阅读说明：本技术 芯片电子零件检查分选装置用的芯片电子零件输送圆盘 (Chip electronic part conveying disc for chip electronic part checking and sorting device ) 是由 林央人 山本哲矢 萩田雅也 于 2021-06-02 设计创作，主要内容包括：本发明涉及一种芯片电子零件检查分选装置用的芯片电子零件输送圆盘。提供一种对于防止在使用芯片电子零件输送圆盘测量芯片电子零件的电气特性时容易产生的测量误差的产生有效的芯片电子零件输送圆盘,所述芯片电子零件输送圆盘以与芯片电子零件检查分选装置的输送圆盘支承台的表面接触的状态安装而旋转移动。作为芯片电子零件输送圆盘,使用在其背面形成有同心圆状的连续凹槽的输送圆盘,所述同心圆状的连续凹槽将以同心圆状形成有多列的芯片电子零件收容用的透孔群的各自内包,或者使用在输送圆盘的背面形成有凹槽的输送圆盘,所述凹槽与在半径方向上形成有多列的芯片电子零件收容用的透孔群的各列并列。(The invention relates to a chip electronic part conveying disc for a chip electronic part checking and sorting device. Provided is a chip electronic component conveying disc which is mounted in a state of contacting with the surface of a conveying disc supporting table of a chip electronic component checking and sorting device and rotates and moves, and is effective for preventing the generation of a measuring error which is easy to generate when the chip electronic component conveying disc is used for measuring the electrical characteristics of the chip electronic component. As the chip electronic component conveying disk, a conveying disk is used in which concentric continuous grooves are formed on the back surface thereof, the concentric continuous grooves containing through-hole groups for chip electronic component accommodation formed in a plurality of rows in a concentric manner, or a conveying disk is used in which grooves are formed on the back surface thereof, the grooves being aligned with the rows of through-hole groups for chip electronic component accommodation formed in a plurality of rows in the radial direction.)

1. A chip electronic component conveying disc is mounted in a state of contacting with the surface of a conveying disc supporting table of a chip electronic component checking and sorting device and rotates, and the chip electronic component checking and sorting device comprises: a conveying disc supporting table for supporting the conveying disc containing and holding the chip electronic component in a vertical or inclined state in a manner of intermittently rotating; the exhaust device is arranged at the back of the conveying disc supporting table; a chip electronic component supply device which is arranged at a position along the rotation path of the conveying disc around the conveying disc supporting table and is used for supplying the chip electronic components to the surface of the conveying disc and accommodating and holding the chip electronic components in the conveying disc; an electrical characteristic measuring device for measuring the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk; a chip electronic component evaluation device connected to the electrical characteristic measurement device; and a chip electronic component recovery device for taking out and recovering the chip electronic component of which the electrical characteristic is measured; the back surface of the conveying disc is provided with concentric circular grooves which respectively enclose a plurality of rows of through hole groups formed in a concentric circle shape.

2. A chip electronic component conveying disc is mounted in a state of contacting with the surface of a conveying disc supporting table of a chip electronic component checking and sorting device and rotates, and the chip electronic component checking and sorting device comprises: a conveying disc supporting table for supporting the conveying disc containing and holding the chip electronic component in a vertical or inclined state in a manner of intermittently rotating; the exhaust device is arranged at the back of the conveying disc supporting table; a chip electronic component supply device which is arranged at a position along the rotation path of the conveying disc around the conveying disc supporting table and is used for supplying the chip electronic components to the surface of the conveying disc and accommodating and holding the chip electronic components in the conveying disc; an electrical characteristic measuring device for measuring the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk; a chip electronic component evaluation device connected to the electrical characteristic measurement device; and a chip electronic component recovery device for taking out and recovering the chip electronic component of which the electrical characteristic is measured; the back surface of the conveying disc is provided with a groove, and the groove is parallel to each row of a plurality of rows of through hole groups formed in the radial direction of the conveying disc.

3. The chip electronic component transfer tray according to claim 2, wherein a ridge portion having a groove is formed at a position adjacent to each through hole on both sides of the groove juxtaposed to the through hole group.

Technical Field

The present invention relates to a conveyor disc (chip electronic component conveyor disc) mounted on a chip electronic component inspection and sorting apparatus used for continuously and rapidly inspecting and sorting electrical characteristics of chip electronic components represented by chip capacitors (also referred to as chip capacitors) which are mass-produced in the same specification.

Background

As the production of small electronic devices such as mobile phones, smart phones, liquid crystal televisions, and electronic game machines has increased, the production of small chip electronic components incorporated in such small electronic devices has increased significantly. Many of the chip electronic components are electronic components having a two-terminal structure including a columnar body portion formed of a ceramic base material and electrode portions provided on both opposite end surfaces of the body portion. Examples of the chip electronic component having such a structure include a chip capacitor (or a chip capacitor), a chip resistor (including a chip varistor), and a chip inductor.

