阅读说明：本技术 摄像装置及其连接方法 (Image pickup apparatus and method for connecting the same ) 是由 陈功 许杨柳 李晖 于 2021-09-27 设计创作，主要内容包括：一种摄像装置,包括第一线路板和第二线路板,第一线路板包括陶瓷基板、集成于陶瓷基板的导电线路以及与导电线路连接的第一焊盘,第一焊盘连接于陶瓷基板的侧面,侧面凹陷形成有安装槽,第二线路板包括插接端,插接端设有第二焊盘,插接端安装于安装槽中,第一焊盘与第二焊盘通过焊锡实现连接。本发明的摄像装置的制作工艺简单,有效提升制作效率和摄像装置的可靠性。本发明还涉及一种摄像装置的连接方法。(The utility model provides a camera device, includes first circuit board and second circuit board, and first circuit board includes ceramic substrate, integrated in ceramic substrate's conducting wire and the first pad of being connected with the conducting wire, and first pad is connected in ceramic substrate's side, and the side is sunken to be formed with the mounting groove, and the second circuit board includes the grafting end, and the grafting end is equipped with the second pad, and the grafting end is installed in the mounting groove, and first pad passes through soldering tin with the second pad and realizes being connected. The camera device is simple in manufacturing process, and manufacturing efficiency and reliability of the camera device are effectively improved. The invention also relates to a connecting method of the camera device.)

1. The camera device is characterized by comprising a first circuit board (11) and a second circuit board (12), wherein the first circuit board (11) comprises a ceramic substrate (111), a conductive circuit integrated on the ceramic substrate (111) and a first bonding pad (112) connected with the conductive circuit, the first bonding pad (112) is connected to the side surface of the ceramic substrate (111), a mounting groove (101) is formed in the side surface in a recessed mode, the second circuit board (12) comprises a plug-in end (121), the plug-in end (121) is provided with a second bonding pad (122), the plug-in end (121) is mounted in the mounting groove (101), and the first bonding pad (112) and the second bonding pad (122) are connected through soldering tin.

2. The camera device as claimed in claim 1, wherein the side surface is divided into a first sub-side surface (114) and a second sub-side surface (115) by the mounting groove (101), the first pad (112) is connected to the first sub-side surface (114), the first circuit board (11) further includes a third pad (113) connected to the conductive circuit, the third pad (113) is connected to the second sub-side surface (115), the mating terminal (121) has a first mating surface and a second mating surface opposite to each other, the second pad (122) is disposed on the first mating surface, the mating terminal further includes the fourth pad (123) disposed on the second mating surface, and the third pad (113) and the fourth pad (123) are connected by solder.

3. The camera device according to claim 1 or 2, wherein the mounting groove (101) comprises a first inner wall and a second inner wall, the first inner wall and the second inner wall are arranged oppositely, the first inner wall is provided with a first conductive sheet (13), the first conductive sheet (13) is connected with the first welding pad (112), the second welding pad (122) comprises a first welding part (1221) and a first contact part (1222) which are connected with each other, the first welding pad (112) is connected with the first welding part (1221) through soldering tin, and the first contact part (1222) is in contact with or spaced from the first conductive sheet (13).

4. The imaging apparatus according to claim 3, wherein the second inner wall is provided with a second conductive sheet (14), the second conductive sheet (14) is connected to the third pad (113), the fourth pad includes a second soldering portion (1231) and a second contact portion (1232) connected to each other, the third pad is connected to the second soldering portion (1231) by solder, and the second contact portion (1232) is in contact with or spaced from the second conductive sheet (14).

5. The imaging apparatus according to claim 2, wherein the first wiring board (11) includes a plurality of the first pads (112) and/or a plurality of the third pads (113), the plurality of the first pads (112) are provided at intervals in a width direction of the first sub-side surface (114), and the plurality of the third pads (113) are provided at intervals in a width direction of the second sub-side surface (115).

6. The camera device as claimed in claim 1, wherein the mounting groove (101) comprises a first inner wall and a second inner wall, the first inner wall and the second inner wall are disposed opposite to each other, and a gap between the first inner wall and the second inner wall is greater than a thickness of the insertion end (121).

7. The imaging device according to claim 1, wherein the ceramic substrate (111) and the insertion terminal (121) are fixedly connected by glue.

8. The camera device according to any one of claims 1 to 7, further comprising a camera module (15) and a connector, wherein the first circuit board (11) comprises a mounting surface, the mounting surface is perpendicular to the side surface, the camera module (15) is mounted on the mounting surface, and the connector is connected to an end of the second circuit board (12) away from the mating terminal (121).

