阅读说明：本技术 电感及电源模块 (Inductor and power module ) 是由 梁泓智 陈品榆 叶秀发 吕航军 杨雅雯 许玉婷 于 2021-09-17 设计创作，主要内容包括：本发明公开一种电感及电源模块。电感包含绝缘本体及导体。绝缘本体具有顶面及底面。导体包含两个接脚部及散热部。各个接脚部的一部分露出于底面,外露于绝缘本体的两个接脚部的一部分用以固定于电路板。散热部与两个接脚部相连接,散热部露出于顶面；散热部用以与外部散热构件相连接。电感通过外露于底面的两个接脚部固定于电路板时,两个接脚部与底面共同形成容置空间,容置空间用以容置设置于电路板上的芯片。当散热部与外部散热构件相连接时,电感运作所产生的热能通过散热部及外部散热构件向外传递。(The invention discloses an inductor and a power supply module. The inductor comprises an insulating body and a conductor. The insulating body is provided with a top surface and a bottom surface. The conductor includes two pin portions and a heat dissipation portion. A part of each pin part is exposed out of the bottom surface, and a part of the two pin parts exposed out of the insulating body is used for being fixed on the circuit board. The heat dissipation part is connected with the two pin parts and is exposed out of the top surface; the heat dissipation part is used for being connected with an external heat dissipation component. When the inductor is fixed on the circuit board through the two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface form an accommodating space together, and the accommodating space is used for accommodating a chip arranged on the circuit board. When the heat dissipation part is connected with the external heat dissipation component, the heat energy generated by the operation of the inductor is transmitted outwards through the heat dissipation part and the external heat dissipation component.)

1. An inductor, comprising:

an insulating body having a top surface and a bottom surface; and

a conductor, comprising:

two leg portions, a part of each of which is exposed to the bottom surface; a part of the two pin parts exposed out of the insulating body is used for being fixed on a circuit board; and

the heat dissipation part is connected with the two pin parts, and the heat dissipation part is exposed out of the top surface; the heat dissipation part is used for being connected with an external heat dissipation component;

when the inductor is fixed on the circuit board through the two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface form an accommodating space together;

when the heat dissipation part is connected with the external heat dissipation member, the heat energy generated by the operation of the inductor is transferred outwards through the heat dissipation part and the external heat dissipation member.

2. The inductor according to claim 1, wherein the conductor further comprises two diagonal segments and two longitudinal segments, two ends of each diagonal segment are respectively connected to one of the pin portions and one of the longitudinal segments, and two sides of the heat dissipation portion are respectively connected to one of the longitudinal segments; in a side view of the conductor, an included angle between each of the longitudinal sections and the oblique section is greater than 90 degrees and less than 150 degrees.

3. The inductor as claimed in claim 2, wherein in a side view of the conductor, an angle between each of the slanted segments and the pin portion connected thereto is greater than 90 degrees and less than 150 degrees.

4. An inductor according to claim 2, characterised in that the width of the inductor is at least more than twice the height of the inductor.

5. The inductor as claimed in claim 1, wherein in a top view of the inductor, the area of the heat dissipation portion is not less than thirty percent of the area of the top surface.

6. The inductor according to claim 1, wherein in a cross-section of the inductor, the conductor divides the insulator body into a first portion and two second portions, a cross-sectional area of the two second portions being equal to a cross-sectional area of the first portion.

7. The inductor according to claim 1, wherein the conductor further comprises a connecting portion and an auxiliary connecting portion, two ends of the connecting portion are connected to the two pin portions, one end of the auxiliary connecting portion is connected to one side of the connecting portion, and the other end of the auxiliary connecting portion is connected to the heat dissipating portion.

8. The inductor of claim 1 further comprising a thermally conductive auxiliary plate, said thermally conductive auxiliary plate being connected to said heat sink portion and having an area greater than an area of said heat sink portion, said thermally conductive auxiliary plate shielding at least a portion of said top surface.

9. The inductor of claim 8 wherein said secondary thermally conductive plate shields at least eighty percent of the area of said top surface.

