阅读说明：本技术 散热结构、方法及具有所述散热结构的电子装置 (Heat dissipation structure, method and electronic device with heat dissipation structure ) 是由 邱崇哲 于 2020-06-03 设计创作，主要内容包括：本发明公开一种散热结构、方法及具有所述散热结构的电子装置,所述散热结构包括：待散热元件,所述待散热元件包括第一元件及第二元件；致冷器,靠近所述第一元件设置,所述致冷器形成第一散热通道对所述第一元件进行散热,将所述第一元件的温度控制为第一目标温度；以及散热器,靠近所述待散热元件及所述致冷器设置,所述散热器形成第二散热通道对所述第二元件进行散热,将所述第二元件的温度控制为第二目标温度,所述第一目标温度高于所述第二目标温度。(The invention discloses a heat radiation structure, a method and an electronic device with the heat radiation structure, wherein the heat radiation structure comprises: the device comprises a component to be radiated, a first radiating component and a second radiating component, wherein the component to be radiated comprises the first component and the second component; the refrigerator is arranged close to the first element, forms a first heat dissipation channel to dissipate heat of the first element, and controls the temperature of the first element to be a first target temperature; and the radiator is arranged close to the element to be radiated and the refrigerator, forms a second radiating channel to radiate the second element, and controls the temperature of the second element to be a second target temperature, wherein the first target temperature is higher than the second target temperature.)

1. A heat radiation structure is characterized in that: the heat dissipation structure includes:

the device comprises a component to be radiated, a first radiating component and a second radiating component, wherein the component to be radiated comprises the first component and the second component;

the refrigerator is arranged close to the first element, forms a first heat dissipation channel to dissipate heat of the first element, and controls the temperature of the first element to be a first target temperature; and

the radiator is arranged close to the element to be radiated and the refrigerator, a second radiating channel is formed by the radiator to radiate the second element, the temperature of the second element is controlled to be a second target temperature, and the first target temperature is higher than the second target temperature.

2. The heat dissipating structure of claim 1, wherein the refrigerator includes an refrigerant end and a heat dissipating end, the refrigerant end being proximate to the first element and the heat dissipating end being proximate to the heat sink.

3. The heat dissipating structure of claim 2, wherein a conductive surface is formed between the heat dissipating end and the heat sink, the conductive surface having an interface temperature, the interface temperature being higher than the second target temperature and lower than the first target temperature.

4. The heat dissipating structure of claim 1, wherein the refrigerator is a semiconductor refrigerator.

5. The heat dissipation structure of claim 1, wherein: the radiator is at least one or a combination of a plurality of radiating fins, fans and heat pipes.

6. The heat dissipation structure of claim 1, wherein the first element is a blue light emitting diode and the second element is a red light emitting diode or a green light emitting diode.

7. The heat dissipation structure of claim 1, wherein the first target temperature is 65 ℃ to 70 ℃ and the second target temperature is 45 ℃.

8. A heat dissipation method is used for dissipating heat of an element to be dissipated, wherein the element to be dissipated at least comprises a first element and a second element, and the heat dissipation method is characterized in that: the heat dissipation method comprises the following steps:

forming a first heat dissipation channel to dissipate heat of the first element so as to control the temperature of the first element to be a first target temperature; and

and forming a second heat dissipation channel to dissipate heat of the second element so as to control the temperature of the second element to be a second target temperature, wherein the first target temperature is higher than the second target temperature.

9. The method of claim 8, wherein a conductive surface is formed between the first heat dissipation channel and the second heat dissipation channel, the conductive surface having an interface temperature, the interface temperature being higher than the second target temperature and lower than the first target temperature.

10. An electronic device, characterized in that: the electronic device includes the heat dissipation structure as recited in any one of claims 1 to 7.

Technical Field

The present disclosure relates to heat dissipation technologies, and particularly to a heat dissipation structure, a method thereof, and an electronic device having the heat dissipation structure.

Background

When an electronic device is used to dissipate heat, one or more heat conductive heat sinks, such as heat sinks or fans, are commonly used to dissipate heat of a plurality of components disposed in the electronic device, and the temperatures of the plurality of components can only be lowered to a same target temperature.

Disclosure of Invention

In view of the foregoing, it is desirable to provide a heat dissipation structure and a method for achieving differential temperature control of different components, and an electronic device having the heat dissipation structure.

A heat dissipation structure, the heat dissipation structure comprising:

the device comprises a component to be radiated, a first radiating component and a second radiating component, wherein the component to be radiated comprises the first component and the second component;

the refrigerator is arranged close to the first element, forms a first heat dissipation channel to dissipate heat of the first element, and controls the temperature of the first element to be a first target temperature; and

the radiator is arranged close to the element to be radiated and the refrigerator, a second radiating channel is formed by the radiator to radiate the second element, the temperature of the second element is controlled to be a second target temperature, and the first target temperature is higher than the second target temperature.

