阅读说明：本技术 一种微型无线音频模块 (Miniature wireless audio module ) 是由 周宏达 吴忠威 江文耀 李勋 于 2021-09-17 设计创作，主要内容包括：本发明公开了一种微型无线音频模块,其包括基体以及配合于基体的无线通信模组、通信天线和微型扬声器；所述通信天线和微型扬声器与无线通信模组电连接；所述微型扬声器包括振动机体、可在交变电信号作用下产生交变磁场的可动磁体以及可产生磁场的固定磁体；所述振动机体包括与基体相配合的基座以及活动配合于基座上的振动片,基座与振动片之间形成有安装空间,所述振动机体的振动片上配合有至少一个与无线通信模组电连接的可动磁体,且可动磁体为采用半导体工艺制作的半导体线圈芯片；所述固定磁体配合于安装空间中。本发明集成有无线通信功能和声音播放功能,且体积小。(The invention discloses a micro wireless audio module, which comprises a base body, a wireless communication module, a communication antenna and a micro loudspeaker, wherein the wireless communication module, the communication antenna and the micro loudspeaker are matched with the base body; the communication antenna and the micro loudspeaker are electrically connected with the wireless communication module; the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal; the vibrating body comprises a base matched with the base body and a vibrating plate movably matched on the base, an installation space is formed between the base and the vibrating plate, at least one movable magnet electrically connected with the wireless communication module is matched on the vibrating plate of the vibrating body, and the movable magnet is a semiconductor coil chip manufactured by adopting a semiconductor process; the fixed magnet is fitted in the installation space. The invention integrates the wireless communication function and the sound playing function and has small volume.)

1. A miniature wireless audio module, its characterized in that: the wireless communication device comprises a base body, a wireless communication module, a communication antenna and a micro loudspeaker, wherein the wireless communication module, the communication antenna and the micro loudspeaker are matched with the base body;

the communication antenna is electrically connected with the wireless communication module;

the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal; the vibrating body comprises a base matched with the base body and a vibrating plate movably matched on the base, an installation space is formed between the base and the vibrating plate, at least one movable magnet electrically connected with the wireless communication module is matched on the vibrating plate of the vibrating body, and the movable magnet is a semiconductor coil chip manufactured by adopting a semiconductor process; the fixed magnet is fitted in the installation space.

2. The miniature wireless audio module of claim 1, wherein: the fixed magnet is a magnet.

3. The miniature wireless audio module of claim 1, wherein: the fixed magnet is a semiconductor coil chip manufactured by adopting a semiconductor process, and the fixed magnet is electrically connected with the wireless communication module.

4. A miniature wireless audio module as claimed in claim 1 or 3, wherein: the semiconductor coil chip is matched with a magnetizer with magnetic permeability.

5. A miniature wireless audio module as claimed in claim 1 or 3, wherein: the semiconductor coil chip comprises at least one coil layer, and at least one coiled coil body is etched on the coil layer; when the number of the coils on the coil layer is more than two, the coil bodies of the coil layer are connected in series and/or in parallel; when the semiconductor coil chip includes at least two coil layers, the coil bodies of the coil layers are connected in series and/or in parallel.

6. A miniature wireless audio module as claimed in claim 1 or 3, wherein: the semiconductor coil chip comprises at least one coil layer, at least one coil body is arranged on the coil layer, the coil body comprises a plurality of metal wire sections etched on the coil layer and distributed in a spiral shape, two ends of each metal wire section of the coil body are divided into a starting end and an ending end along the spiral direction of the coil body, the starting ends of the metal wire sections of the coil body are connected in parallel, and the ending ends of the metal wire sections of the coil body are connected in parallel.

7. The miniature wireless audio module of claim 6, wherein: the semiconductor coil chip also comprises an electrode layer, wherein the electrode layer is provided with a first electrode region and a second electrode region, the first electrode region is electrically connected with the initial end of each metal wire section of the coil body of the coil layer, and the second electrode region is electrically connected with the tail end of each metal wire section of the coil body of the coil layer.

8. The miniature wireless audio module of claim 1, wherein: the base body is plate-shaped, and the wireless communication module, the communication antenna and the micro loudspeaker are matched on the same end face of the base body.

9. The miniature wireless audio module of claim 1, wherein: an accommodating cavity is formed in the base body, and at least one sound hole communicated with the accommodating cavity is formed in the base body; the wireless communication module and the micro speaker are matched in the accommodating cavity of the base body and are stacked together, the vibrating plate of the micro speaker is a vibrating diaphragm, and the communication antenna is matched on the surface of the base body.

