阅读说明：本技术 具有集成信号传输功能的部件及其制造方法 (Component with integrated signal transmission function and method for producing the same ) 是由 克里斯蒂安·克拉克森贝格 于 2021-06-08 设计创作，主要内容包括：本发明涉及一种用于制造具有集成信号传输功能的部件(10)的方法,其中提供了具有多个电导体(14)的信号传输结构(12),且将信号传输结构(12)嵌入在电绝缘的载体材料(16)中,其中,在部件(10)上至少制造一个用于将信号馈送到导体(14)中和/或用于从导体(14)中读出信号的接口(18)。此外,本发明还涉及一种具有集成信号传输功能的部件(10)。(The invention relates to a method for producing a component (10) having an integrated signal transmission function, wherein a signal transmission structure (12) having a plurality of electrical conductors (14) is provided, and the signal transmission structure (12) is embedded in an electrically insulating carrier material (16), wherein at least one interface (18) for feeding signals into the conductors (14) and/or for reading signals out of the conductors (14) is produced on the component (10). The invention further relates to a component (10) having an integrated signal transmission function.)

1. A method for producing a component (10) with an integrated signal transmission function, wherein a signal transmission structure (12) having a plurality of electrical conductors (14) is provided and the signal transmission structure (12) is embedded in an electrically insulating carrier material (16), wherein at least one interface (18) for feeding signals into the conductors (14) and/or for reading signals out of the conductors (14) is produced on the component (10).

2. The method of claim 1,

the signal transmission structure (12) is manufactured by weaving conductors (14) into a woven metal mesh constituting the signal transmission structure (12).

3. The method of claim 1,

the signal transmission structure (12) is made of a metal plate by separating a conductor (14) designed as a busbar from the metal plate.

4. The method of claim 3,

the conductor (14) is separated from the metal plate by a laser.

5. The method according to claims 2 to 4,

after the conductor (14) has been woven into a woven metal mesh or after the conductor (14) has been separated from a metal sheet, the conductor (14) is shaped into a three-dimensional structure and is then embedded in a carrier material (16).

6. The method of claim 5,

and forming the conductor into the three-dimensional structure by stamping or compression molding.

7. The method according to any of the preceding claims,

embedding the conductor (14) in the carrier material (16) by:

-injection-coating the conductor (14) with the carrier material (16) by means of an injection-moulding process, or

-making the carrier material (16) in which the conductor (14) is embedded a thermoplastic adhesive, or

-making the carrier material (16) a thin film arranged on the conductor (14).

8. The method according to any of the preceding claims,

an intermediate component (20) is first produced by embedding the signal transmission structure (12) in a carrier material (16), which intermediate component is mounted on the other components (22) during the production of the component (10).

9. The method according to any of the preceding claims,

the conductor (14) is at least partially made of aluminum or copper.

10. A component (10) with integrated signal transmission functionality, comprising a signal transmission structure (12) with a plurality of conductors (14) embedded in an electrically insulating carrier material (16), wherein the component (10) has at least one interface (18) for feeding signals into the conductors (14) and/or reading signals out of the conductors (14).

Technical Field

The invention relates to a method for producing a component with integrated signal transmission and to a component with integrated signal transmission.

Background

The signals transmitted within the component elements generally require a relatively high cost and, in addition, the requirements for the mechanical carrying capacity of the component elements are increased. In general, a conventional wiring assembly or a flexible circuit board is used in such constituent elements. This typically requires manual operations during the manufacturing process and results in a corresponding cost.

Disclosure of Invention

The object of the present invention is therefore to provide a solution by means of which the signal transmission function can be implemented in a component in a particularly simple and reliable manner.

In a method according to the invention for producing a component with integrated signal transmission function, a signal transmission structure with a plurality of electrical conductors is provided and is embedded in an electrically insulating carrier material, wherein at least one interface for feeding signals into the conductors and/or at least one interface for reading signals out of the conductors is produced on the component.

The component produced may be, for example, a so-called high-pressure tank for electrically driving a motor vehicle. In principle, however, the component described may be any component with integrated signal transmission functionality. In the case of the described high-pressure tank, which is usually composed of an aluminum diecast housing, this high-pressure tank can be replaced by the method according to the invention by a plastic material in the form of a carrier material, in which the electrical conductors serving as signal transmission structures have been embedded.

The electrical conductor embedded in the carrier material constitutes a signal transmission structure with a signal transmission function, which allows a high mechanical load-bearing capacity of the manufactured component, in particular compared to components filled with conventional fillers. The component, which is usually produced as an aluminum injection-molded housing, can therefore be replaced by a plastic component with an integrated metal grid by means of the method according to the invention, wherein the metal grid is formed by the signal transmission structure and the plastic component is formed from an electrically insulating carrier material. Furthermore, EMC (electromagnetic compatibility) performance is improved in the component manufactured according to the invention. Furthermore, for example, a control or the like, which is connected together with several or all electrical conductors in a signal-technical manner, can also be integrated into the component.