In recent years, chip electronic parts have become very small in response to further miniaturization of electronic devices into which the chip electronic parts are incorporated and an increase in the number of chip electronic parts incorporated into electronic devices. For example, as for chip capacitors, such minute chip electronic parts are produced by mass production in units of several tens to several hundreds of thousands per unit of production at one time, using those having extremely small sizes (for example, a size of 1.6mm × 0.8mm × 0.8mm called 1608, a size of 1.0mm × 0.5mm × 0.5mm called 1005, and a size of 0.4mm × 0.2mm × 0.2m called 0402 chip).

In an electronic device in which chip electronic components are incorporated, in order to prevent the chip electronic components from being defective due to defects of the incorporated chip electronic components, it is common to perform a total number inspection of the incorporated chip electronic components in advance. For example, chip capacitors incorporated in electronic devices are generally inspected for their electrical characteristics such as electrostatic capacitance and leakage current before they are incorporated in electronic devices.

As a device for automatically performing such high-speed inspection, in recent years, an automated device (i.e., a chip electronic component inspection and sorting device) for inspecting and sorting the electrical characteristics of chip electronic components, in which a chip electronic component transfer disk (in some cases, simply referred to as a "transfer disk" or a "rotor") in which a plurality of through holes for housing (temporarily housing) chip electronic components are formed in a plurality of concentric circular rows on a disk surface, is mounted so as to be intermittently rotatable, has been generally used.

Examples of typical configurations of conventionally used chip electronic component inspection and sorting apparatuses are described and shown in patent documents 1 and 2.

As can be understood from the description and illustration of each of the above patent documents, most of the chip electronic component inspection and sorting apparatuses used in the past can be said to be the following apparatuses: the back side of the device is provided with an exhaust device (hereinafter simply referred to as "exhaust device") for sucking air inside the device and exhausting the air to the outside of the device, and the device is provided with: a transport disk support table (also referred to as a reference table or a base plate) that supports a transport disk that holds a chip electronic component while accommodating (temporarily accommodating for inspection) the chip electronic component in a vertical or inclined state so as to be intermittently rotatable; a chip electronic component supply device which is arranged at a position along the rotation path of the conveying disc around the conveying disc supporting table and is used for supplying the chip electronic components to the surface of the conveying disc and accommodating and holding the chip electronic components in the through holes of the conveying disc; an electrical characteristic measuring device for measuring the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk; a chip electronic component evaluation device (or a chip electronic component sorting device) connected to the electrical characteristic measurement device; and a chip electronic component collecting device for taking out and collecting the chip electronic component of which the electrical characteristic is measured from the conveying disc.

When the chip electronic component inspection and sorting device is used, a conveying disc is mounted on the front surface side of a conveying disc supporting table arranged in a vertical or inclined state in the device, the conveying disc is intermittently rotated, chip electronic components are sucked and stored and held in through holes of the conveying disc by an exhaust device arranged behind the conveying disc supporting table, then the conveying disc is rotationally moved to an electrical characteristic inspection part arranged at a position along a rotation path of the conveying disc, and a pair of electrode terminals (inspection contacts) are brought into contact with each electrode of the chip electronic components held by the conveying disc by the electrical characteristic inspection part and electric energy of a predetermined voltage is applied, thereby performing an inspection operation for measuring the electrical characteristics of the chip electronic components. Then, the chip electronic components are evaluated or sorted by an electrical characteristic determination device electrically connected to the inspection contact.

For example, when the electrostatic capacitance of the chip capacitor is inspected, an inspection voltage having a predetermined frequency is applied to the chip capacitor from an inspection device (electrical characteristic measurement device) provided in the chip electronic component inspection and sorting device via an inspection contact by an electrical characteristic inspection unit. Then, the current value of the current generated in the chip capacitor by the application of the inspection voltage is detected by an inspector, and the electrostatic capacitance of the chip capacitor to be inspected is inspected based on the detected current value and the voltage value of the applied inspection voltage.

When the inspection of the chip electronic components stored and held in the conveying disc is finished, the chip electronic components are discharged from the through holes of the conveying disc and sorted based on the inspection result so as to be stored in a predetermined container. Therefore, a chip electronic component sorting unit (sorting field) for sorting (or sorting) the chip electronic components after inspection is further provided in the normal chip electronic component inspection and sorting apparatus. Then, the chip electronic component electrical characteristic inspection and sorting apparatus having such a configuration is commercialized and sold.