10. A power module, comprising:

a circuit board;

the chip is fixedly arranged on the circuit board;

a heat dissipating member;

at least one inductor, comprising:

an insulating body having a top surface and a bottom surface;

a conductor, comprising:

two leg portions, a part of each of which is exposed to the bottom surface; a part of the two pin parts exposed out of the insulation body is fixed on the circuit board;

the heat dissipation part is connected with the two pin parts, is exposed out of the top surface and is connected with an external heat dissipation component;

the inductor is fixed on the circuit board through the two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface form an accommodating space together, and the chip is located in the accommodating space;

when the heat dissipation part is connected with the external heat dissipation member, the heat energy generated by the operation of the inductor is transferred outwards through the heat dissipation part and the external heat dissipation member.

11. The power module as claimed in claim 10, wherein the conductor further comprises two diagonal sections and two longitudinal sections, two ends of each diagonal section are respectively connected to one of the pin portions and one of the longitudinal sections, and two sides of the heat sink portion are respectively connected to one of the longitudinal sections; in a side view of the conductor, an included angle between each of the longitudinal sections and the oblique section is greater than 90 degrees and less than 150 degrees.

12. The power module of claim 11 wherein, in a side view of said conductor, each of said angled sections is angled more than 90 degrees and less than 150 degrees from said pin portion to which it is connected.

13. The power module of claim 10 wherein said inductor further comprises a thermally conductive auxiliary plate, said thermally conductive auxiliary plate being connected to said heat sink portion and having an area greater than an area of said heat sink portion, said thermally conductive auxiliary plate shielding at least a portion of said top surface.

14. The power module of claim 13, further comprising a heat sink member fixedly disposed on a side of the auxiliary heat-conducting plate opposite to a side connected to the heat sink portion.

15. The power module of claim 13, wherein said thermally-conductive-auxiliary plate shields at least eighty percent of the area of said top surface.

Technical Field

The present invention relates to an inductor and a power module, and more particularly, to an inductor suitable for a small size and a high current and a power module suitable for a high current.

Background

Most of the conventional inductors in power modules (power lines) are provided with an additional heat dissipation housing to dissipate heat generated by the operation of the inductors, the heat dissipation housing is connected to the ground terminal of the circuit board, and when the design is applied to a small-sized power module, the heat dissipation effect of the heat dissipation housing is poor.

Disclosure of Invention

The invention discloses an inductor and a power supply module, which are mainly used for solving the problem that the known small-size and high-current inductor and small-size power supply module are poor in heat dissipation effect due to the fact that heat dissipation is carried out through an additionally arranged heat dissipation shell.

One embodiment of the invention discloses an inductor, which comprises an insulating body, a first insulating layer, a second insulating layer and a third insulating layer, wherein the insulating body is provided with a top surface and a bottom surface; a conductor including two leg portions, a portion of each leg portion being exposed at the bottom surface; one part of the two pin parts exposed out of the insulating body is used for fixing a circuit board; the heat dissipation part is connected with the two pin parts and is exposed out of the top surface; the heat dissipation part is used for being connected with an external heat dissipation component; when the inductor is fixed on the circuit board through the two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface form an accommodating space together; when the heat dissipation part is connected with the external heat dissipation component, heat energy generated by the inductance operation is transmitted outwards through the heat dissipation part and the external heat dissipation component.

Preferably, the conductor further comprises two oblique sections and two longitudinal sections, two ends of each oblique section are respectively connected with one of the pin parts and one of the longitudinal sections, and two sides of the heat dissipation part are respectively connected with one of the longitudinal sections; in a side view of the conductor, an included angle between each longitudinal section and the oblique section is greater than 90 degrees and less than 150 degrees.

Preferably, in a side view of the conductor, an angle between each oblique section and the pin portion connected thereto is greater than 90 degrees and less than 150 degrees.

Preferably, the width of the inductor is at least two times greater than the height of the inductor.

Preferably, in a top view of the inductor, the area of the heat dissipation portion is not less than thirty percent of the area of the top surface.

Preferably, in a cross section of the inductor, the conductor divides the insulating body into a first portion and two second portions, and a sum of cross sections of the two second portions is equal to a sum of cross sections of the first portion.

Preferably, the conductor further includes a connecting portion and an auxiliary connecting portion, two ends of the connecting portion are connected to the two pin portions, one end of the auxiliary connecting portion is connected to one side of the connecting portion, and the other end of the auxiliary connecting portion is connected to the heat dissipating portion.