9. The image pickup device according to claim 8, wherein the image pickup module (15) further comprises a photosensitive chip (151), the mounting surface is recessed to form a receiving groove, the receiving groove is disposed opposite to the image pickup module (15), and the photosensitive chip (151) is mounted in the receiving groove.

10. A method of connecting an image pickup apparatus, the method comprising the steps of:

electroplating the first pad (112) or/and the third pad (113) on the side surface of the ceramic substrate (111);

electroplating the second pad (122) or/and the fourth pad (123) on the second circuit board (12);

a mounting groove (101) is formed in the side face of a ceramic substrate (111), a second circuit board (12) is inserted into the mounting groove (101), and a first pad (112) and a second pad (122) are welded through a laser solder ball, or/and a third pad (113) and a fourth pad (123) are welded through a laser solder ball.

Technical Field

The present invention relates to the field of camera technologies, and in particular, to a camera device and a connection method thereof.

Background

The existing camera module has two connection modes between a ceramic plate and an FPC (flexible printed circuit), one mode is that a conductive adhesive is added between the ceramic plate and the FPC, and then the ceramic plate and the FPC are conducted by an over-heating process, and the mode needs special equipment and the special conductive adhesive, so that the cost is high, the working efficiency is low, and the connection reliability between the ceramic plate and the FPC is poor; the other type is that the side at the ceramic plate is provided with a groove, the inner wall of the groove is provided with a golden finger, the inserting end of the FPC is provided with the golden finger, the golden finger is provided with an electric contact point, the FPC is inserted into the groove, the golden finger on the inner wall of the groove is electrically connected with the golden finger of the FPC, but the connection mode usually needs interference fit, the FPC is inserted into the groove to be difficult, the FPC is damaged, the ceramic plate and the FPC are easy to fall off in the using process, and the reliability is low.

Disclosure of Invention

In view of this, the manufacturing process of the image pickup device of the present invention is simple, and the manufacturing efficiency and the reliability of the image pickup device are effectively improved.

The utility model provides a camera device, includes first circuit board and second circuit board, first circuit board include ceramic substrate, integrated in ceramic substrate's conducting wire and with the first pad that the conducting wire is connected, first pad connect in ceramic substrate's side, the side is sunken to be formed with the mounting groove, the second circuit board includes the grafting end, the grafting end is equipped with the second pad, the grafting end install in the mounting groove, first pad with the second pad is connected through soldering tin realization.

In the invention, the side face is divided into a first sub-side face and a second sub-side face by the mounting groove, the first pad is connected to the first sub-side face, the first circuit board further comprises a third pad connected with the conductive circuit, the third pad is connected to the second sub-side face, the plugging end comprises a fourth pad and a first plugging face and a second plugging face which are opposite to each other, the second pad is connected to the first plugging face, the fourth pad is connected to the second plugging face, and the third pad and the fourth pad are connected through soldering tin.

In the invention, the mounting groove comprises a first inner wall and a second inner wall, the first inner wall and the second inner wall are arranged oppositely, the first inner wall is provided with a first conducting strip, the first conducting strip is connected with the first welding plate, the second welding plate comprises a first welding part and a first contact part which are mutually connected, the first welding plate is connected with the first welding part through soldering tin, and the first contact part is in contact with or arranged at intervals with the first conducting strip.

In the invention, the second inner wall is provided with a second conductive sheet, the second conductive sheet is connected with the third pad, the fourth pad comprises a second welding part and a second contact part which are connected with each other, the third pad is connected with the second welding part through soldering tin, and the second contact part is in contact with or spaced from the second conductive sheet.

In the present invention, the first circuit board includes a plurality of the first pads and/or a plurality of the third pads, the plurality of the first pads are disposed at intervals in a width direction of the first sub-side surface, and the plurality of the third pads are disposed at intervals in a width direction of the second sub-side surface.

In the invention, the gap between the first inner wall and the second inner wall is larger than the thickness of the inserting end.

In the invention, the ceramic substrate and the insertion end are fixedly connected through glue.

In the invention, the camera device further comprises a camera module and a connector, the first circuit board comprises a mounting surface, the mounting surface is perpendicular to the side surface, the camera module is mounted on the mounting surface, and the connector is connected to one end, far away from the plugging end, of the second circuit board.

In the invention, the camera module further comprises a photosensitive chip, the mounting surface is recessed to form a containing groove, the containing groove is arranged opposite to the camera module, and the photosensitive chip is mounted in the containing groove.

