阅读说明：本技术 背板以及电子装置 (Backboard and electronic device ) 是由 李胜 万昌兵 柳峰麟 王德旭 于 2020-06-02 设计创作，主要内容包括：一种背板,所述背板包括底壁、侧壁、多个通风孔以及多个并排设置的导流板。所述侧壁围设于所述底壁的周缘；所述通风孔设置于所述侧壁上；所述导流板设置于所述侧壁的内侧,每一所述通风孔与相邻的两个所述导流板之间的间隙连通形成通风通道；每一所述导流板包括连接所述侧壁的连接部以及连接所述连接部的挡板部；定义其中一所述导流板的所述连接部与所述侧壁的连接点为A；所述挡板部远离所述连接部的端点为C,端点C在所述侧壁的投影为C’,相邻的另一所述导流板的所述连接部与所述侧壁的连接点为D；所述连接点A和所述连接点D之间的距离为L1,所述连接点A和所述投影C’之间的距离为L2,其中,L1≤L2。(A backplate, the backplate includes a bottom wall, a side wall, a plurality of vents, and a plurality of baffles arranged side by side. The side wall is arranged around the periphery of the bottom wall; the vent hole is arranged on the side wall; the air deflectors are arranged on the inner side of the side wall, and each air vent is communicated with a gap between two adjacent air deflectors to form an air vent channel; each guide plate comprises a connecting part connected with the side wall and a baffle part connected with the connecting part; defining the connection point of the connecting part of one of the guide plates and the side wall as A; the end point of the baffle part far away from the connecting part is C, the projection of the end point C on the side wall is C', and the connecting point of the connecting part of the adjacent other guide plate and the side wall is D; the distance between the connecting point A and the connecting point D is L1, the distance between the connecting point A and the projection C' is L2, wherein L1 is not more than L2.)

1. A backing sheet, comprising:

a bottom wall;

the side wall is arranged around the periphery of the bottom wall in a surrounding manner;

a plurality of vent holes disposed on the side wall; and

the air guide plates are arranged side by side and are arranged on the inner side of the side wall, and each air vent is communicated with a gap between two adjacent air guide plates to form a ventilation channel; each guide plate comprises a connecting part connected with the side wall and a baffle part connected with the connecting part; defining the connection point of the connecting part of one of the guide plates and the side wall as A; the end point of the baffle part far away from the connecting part is C, the projection of the end point C on the side wall is C', and the connecting point of the connecting part of the adjacent other guide plate and the side wall is D; a distance between the connection point A and the connection point D is L1, a distance between the connection point A and the projection C' is L2,

wherein L1 is less than or equal to L2.

2. A backboard according to claim 1, wherein the connection point of the connecting portion and the baffle portion is B, the projection of the connection point B on the side wall is B ', and the projection B ' is located between the connection point a and the projection C '.

3. The back sheet according to claim 2, wherein the connecting portion has a broken line or an arc shape in cross section.

4. The backplate of claim 1, wherein the baffle further comprises a protrusion disposed at the junction of the connecting portion and the sidewall.

5. The back plate of claim 1, further comprising a blocking portion disposed between two adjacent connecting portions.

6. The back plate as claimed in claim 1, wherein the bottom wall and the side wall define a receiving cavity, and the side wall has an opening therein, the opening communicating with the receiving cavity.

7. The backplate of claim 1, further comprising a mounting portion extending outwardly along a perimeter of the sidewall.

8. The back plate of claim 1, wherein the connecting portion is perpendicular to the side wall.

9. An electronic device, characterized in that it comprises a back-sheet according to any of claims 1 to 8.

Technical Field

The present application relates to the field of electronic products, and in particular, to a backplane and an electronic device.

Background

The electronic device can generate heat in the operation process, and in order to ensure that the electronic device cannot damage internal elements due to overheating in the long-term operation process, the heat dissipation holes are usually formed in the back plate of the electronic device, so that the heat dissipation of the internal elements is facilitated.

Generally, to improve the heat dissipation performance of the electronic device, the size of the heat dissipation hole is increased to increase the ventilation area. Therefore, external foreign matters can easily fall into the back plate to pollute internal elements; in addition, the size of the heat dissipation hole is increased, so that the internal elements can be directly seen through the heat dissipation hole, and the attractiveness of the electronic product is affected.

Disclosure of Invention

In view of the above, it is desirable to provide a back plate with good heat dissipation performance, effective blocking of foreign matters and good appearance, so as to solve the above problems.

A backplate, the backplate includes a bottom wall, a side wall, a plurality of vents, and a plurality of baffles arranged side by side. The side wall is arranged around the periphery of the bottom wall; the vent hole is arranged on the side wall; the air deflectors are arranged on the inner side of the side wall, and each air vent is communicated with a gap between two adjacent air deflectors to form an air vent channel; each guide plate comprises a connecting part connected with the side wall and a baffle part connected with the connecting part; defining the connection point of the connecting part of one of the guide plates and the side wall as A; the end point of the baffle part far away from the connecting part is C, the projection of the end point C on the side wall is C', and the connecting point of the connecting part of the adjacent other guide plate and the side wall is D; the distance between the connecting point A and the connecting point D is L1, the distance between the connecting point A and the projection C' is L2, wherein L1 is not more than L2.

