阅读说明：本技术 芯片组装方法及组件 (Chip assembling method and assembly ) 是由 周进群 张强波 柳仁辉 熊艳春 江京 于 2020-06-01 设计创作，主要内容包括：本发明提供了一种芯片组装方法及组件通过吸取装置吸取芯片并识别吸附载板上的多个标识点,将多个芯片分别放置在标识点对应的真空孔上,使用抽真空装置抽真空使芯片吸附在吸附载板上,然后将待组装板材上设置和芯片对应的焊盘对准芯片,加热使其连接,最后将吸附载板的真空孔释放真空,使芯片和吸附载板分离,完成芯片的组装。该技术方案组装的芯片共面性好,生产效率高。(The invention provides a chip assembling method and a chip assembling assembly, wherein a chip is sucked by a sucking device, a plurality of identification points on an adsorption carrier plate are identified, a plurality of chips are respectively placed on vacuum holes corresponding to the identification points, a vacuumizing device is used for vacuumizing to enable the chips to be adsorbed on the adsorption carrier plate, then pads corresponding to the chips and arranged on a plate to be assembled are aligned to the chips, the chips are heated to be connected, and finally the vacuum holes of the adsorption carrier plate are released for vacuum, so that the chips are separated from the adsorption carrier plate, and the chip assembling is completed. The chip assembled by the technical scheme has good coplanarity and high production efficiency.)

1. A method of chip assembly, comprising:

identifying a plurality of identification points on an adsorption carrier plate, respectively placing a plurality of chips on vacuum holes corresponding to the identification points, and vacuumizing to enable the chips to be adsorbed on the adsorption carrier plate;

obtaining a plate to be assembled, and coating an adhesive on the plate to be assembled and a bonding pad corresponding to the chip;

moving the plate to be assembled to enable the plate to be adhered to the chip through the adhesive;

and releasing vacuum from the vacuum holes of the adsorption carrier plate to separate the chip from the adsorption carrier plate.

2. The method of claim 1, wherein the step of identifying a plurality of identification points on the adsorption carrier plate, placing a plurality of chips on the vacuum holes corresponding to the identification points, and performing vacuum pumping to adsorb the chips on the adsorption carrier plate comprises:

and absorbing the chip by using an absorbing device, identifying the identification points on the adsorption carrier plate by using an image, placing the chip on the vacuum holes corresponding to the identification points, and absorbing the chip on the adsorption carrier plate by vacuumizing.

3. The chip assembly method according to claim 1, wherein the step of obtaining a plate to be assembled and applying an adhesive to the plate to be assembled at the bonding pads corresponding to the chips comprises: and before connecting the bonding pads on the plate to be assembled with the chips by using a coating device, coating adhesive on the plate to be assembled and the bonding pads corresponding to the chips, wherein the adhesive comprises solder or conductive glue.

4. The chip assembling method according to claim 3, wherein the step of moving the board to be assembled to be bonded to the chip by the adhesive comprises:

and a heating device is arranged below the adsorption support plate and heats the adhesive between the chip and the bonding pad on the plate to be assembled, so that the chip is fixed on the plate to be assembled.

5. The chip assembly method according to claim 1, wherein the adsorption carrier plate is a glass carrier plate with a smooth surface, and the to-be-assembled plates include a PCB (printed circuit board), a package substrate and a QFN (quad Flat No-lead) plate.

6. A chip assembly, comprising:

the adsorption carrier plate is provided with a plurality of groups of vacuum holes and a plurality of identification points, and each group of vacuum holes is provided with at least one identification point;

the moving unit is arranged corresponding to the adsorption carrier plate and used for acquiring a plate to be assembled and moving the plate to be assembled to be bonded with the chip;

and the vacuumizing device is used for vacuumizing the plurality of groups of vacuum holes on the adsorption carrier plate, and a plurality of chips are adsorbed on the vacuum holes on the adsorption carrier plate through the vacuumizing device in a vacuumizing way, and the to-be-assembled plate and the chips are connected and then released to separate the chips from the adsorption carrier plate.