Patent document 3 describes a method for inspecting continuity of electrical characteristics of chip electronic components using an improved apparatus for inspecting and sorting chip electronic components described in patent document 1. Fig. 1 of patent document 3 shows an example of a basic structure of a two-terminal chip electronic component, and fig. 4 (a) and 4 (b) show a front surface of a chip electronic component conveying disk and a cross section of a conveying disk support base, respectively. Fig. 4 of patent document 3 shows a chip electronic component transfer disk in which rows of three rows of through holes are formed concentrically on the surface, but at present, a chip electronic component transfer disk in which rows of six or eight rows of through holes are formed on the surface has become mainstream.

Fig. 7, 8, and 9 of patent document 3 show a series of operations of storing and holding the chip electronic components in the through holes of the conveying disk, measuring the electrical characteristics, and finally discharging and collecting the chip electronic components.

Patent document 2 describes a chip electronic component transfer disk as a test board, and the following contents are described from column 9, line 41 to column 10, as descriptions of fig. 5, fig. 6, fig. 8, and fig. 16, which illustrate the structure of a vacuum plate (a support stand for the test board).

Referring again to fig. 5, 6, 8 and 16, a stationary 'vacuum' plate 9 that supports the mounted parts is located below the parts table ring. The vacuum plate is preferably, but not necessarily, a steel ring having a flat upper surface that is chrome-plated to minimize friction between the stationary upper surface and the moving parts and to minimize wear of the vacuum plate. The upper surface of the vacuum plate defines a plurality of annular vacuum paths 11. There is a vacuum path adjacent to and concentric with each part pedestal ring. As illustrated for this embodiment, there are 4 vacuum paths adjacent to each pedestal ring near the center. Since the vacuum path is connected to all the low pressure sources (lower than the other air pressures), the vacuum path passes a partial vacuum to the plurality of connecting paths 13 defined on the bottom surface of the test plate during operation. These bond paths transmit a partial vacuum to the test plate. There are 1 to 1 connection paths communicating with each component base. By this means, the parts are pushed into the table and held there by a partial vacuum in the vacuum path connecting to the table via their respective connecting paths. ".

The technical contents of the above description of patent document 2 are not necessarily clear, but if considered with reference to fig. 5, 6, 8, and 16, it can be understood that: the chip electronic component of the measurement object is conveyed and moves while contacting with the upper surface of the vacuum plate (namely, the conveying disc supporting table); an annular vacuum path is formed on the upper surface of the vacuum plate; a plurality of connecting paths connected to the annular vacuum path are formed on the bottom surface (back surface) of the test board (transport disk), and the connecting paths are connected to a low pressure source provided on the back side of the vacuum board (transport disk support table), so that a partial vacuum is generated in the annular vacuum path.

On the other hand, patent documents 1 and 3 do not disclose or show the structure of the back surface (back surface) of the chip electronic component transfer tray.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2001-26318

Patent document 2: japanese patent No. 3426246 (Japanese patent application laid-open No. corresponding to WO 97/018046)

Patent document 3: japanese patent laid-open publication No. 2015-213121.

Disclosure of Invention

Problems to be solved by the invention

As described above, chip electronic components have been miniaturized to have an extremely small size, and it can be said that the extremely small size has become the mainstream in recent years, but according to the study by the inventors of the present invention, it has been found that in a chip electronic component inspection and sorting device for performing inspection and sorting of such an extremely small chip electronic component, first, a thickness of a transport disk for vertically storing and holding the chip electronic component in a longitudinal direction (longitudinal direction) of a through hole and transporting the chip electronic component needs to be slightly smaller (thinner) than a longitudinal length of the chip electronic component, and thus the transport disk which is thin is easily deformed by a pressure difference of a gas atmosphere (air) in contact with an upper surface and a lower surface of the transport disk.

That is, in the conventional chip electronic component inspection and sorting apparatus, as can be understood from the description of patent document 2 and fig. 3b and 6 of the drawings, the test board (transport disk) is attached to the upper surface side (or front surface side) of the vacuum board (transport disk support) so as to be smoothly rotated and moved while floating with a slight space therebetween, and is rotated and moved in this state.

In addition, since the conveying disc has been conventionally manufactured as a molded article of synthetic resin or a molded article of synthetic resin in which reinforcing fibers are incorporated, the conveying disc having such a small thickness is easily deformed by a pressure difference between air in the space portion on the upper surface side and air in the suction portion on the lower surface side. Therefore, the conveying disk deforms while partially contacting the upper surface of the conveying disk support table, and the conveying disk rotates, so that a trouble is likely to occur in smooth rotation of the conveying disk accommodating and holding the chip electronic component.