Further, a connection point of the connecting portion and the baffle portion is B, a projection of the connection point B on the side wall is B ', and the projection B ' is located between the connection point a and the projection C '.

Further, the cross section of the connecting part is a broken line or an arc.

Furthermore, the guide plate also comprises a convex block which is arranged at the joint of the connecting part and the side wall.

Further, the back plate further comprises a blocking portion, and the blocking portion is arranged between the two adjacent connecting portions.

Further, the bottom wall and the side wall are enclosed to form an accommodating groove, an opening is formed in the side wall, and the opening is communicated with the accommodating groove.

Further, the back plate further comprises a mounting portion extending outwardly along a periphery of the side wall.

Further, the connecting portion is perpendicular to the side wall.

An electronic device comprising the backplane.

According to the backboard provided by the embodiment of the application, the ventilation and heat dissipation performance of the backboard is ensured by arranging the plurality of guide plates; in addition, through the size design of the connecting part of the guide plate and the baffle part, external sundries can be prevented from directly entering the back plate, elements accommodated in the back plate can be prevented from being directly seen from the outside, and the attractiveness of the electronic device is improved.

Drawings

Fig. 1 is a schematic structural diagram of a backplane provided in an embodiment of the present application.

Fig. 2 is a schematic structural view of another angle of the back plate according to the embodiment of the present application.

Fig. 3 is a schematic structural view of a back plate at another angle according to an embodiment of the present disclosure.

Fig. 4 is an enlarged schematic structural diagram of two adjacent baffles provided in an embodiment of the present application.

Fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 6 is an exploded view of the electronic device shown in fig. 5.

Description of the main elements

Back plate 100

Bottom wall 10

Side wall 20

Accommodating groove 25

Flow deflector 30

Connecting part 32

Bump 322

Baffle portion 34

Stopper 35

Vent hole 36

Mounting portion 40

Opening 52

Electronic device 200

Fixing seat 210

Frame 220

Front panel 230

Component 240

Point A, B, C, D

Projection B ', C'

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1, fig. 2 and fig. 3, a backplane 100 is provided in an embodiment of the present disclosure, and the backplane 100 may be applied to an electronic device 200 (see fig. 5). The back plate 100 is used to protect the components 240 (see fig. 6) in the electronic device 200 from being damaged by external force, prevent foreign matters from falling into the back plate 100 to contaminate the components 240, and has a ventilation function to facilitate heat dissipation of the components 240 in the electronic device 200.

The back plate 100 comprises a bottom wall 10 and a side wall 20, the side wall 20 is arranged around the periphery of the bottom wall 10, and a certain included angle is formed between the side wall 20 and the bottom wall 10. In the present embodiment, the angle between the side wall 20 and the bottom wall 10 is 90 °. It will be understood that the angle between the side wall 20 and the bottom wall 10 may be greater than 90 ° or less than 90 °. In the present embodiment, the angle between the side wall 20 and the bottom wall 10 is obtuse (i.e. greater than 90 °).

In this embodiment, the number of the side walls 20 is 4, the side walls 20 and the bottom wall 10 together form a receiving groove 25, and the receiving groove 25 can be used for receiving the component 240 in the electronic device 200.

Referring to fig. 4, a plurality of baffles 30 are disposed on the side wall 20, and the baffles 30 on the same side wall 20 are disposed side by side. The side wall 20 is provided with a plurality of ventilation holes 36, each ventilation hole 36 is communicated with a gap between two adjacent guide plates 30 to form a ventilation channel, the ventilation holes 36 are used for ventilation and heat dissipation, and the guide plates 30 can also be used for blocking external larger foreign matters from entering the back plate 100 and blocking part of dust.

Each of the baffles 30 includes a connecting portion 32 and a baffle portion 34, one end of the connecting portion 32 is connected to the side wall 20, the other end of the connecting portion 32 is connected to the baffle portion 34, and the baffle portion 34 is disposed in the accommodating groove 25 through the connecting portion 32.

The connecting portion 32 and the side wall 20 form an included angle therebetween, and in this embodiment, the included angle between the connecting portion 32 and the side wall 20 is 90 °.

The shape of the connection portion 32 is not limited, and the cross section of the connection portion 32 may be a straight line, a broken line, an arc, and the like.

Preferably, the connecting portion 32 has a broken line or an arc shape in cross section. In this embodiment, the cross section of the connecting portion 32 is a broken line.

The baffle portion 34 is disposed apart from the side wall 20 through the connecting portion 32, the angle between the baffle portion 34 and the side wall 20 is greater than or equal to 0 °, in this embodiment, the angle between the baffle portion 34 and the side wall 20 is 0 °, that is, the baffle portion 34 is parallel to the side wall 20, so that ventilation is facilitated, and foreign matters can be prevented from directly sliding down to the back plate 100.