7. The chip assembly according to claim 6, further comprising a suction device for sucking the chip, image-recognizing the mark points on the adsorption carrier plate, and placing the chip on the vacuum holes corresponding to the mark points.

8. The chip assembly according to claim 6, further comprising a coating device, wherein the coating device coats an adhesive on the board to be assembled at the pad corresponding to the chip before the pad on the board to be assembled and the chip are connected, and the adhesive comprises solder or conductive glue.

9. The chip assembly according to claim 8, further comprising a heating device disposed below the adsorption carrier plate, wherein the heating device is configured to heat the adhesive between the chip and the pad on the board to be assembled, so that the chip is fixed on the board to be assembled.

10. The chip assembly component according to claim 6, wherein the absorption carrier plate is a glass carrier plate with a smooth surface, and the to-be-assembled plates comprise a PCB (printed circuit board), a package substrate and a QFN (quad Flat No-lead) plate.

Technical Field

The invention relates to the technical field of chip packaging, in particular to a chip assembling method and a chip assembling assembly.

Background

With the rapid development of technology, the demand of integrated chip devices is increasing. The integrated chip device mainly includes: a plurality of chips, a control chip, electronic components, and the like. In a CT machine of a medical apparatus, a chip arranged in a matrix receives X-rays transmitted through the layer, converts the X-rays into visible light, converts the visible light into an electrical signal by a photoelectric converter, converts the electrical signal into a digital signal by an analog/digital converter (analog/digital converter), and inputs the digital signal into a computer for processing. Each digit in the digital matrix is converted into small blocks of unequal gray scale from black to white, i.e. pixels, by a digital/analog converter (digital/analog converter), and arranged in a matrix, i.e. a CT image is formed. If a clear CT image is required, the method depends on the good coplanarity of the chip assembly. How to solve the problem of poor coplanarity caused by multi-chip assembly in the prior art is a subject of key research in the industry at present.

Disclosure of Invention

The invention aims to solve the problem of poor coplanarity caused by multi-chip assembly in the prior art.

In order to solve the above technical problems, the present invention provides a chip assembly method, including: identifying a plurality of identification points on the adsorption carrier plate, respectively placing a plurality of chips on the vacuum holes corresponding to the identification points, and vacuumizing to enable the chips to be adsorbed on the adsorption carrier plate; obtaining a plate to be assembled, and coating an adhesive on the plate to be assembled and a bonding pad corresponding to the chip; moving the plate to be assembled to enable the plate to be adhered to the chip through the adhesive; and releasing vacuum from the vacuum holes of the adsorption carrier plate to separate the chip from the adsorption carrier plate.

Further, discerning a plurality of identification points on the absorption support plate, placing a plurality of chips on the corresponding vacuum hole of identification point respectively, the step that makes the chip adsorb on the absorption support plate of evacuation includes: and (3) sucking the chip by using a sucking device, identifying the identification points on the adsorption carrier plate by using an image, placing the chip on the vacuum hole corresponding to the identification points, and sucking the chip on the adsorption carrier plate by vacuumizing.

Further, the step of obtaining a plate to be assembled and coating an adhesive on the plate to be assembled and the bonding pad corresponding to the chip comprises: before the bonding pads on the board to be assembled are connected with the chip by using a coating device, coating an adhesive on the board to be assembled and the bonding pads corresponding to the chip, wherein the adhesive comprises solder or conductive glue.

And further, the step of moving the plate to be assembled to enable the plate to be adhered with the chip through the adhesive comprises the step of arranging a heating device below the adsorption support plate, and heating the adhesive between the chip and the bonding pad on the plate to be assembled by the heating device to enable the chip to be fixed on the plate to be assembled.

Furthermore, the adsorption carrier plate is a glass carrier plate with a smooth and flat surface, and the plate to be assembled comprises a PCB (printed circuit board), a packaging substrate and a QFN (quad Flat No lead) plate.