Preferably, the inductor further comprises an auxiliary heat conducting plate, the auxiliary heat conducting plate is connected with the heat dissipation portion, the area of the auxiliary heat conducting plate is larger than that of the heat dissipation portion, and the auxiliary heat conducting plate shields at least a part of the top surface.

Preferably, the secondary thermally conductive plate shields at least eighty percent of the area of the top surface.

One embodiment of the invention discloses a power module, which comprises a circuit board; a chip fixedly arranged on the circuit board; a heat dissipating member; at least one inductor, which comprises an insulating body with a top surface and a bottom surface; a conductor including two leg portions, a portion of each leg portion being exposed at the bottom surface; one part of the two pin parts exposed out of the insulation body is fixed on the circuit board; the heat dissipation part is connected with the two pin parts, is exposed out of the top surface and is connected with an external heat dissipation component; the inductor is fixed on the circuit board through two pin parts exposed out of the bottom surface, the two pin parts and the bottom surface form an accommodating space together, and the chip is positioned in the accommodating space; when the heat dissipation part is connected with the external heat dissipation component, heat energy generated by the inductance operation is transmitted outwards through the heat dissipation part and the external heat dissipation component.

Preferably, the conductor further comprises two oblique sections and two longitudinal sections, two ends of each oblique section are respectively connected with one of the pin parts and one of the longitudinal sections, and two sides of the heat dissipation part are respectively connected with one of the longitudinal sections; in a side view of the conductor, an included angle between each longitudinal section and the oblique section is greater than 90 degrees and less than 150 degrees.

Preferably, in a side view of the conductor, an angle between each oblique section and the pin portion connected thereto is greater than 90 degrees and less than 150 degrees.

Preferably, the inductor further comprises an auxiliary heat conducting plate, the auxiliary heat conducting plate is connected with the heat dissipation portion, the area of the auxiliary heat conducting plate is larger than that of the heat dissipation portion, and the auxiliary heat conducting plate shields at least a part of the top surface.

Preferably, the power module further comprises a heat dissipation member, and the heat dissipation member is fixedly disposed on a side of the auxiliary heat conduction plate opposite to the side connected with the heat dissipation portion.

Preferably, the secondary thermally conductive plate shields at least eighty percent of the area of the top surface. Effectively discharging heat energy generated by the inductor and the power module during operation.

In summary, the inductor and the power module of the present invention can effectively discharge heat generated by the operation of the inductor and the power module to the outside through the design of the heat dissipation portion of the conductor.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

Fig. 1 is a schematic perspective view of an inductor according to a first embodiment of the present invention.

Fig. 2 is an exploded view of a first embodiment of the inductor of the present invention.

Fig. 3 is a schematic side view of the inductor of the present invention mounted on a circuit board.

Fig. 4 is a side view of a conductor of a first embodiment of an inductor of the present invention.

Fig. 5 is a cross-sectional view of a first embodiment of an inductor according to the present invention.

Fig. 6 is a top view of a first embodiment of an inductor according to the present invention.

Fig. 7 is a schematic perspective view of an inductor according to a second embodiment of the present invention.

Fig. 8 is a cross-sectional view of a second embodiment of an inductor according to the present invention.

Fig. 9 is a schematic diagram of a third embodiment of the inductor of the present invention.

Fig. 10 is an exploded view of a third embodiment of the inductor of the present invention.

Fig. 11 and 12 are schematic perspective views of an inductor according to a fourth embodiment of the invention from two different viewing angles.

Fig. 13 is an exploded view of a third embodiment of the inductor according to the present invention.

Fig. 14 is a schematic diagram of a power module of the present invention.

Fig. 15 is an exploded view of the power module of the present invention.

Fig. 16 is a side view of a power module of the present invention.

Fig. 17 and 18 are schematic diagrams illustrating an assembly and an disassembly of a power module according to another embodiment of the invention.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the subject matter described herein, and in which is shown by way of illustration only, and not by way of limitation, specific reference may be made to the drawings.

Referring to fig. 1 to 3, an inductor 1 of the present invention includes an insulating body 11 and a conductor 12. The insulating body 11 has a top surface 111 and a bottom surface 112, and the top surface 111 and the bottom surface 112 are located on two opposite sides of the insulating body 11. In practical applications, the insulating body 11 may be formed by two combination portions 113, each combination portion 113 may be a groove 1131 having an outer shape corresponding to the conductor 12, the grooves 1131 are used for accommodating the conductor 12, and the two combination portions 113 may be fixed to each other by bonding, for example.