By means of the method according to the invention, the signal transmission function can be integrated in the component. Thus, the required wiring assembly can often be replaced partially or completely. Manual operations for realizing such a signal transmission function can thus be reduced, so that process risks can be reduced. In particular, the method according to the invention can be carried out in a fully automated manner.

In other words, the conductors of the signal carrying structure embedded in the insulating carrier material constitute a kind of "molded data signal lines". The electrical conductors of the signal transmission structure show signal processing, signal interception and signal distribution points. By means of the method according to the invention, it is thus possible to provide components with integrated signal transmission functions in a particularly simple and reliable manner.

One possible embodiment of the method provides that the signal transmission structure is produced by weaving the conductors into a woven metal mesh forming the signal transmission structure. The signal transmission structure can thus be produced in a particularly resource-saving manner. In the manufacture of the signal transmission structure, there is little or no waste material, since only the conductors need to be provided (deflected and then woven into a woven metal mesh, if necessary).

A possible alternative embodiment of the invention provides for the signal transmission structure to be produced from a metal plate by separating the conductors, which are designed as busbars, from the metal plate. The conductor can be separated from the metal plate, in particular, by means of a laser. The metal plate can be, for example, an aluminum plate or a copper plate, wherein the corresponding busbar run can be cut out by means of a laser device. The greatest advantage here is that any contour can be flexibly embodied, whereby a plurality of different variants and modifications can be quickly implemented in a single device. To create a new variant, only the corresponding laser software for cutting needs to be reprogrammed for this purpose.

Another possible embodiment of the invention provides that after the conductor has been woven into a metal woven mesh or after the conductor has been separated from the metal sheet, the conductor is shaped into a three-dimensional structure and is then embedded in a carrier material. Thus, if only a two-dimensional profile is required in the signal transmission structure, the conductors can be embedded directly in the insulating carrier material. On the other hand, if it is necessary or desirable for the signal transmission structure consisting of electrical conductors to have a three-dimensional contour, it can be provided that after the conductors have been woven into a woven metal mesh or after the conductors have been separated from the metal sheet, the conductors are shaped into said three-dimensional structure and then first embedded in a carrier material. After three-dimensional shaping, it can be ensured by the conductors embedded in the carrier material that this three-dimensional structure is still maintained.

In a further possible embodiment of the invention, provision is made for the conductor to be shaped into a three-dimensional structure by stamping or pressing. The molding can be flexibly and modularly constructed so that it can be automatically adapted to changes and modifications during the production process.

Another possible embodiment of the invention provides that the conductors are embedded in the carrier material by injection molding the conductors with the carrier material by means of an injection molding process, or by the carrier material being a thermoplastic adhesive in which the conductors are embedded, or by the carrier material being a film arranged on the conductors. If the conductors are injection-molded with the carrier material, the conductors and the signal transmission structure contribute to the mechanical stability of the component, in which case the respective rail, which is formed from the conductors, is regarded as a filler. Instead of injection-molding the conductors of the signal transmission structure coated with the carrier material, it is also possible to embed the carrier material in a thermoplastic binder or to embed the carrier material in a film. In both cases, the conductor can be fixed in the desired pattern.

Another possible embodiment of the invention provides that, by embedding the signal transmission structure in the carrier material, an intermediate component is first produced, which is mounted on the other components in the component construction to form the component. The signal transmission structure embedded in the carrier material thus forms an assembly part or assembly in the form of an intermediate component. The intermediate component can then in principle be mounted arbitrarily on the other component, thus forming the component. Of course, it is also possible to manufacture a plurality of such intermediate components in an integrated signal transmission structure and to mount them on another component at the same time as the component is constructed. Alternatively, the finished component can also be produced directly, for example by an injection molding process, when the signal transmission structure is embedded in the carrier material. In the latter case, the entire component with integrated signal transmission structure may be produced by a single process step.

Another possible embodiment of the invention provides that the conductor is at least partially made of aluminum or copper. For example, the conductors may also be made from various aluminum alloys or copper alloys. The conductor may, for example, have a circular but also an angular cross section. For example, the conductor may also have a hexagonal cross-section. In the case of an angular cross section of the conductor, a particularly firm embedding of the conductor in the carrier material is facilitated. The conductors may also have different cross-sections or widths depending on the application. Thus, not only can signals be transmitted via the conductors, but the conductors can also have, for example, higher currents, if desired and necessary.

The component with integrated signal transmission function according to the invention comprises a signal transmission structure with a plurality of conductors which are embedded in an electrically insulating carrier material, wherein the component has at least one interface for feeding signals into the conductors and/or at least one interface for reading signals out of the conductors. Possible embodiments of the method described are to be considered as possible embodiments of the components described and vice versa. The component can in principle be any component, in particular a component for a motor vehicle, for example in the form of a high-pressure tank or the like.