The present inventors have conducted studies to solve the above-described problem caused by deformation during the rotational movement of the thin transport disk, and as a result, have found that the problem caused by the deformation of the transport disk can be solved by arranging the transport disk so as to be in direct contact with the surface of the transport disk support table without interposing a space therebetween, and taking a measure to rotate and move the transport disk in contact with the surface of the transport disk support table.

However, this time, a problem of a decrease in the measurement accuracy of the electrical characteristics of the chip electronic component is noted. Then, as a result of further continuing the investigation for finding the cause of the decrease in the measurement accuracy, it was found that the lower surface layer of the transport disk which is rotationally moved in a state of being in contact with the surface of the transport disk support table is partially abraded by the contact with the upper surface of the transport disk support table, thereby generating abrasion powder (resin abrasion powder or the like) which is partially attached to the lower electrode of the chip electronic component to be measured, and becomes a cause of the decrease in the measurement accuracy.

Further, the chip electronic component is accommodated in a through hole (chip electronic component accommodating hole) of the conveying disc in an upright position (that is, is accommodated in a state where electrode portions provided at both ends of the chip electronic component are slightly protruded from each of a front surface side (front surface side) opening portion and a back surface side (back surface side) opening portion of the conveying disc), and is rotated and moved on the surface of the conveying disc support table in this state by intermittent rotation of the conveying disc. Therefore, the electrode portion (lower electrode portion of the chip electronic component) protruding from the opening portion on the back surface of the transport disk rotates while being in contact with the surface of the transport disk support table. Then, by such a contact rotation movement, the lower electrode portion of the chip electronic component is slightly abraded, and abrasion powder of the electrode is also generated. Since the abrasion powder generated in this way is very small and slight, and is an abrasion powder of an electrode material, even if the abrasion powder adheres to an electrode portion of another chip electronic component, it does not become a particularly large problem in measurement of electrical characteristics of a relatively large-sized chip electronic component which has been conventionally measured. However, according to the studies of the inventors of the present invention, it has been found that, particularly in the measurement of the electrical characteristics of extremely fine chip electronic components which have been generally used in recent years, the abrasion powder of the conveyor disk which is a molded product of a resin material and the abrasion powder of the electrode portion of the chip electronic component cause a slight error in the measurement of the electrical characteristics of the chip electronic component if the abrasion powder adheres to the electrode portion of the chip electronic component adjacent to or accommodated in another position.

The inventors of the present invention studied a method for avoiding the reduction in the measurement accuracy of the electrical characteristics of the chip electronic parts due to the generation of the abrasion powder (particularly, abrasion powder of the material of the conveyance disc) described above, and as a result reached the conclusion that it is effective to remove the abrasion powder promptly after the generation thereof for preventing the reduction in the measurement accuracy described above. However, it cannot be said that the development of a method for removing abrasion powder quickly after generation is easy.

Therefore, an object of the present invention is to provide an electronic component inspection and sorting apparatus that is effective in preventing the occurrence of measurement errors in electrical characteristics when inspecting and sorting chip electronic components, particularly when inspecting and sorting minute chip electronic components that have become common in recent years.

Means for solving the problems

The inventors of the present invention have studied means for preventing the occurrence of measurement errors due to the adhesion of abrasion powder generated from a rotating and moving conveyor disc (and from an electrode portion of a chip electronic component) to a chip electronic component to be measured, and as a result, have found that the formation of concentric grooves along both side surfaces of each through hole of a plurality of through hole groups arranged in a concentric manner on the back surface (back surface) of the conveyor disc leads and discharges the abrasion powder immediately after the occurrence thereof to an exhaust mechanism provided behind a conveyor disc support table via the grooves, whereby the adhesion to the chip electronic component to be measured is effectively suppressed, and the occurrence of measurement errors in electrical characteristics can be effectively prevented.

The present inventors have also found that, as a means for preventing the occurrence of a measurement error caused by the adhesion of abrasion powder generated from a rotating and moving conveyor disc (and from an electrode portion of a chip electronic component) to a chip electronic component to be measured, the adhesion of abrasion powder to the chip electronic component to be measured can also be effectively suppressed by forming a concave groove on the back surface (back surface) of the conveyor disc, the concave groove being aligned with each row of a group of through holes formed in a plurality of rows in the radial direction of the conveyor disc, and guiding and discharging the abrasion powder to an exhaust mechanism provided behind a conveyor disc support table via the concave groove immediately after the occurrence of the abrasion powder, thereby preventing the occurrence of a measurement error in electrical characteristics.