There is also provided a chip assembly comprising: the adsorption carrier plate is provided with a plurality of groups of vacuum holes and a plurality of identification points, and each group of vacuum holes is provided with at least one identification point; the moving unit is arranged corresponding to the adsorption support plate and used for acquiring the plate to be assembled and moving the plate to be assembled to enable the plate to be assembled to be bonded with the chip; and the vacuumizing device is used for vacuumizing a plurality of groups of vacuum holes on the adsorption carrier plate, a plurality of chips are vacuumized and adsorbed on the vacuum holes on the adsorption carrier plate through the vacuumizing device, and the chips are separated from the adsorption carrier plate by releasing vacuum after the board to be assembled is connected with the chips.

Further, the vacuum chip adsorption device further comprises an adsorption device, the adsorption device adsorbs the chip, the image recognition adsorbs the identification points on the carrier plate, and the chip is placed on the vacuum hole corresponding to the identification points.

Furthermore, the chip assembly component also comprises a coating device, wherein before the bonding pad on the plate to be assembled is connected with the chip, the coating device coats an adhesive on the plate to be assembled and the bonding pad corresponding to the chip, and the adhesive comprises solder or conductive glue.

Further, still include heating device, heating device sets up in absorption support plate below, and heating device is used for heating the bonding agent between the pad on chip and the panel of waiting to assemble, makes the chip fix on waiting to assemble the panel.

Furthermore, the adsorption carrier plate is a glass carrier plate with a smooth and flat surface, and the plate to be assembled comprises a PCB (printed circuit board), a packaging substrate and a QFN (quad Flat No lead) plate.

The invention firstly identifies a plurality of identification points on the adsorption carrier plate, respectively places a plurality of chips on vacuum holes corresponding to the identification points, carries out vacuum pumping to ensure that the chips are adsorbed on the adsorption carrier plate, then aligns pads corresponding to the chips on a plate to be assembled with the chips, heats the pads to ensure that the chips are connected, and finally releases vacuum in the vacuum holes of the adsorption carrier plate to ensure that the chips are separated from the adsorption carrier plate, thereby completing the assembly of the chips. The chip assembled by the technical scheme has good coplanarity and high production efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a block diagram of a chip assembly according to the present invention;

FIG. 2 is a schematic structural diagram of an adsorption carrier plate of the chip assembly device according to the present invention;

FIG. 3 is a schematic structural diagram of a board to be assembled of the chip assembly of the present invention;

FIG. 4 is a flow chart illustrating a chip assembly method according to the present invention;

FIG. 5 is a schematic view of a chip adsorbed by the adsorption carrier plate of the chip assembly device according to the present invention;

FIG. 6 is a schematic structural diagram of a board connecting chip to be assembled of the chip assembly of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.

The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Please refer to fig. 1, which is a schematic structural diagram of a chip assembly according to the present invention. Fig. 2 is a schematic structural diagram of an absorption carrier plate of the chip assembly device according to the present invention. Please refer to fig. 3, which is a schematic structural diagram of a board to be assembled of the chip assembly component according to the present invention.

The chip assembly component provided by the invention comprises an adsorption carrier plate 3, a moving unit, a vacuum-pumping device, a coating device, a suction device and a heating device 8. The adsorption carrier plate 3 is formed with a plurality of groups of vacuum holes 7 and a plurality of identification points 9, and each group of vacuum holes 7 corresponds to at least one identification point 9, and in other embodiments, each group of vacuum holes 7 may correspond to two or three identification points 9. The adsorption carrier plate 3 is arranged on the heating device 8 and is connected with a vacuum-pumping device. The moving unit is disposed corresponding to the adsorption carrier plate, and the moving unit is configured to obtain the board to be assembled and move the board to be assembled. The moving unit moves the plate 4 to be assembled above the adsorption carrier plate 3, a bonding pad 5 corresponding to the chip bonding pad 2 of the chip 1 is arranged on one surface, close to the adsorption carrier plate 3, of the plate 4 to be assembled, and the bonding pad 5 is used for being connected with the chip 1. During the use, absorb a plurality of chips 1 through suction means respectively, then identification point 9 on the image recognition absorption support plate 3, place a plurality of chips 1 respectively on the vacuum hole 7 that identification point 9 corresponds, open evacuating device, make a plurality of chips 1 adsorb on the vacuum hole 7 on the absorption support plate 3, a plurality of chips 1 at this moment are adsorbed on absorption support plate 3, and a plurality of chips 1 keep on same horizontal plane. The moving unit moves the plate 4 to be assembled to the upper part of the adsorption support plate 3, before the pad 5 on the plate 4 to be assembled is connected with the chip 1 by the coating device, the pad 5 corresponding to the chip 1 on the plate 4 to be assembled is coated with the adhesive 6, and then the pad 5 of the plate 4 to be assembled is correspondingly connected with the chip 1 by the moving unit, because the surface of the pad 5 is coated with the adhesive 6 (solder or conductive glue), the adhesive 6 slowly solidifies after the heating device is opened, so that the chip 1 is fixedly connected with the plate 4 to be assembled. After the vacuum-pumping device is closed, the chip 1 and the adsorption carrier plate 3 can be separated, and the assembly of the chip 1 is completed. Since a plurality of chips 1 are placed on the same adsorption carrier plate 3 and the vacuum holes 7 on the adsorption carrier plate 3 can adsorb a plurality of chips 1 after vacuum pumping, the plurality of chips 1 can maintain good coplanarity.