The conductor 12 is fixedly disposed in the insulating body 11. The conductor 12 includes two pin portions 121, two connecting portions 122, and a heat dissipation portion 123. A part of each leg portion 121 is exposed to the bottom surface 112. A portion of the two pin portions 121 exposed out of the insulating body 11 is used to fix a circuit board a, and specifically, the two pin portions 121 exposed out of the insulating body 11 are used as electrodes of the inductor 1. Two ends of each connecting portion 122 are respectively connected to one of the pin portions 121 and the heat dissipating portion 123, the two connecting portions 122 are mainly used for connecting the heat dissipating portion 123 with the two pin portions 121, and the shape of each connecting portion 122 is not limited to that shown in the figures.

A part of the heat dissipation portion 123 is exposed to the top surface 111 of the insulating body 11. The heat dissipation portion 123 is used to connect with an external heat dissipation member (not shown). The external heat dissipation member may be various heat dissipation fins, for example. The external heat dissipation member and the heat dissipation portion 123 may be fixed to each other by adhesion, and a heat dissipation paste may be disposed between the external heat dissipation member and the heat dissipation portion 123.

When the heat dissipation portion 123 is connected to the external heat dissipation member, the heat generated by the inductor 1 during operation can be transferred to the outside through the heat dissipation portion 123 and the external heat dissipation member, so as to effectively reduce the temperature of the inductor 1 during operation, thereby prolonging the service life of the inductor 1. The shape and size of the heat dissipation member 123 are not limited to those shown in the drawings. It should be noted that even in a state where the heat dissipation portion 123 is not connected to the external heat dissipation member, the heat generated by the operation of the inductor 1 can still be transferred to the outside through the heat dissipation portion 123, and the heat dissipation effect of the heat dissipation portion 123 is still better than the heat dissipation effect of the conventional heat dissipation housing disposed around the inductor.

As shown in fig. 3, when the inductor 1 is fixed on the circuit board a through the two pin portions 121 exposed on the bottom surface 112, the two pin portions 121 and the bottom surface 112 together form an accommodating space SP, and the accommodating space SP can be used for accommodating a chip C disposed on the circuit board a. By this design, the circuit board a can be used most efficiently.

As shown in fig. 2 to fig. 5, in the embodiment that when the inductor is fixed on the circuit board a, the two pin portions 121 and the bottom surface 112 together form the accommodating space SP, and the width W of the inductor 1 is greater than twice the height H of the inductor 1, each of the connecting portions 122 of the conductor 12 may include an oblique section 1221 and a longitudinal section 1222, two ends of the oblique section 1221 are respectively connected to one of the pin portions 121 and one of the longitudinal sections 1222, and two sides of the heat dissipation portion 123 are respectively connected to one of the longitudinal sections 1222. In a side view of the conductor 12 (as shown in fig. 4), an angle θ 1 between each longitudinal segment 1222 and the oblique segment 1221 is greater than 90 degrees and less than 150 degrees, and an angle θ 2 between each oblique segment 1221 and the pin portion 121 connected thereto is greater than 90 degrees and less than 150 degrees. By designing each connection portion 122 of the conductor 12 to include the diagonal section 1221 and the longitudinal section 1222 and making the diagonal section 1221, the longitudinal section 1222 and the foot 121 meet the above-mentioned angles, a person skilled in the art can easily meet the general requirements for use (such as voltage resistance between 20% and 30%) by simply modifying the shapes of the conductor 12 and the insulating body 11, and the design also makes the conductor 12 relatively easy to bend during the manufacturing process.

In the embodiment where the thickness of the conductor 12 is greater than 0.5 millimeter (mm), and the width of the inductor 1 is greater than twice the height of the inductor 1, if the included angle between each longitudinal section 1222 and the oblique section 1221 is equal to 90 degrees, or the included angle between each oblique section 1221 and the connecting pin 121 connected thereto is equal to 90 degrees, the conductor 12 will be difficult to bend, and the related characteristics of the inductor 1 are difficult to achieve the general requirements.