Therefore, a first aspect of the present invention is a chip electronic component transfer disk mounted in contact with a transfer disk support table of a chip electronic component inspection and sorting apparatus and rotatably moved, the apparatus including: a conveying disc supporting table for supporting the conveying disc containing and holding the chip electronic component in a vertical or inclined state in a manner of intermittently rotating; the exhaust device is arranged at the back of the conveying disc supporting table; a chip electronic component supply device which is arranged at a position along the rotation path of the conveying disc around the conveying disc supporting table and is used for supplying the chip electronic components to the surface of the conveying disc and accommodating and holding the chip electronic components in the conveying disc; an electrical characteristic measuring device for measuring the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk; a chip electronic component evaluation device connected to the electrical characteristic measurement device; and a chip electronic component recovery device for taking out and recovering the chip electronic component of which the electrical characteristic is measured; the back surface of the conveying disc is provided with concentric circular grooves which enclose a plurality of rows of through-hole groups (chip electronic component accommodating hole groups) formed in concentric circles.

A second aspect of the present invention is a chip electronic component transfer disk mounted in contact with a surface of a transfer disk support table of a chip electronic component inspection and sorting apparatus for rotating and moving, the apparatus comprising: a conveying disc supporting table for supporting the conveying disc containing and holding the chip electronic component in a vertical or inclined state in a manner of intermittently rotating; the exhaust device is arranged at the back of the conveying disc supporting table; a chip electronic component supply device which is arranged at a position along the rotation path of the conveying disc around the conveying disc supporting table and is used for supplying the chip electronic components to the surface of the conveying disc and accommodating and holding the chip electronic components in the conveying disc; an electrical characteristic measuring device for measuring the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk; a chip electronic component evaluation device connected to the electrical characteristic measurement device; and a chip electronic component recovery device for taking out and recovering the chip electronic component of which the electrical characteristic is measured; the rear surface of the conveying disc is formed with a groove, and the groove is juxtaposed with each row of a plurality of rows of through-hole groups (chip electronic component accommodating hole groups) formed in the radial direction of the conveying disc.

In the second chip electronic component transfer disk according to the present invention, preferably, a ridge portion having a groove is formed at a position close to each through hole on both sides of the groove juxtaposed to the group of through holes. Further, the groove juxtaposed with the through-hole group is preferably a groove continuous in the longitudinal direction.

Effects of the invention

Since the abrasion powder of the conveying disk (and the abrasion powder of the electrode of the conveyed chip electronic component) generated by rotating the chip electronic component conveying disk in a state of being in contact with the surface of the conveying disk support table is discharged to the outside of the apparatus via the groove on the back surface of the conveying disk, the suction hole of the conveying disk support table, and the groove immediately after the generation of the abrasion powder, the adhesion of the abrasion powder to the adjacent or nearby chip electronic component is suppressed, and as a result, the occurrence of the measurement error of the electrical characteristics of the chip electronic component can be effectively prevented.

The second chip electronic component transfer disk of the present invention is highly useful as a transfer disk for chip electronic components having a size of 1.0mm × 0.5mm × 0.5mm and smaller, which is called 1005.

Drawings

Fig. 1 to 10 attached to the present specification are views for explaining a conventional technique relating to the present invention, and fig. 11 and 12 are views showing specific examples of a chip electronic component conveying disk according to the present invention.

Fig. 1 is a perspective view showing a structure of a standard chip electronic component.

Fig. 2 is a front view showing an outline of the overall configuration of the chip electronic component inspection and sorting apparatus in which a conveyor disc support table for supporting the rotation of the conveyor disc is vertically arranged.

Fig. 3 is a plan view showing a standard structure of the front surface of the conveyance puck.

Fig. 4 is a plan view showing images of each processing portion of the chip electronic component inspection and sorting apparatus together with the front surface of the mounted conveying disk.

Fig. 5 is a diagram for explaining a process of accommodating the chip electronic component in the through hole of the conveying disk, fig. 5 (a) is a vertical sectional view showing a chip electronic component accommodating portion, and fig. 5 (b) is a vertical sectional view showing a positional relationship between the chip electronic component accommodating portion and the conveying disk. Fig. 5 (c) is a vertical sectional view showing a positional relationship between the transport puck and the transport puck support base, and fig. 5 (d) is a view showing a positional relationship between the transport puck and the partition shelf.

Fig. 6 (a) is a plan view showing the structure of the front surface of the transport disk support table, and fig. 6 (b) is a view showing a state in which chip electronic components are accommodated in the through holes of the transport disk mounted on the transport disk support table.

Fig. 7 is a view showing a process of inspecting the electrical characteristics of the chip electronic component accommodated in the through hole of the conveying disk by the inspection portion.

Fig. 8 is a cross-sectional view showing a process of discharging and collecting the chip electronic component, which has been subjected to the measurement of the electrical characteristics, from the through-holes of the transfer disk.