Please refer to fig. 2, which is a schematic structural diagram of an absorption carrier of a chip assembly device according to the present invention.

In the embodiment, the adsorption carrier plate 3 is a flat and smooth carrier plate, and the material of the adsorption carrier plate 3 may be glass or other inorganic materials. The adsorption carrier plate 3 is formed with the vacuum hole 7 group of matrix arrangement, and each group of vacuum hole 7 can be including a plurality of vacuum holes 7, and every vacuum hole 7 aperture size is the same, neatly arranges on the adsorption carrier plate 3, and when the aim at that sets up like this carries out the evacuation, each group of vacuum hole 7 can form the adsorption affinity of even size to the chip for the chip adsorbs on the adsorption carrier plate 3. Each group of vacuum holes 7 is correspondingly provided with one or more identification points 9. In the present embodiment, each group of vacuum holes 7 corresponds to one identification point 9, and the identification point 9 is disposed on the upper left side of the group of vacuum holes 7. When adsorbing the chip, suction means absorbs the chip, through camera device image recognition this chip correspond identification point 9, place this chip on this identification point 9 corresponds vacuum hole 7 groups. The chips are sucked for many times, the steps are repeated, the chips can be placed on the corresponding vacuum hole 7 groups, then the vacuumizing device is started, the chips are adsorbed on the adsorption support plate 3 under the action of atmospheric pressure, the state that the chips keep the same horizontal plane is kept, and the chips can be kept in good coplanarity after the plates to be assembled are connected with the chips.

Please refer to fig. 3, which is a schematic structural diagram of a board to be assembled of the chip assembly device according to the present invention.

In the present embodiment, the board 4 to be assembled is a PCB, and in other embodiments, the board 4 to be assembled may be a PCB or a package substrate or a QFN board. The board 4 to be assembled is a final carrier of the chip, and the chip is finally mounted on the device together with the board 4 to be assembled for use. The board 4 to be assembled is moved above the adsorption carrier plate through the moving unit, one surface of the board 4 to be assembled is provided with a bonding pad 5, and the bonding pad 5 and the chip are correspondingly arranged. When the chip is connected, the coating device coats a layer of adhesive 6 on the surface of the bonding pad 5, the adhesive can be solder or conductive glue, the moving unit moves the plate 4 to be assembled above the adsorption support plate, the bonding pad 5 and the chip are correspondingly connected, the heating device is started, the adhesive 6 is solidified, and the chip can be firmly fixed on the plate 4 to be assembled.

The embodiment sucks the chip through the suction device, identifies a plurality of identification points on the adsorption carrier plate, places a plurality of chips on the vacuum holes corresponding to the identification points respectively, uses the vacuumizing device to vacuumize to make the chip adsorbed on the adsorption carrier plate, then aligns the bonding pads corresponding to the chip on the board to be assembled with the chip, heats the bonding pads to make the bonding pads connected, and finally releases the vacuum of the vacuum holes of the adsorption carrier plate to separate the chip from the adsorption carrier plate. The chip assembled by the technical scheme has good coplanarity and high production efficiency.