Preferably, the refrigerator includes an refrigerant end and a heat sink end, the refrigerant end being proximate to the first element and the heat sink end being proximate to the heat sink.

Preferably, a conduction surface is formed between the heat dissipation end and the heat sink, and the conduction surface has an interface temperature which is higher than the second target temperature and lower than the first target temperature.

Preferably, the refrigerator is a semiconductor refrigerator.

Preferably, the heat sink is at least one or a combination of a heat sink, a fan, and a heat pipe.

Preferably, the first element is a blue light emitting diode, and the second element is a red light emitting diode or a green light emitting diode.

Preferably, the first target temperature is 65 ℃ to 70 ℃ and the second target temperature is 45 ℃.

A heat dissipation method is used for dissipating heat of an element to be dissipated, wherein the element to be dissipated at least comprises a first element and a second element, and the heat dissipation method comprises the following steps:

forming a first heat dissipation channel to dissipate heat of the first element so as to control the temperature of the first element to be a first target temperature; and

and forming a second heat dissipation channel to dissipate heat of the second element so as to control the temperature of the second element to be a second target temperature, wherein the first target temperature is higher than the second target temperature.

Preferably, a conducting surface is formed between the first heat dissipation channel and the second heat dissipation channel, and the conducting surface has an interface temperature, and the interface temperature is higher than the second target temperature and lower than the first target temperature.

An electronic device comprises the heat dissipation structure.

Compared with the prior art, the heat dissipation structure, the heat dissipation method and the electronic device with the heat dissipation structure respectively dissipate heat of the first element and the second element through different heat dissipation channels formed by the refrigerator and the radiator, so that the temperatures of the first element and the second element are respectively controlled at the first target temperature and the second target temperature, and differential temperature control of different elements is realized.

Drawings

Fig. 1 is a schematic view of an electronic device according to a preferred embodiment of the invention.

Fig. 2 is a schematic view of an electronic device according to another preferred embodiment of the invention.

Fig. 3 is a flowchart of a heat dissipation method according to a preferred embodiment of the invention.

Description of the main elements

Electronic device 100, 200

Heat dissipation structure 10

Element to be radiated 11

First element 111

Second elements 113, 113a, 113b

Refrigerator 13

Refrigerating end 131

Heat dissipating end 133

Conducting surface 135

Heat sink 14, 14a

End 141, 141a, 141b

Connecting part 143

The following detailed description will further illustrate the invention in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "electrically connected" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "electrically connected" to another element, it can be connected by contact, e.g., by wires, or by contactless connection, e.g., by contactless coupling.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, a preferred embodiment of the present invention provides an electronic device 100, where the electronic device 100 includes a heat dissipation structure 10, the heat dissipation structure 10 is used for dissipating heat of components disposed in the electronic device 100, and the electronic device 100 may be a projector, a computer, or the like. In the preferred embodiment, the electronic device 100 is taken as a projector for illustration.

The heat dissipation structure 10 includes a component 11 to be dissipated, a refrigerator 13 and a heat sink 14. The refrigerator 13 and the heat sink 14 are used for dissipating heat of the element to be dissipated 11.

The element to be radiated 11 includes a first element 111 and a second element 113. In the preferred embodiment, the number of the first element 111 and the second element 113 is 1. The first element 111 has a low requirement on the working temperature and needs to work at a first target temperature, the second element 113 has a high requirement on the working temperature and needs to work at a second target temperature, and the first target temperature is higher than the second target temperature. It is to be understood that the first target temperature and the second target temperature may be temperature values or temperature ranges, and it is only necessary that the temperature value or the temperature range corresponding to the first target temperature is higher than the temperature value or the temperature range corresponding to the second target temperature.

In the preferred embodiment, the first element 111 and the second element 113 are light emitting diodes in a light source device of the projector, wherein the first element 111 is a blue light emitting diode, and the first target temperature is 65 ℃ to 70 ℃; the second element 113 is a red light emitting diode or a green light emitting diode, and the second target temperature is 45 ℃.

The refrigerator 13 is disposed close to the first element 111, and the refrigerator 13 forms a first heat dissipation channel to dissipate heat of the first element 111, so as to control the temperature of the first element 111 to a first target temperature. The refrigerator 13 includes an refrigerant end 131 and a heat sink end 133, the refrigerant end 131 is close to the first element 111, and the heat sink end 133 is close to the heat sink 14. A conductive surface 135 is formed between the heat dissipating end 133 and the heat sink 14, and the conductive surface 135 has an interface temperature higher than the second target temperature and lower than the first target temperature. In the preferred embodiment, the refrigerator 13 is a semiconductor refrigerator.

The heat sink 14 is disposed close to the element to be cooled 11 and the refrigerator 13, the heat sink 14 forms a second heat dissipation channel to dissipate heat of the second element 113, and the temperature of the second element 113 is controlled to a second target temperature. The heat sink 14 is at least one or a combination of heat sink fins, fans, and heat pipes.