Fig. 9a is a diagram showing a through-hole row on the front surface (front surface) of a conventional chip electronic component conveying disk (an example in which eight concentric circular through-hole rows are formed), and fig. 9b is a diagram showing an arrangement state of openings on the back surface (reverse side surface) of the chip electronic component conveying disk shown in fig. 9 a.

Fig. 10 (a) is a partially enlarged view of fig. 9 (b), and fig. 10 (b) is an enlarged view of the shape of the opening of the through hole in the back surface of the transport disk. Fig. 10 (c) is a view showing a state in which the chip electronic component is accommodated in the through hole of the transport disk in fig. 10 (b), and fig. 10 (d) is a view showing a positional relationship between the suction hole and the annular groove on the surface of the transport disk support table and the through hole back side opening of the transport disk supported by the transport disk support table.

Fig. 11 (a) is a partially enlarged view of the back surface (reverse side surface) of the first chip electronic component conveyance puck according to the present invention, showing the positional relationship between the openings of the back surface of the through holes and the grooves for discharging the abrasive dust, and fig. 11 (b) is an enlarged view showing the shapes of the openings of the through holes and the grooves on the back surface of the conveyance puck. Fig. 11 (c) is a view schematically showing a state in which the chip electronic component is accommodated in the through-hole of the conveying disc in fig. 11 (b), and fig. 11 (d) is a view showing the arrangement of the conveying disc supported by the conveying disc support table, showing the abrasion powder discharging grooves continuously formed on both side surfaces of each through-hole along the through-hole back surface openings of each row of the conveying disc, and the positional relationship between the ring groove and the suction hole on the surface of the conveying disc support table.

Fig. 12 (a) is a partially enlarged view of the back surface (reverse side surface) of the second chip electronic component conveyance puck according to the present invention, showing the arrangement of the back surface openings of the through holes and the grooves for discharging the abrasive powder, and fig. 12 (b) is an enlarged view showing the shapes of the openings of the through holes in the back surface of the conveyance puck shown in fig. 12 (a). Fig. 12 (c) is a cross-sectional view of the through-holes of the conveyor disc, and fig. 12 (d) is a view for clarifying the positional relationship between the openings on the back side of the through-holes of the conveyor disc supported by the conveyor disc support table and the circular grooves and the suction holes on the surface of the conveyor disc support table.

Detailed Description

First, a structure of a conventional general chip electronic component inspection and sorting apparatus and a chip electronic component transfer tray will be described in brief with reference to fig. 1 to 10 of the drawings.

Fig. 1 is a diagram showing a standard structure of a chip capacitor as a typical example of a chip electronic component to be inspected, and a chip capacitor 1 is configured by a capacitor main body 1a formed of a dielectric and a pair of electrodes (or electrode portions) 1b, 1b provided to face each other at both ends thereof.

Fig. 2 is a front view showing a configuration example of the chip electronic component inspection and sorting apparatus in which a conveyor disc support base for supporting the rotation of the conveyor disc is vertically arranged. In the chip electronic component inspection and sorting apparatus 10 shown in fig. 2, a conveying disk formed in an arrangement in which a plurality of through holes (chip electronic component housing and holding holes) for temporarily housing chip electronic components are concentrically arranged is axially supported by a central shaft 42 provided on a base 41 so as to be intermittently rotatable along a contact surface with a chip electronic part conveying disk support base. The intermittent rotation of the conveyance puck 11 is driven by the rotary drive device 43.

Fig. 3 shows the structure of a standard front surface (front side surface) of the conveyor disk. Through holes 11a for accommodating chip electronic components are formed in a plurality of rows (in recent years, six or eight rows) arranged concentrically on the surface of the conveying disk 11.

As shown in fig. 4, a supply storage portion (supply storage area) 101 for chip electronic components, an inspection portion (inspection area) 102 for electrical characteristics of the chip electronic components, and a sorting portion (sorting area) 103 for the chip electronic components are set in the rotation path of the conveyor disk 11.

The inspection unit 102 includes electrode terminals (contacts) for measuring electrical characteristics at positions close to both openings of the through holes 11a in each row of the conveyor disc 11. The electrode terminals are electrically connected to the testers 14a and 14b, and the testers are connected to the controller 15 to supply signals related to the inspection process to the testers.

The sorting section (sorting field) 103 includes a chip electron discharge tube 62 for guiding the chip electronic components discharged from the through holes 11a of the conveyor disk 11 to the chip electronic component collecting box 64.

As shown in fig. 3, the through holes 11a of the transport disk 11 are generally arranged at positions such that they divide a plurality of concentric circles or the like.

In the chip electronic component inspection and sorting apparatus 10 shown in fig. 2, a total of 6 through holes arranged in the radial direction are provided between the center and the periphery of the conveyor disk 11, and the electrical characteristics of the chip electronic component are inspected for each of the total of 6 chip electronic components accommodated in each of the through holes.

