wide printing head, which comprises the following steps:

s1: providing a base;

s2: the printing method comprises the following steps of sequentially pasting at least two printing head chips on different positions of the upper surface of a base along the X direction, wherein at least one part of the printing head chip pasted in the next step is overlapped with at least one part of the printing head chip pasted in the previous step in the Y direction, the X direction and the Y direction are both parallel to the upper surface of the base, and the X direction and the Y direction are perpendicular to each other.

As an example, referring to fig. 1, three print head chips (a first print head chip 2, a second print head chip 3, and a third print head chip 4) are sequentially attached to different positions on the upper surface of the base 1 along the X direction, wherein at least a part of the print head chip attached in the next step and the print head chip attached in the previous step are overlapped in the Y direction, so as to realize seamless butt joint of the nozzles, and combine to form a wide print head. Among them, the plurality of print head chips are preferably the same type of print head chip.

Of course, the number of the printhead chips in other embodiments may be adjusted according to the requirement, for example, two printhead chips are used for splicing, or more than three printhead chips are used for splicing, and the protection scope of the present invention should not be limited excessively herein.

As an example, the plurality of print head chips are regularly arranged in an AB manner, that is, arranged in a manner of one on top of another in the Y direction, so that on one hand, the space utilization rate can be improved, and on the other hand, the subsequent mounting of the flexible circuit board can be facilitated.

As an example, the print head chip is attached to the upper surface of the base 1 by glue. In this embodiment, glue is first applied to a preset position on the upper surface of the base, and then the printhead chip is adsorbed by the suction device and pressed to the preset position on the upper surface of the base.

It is noted that the present invention is applicable not only to small-sized head chips but also to large-sized head chips. For a larger print head chip, for example, a print head chip with a width in the X direction of 1 inch, a chip mounter on the market may not meet the requirements of absorption and mounting accuracy of this type of chip, and may design a mounting jig related to a custom device through close cooperation with a device supplier.

As an example, a large-size suction nozzle suction chip is customized, a recognition system is optimized, a zoom lens is used for recognizing chip mark (mark) points, the chip is roughly recognized under the condition of a one-time lens, then the system lens is adjusted to a four-time focal length to amplify and recognize the chip mark points, fine recognition is carried out, and the first printing head chip 2 is attached to the specified position of the base 1. Then, the second print head chip 3 is mounted by using the first print head chip 2 as an alignment point and by setting the expected positions of the first print head chip 2 and the second print head chip 3 with identification mark points after glue (for example, epoxy glue) is applied to another specified position of the base 1. After that, the third print head chip 4 is mounted by using the second print head chip 3 as an alignment point in the same manner.

Of course, in other embodiments, the lens magnification of the coarse recognition and the fine recognition can be adjusted according to the requirement, and the scope of the present invention should not be limited too much here.

As an example, after the mounting of three head chips is completed, a heat curing process is further performed to cure the glue between the head chips and the base 1. In this embodiment, the mounted structure is placed in an oven to be baked at a preset temperature, so that the glue is cured, wherein the base 1 is made of a high-temperature baking-resistant plastic base material, including but not limited to polyphenylene sulfide (PPS), which is taken as an example in this embodiment. After the glue is cured, the relative position of the chip is measured, and the integral deviation is about 15 microns. Compared with the wide printing head on the market with the relative position deviation of +/-25 microns, the wide printing head manufactured by the embodiment has the advantage that the relative position deviation is greatly improved.

As an example, a flexible circuit board 5 is further attached to the upper surface of the base 1, and the printhead chip is electrically connected to the flexible circuit board 5, and the flexible circuit board 5 is provided with an external circuit interface 6 for connecting to an external control component.

As an example, the flexible circuit board 5 may be adhered to the upper surface of the base 1 by a double-sided tape or glue, and the printhead chip is electrically connected to the flexible circuit board 5 by a wire bonding method (e.g., the connection line 7 shown in fig. 1) or a pad thermocompression bonding method (e.g., a copper sheet thermocompression bonding).

For example, different print head chips may be electrically connected to the independent flexible printed circuit boards, or at least two print head chips may share one flexible printed circuit board. Fig. 1 shows a case where three print head chips use respective flexible circuit boards.

The product obtained by the splicing and packaging method of the wide printing head can meet the existing wide printing requirement. Compared with the traditional scheme of firstly mounting the printing head on the module and then assembling and splicing the printing head, the scheme has the defects of low precision and poor efficiency, and the product obtained by adopting the method for splicing and packaging the wide printing head has higher printing precision, less modification of a printing system and higher production efficiency, so that the mass production of high-performance wide printing head products becomes possible.

Example two

The present embodiment and the first embodiment adopt the same technical solution, but the difference is that the material of the base is more optimized.

Specifically, the base needs to be cleaned before the printhead chip is mounted, and is pre-baked after the cleaning. When the base adopts a plastic finish piece, the measured data shows that the base generates crying face deformation after being baked, and the deformation amount is about 150 microns. As shown in fig. 2, the printhead chip is a silicon-based material, which has a good rigidity, and the mounting on the deformable substrate causes the chip to be uneven, which affects the accuracy of the position of the chip. A plurality of plastic base materials are selected for testing, and all have warping of different degrees.