A method of connecting an image pickup apparatus, the method comprising the steps of:

electroplating a first bonding pad or/and a third bonding pad on the side surface of the ceramic substrate;

electroplating a second bonding pad or/and a fourth bonding pad on the second circuit board;

and arranging a mounting groove on the side surface of the ceramic substrate, inserting the second circuit board into the mounting groove, and welding the first bonding pad and the second bonding pad through a laser solder ball, or/and welding the third bonding pad and the fourth bonding pad through a laser solder ball.

The ceramic substrate of the camera device has the characteristic of three-dimensional electroplating, so that the first bonding pad is arranged on the side surface of the ceramic substrate, and the first bonding pad and the second bonding pad are electrically connected through soldering tin, so that the manufacturing efficiency can be improved, the yield can be improved, the phenomenon of short circuit or poor contact of a camera module can be avoided, and the reliability of the camera module can be improved.

Drawings

Fig. 1 is a schematic configuration diagram of an image pickup apparatus according to a first embodiment of the present invention.

Fig. 2 is a partially enlarged view of fig. 1.

Fig. 3 is a schematic top view of the second wiring board according to the first embodiment of the present invention.

Fig. 4 is a schematic cross-sectional structure diagram of an angle of view of the image pickup apparatus according to the first embodiment of the present invention.

Fig. 5 is a schematic cross-sectional structure view of another angle of view of the image pickup apparatus according to the first embodiment of the present invention.

Fig. 6 is a schematic partial cross-sectional structure diagram of the first circuit board and the second circuit board according to the first embodiment of the invention.

Fig. 7 is a schematic partial cross-sectional view of the first circuit board and the second circuit board according to the second embodiment of the invention.

Fig. 8 is a schematic partial cross-sectional view of the first circuit board and the second circuit board according to the third embodiment of the invention.

Fig. 9 is a schematic partial cross-sectional view of a first circuit board and a second circuit board according to a fourth embodiment of the invention.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In order to facilitate understanding of those skilled in the art, the present application provides a specific implementation process of the technical solution provided by the present application through the following embodiments.

First embodiment

Fig. 1 is a schematic structural diagram of an image pickup device according to a first embodiment of the present invention, fig. 2 is a partially enlarged view of fig. 1, fig. 3 is a schematic top-view structural diagram of a second circuit board according to the first embodiment of the present invention, fig. 4 is a schematic cross-sectional structural diagram of a viewing angle of the image pickup device according to the first embodiment of the present invention, fig. 6 is a schematic partial cross-sectional structural diagram of a first circuit board according to the first embodiment of the present invention which is matched with the second circuit board, as shown in fig. 1, fig. 2, fig. 3, fig. 4 and fig. 6, the image pickup device includes a first circuit board 11 and a second circuit board 12, the first circuit board 11 includes a ceramic substrate 111, a conductive trace integrated on the ceramic substrate 111, and a first pad 112 connected to the conductive trace, the first pad 112 is connected to a side surface of the ceramic substrate 111, a mounting groove 101 is formed in a side surface depression, the second circuit board 12 includes a plug terminal 121, the plug terminal 121 is provided with a second pad 122, the inserting end 121 is installed in the mounting groove 101, and the first pad 112 and the second pad 122 are connected by soldering. In this embodiment, the side on which the first pad 112 is mounted is defined as a side surface, a tin melting region (not shown) is disposed between the first pad 112 and the second pad 122, a solder ball is placed in the tin melting region, and the first pad 112 and the second pad 122 are soldered by melting the solder ball with laser to realize the electrical connection between the first pad 112 and the second pad 122, so that the reliability of the connection between the first circuit board 11 and the second circuit board 12 can be increased.

The ceramic substrate 111 of the camera device has the characteristic of three-dimensional electroplating, so that the first bonding pad 112 is arranged on the side surface of the ceramic substrate 111, and the first bonding pad 112 and the second bonding pad 122 are electrically connected through soldering tin, so that the manufacturing efficiency can be improved, the yield can be improved, the phenomenon of short circuit or poor contact of the camera module 15 can be avoided, and the reliability of the camera module 15 can be improved.

Further, the first wiring board 11 includes a plurality of first pads 112, and the plurality of first pads 112 are provided at intervals in the width direction of the side surface.

Further, the mounting groove 101 includes a first inner wall and a second inner wall, the first inner wall and the second inner wall are arranged oppositely, and a gap between the first inner wall and the second inner wall is larger than the thickness of the inserting end 121, so that the inserting end 121 of the second circuit board 12 can be conveniently inserted into the mounting groove 101, and components of the inserting end 121 of the second circuit board 12 are prevented from being damaged in the mounting process. .