Fig. 4 is a schematic flow chart of a chip assembly method according to the present invention.

And step S01, identifying a plurality of identification points on the adsorption carrier plate, respectively placing a plurality of chips on the vacuum holes corresponding to the identification points, and vacuumizing to enable the chips to be adsorbed on the adsorption carrier plate.

Before placing the chip, firstly, an adsorption carrier plate is required to be prepared, the material of the adsorption carrier plate can be glass or other inorganic materials, and the surface of the adsorption carrier plate after processing is flat and smooth. Fig. 5 is a schematic structural diagram of an absorption carrier plate absorption chip of the chip assembly device according to the present invention. The adsorption carrier plate 3 is formed with the vacuum hole 7 group of matrix arrangement, and each group of vacuum hole 7 can be including a plurality of vacuum holes 7, and a plurality of vacuum holes 7 aperture size is the same, neatly arranges on the adsorption carrier plate 3, and when the aim at that sets up like this carries out the evacuation, each group of vacuum hole 7 can form the adsorption affinity of even size to chip 1 for chip 1 stably adsorbs on adsorption carrier plate 3.

Will adsorb support plate 3 and set up on heating device, and connect evacuating device, a plurality of chips 1 absorb through suction means respectively, then identification point 9 on the image recognition adsorbs support plate 3, place a plurality of chips 1 respectively on the vacuum hole 7 group that identification point 9 corresponds, open evacuating device, make a plurality of chips 1 adsorb on adsorbing vacuum hole 7 on support plate 3, a plurality of chips 1 of this moment are adsorbed on adsorbing support plate 3, a plurality of chips 1 keep on same horizontal plane.

And step S02, obtaining a plate to be assembled, and coating an adhesive on the plate to be assembled and the bonding pad corresponding to the chip.

After adsorbing the chip on the adsorption support plate, the mechanical arm moves the plate to be assembled above the adsorption support plate, a bonding pad is arranged on one surface, close to the adsorption support plate, of the plate to be assembled, and the bonding pad and the chip are correspondingly arranged. Before connecting the chip, a layer of adhesive, which can be solder or conductive glue, is coated on the surface of the bonding pad.

Step S03, moving the board to be assembled to make it adhere to the chip by the adhesive.

And the mechanical arm correspondingly connects the bonding pad of the plate to be assembled with the chip, the heating device is started to heat for 5-10 minutes, the adhesive is solidified, and the chip can be firmly fixed on the plate to be assembled.

And step S04, releasing the vacuum from the vacuum holes of the adsorption carrier plate to separate the chip from the adsorption carrier plate.

After the chip and the plate to be assembled are firmly fixed, the vacuumizing device is closed, the chip is adsorbed on the adsorption support plate under the action of atmospheric pressure, the vacuum state in the vacuum hole disappears after the vacuumizing device is closed, the atmospheric pressure between the chip and the adsorption support plate disappears, the plate to be assembled is taken away to obtain the assembled chip and the plate to be assembled, the plate to be assembled is a final carrier of the chip, and finally the chip and the plate to be assembled are installed on equipment together for use. Please refer to fig. 6, which is a schematic structural diagram of a board to be assembled connecting chip of the chip assembly component according to the present invention. At this time, the plate 4 to be assembled is arranged below the chip 1 and is already a finished product of the assembly of the chip 1, a chip bonding pad 2, a bonding agent 6 after heating and solidification and a bonding pad 5 are arranged between the chip 1 and the plate 4 to be assembled, and all the chips 1 keep the same horizontal plane.

This embodiment is through at first discerning a plurality of identification points on the absorption support plate, places a plurality of chips respectively on the corresponding vacuum hole of identification point, carries out the evacuation and makes the chip adsorb on the absorption support plate, then will wait to assemble the pad that sets up on the panel and correspond with the chip and aim at the chip, heats and makes it connect, and the vacuum hole release vacuum that will adsorb the support plate at last makes chip and absorption support plate separation. The chip assembled by the technical scheme has good coplanarity and high production efficiency.

The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.