10. The miniature wireless audio module of claim 1, wherein: the vibrating plate has magnetic permeability and/or the vibrating plate is matched with a magnetic conductive plate with magnetic permeability.

Technical Field

The invention relates to the technical field of electronics, in particular to a miniature wireless audio module.

Background

At present, many electronic devices are equipped with a wireless communication module and a loudspeaker to realize short-distance communication transmission and sound playing functions; wherein wireless communication module often separates with the speaker, and this is because the coil that inside magnet of speaker and wire winding formed can occupy great space and make the speaker bulky, and the wireless audio module that forms can have bulky problem together with speaker and wireless communication module integration like this, is unfavorable for the electronic equipment miniaturization.

Disclosure of Invention

The invention aims to provide a miniature wireless audio module which integrates a wireless communication function and a sound playing function and is small in size.

In order to achieve the above purpose, the solution of the invention is:

a micro wireless audio module comprises a base body, a wireless communication module, a communication antenna and a micro loudspeaker, wherein the wireless communication module, the communication antenna and the micro loudspeaker are matched with the base body; the communication antenna is electrically connected with the wireless communication module; the micro loudspeaker comprises a vibrating body, a movable magnet and a fixed magnet, wherein the movable magnet can generate an alternating magnetic field under the action of an alternating electric signal; the vibrating body comprises a base matched with the base body and a vibrating plate movably matched on the base, an installation space is formed between the base and the vibrating plate, at least one movable magnet electrically connected with the wireless communication module is matched on the vibrating plate of the vibrating body, and the movable magnet is a semiconductor coil chip manufactured by adopting a semiconductor process; the fixed magnet is fitted in the installation space.

The fixed magnet is a magnet.

The fixed magnet is a semiconductor coil chip manufactured by adopting a semiconductor process, and the fixed magnet is electrically connected with the wireless communication module.

The semiconductor coil chip is matched with a magnetizer with magnetic permeability.

The semiconductor coil chip comprises at least one coil layer, and at least one coiled coil body is etched on the coil layer; when the number of the coils on the coil layer is more than two, the coil bodies of the coil layer are connected in series and/or in parallel; when the semiconductor coil chip includes at least two coil layers, the coil bodies of the coil layers are connected in series and/or in parallel.

The semiconductor coil chip comprises at least one coil layer, at least one coil body is arranged on the coil layer, the coil body comprises a plurality of metal wire sections etched on the coil layer and distributed in a spiral shape, two ends of each metal wire section of the coil body are divided into a starting end and an ending end along the spiral direction of the coil body, the starting ends of the metal wire sections of the coil body are connected in parallel, and the ending ends of the metal wire sections of the coil body are connected in parallel.

The semiconductor coil chip also comprises an electrode layer, wherein the electrode layer is provided with a first electrode region and a second electrode region, the first electrode region is electrically connected with the initial end of each metal wire section of the coil body of the coil layer, and the second electrode region is electrically connected with the tail end of each metal wire section of the coil body of the coil layer.

The base body is plate-shaped, and the wireless communication module, the communication antenna and the micro loudspeaker are matched on the same end face of the base body.

An accommodating cavity is formed in the base body, and at least one sound hole communicated with the accommodating cavity is formed in the base body; the wireless communication module and the micro speaker are matched in the accommodating cavity of the base body and are stacked together, the vibrating plate of the micro speaker is a vibrating diaphragm, and the communication antenna is matched on the surface of the base body.

The vibrating plate has magnetic permeability and/or the vibrating plate is matched with a magnetic conductive plate with magnetic permeability.

After the scheme is adopted, the wireless communication module is combined with the communication antenna, so that the wireless communication loudspeaker has a wireless communication function, and the micro loudspeaker can play a sound playing function; the movable magnet of the micro-speaker is a semiconductor coil chip manufactured by adopting a semiconductor process, so that the micro-speaker is small in size, and the micro wireless audio module has the advantage of small size.