Further, the gap between the ceramic substrate 111 and the second circuit board 12 is fixedly connected by glue or adhesive tape, it should be noted that the glue or adhesive tape is only used for fixing the ceramic substrate 111 and the second circuit board 12, and is not a conductive adhesive, so that not only is the cost low, but also the quality of the glue does not affect the electrical connection between the ceramic substrate 111 and the second circuit board 12.

Further, ceramic substrate 111 still includes left surface, right flank and leading flank, and left surface and right flank parallel arrangement, leading flank connect left surface and right flank, and the leading flank is sunken to form mounting groove 101, and mounting groove 101 runs through left surface and right flank.

Fig. 5 is a schematic cross-sectional structure view of another viewing angle of the image pickup apparatus according to the first embodiment of the present invention, and as shown in fig. 1 and 5, the image pickup apparatus further includes an image pickup module 15 and a connector (not shown), the first circuit board 11 includes a mounting surface (not shown), the mounting surface is perpendicular to the side surface, the image pickup module 15 is mounted on the mounting surface, and the connector is connected to an end of the second circuit board 12 away from the mating terminal 121. In this embodiment, the camera module 15 is fixedly connected to the mounting surface through glue; the second circuit board 12 can be electrically connected with an external circuit through a connector; the second circuit board 12 is, for example, a flexible circuit board made of a material such as electrolytic copper or rolled copper, and the second circuit board 12 may be made of a plurality of layers of circuits stacked, but not limited thereto.

Further, the camera module 15 further includes a photosensitive chip 151, the mounting surface is recessed to form a receiving groove (not shown), the receiving groove is disposed opposite to the camera module 15, and the photosensitive chip 151 is mounted in the receiving groove, so that the height of the camera module 15 in the z-axis direction can be reduced (the direction perpendicular to the first circuit board 11 is defined as the z-axis direction). In this embodiment, the photosensitive chip 151 and the first circuit board 11 are electrically connected by gold wires, that is, the photosensitive chip 151 and the conductive wires of the first circuit board 11 are connected.

Furthermore, the camera module 15 further includes a voice coil motor 152, a lens 153, an optical filter 154 and a base 155, the voice coil motor 152 is provided with a first light through hole, the lens 153 is installed in the first light through hole, the base 155 is fixedly connected with the voice coil motor 152, the base 155 is provided with a second light through hole, a bearing table is arranged on a hole wall of the second light through hole, the optical filter 154 is fixedly connected to the bearing table, and the lens 153, the optical filter 154 and the photosensitive chip 151 are located in the same optical axis direction. The camera device may be a common camera device or a micro camera device, and the mobile terminal includes an electronic product such as a mobile phone, a tablet, or a mobile computer, but not limited thereto.

A method for connecting an image pickup apparatus, the method comprising the steps of:

plating a first pad 112 on a side surface of the ceramic substrate 111;

plating the second pads 122 on the second circuit board 12;

a mounting groove 101 is provided on a side surface of the ceramic substrate 111, the second circuit board 12 is inserted into the mounting groove 101, and the first pads 112 and the second pads 122 are soldered by a laser solder ball.

Second embodiment

Fig. 7 is a schematic partial sectional view showing the arrangement of the first circuit board and the second circuit board according to the second embodiment of the present invention, and as shown in fig. 7, the image pickup apparatus of the present embodiment is substantially the same as the image pickup apparatus of the first embodiment, except that the first circuit board and the second circuit board have different structures.

Specifically, the side surface of the mounting groove 101 is divided into a first sub-side surface 114 and a second sub-side surface 115, the first pad 112 is connected to the first sub-side surface 114, the first circuit board 11 further includes a third pad 113 connected to the conductive trace, the third pad 113 is connected to the second sub-side surface 115, the mating terminal 121 includes a fourth pad 123 and opposite first and second mating surfaces, the second pad 122 is connected to the first mating surface, the fourth pad 123 is connected to the second mating surface, and the third pad 113 and the fourth pad 123 are connected by soldering tin. In the present embodiment, the second circuit board 12 includes a first surface 125 and a second surface 126, the first surface 125 is disposed on a side of the second circuit board 12 close to the first sub-side 114, the second surface 126 is disposed on a side of the second circuit board 12 close to the second sub-side 115, the first plug surface is located on the first surface 125, the second pad 122 is connected to the first surface 125, the second plug surface is located on the second surface 126, and the fourth pad 123 is connected to the second surface 126.