The conveyance disc 11 is rotatably attached to the base 41 via a conveyance disc support base and a center shaft 42, and the conveyance disc 11 intermittently rotates around the center shaft 42 at a predetermined cycle by operating a rotation drive device 43 provided on the back side of the conveyance disc support base.

The chip electronic component 19 to be inspected is accommodated and held in the through hole 11a of the conveying disk 11 by the chip electronic component supply housing unit 101.

That is, the chip electronic component to be inspected, which is supplied from the outside, is loaded into the hopper (hopper) 47, and is supplied to each through hole 11a of the conveying disk 11 through the bucket (bucket) 44 and the chip electronic component accommodating portion 44a as shown in fig. 2, 5 (a), 5 (b), 5 (c), and 5 (d).

Fig. 5 (a) shows the bucket 44, the chip electronic component housing portion 44a, and the partition shelf (chip electronic component conveying shelf) 33 provided inside the chip electronic component housing portion 44 a. Fig. 5 (b) is a vertical sectional view showing a positional relationship between the bucket 44 and the chip electronic component housing portion 44a, and between the partition shelf 33 and the transfer disk 11. Fig. 5 (c) is a vertical cross-sectional view showing a state in which the transport disk 11 is supported in contact with the transport disk support table 45. Fig. 5 (d) is a view of the through hole 11a of the conveyor disk 11 supported by the conveyor disk support table 45 as viewed from the front surface side of the partition shelf 33 of the chip electronic component housing portion 44 a.

The chip electronic component is supplied from the hopper 47 to the bucket 44, but when supplied to the chip electronic component housing portion 44a, a gas flow such as an air flow is introduced from the outside into the housing portion 44a and is ejected, so that the chip electronic component is in a floating state in the chip electronic component housing portion in many cases.

In order to smoothly store the chip electronic component 19 in the conveyor disc 11a, suction holes 45a are formed in the conveyor disc support base 45. The suction hole is connected with an exhaust device.

Fig. 6 (a) is a plan view showing the front surface (front side surface) of the conveyance disc support table 45. Suction holes 45a for maintaining the through holes 11a in a reduced pressure state are concentrically and separately provided in the front surface of the conveying disc support table 45, and grooves (annular grooves) 45b are formed in a concentric manner so as to surround the suction holes 45a connected to the exhaust device. The annular groove 45b has a function of equalizing the pressure reduction state of each suction hole 45 a.

Fig. 6 (b) is a cross-sectional view showing the positional relationship between the chip electronic component housing portion 44a and the transport disk 11, and also shows the positional relationship between the transport disk 11 and the transport disk support table 45.

The transfer tray 11 containing the chip electronic components is then moved to an inspection section (electrical characteristic measurement position) 102 shown in fig. 2 and 4. In the inspection unit 102, as shown in fig. 7, in order to electrically connect the electrodes (22 a, 22 b) at both ends of each of the chip electronic components 19 (i.e., 19a, 19b, … …) to the inspector, electrode terminals 13a, 12a configured as a pair are disposed at positions close to both openings of the through hole 11a of the transfer puck 11. Among these electrode terminals, the electrode terminal 12a is a fixed electrode terminal and is fixed to the bottom plate 45 via an electrically insulating cylindrical body 51 disposed around the fixed electrode terminal. On the other hand, the electrode terminal 13a is a movable electrode terminal. As the movable electrode terminal, a roller-type electrode terminal is generally used in addition to the rod-shaped electrode terminal shown in the figure.

In the inspection unit 102, the electrical characteristics of each of the 6 chip electronic components 19a, 19b, and … … accommodated and arranged in a row in the radial direction of the conveyance disc 11 are inspected, and a chip electronic component exhibiting predetermined electrical characteristics is selected.

The chip electronic components whose electrical characteristics have been inspected are then transferred to the sorting unit 103 of the chip electronic components shown in fig. 2 and 4 by the rotational movement of the transfer disk 11, and the selected chip electronic components are sorted (sorted) based on the inspection results.

Fig. 8 schematically shows a chip electronic component sorting process in the chip electronic component sorting unit 103. In the sorting unit 103, a pressurized gas discharge hole 45b is formed in the conveyance disc support table 45, and the pressurized gas discharge hole 45b is connected to the pressurized gas generator 63. The pressurized gas is generally produced by pressurizing air.

That is, the chip electronic components 119a, 19b, and … …, which have been subjected to the electrical characteristic inspection and are conveyed to the sorting unit 103 by the rotational movement of the conveyor disk, are stopped at positions corresponding to the pressurized gas ejection holes 45b of the conveyor disk support table 45. Then, based on a control signal sent from the controller 15, pressurized gas is supplied to the through hole 11a of the conveyor disk 11 through a predetermined pressurized gas ejection hole 45b, and the chip electronic component 19a in the through hole 11a is blown up and discharged by the supply of the pressurized gas, and is stored in the chip electronic component collection box 64 through the inside of the chip electronic component discharge pipe 62.