Drawings

FIG. 1 is a schematic structural diagram according to a first embodiment of the present invention;

FIG. 2 is a schematic structural diagram according to a second embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a micro-speaker according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a micro-speaker according to a second embodiment of the present invention;

fig. 5 is a schematic structural diagram of a micro-speaker according to a third embodiment of the present invention;

fig. 6 is a schematic structural diagram of a fourth embodiment of a micro-speaker according to the present invention;

FIG. 7 is a schematic structural diagram of a first embodiment of a semiconductor coil chip according to the present invention;

FIG. 8 is a schematic structural diagram of a second embodiment of a semiconductor coil chip according to the present invention;

FIG. 9 is a schematic view showing the connection between an electrode layer and a coil layer of a second embodiment of a semiconductor coil chip according to the present invention;

description of reference numerals:

a base body 1, a containing cavity 11, a sound hole 12,

the wireless communication module (2) is provided with a wireless communication module,

the communication antenna (3) is provided with,

the micro-speaker 4, the installation space 40,

a vibrating body 41, a base 411, a fixing plate 4111, a fixing frame 4111', a vibrating plate 412,

the movable magnet (42) is mounted on the frame,

the fixed magnet 43 is fixed to the fixed body,

the microphone (5) is arranged in the casing,

the audio-frequency processing module (6) is provided with,

the coil comprises a semiconductor coil chip A, a coil layer A1, a coil body A11, a metal wire segment A111, a starting end A1111, a tail end A1112, a magnetizer A2, an electrode layer A3, a first electrode area A31, a first metal wire A311, a second electrode area A32 and a second metal wire A321.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.

As shown in fig. 1 to 9, the present invention discloses a micro wireless audio module, which comprises a base 1, a wireless communication module 2, a communication antenna 3 and a micro speaker 4, wherein the wireless communication module 2, the communication antenna 3 and the micro speaker 4 are matched with the base 1; the communication antenna 3 and the micro loudspeaker 4 are electrically connected with the wireless communication module 2, the communication antenna 3 can be directly etched on the substrate 1, so that the occupied space of the communication antenna 3 is small, the wireless communication module 2 is combined with the communication antenna 3, so that the wireless communication module has a wireless communication function, and the wireless communication module 2 can adopt a Bluetooth module or a WiFi module and the like; the micro loudspeaker 4 can realize the function of playing sound; the micro-speaker 4 is small in size, so that the number of the micro-speakers 4 can be set to be more than one according to the requirement, and the sound quality is improved. In addition, the invention can also comprise a microphone 5 matched with the base body 1, the microphone 5 is electrically connected with the wireless communication module 2, and the microphone 5 can pick up sound, so that the invention has a sound pick-up function.

As shown in fig. 1, in the first embodiment of the present invention, the base 1 is a plate, the wireless communication module 2, the communication antenna 3, the micro speaker 4 and the microphone 5 are fitted on the same end surface of the base 1, and a circuit for electrically connecting the wireless communication module 2, the communication antenna 3, the micro speaker 4 and the microphone 5 may be etched on the base 1; the wireless communication module 2, the communication antenna 3, the micro loudspeaker 4 and the microphone 5 are matched on the same end face of the base body 1, so that the space occupied by the wireless communication module 2, the communication antenna 3, the micro loudspeaker 4 and the microphone 5 matched on the end face perpendicular to the base body 1 is small.

As shown in fig. 2, in the second embodiment of the present invention, an accommodating cavity 11 is formed inside the base 1, and at least one sound hole 12 communicated with the accommodating cavity 11 is formed on the base 1; the wireless communication module 2, the micro speaker 4 and the microphone 5 are matched in the accommodating cavity 11 of the base body 1, the sound hole 12 enables the microphone 5 to pick up outside sound and enables sound played by the micro speaker 4 to be transmitted to the outside, and the communication antenna 3 is matched on the surface of the base body 1; the wireless communication module 2, the micro loudspeaker 4 and the microphone 5 are stacked together, so that the space occupation of the wireless communication module 2, the micro loudspeaker 4 and the microphone 5 in the horizontal direction is reduced; in addition, the wireless communication module 2 and the micro-speaker 4 can be electrically connected through the audio processing module 6, so that the sound effect of the micro-speaker 4 is better.