As shown in fig. 1 and fig. 5, in the embodiment where the width W of the inductor 1 is greater than twice the height H of the inductor 1, in a cross section of the inductor 1 (as shown in fig. 5), the insulating body 11 is divided into two first portions 114 and a second portion 115 by the conductor 12, and if the cross-sectional area of the two first portions 114 is equal to the cross-sectional area of the second portion 115, it is possible for a relevant person to easily meet the general use requirement (for example, the withstand voltage is between 20% and 30%) by simply modifying the shapes of the conductor 12 and the insulating body 11.

As shown in fig. 6, in the top view of the inductor 1, the area of the heat dissipation portion 123 is not less than thirty percent of the area of the top surface 111, so that the heat dissipation performance of the inductor 1 is significantly different from that of the heat dissipation portion 123.

Fig. 7 and fig. 8 are a schematic perspective view and a schematic cross-sectional view of an inductor according to a second embodiment of the invention. The inductor 1A of the present embodiment includes an insulating body 11A and a conductor 12A. The insulating body 11A may include two combining portions 113A, and for the detailed description of the insulating body 11A, please refer to the description of the insulating body 11, which is not described herein again. The conductor 12A includes two pin portions 121A, two connecting portions 122A, and a heat sink portion 123A. Each connection 122A includes an oblique section 1221A and a longitudinal section 1222A. For detailed descriptions of the foot 121A, the connecting portion 122A, the heat dissipating portion 123A, the oblique section 1221A, and the longitudinal section 1222A, please refer to the descriptions of the foot 121, the connecting portion 122, the heat dissipating portion 123, the oblique section 1221, and the longitudinal section 1222, which will not be described herein again. The inductor 1A of the present embodiment is different from the previous embodiments in the following point: the length ratios of the diagonal section 1221A and the longitudinal section 1222A of the connecting portion 122A are different.

As described in the foregoing embodiments, the inductor 1A of the present embodiment can also make the included angle θ 1 between each longitudinal segment 1222A and the oblique segment 1221A greater than 90 degrees and smaller than 150 degrees, and make the included angle θ 2 between each oblique segment 1221A and the foot 121A connected thereto greater than 90 degrees and smaller than 150 degrees, so that the conductor 12A can be easily bent during the manufacturing process, and relevant personnel can easily modify the shapes of the conductor 12A and the insulating body 11A, so as to make the inductor 1A easily meet the general use requirement.

As shown in fig. 8, which shows a cross section of the inductor 1A of the present embodiment, the insulating body 11 is divided by the conductor 12 into two first portions 114A and a second portion 115A, and preferably, a sum of cross sections of the two first portions 114A is equal to a sum of cross sections of the second portion 115A, so that a relevant person can easily meet a requirement of a general application by simply modifying shapes of the conductor 12 and the insulating body 11.

Please refer to fig. 9 and fig. 10, which respectively illustrate a schematic diagram and an exploded schematic diagram of a third embodiment of an inductor according to the present invention. The largest difference between the inductor 1C of the present embodiment and the inductor 1B of the previous embodiment is: the inductor 1C further includes an auxiliary heat-conducting plate 13, the auxiliary heat-conducting plate 13 is connected to the heat-dissipating portion 123A, an area of the auxiliary heat-conducting plate 13 is larger than an area of the heat-dissipating portion 123A, and the auxiliary heat-conducting plate 13 shields at least a portion of the top surface 11A1 of the insulating body 11A.

In practical applications, the auxiliary heat-conducting plate 13 may be made of any material with high thermal conductivity, such as various metal plates, and the auxiliary heat-conducting plate 13 and the heat dissipation portion 123A may be fixed to each other by welding, bonding, or fastening. The heat-conducting plate 13 and the top 11a1 may be fixed to each other by adhesive or the like according to the requirement.

By the arrangement of the auxiliary heat conducting plate 13, the heat generated by the inductor 1C during operation can be dissipated outwards through the auxiliary heat conducting plate 13. Preferably, the auxiliary heat conducting plate 13 covers at least eighty percent of the area of the top surface 113A, so that the heat dissipation effect of the inductor 1C can be effectively enhanced.