In this embodiment, a ceramic material is finally selected as the base in order to achieve a deformation coefficient close to that of the printhead chip material. Wherein, potteryThe CTE (coefficient of thermal expansion) of the porcelain is about 40X 10^-7V. C, and CTE coefficient of silicon 35X 10^-7The/° c are very close. As shown in FIG. 3, the large-sized chip is attached to the ceramic base while maintaining good flatness. After the printing head chip is solidified, the test related position deviation is about +/-11 microns, and the obvious improvement is realized.

Of course, in other embodiments, other materials with CTE close to that of the chip may be selected, such as stainless steel, without unduly limiting the scope of the invention.

EXAMPLE III

The present embodiment and the first embodiment adopt the substantially same technical solution, except that the material of the base is more optimized, and a pre-curing step of glue is added.

Specifically, the printing head chip is bonded by using thermosetting glue, and the selected high-viscosity glue can prevent the chip from moving after being mounted. Experiments show that the position of the chip after being mounted does not obviously move, but when the chip is baked and cured at high temperature by an oven, the viscosity of the glue is reduced at high temperature, and the glue reacts to cause the chip to have small displacement. And evaluating the glues with different viscosities, and still finding that the chip has a displacement phenomenon after being baked.

In this embodiment, the UV thermosetting glue (the UV system raw material is added to the thermosetting glue), compared to the common UV glue that does not need thermosetting, the UV thermosetting glue used in this embodiment is more solvent-resistant, and can be pre-cured by UV.

By way of example, the UV thermosetting glue is an epoxy system UV glue.

Specifically, a UV curing system is customized on mounting equipment, UV thermosetting glue is applied to a designated area of a ceramic substrate, then a printing head chip is sucked and mounted, and a UV lamp is turned on for pre-curing while the printing head chip is pressed down. And after finishing the mounting and the pre-curing of the three chips, moving the product into an oven for high-temperature baking to completely cure the glue. And measuring the relative position of the printing head chip after the completion, and basically achieving the mounting position deviation of +/-7 microns of the design requirement. And actually carrying out measurement and printing test by using the pasted product, wherein the relative position and the levelness of the chip of the product meet the design requirements, and the printing test meets the requirements.

Example four

In this embodiment, referring to fig. 1 and 3, the wide printing head package structure includes a base 1 and at least two printing head chips, in this embodiment, taking three printing head chips as an example, a first printing head chip 2, a second printing head chip 3 and a third printing head chip 4 are sequentially adhered to different positions on the upper surface of the base 1 along an X direction, at least a part of each of the two adjacent printing head chips coincides with each other in a Y direction, the X direction and the Y direction are both parallel to the upper surface of the base 1, and the X direction and the Y direction are perpendicular to each other.

By way of example, the base 1 may be made of materials including, but not limited to, ceramic, stainless steel, or plastic. In this embodiment, ceramic having a CTE (coefficient of thermal expansion) closer to that of silicon is preferably used, which is beneficial to reducing thermal deformation of the base, and further reducing mounting position deviation of the printhead chip.

As an example, the printhead chip and the base are bonded by glue. In this embodiment, preferably, a UV thermosetting adhesive is used for bonding, which can prevent the print head chip from shifting during the baking process after pre-curing, thereby further reducing the mounting position deviation of the print head chip.

As an example, the wide printhead package structure further includes a flexible printed circuit 5, the flexible printed circuit 5 is attached to the upper surface of the base 1, the printhead chip is electrically connected to the flexible printed circuit 5, and the flexible printed circuit 5 is provided with an external circuit interface 6 for connecting with an external control component.

As an example, the flexible circuit board 5 may be attached to the upper surface of the base 1 by a double-sided tape or glue because the attachment accuracy is required to be lower than that of the printhead chip. After the mounting is completed, the flexible circuit board 5 is electrically connected to the printhead chip by a wire bonding method (e.g., the connection wire 7 shown in fig. 1) or a pad thermocompression bonding method (e.g., copper thermocompression bonding).

For example, different print head chips may be electrically connected to the independent flexible printed circuit boards, or at least two print head chips may share one flexible printed circuit board. Fig. 1 shows a case where three print head chips use respective flexible circuit boards.

The packaging structure of the wide printing head has small relative position deviation and higher levelness, so that the printing precision is higher, and the existing wide printing requirement can be met.

In summary, the wide printing head splicing and packaging method and the wide printing head packaging structure of the invention mount the plurality of printing head chips on one base, and compared with the wide printing head on the market, the relative position deviation of the wide printing head is ± 25 microns, and the relative position levelness deviation is larger than ± 100 microns, the wide printing head packaging structure of the invention has smaller relative position deviation and better levelness. In addition, the invention can further control the relative position deviation within +/-7 microns by adding a pre-curing step, and can further control the relative position levelness deviation within +/-50 microns by selecting a base with a coefficient closer to the CTE (coefficient of coefficient) of the chip. In addition, compared with the traditional scheme that each print head chip is respectively attached to different small bases and then assembled, the scheme that the plurality of print head chips are all attached to one base is higher in efficiency and lower in cost. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.