The baffle portions 34 of the baffles 30 on the same side wall extend in the same direction so that the adjacent baffles 30 form the ventilation holes 36 to facilitate ventilation and heat dissipation of the components 240 inside the backplane 100.

For convenience of illustration, please refer to fig. 4 again, a connection point of the connection portion 32 of one of the baffles 30 and the sidewall 20 is defined as a; the connection point of the connecting portion 32 and the baffle portion 34 is B, and the projection of the connection point B on the side wall 20 is B'; the end point of the baffle part 34 far away from the connecting part 32 is C, and the projection of the end point C on the side wall 20 is C'; the connecting portion 32 of another adjacent baffle 30 is connected to the sidewall 20 at a point D, wherein two adjacent baffle portions 34 both extend toward the same direction, and A, B, C and D both lie in the same plane.

The distance between the connection point A and the connection point D is L1, the distance between the connection point A and the projection C' is L2, and L1 is equal to or less than L2, namely, the distance between two adjacent connection parts 32 is smaller than or equal to the distance between the connection parts 32 and the baffle plate part 34 projected on the side wall 20. Therefore, under the condition that the back plate 100 has good ventilation and heat dissipation performance, external foreign matters can be ensured to directly fall into the back plate 100; meanwhile, the elements 240 accommodated inside the back panel 100 cannot be directly seen from the outside of the back panel 100, which improves the aesthetic property.

Further, the projection B 'is located between the connection point a and the projection C', for example, the cross section of the connection portion 32 is a broken line or an arc, on one hand, a space can be provided for the extension of the baffle portion 34, which is beneficial to increase the width of the baffle portion 34 (i.e. the distance between the connection point B and the end point C), so as to ensure that L1 ≦ L2; on the other hand, the width of the baffle plate part 34 is too long, so that the distance between two adjacent baffle plate parts 34 is too short, and the ventilation and heat dissipation performance is reduced.

Further, each of the baffles 30 further includes a protrusion 322, the protrusion 322 is disposed at a connection position of the connection portion 32 and the sidewall 20, and the protrusion 322 may be disposed on one or both sides of the connection portion 32. The bump 322 can reduce the distance between two adjacent connecting portions 32 (i.e. the distance between the connecting point a and the connecting point B) to further ensure that L1 is less than or equal to L2.

Further, the back plate 100 further includes a blocking portion 35, the blocking portion 35 is connected to the side wall 20, and the blocking portion 35 is disposed in each of the ventilation holes 36. It is understood that the number of the blocking portions 35 may be one or more. The blocking portion 35 is used to reduce the area enclosed by two adjacent connecting portions 32 and the side wall 20, that is, the area of each vent hole 36, so as to further prevent foreign matters from entering the back plate 100.

Further, a plurality of openings 52 are disposed on one of the side walls 20, and the openings 52 are communicated with the accommodating groove 25.

After the back plate 100 is assembled into the electronic device 200, the sidewall 20 with the opening 52 is located at the lower side of the electronic device 200 and is parallel to the horizontal line, and the sidewall 20 with the opening 52 is located at the left side, the right side and/or the upper side of the electronic device 200. The opening 52 is provided to facilitate the external air or cool air to enter the rear panel 100 from the lower side of the rear panel 100, and then according to the principle of using the hot air to rise, the hot air generated by the heat dissipation of the components 240 in the rear panel 100 is discharged from the ventilation holes 36 located at the left side, the right side and/or the upper side by the effect of the air deflector 30, so as to enhance the heat dissipation performance and ensure the aesthetic appearance of the electronic device 200.

The back plate 100 further comprises a mounting portion 40, the mounting portion 40 extends outwards along the periphery of the side wall 20, and the plane of the mounting portion 40 may be substantially parallel to the bottom wall 10. The mounting portion 40 is used to mount the backplate 100 on the electronic device 200.

The present application further provides an electronic device 200, wherein the electronic device 200 may be a communication device, an air conditioning device, or the like. In the present embodiment, the electronic device 200 is a display.

Specifically, the electronic device 200 includes a fixing base 210, a frame 220, a front panel 230, a component 240, and the rear panel 100. The front panel 230 is fixedly disposed in the frame 220, the back plate 100 is fixedly connected to the frame 220 through the mounting portion 40, the component 240 is received in the receiving groove 25 of the back plate 100, and the fixing base 210 is fixed to the back plate 100, so as to assemble the electronic device 200.

According to the back plate 100 provided by the embodiment of the application, the plurality of the guide plates 30 are arranged, so that the ventilation and heat dissipation performance of the back plate 100 is ensured; in addition, by the size design of the connecting portion 32 and the baffle portion 34 of the flow guide plate 30, external impurities can be prevented from directly entering the backboard 100, and the components 240 contained in the backboard 100 can be prevented from being directly seen from the outside, thereby improving the appearance of the electronic device 200.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.