Next, a chip electronic component carrying puck according to the present invention will be described with reference to fig. 9 to 12, and first, a front surface (a) and a back surface (b) of a carrying puck having eight concentric rows of through holes formed therein, which has been the mainstream in the past, are shown in fig. 9 and 10.

Fig. 10 (a) is a partially enlarged view showing an example of the arrangement state of the through holes in the back surface (b) of the conventional conveyor disc shown in fig. 9, and fig. 10 (b) is an enlarged view showing the shape of the opening 11b of each through hole in the back surface of the conveyor disc. That is, an opening 11b and an elongated suction passage 11c are formed on the back surface of a conventionally used conveyance disk, the opening 11b is formed in a substantially rectangular shape to accommodate a chip electronic component in a state of being vertically erected with respect to the conveyance disk, and the suction passage 11c is connected to the opening. Since the air on the front surface side of the transfer puck is sucked by the air discharging means provided behind the transfer puck supporting base via the suction passage 11c, the chip electronic components supplied to the front surface side of the transfer puck are accommodated in the through-holes and held in a vertical state. Fig. 10 (c) is a view showing a state in which the chip electronic component is accommodated in the through hole of the transport disk in fig. 10 (b).

Fig. 10 (d) is a diagram showing the arrangement of a conventional conveyor disc supported by a conveyor disc support table, and showing the positional relationship between the ring grooves and the suction holes in the through-hole back-side openings of the conveyor disc and the surface of the conveyor disc support table.

FIG. 11 (a) is an enlarged view of a portion of the back surface (opposite side surface) of the first chip electronic component carrier disk of the present invention, showing the positional relationship between the back surface opening 11b (and the suction passage 11 c) of the through hole and the annular groove 11d for discharging the abrasion powder, FIG. 11 (b) is an enlarged view of the shapes of the back opening 11b and the suction passage 11c of the through hole in the back of the transport disk, FIG. 11 (c) is a view schematically showing a state where the chip electronic component 1 is accommodated in the through hole of the transport disk in FIG. 11 (b), fig. 11 (d) is a view showing the arrangement of the conveyor disc 11 supported by the conveyor disc support table, showing the annular grooves 11d formed continuously on both side surfaces by enclosing the respective through holes along the through hole back surface opening portions of the respective rows of the conveyor disc 11, and showing the positional relationship of the annular grooves 45b and the suction holes 45a on the surface of the conveyor disc support table.

Fig. 12 (a) is a partially enlarged view of the back surface (reverse side surface) of the second chip electronic component conveyance disk of the present invention, showing the arrangement state of the back surface openings 11b (and the suction passages 11 c) of the through-hole groups and the abrasion powder discharge grooves 11d formed in parallel with the respective rows of the through-hole groups, and fig. 12 (b) is an enlarged view showing the shape of the openings 11b (and the suction passages 11 c) of the through-holes in the back surface of the conveyance disk. Fig. 12 (b) shows a structure in which a recessed ridge portion 11e is formed at a position close to the through hole on both sides of the recessed groove 11d arranged in parallel with the through hole group. Fig. 12 (c) is a cross-sectional view of the conveyance puck of fig. 12 (b). Fig. 12 (d) is a view for clarifying the arrangement of the transport disk supported by the transport disk support table and clarifying the positional relationship between the through-hole back-side opening 11b of the transport disk and the annular groove 45b and the suction hole 45a on the surface of the transport disk support table.

In the present specification, the description has been given of the structure of the chip electronic component inspecting and sorting device and the operational effects of the present invention, taking as an example a chip electronic component inspecting and sorting device in which a chip electronic component conveying disk is disposed in a vertical direction and operated, but the chip electronic component inspecting and sorting device used in the method for measuring electrical characteristics of a chip electronic component according to the present invention may be a device in which a chip electronic component conveying disk is mounted on a base in an inclined state by being supported by the base.

Description of the reference numerals

1 chip electronic component (chip capacitor)

1b electrode part

10 chip electronic parts inspection sorting unit

11 chip electronic parts conveying disc (conveying disc)

11a through hole (chip electronic parts storing and holding hole)

11b through hole rear surface opening portion

11c through hole back side exhaust channel

11d conveying disc back surface abrasion powder discharging groove

11e raised part of groove for discharging abrasion powder

45 conveying disc supporting table

Suction hole of 45a conveying disc supporting table

45b convey the circular groove for suction of the disc support table.