Fig. 11 to fig. 13 are a schematic diagram, a partially exploded view and an exploded view respectively illustrating different viewing angles of a fourth embodiment of an inductor according to the present invention. The inductor 1B of the present embodiment includes an insulating body 11B and a conductor 12B. The insulating body 11B may include two assembling portions 113B, and the detailed description of the insulating body 11B and the assembling portions 113B and the description referring to the insulating body 11 and the assembling portions 113 are omitted for brevity. The conductor 12B includes two pins 121B, a heat sink 123B, a connecting portion 122B, and an auxiliary connecting portion 124. The two pin portions 121B are used to be fixed to the circuit board. Two ends of the connecting portion 122B are connected to the two pin portions 121B, one side of the connecting portion 122B extends outward and upward to form an auxiliary connecting portion 124, and an end of the auxiliary connecting portion 124 opposite to the end connected to the connecting portion 122B is connected to the heat dissipating portion 123B.

The conductor 12B is fixedly disposed in the insulating body 11B, each combination portion 113B of the insulating body 11B may have a plurality of grooves corresponding to different portions of the conductor 12B, a portion of the auxiliary connecting portion 124 and the heat dissipation portion 123B are exposed out of the insulating body 11B, and the auxiliary connecting portion 124 and the heat dissipation portion 123B may be used together to assist in transferring heat energy generated during the operation of the inductor 1B to the outside. The size and shape of the connecting portion 122B and the auxiliary connecting portion 124 shown in the present embodiment may vary according to requirements, and are only an exemplary embodiment.

Fig. 14 to 16 are a perspective view and an exploded view of a power module according to the present invention. The power module 2 includes a circuit board 21, a chip 22, a heat dissipation member 23 and an inductor 24. The chip 22 is fixedly disposed on the circuit board 21. The inductor 24 includes an insulating body 241 and a conductor 242. The conductor 242 includes two pin portions 2421 and a heat dissipation portion 2422. The inductor 24 and the components thereof in this embodiment are the same as the inductor 1 of the present invention, and are not described herein again.

When the inductor 24 is fixed on the circuit board 21 by the two pin parts 2421, the two pin parts 2421 and the bottom surface 2411 of the insulating body 241 together form an accommodating space SP, and the chip 22 is correspondingly located in the accommodating space SP. The heat dissipation member 23 is connected to the heat dissipation part 2422 of the inductor 1. In the drawings of the present embodiment, the heat dissipation member 23 includes a plurality of fins as an example, but the shape of the heat dissipation member 23 is not limited thereto. When the power module 2 is operated, the generated heat energy can be transmitted to the outside through the heat dissipation part 2422 and the heat dissipation member 23.

Please refer to fig. 17 and 18, which are a schematic diagram and an exploded schematic diagram of a power module according to another embodiment of the invention. The present embodiment is different from the previous embodiments in the following point: the inductor 24A of the power module 2A further includes an auxiliary heat-conducting plate 243, the auxiliary heat-conducting plate 243 is connected to the heat dissipation portion 2422, the area of the auxiliary heat-conducting plate 243 is larger than the area of the heat dissipation portion 2422, and the auxiliary heat-conducting plate 243 shields at least a portion of the top surface 2412 of the insulating body 241.

In practical applications, the auxiliary heat-conducting plate 243 may be made of any material with high thermal conductivity, such as various metal plates, and the auxiliary heat-conducting plate 243 and the heat dissipation portion 2422 may be fixed to each other by welding, bonding, or fastening. In addition, the auxiliary heat conducting plate 243 and the top surface 2412 may be fixed to each other by using an adhesive or the like according to the requirement.

The present embodiment is different from the previous embodiments in that: the heat dissipation member 23A of the power module 2A has a plurality of columnar structures. Of course, the shape of the heat dissipation member 23A may vary according to requirements, and is shown in the drawings only in an exemplary manner.

By providing the auxiliary heat-conducting plate 243, the heat generated during the operation of the inductor 24A can be dissipated through the auxiliary heat-conducting plate 243. Preferably, the auxiliary heat conducting plate 243 shields at least eighty percent of the area of the top surface 2412, so as to effectively enhance the heat dissipation effect of the inductor 24.

In the power module 2 of the present invention, the conductor 242 of the inductor 1 has the heat dissipation part 2422, and the heat dissipation part 2422 is connected to the heat dissipation member 23, so that heat energy generated during the operation of the power module 2 can be rapidly transferred to the outside, and the temperature of the power module 2 does not continuously rise, thereby prolonging the service life of the power module 2.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent technical changes made by using the contents of the present specification and the accompanying drawings are included in the scope of the present invention.