In the preferred embodiment, the heat sink 14 includes a plurality of heat dissipation fins stacked to form an end portion 141 and a connecting portion 143 connected to the end portion 141, the end portion 141 is disposed near the second element 113, and the connecting portion 143 is disposed near the refrigerator 13.

Referring to fig. 2, a preferred embodiment of the invention provides an electronic device 200, the structure and the operation principle of the electronic device 200 are substantially the same as those of the electronic device 100, but the electronic device 200 includes two second elements 113a and 113b, for example, a red light emitting diode or a green light emitting diode, respectively, and the second target temperatures of the two second elements 113a and 113b are the same temperature value or the same temperature range. Correspondingly, the electronic device 200 further includes a heat sink 14a, the heat sink 14a includes two end portions 141a and 141b and a connecting portion 143 connected to the end portions 141a and 141b, the two end portions 141a and 141b are respectively disposed near the second elements 113a and 113b, and the connecting portion 143 is disposed near the refrigerator 13.

In another embodiment, the number of the second elements 113 may be greater than 2 as long as the corresponding second target temperatures are the same temperature value or the same temperature range, and accordingly, the number of the heat sinks 14 or the number of the end portions 141 may be increased to control the temperature of the second elements 113 at the second target temperature.

When the second target temperature is a temperature range, for example, 20 ℃ to 40 ℃, the second target temperature may include a plurality of second sub-target temperatures, and each of the second elements 113 may correspond to a plurality of different second sub-target temperatures, for example, the second sub-target temperature of one second element 113 is 25 ℃ and the second sub-target temperature of another second element 113 is 20 ℃, so that the temperature differential control of the plurality of second elements 113 is further realized, and the temperature differential control may be realized by changing the number (for example, increasing or decreasing the number) or the arrangement (for example, adjusting the distance between the fan and the second element 113) of the heat sink 14.

In another embodiment, the number of the first elements 111 may be multiple, as long as the corresponding first target temperatures are the same temperature value or the same temperature range, and accordingly, the number of the refrigerators 13 may be increased to control the temperature of the first elements 111 to be the first target temperature.

When the first target temperature is a temperature range, for example, 65 ℃ to 70 ℃, the first target temperature may include a plurality of first sub-target temperatures, and each first element 111 may correspond to a plurality of different first sub-target temperatures, for example, the first sub-target temperature of one first element 111 is 65 ℃ and the first sub-target temperature of another first element 111 is 70 ℃, so that further temperature differential control over the plurality of first elements 111 may be achieved by changing the number (for example, increasing or decreasing the number) or setting manner (for example, adjusting the distance between the refrigerator 13 and the first element 111) of the refrigerators 13.

Referring to fig. 3, a heat dissipation method for dissipating heat of a device 11 to be dissipated is provided in a preferred embodiment of the present invention, where the device 11 to be dissipated at least includes a first device 111 and a second device 113, and the heat dissipation method includes the following steps:

step S301, a first heat dissipation channel is formed to dissipate heat of the first element 111, so as to control the temperature of the first element to be a first target temperature.

Step S302, forming a second heat dissipation channel to dissipate heat of the second element 113, so as to control the temperature of the second element to be a second target temperature, where the first target temperature is higher than the second target temperature.

A conducting surface 135 is formed between the first heat dissipation channel and the second heat dissipation channel, and the conducting surface 135 has an interface temperature, which is higher than the second target temperature and lower than the first target temperature.

It is understood that when the number of the first elements 111 is plural, the first target temperature includes a plurality of first sub target temperatures, and the plurality of first elements 111 are respectively radiated by increasing the number of the refrigerators 13 to form a plurality of first radiation channel branches to control the temperature thereof to be the plurality of first sub target temperatures.

It is understood that when the number of the second elements 113 is plural, the first target temperature includes a plurality of second sub-target temperatures, and the plurality of second elements 113 are respectively radiated by increasing the number of the heat sinks 14 to form a plurality of second sub-radiating channel branches to control the temperature thereof to be at the plurality of second sub-target temperatures.

The heat dissipation structure 10 and method and the electronic device 100 and 200 with the heat dissipation structure 10 of the present invention form different heat dissipation channels through the refrigerator 13 and the heat sink 14 to respectively dissipate heat of the first element 111 and the second element 113, so as to respectively control the temperatures of the first element 111 and the second element 113 at a first target temperature and a second target temperature, thereby realizing differential temperature control of different elements.

In addition, the heat dissipation structure 10, the method and the heat dissipation device 10 of the present invention can further realize the control of the temperature difference between the first element 111 and the second element 113 by increasing the number of the refrigerators 13 and the heat sinks 14.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention. Those skilled in the art can also make other changes and the like in the design of the present invention within the spirit of the present invention as long as they do not depart from the technical effects of the present invention. Such variations are intended to be included within the scope of the invention as claimed.