A method for connecting an image pickup apparatus, the method comprising the steps of:

electroplating a first pad 112 on the first sub-side 114 of the ceramic substrate 111, and electroplating a third pad 113 on the second sub-side 11;

electroplating the second pads 122 on the first surface 125 of the second circuit board 12, and electroplating the fourth pads 123 on the second surface 126 of the second circuit board 12;

a mounting groove 101 is provided in a side surface of the ceramic substrate 111, the second circuit board 12 is inserted into the mounting groove 101, the first pad 112 and the second pad 122 are bonded by a laser solder ball, and the third pad 113 and the fourth pad 123 are bonded by a laser solder ball.

Third embodiment

Fig. 8 is a schematic partial sectional view showing a configuration of a first circuit board and a second circuit board according to a third embodiment of the present invention, and as shown in fig. 8, the image pickup apparatus of the present embodiment is substantially the same as the image pickup apparatus of the first embodiment, except that the first circuit board and the second circuit board have different configurations.

Specifically, the mounting groove 101 includes a first inner wall and a second inner wall, the first inner wall and the second inner wall are disposed opposite to each other, the first inner wall is provided with a first conductive sheet 13, the first conductive sheet 13 is connected to a first pad 112, the second pad 122 includes a first welding portion 1221 and a first contact portion 1222 connected to each other, the first pad 112 is connected to the first welding portion 1221 through solder, and the first contact portion 1222 is in contact with or spaced from the first conductive sheet 13. In this embodiment, the first inner wall and the second inner wall are flat, the first inner wall is located above the second inner wall along a direction perpendicular to the circuit board, and the distance between the first inner wall and the second inner wall is greater than the thickness of the plugging end 121, so that the plugging end 121 of the second circuit board 12 can be conveniently inserted into the mounting groove 101, and components of the plugging end 121 of the second circuit board 12 are prevented from being damaged in the mounting process.

Further, the first conductive sheet 13 is electrically connected to the conductive traces of the first circuit board 11.

A method for connecting an image pickup apparatus, the method comprising the steps of:

plating a first pad 112 on a side surface of the ceramic substrate 111;

plating the second pads 122 on the second circuit board 12;

a mounting groove 101 is arranged on the side surface of the ceramic substrate 111, and a first conducting strip 13 is arranged on the first inner wall of the mounting groove 101;

the second circuit board 12 is inserted into the mounting groove 101, and the first pads 112 and the second pads 122 are soldered by a laser solder ball.

In another preferred embodiment, the third bonding pad 113 is connected to the second sub-side 115, the fourth bonding pad 123 is connected to the second mating surface, and the third bonding pad 113 and the fourth bonding pad 123 are connected by soldering.

Fourth embodiment

Fig. 9 is a schematic partial sectional view showing a configuration of a first circuit board and a second circuit board according to a fourth embodiment of the present invention, and as shown in fig. 9, the image pickup apparatus according to the present embodiment is substantially the same as the image pickup apparatus according to the third embodiment, except that the first circuit board and the second circuit board have different configurations.

Specifically, the second inner wall is provided with the second conductive sheet 14, the second conductive sheet 14 is connected to the third pad 113, the fourth pad 123 includes a second soldering portion 1231 and a second contact portion 1232 that are connected to each other, the third pad 113 is connected to the second soldering portion 1231 through soldering, and the second contact portion 1232 is in contact with or spaced from the second conductive sheet 14.

Further, the first wiring board 11 includes a plurality of first pads 112 and a plurality of third pads 113, the plurality of first pads 112 are disposed at intervals in the width direction of the first sub-side surface 114, and the plurality of third pads 113 are disposed at intervals in the width direction of the second sub-side surface 115.

A method for connecting an image pickup apparatus, the method comprising the steps of:

electroplating a first pad 112 on the first sub-side 114 of the ceramic substrate 111, and electroplating a third pad 113 on the second sub-side 11;

electroplating the second pads 122 on the first surface 125 of the second circuit board 12, and electroplating the fourth pads 123 on the second surface 126 of the second circuit board 12;

a mounting groove 101 is arranged on the side surface of the ceramic substrate 111, a first conducting strip 13 is arranged on the first inner wall of the mounting groove 101, and a second conducting strip 14 is arranged on the second inner wall of the mounting groove;

the second circuit board 12 is inserted into the mounting groove 101, the first pads 112 and the second pads 122 are soldered by a laser solder ball, and the third pads 113 and the fourth pads 123 are soldered by a laser solder ball.

The present invention is not limited to the specific details of the above-described embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.