Specifically, as shown in fig. 3 to 6, the micro-speaker 4 includes a vibrating body 41, a movable magnet 42 capable of generating an alternating magnetic field under the action of an alternating electrical signal, and a fixed magnet 43 capable of generating a magnetic field; the vibrating body 41 comprises a base 411 matched with the base 1 and a vibrating piece 412 movably matched on the base 411, a mounting space 40 is formed between the base 411 and the vibrating piece 412, at least one movable magnet 42 electrically connected with the wireless communication module 2 is matched on the vibrating piece 412, and the movable magnet 42 matched on the vibrating piece 412 can be matched on the inner side of the vibrating piece 412; the fixed magnet 43 is fitted in the installation space 40. The working principle of the micro-speaker 4 is as follows: when the wireless communication module 2 inputs an alternating electric signal containing audio information to the movable magnet 42, the movable magnet 42 generates an alternating magnetic field to change the stress of the movable magnet 42 in the magnetic field generated by the fixed magnet 43, so that the movable magnet 42 drives the vibrating piece 412 to vibrate; the vibrating plate 412 may be a vibrating diaphragm or a resonance plate, and the vibrating diaphragm can vibrate air to make sound when vibrating, and the resonance plate can make a resonance medium in contact with the vibrating diaphragm to make sound when vibrating; wherein the resonance sheet may have an elastic structure so that the resonance sheet may be deformed to vibrate; the resonator plate may be a hard structure, and the resonator plate may be movably fitted to the base 411, so that the resonator plate may also move to vibrate; the resonance sheet can be made of metal, plastic or a giant magnetostrictive material, wherein the resonance sheet is preferably made of the giant magnetostrictive material, the magnetostrictive coefficient of the giant magnetostrictive material is far greater than that of the traditional magnetostrictive material, and the giant magnetostrictive material has the advantages of high conversion rate between mechanical energy and electric energy at room temperature, high energy density, high response speedThe sound effect of the invention can be effectively improved, and the requirements of the giant magnetostrictive material adopted by the resonance piece are as follows: coefficient of saturation magnetostriction greater than 10^-5The saturation magnetization field intensity is more than 40 kA/m, and the energy conversion efficiency is more than 45%. Here, in the second embodiment of the present invention, the vibrating plate 412 of the micro-speaker 4 is a diaphragm.

As shown in fig. 3, in the first embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is opened at the upper side, the number of the vibrating pieces 412 of the vibrating body 41 is one, the vibrating pieces 412 are fitted at the upper side opening of the base 411, the vibrating pieces 412 are fitted with a movable magnet 42, and the fixed magnet 43 is fixed on the inner bottom wall of the base 411; in the first embodiment of the micro-speaker according to the present invention, the vibrating reed 412 is not limited to one movable magnet 42, and one or more movable magnets 42 may be attached to the vibrating reed 412, and the larger the number of movable magnets 42 attached to the vibrating reed 412 is, the larger the amplitude of the vibration of the vibrating reed 412 becomes, and the larger the sound emitted by the present invention becomes.

In the second and third embodiments of the micro-speaker according to the present invention, as shown in fig. 4 and 5, the number of the vibrating pieces 412 of the vibrating body 41 is at least two, and the movable magnets 42 coupled to the vibrating pieces 412 are connected in series or in parallel, so that the vibrating pieces 412 of the present invention can vibrate in different directions to generate sound, thereby enhancing the sound-generating effect of the present invention. As shown in fig. 4, in the second embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is opened at the upper and lower sides, the fixing plate 4111 is provided in the base 411, the number of the vibrating pieces 412 of the vibrating body 41 is two, the two vibrating pieces 412 are respectively fitted in the openings at the upper and lower sides of the base 411, the two vibrating pieces 412 are respectively fitted with one movable magnet 42, and the fixed magnet 43 is fixed on the fixing plate 4111 of the base 411. As shown in fig. 5, in the third embodiment of the micro-speaker of the present invention, the base 411 of the vibrating body 41 is open at the upper, lower, left, and right sides, the fixing frame 4111 'is provided in the base 411, the number of the vibrating pieces 412 of the vibrating body 41 is four, the four vibrating pieces 412 are respectively fitted in the openings at the upper, lower, left, and right sides of the base 1, the four vibrating pieces 412 are respectively fitted with one movable magnet 42, and the fixed magnet 43 is fixed on the fixing frame 4111' of the base 411.

As shown in fig. 6, in the fourth embodiment of the micro-speaker according to the present invention, the number of the fixed magnets 43 is the same as that of the vibrating pieces 412, and the fixed magnets 43 are disposed to be opposite to the vibrating pieces 412 one by one, so that the fixed magnets 43 apply magnetic fields to the movable magnets 42 engaged with the vibrating pieces 412, respectively, and the movable magnets 42 engaged with the vibrating pieces 412 receive a large magnetic field from the fixed magnets 43, thereby enabling a large amplitude of vibration of the vibrating pieces 412.