Further advantages, features and details of the invention can be taken from the following description of possible embodiments and with reference to the drawings. The features and feature combinations described above in the description and also features and feature combinations described below in the description of the figures and/or shown in the figures only in isolation can be used not only in the respectively specified combination but also in other combinations or in isolation without departing from the scope of the invention.

Drawings

The figures show:

fig. 1 is a highly schematic diagram showing a component with integrated signal transmission functionality, which is achieved by a signal transmission structure with a plurality of electrical conductors embedded in an electrically insulating carrier material.

FIG. 2 is a schematic diagram showing a signal transmission structure

Fig. 3 is a highly schematic illustration showing another possible embodiment of a component, wherein the signal transmission structure embedded in the insulating carrier material is an intermediate component element which has been mounted on another component element when the component is constructed.

Identical or functionally identical elements in the figures are provided with the same reference numerals.

Detailed Description

In fig. 1, a component 10 with integrated signal transmission functionality is shown in a highly schematic illustration. The component 10 comprises a signal transmission structure 12 having a plurality of electrical conductors 14, wherein for the sake of clarity not all electrical conductors are provided with reference numerals. The electrical conductors 14 constituting the signal transmission structure 12 of the component 10 are embedded in an electrically insulating carrier material 1. The component 10 further comprises a plurality of interfaces 18 for feeding signals into the respective conductors 14 and/or for reading signals out of the conductors 14. Furthermore, the component 10 has a central processor 19 in which all the conductors 14 converge.

The interface 18 may be used partly for intercepting signals or, for example, also as a measuring point. Several interfaces 18 may also be used for feeding current into the component 10 or for outputting current from the component 10. The component 10 shown here can be, for example, a high-pressure tank for electrically driven vehicles. In principle, however, the component 10 shown here can be any component in which a signal transmission function in the form of a signal transmission structure 12 shown here schematically is embedded.

In fig. 2, the signal transmission structure 12 is shown in a schematic view. The signal transmission structure 12 may be manufactured, for example, by weaving the individual conductors 14 into a woven metal mesh that constitutes the signal transmission structure 12. Alternatively, the signal transmission structure 12 can also be produced from a metal plate, not shown here, by separating the metal conductors, which are designed as busbars, from the metal plate. Said separation can be done, for example, by means of a laser.

The signal transmission structure 12 may also be fabricated to have a three-dimensional profile depending on boundary conditions or applications. In this case, provision may be made for the conductor 14 to be shaped into a three-dimensional structure, for example by stamping or compression molding, after the conductor 14 has been woven into a metal woven mesh or after the conductor 14 has been separated from the metal sheet, and then to be embedded in the carrier material 16.

Embedding the corresponding conductors 14 in the carrier material 16 can be done in a variety of ways. For example, it can be provided that the conductor 14 of the signal transmission structure 12 is injection-molded with the carrier material 16 by means of an injection molding process. Alternatively, the carrier material 16 can also be provided in the form of a thermoplastic adhesive, in which the conductor 14 is embedded. The carrier material 16 may also be a thin film on which the conductors 14 are arranged.

The component 10 can be produced directly in a single process step, in particular by injection molding, wherein the final contour of the component 10 is produced by means of an injection molding tool, wherein, for example, a previously produced signal transmission structure 12 is arranged with the respective conductor 14 and is subsequently injection-molded with a carrier material 16.

In fig. 3, another possible embodiment of the component 10 is shown highly schematically. It is also possible to initially produce an intermediate component 20 by embedding the signal transmission structure 12 in the carrier material 16, which intermediate component can be mounted on the other component 22, which is shown schematically here, during the construction of the component 10. For example, it is also possible to produce a plurality of such intermediate components 20 with corresponding integrated signal transmission structures 12, in order to be able to mount a plurality of such intermediate components 20, for example, on further components 22 when the component 10 is constructed. However, as already mentioned, it is also possible to manufacture the signal transmission structure 12 directly as an integral component of the component 10, in particular to injection mold the signal transmission structure 12 with the carrier material 16 by injection molding, from which the remaining part of the component 10 can also be produced, for example.

The electrical conductor 14 for signal transmission can be made of, for example, aluminum alloy, copper alloy, or other electrically conductive material. Here, the conductor 14 may have any cross-sectional shape, such as circular, hexagonal, or other shape. The conductors 14 form a type of grid within the component 10 and help to improve the mechanical load bearing capability of the component 10. In addition to the signal transmission function, the conductor 14 contributes to the mechanical stability of the component 10.

List of reference numerals

10 parts

12 signal transmission structure

14 conductor

16 support material

18 interface

19 central processing unit

20 intermediate constituent element

22 other constituent elements