As shown in fig. 3 to 9, the movable magnet 42 is a semiconductor coil chip a manufactured by a semiconductor process, when an alternating electrical signal is applied to a coil inside the semiconductor coil chip a, the semiconductor coil chip a can generate an alternating magnetic field, and since the semiconductor coil chip a is etched by a semiconductor technology, the pitch of a coil body in the semiconductor coil chip a can be made very small, so that a finished product of the semiconductor coil chip a has advantages of small volume and light weight compared with a coil formed by winding a metal wire, so that the movable magnet 42 of the micro-speaker 4 is made of the semiconductor coil chip a, the movable magnet 42 can be made small in volume, the micro-speaker 4 of the present invention is made small in volume, and the entire volume of the present invention can be made small. As shown in fig. 3 to 9, the fixed magnet 43 may also be a semiconductor coil chip a manufactured by a semiconductor process, so that the volume of the micro-speaker of the present invention is smaller, the fixed magnet 43 is electrically connected to the wireless communication module 2, and the wireless communication module 2 transmits an electrical signal to the fixed magnet 43 to enable the fixed magnet 43 to generate a magnetic field. Of course, the fixed magnet 43 may be a magnet directly, and the magnet itself can directly emit a magnetic field, and the cost is low.

In the first embodiment of the semiconductor coil chip a, as shown in fig. 7, specifically, the semiconductor coil chip a includes at least one coil layer a1, and at least one coil body a11 in a spiral shape is etched on a coil layer a 1; wherein in order to increase the strength of the magnetic field generated by the semiconductor coil chip A; when the number of the coil bodies a11 on the coil layer a1 is more than two, the coil bodies a11 of the coil layer a1 are connected in series and/or in parallel, so that the coil bodies a11 of the coil layer a1 can be connected with electric signals at the same time, and the magnetic fields generated by the coil bodies a11 of the coil layer a1 can be superposed together; in the case that the semiconductor coil chip a includes at least two coil layers a1, the coil bodies a11 of the coil layers a1 may be connected in series and/or in parallel, so that the coil layers a1 may be simultaneously connected to electrical signals to allow the magnetic fields generated by the coil layers a1 to be superimposed, thereby increasing the strength of the magnetic field generated by the semiconductor coil chip a. As shown in fig. 7, in the first embodiment of the semiconductor coil chip a, the semiconductor coil chip a may be matched with a magnetizer a2 having magnetic permeability, and the magnetizer a2 having magnetic permeability may reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby increasing the strength of the magnetic field generated by the semiconductor coil chip a; the semiconductor coil chip A can be provided with a matching hole, the magnetizer A2 is arranged in the matching hole, and the magnetizer A2 can be made of one of mu alloy, permalloy, electric furnace steel, nickel-zinc ferrite, manganese-zinc ferrite, pure iron (0.05 impurity), magnetic conductive alloy (5Mo79Ni), soft steel (0.2C), iron (0.2 impurity), silicon steel (4Si), 78 permalloy (78Ni), nickel, platinum, aluminum and other substances with magnetic conductivity; the material of the magnetizer a2 may also be other magnetic materials doped with magnetic conductive elements, such as iron, nickel, copper, molybdenum, manganese, zinc, platinum, aluminum, etc. with magnetic conductivity.

Specifically, in the second embodiment of the semiconductor coil chip a, as shown in fig. 8, the semiconductor coil chip a includes at least one coil layer A1, at least one coil body a11 is disposed on the coil layer A1, the coil body a11 includes a plurality of metal line segments a111 etched on the coil layer A1 and arranged in a spiral shape, two ends of the metal line segment a111 of the coil body a11 are divided into a starting end a1111 and a trailing end a1112 in a spiral direction of the coil body a11, the metal line segments a111 of the coil body a11 are connected in parallel, wherein the starting ends a1111 of the metal line segments a111 of the coil body a11 are connected in parallel and the trailing ends a1112 of the metal line segments a111 of the coil body a11 are connected in parallel. Because the metal wire segments A111 of the coil body A11 are arranged in a spiral shape, and the metal wire segments A111 of the coil body A11 are connected in parallel, the current density of the coil layer A1 can be increased, and the overall resistance of the coil body A11 is reduced in a parallel connection manner, so that the semiconductor coil chip A can have a stronger magnetic field function when realizing a small size. In the second embodiment of the semiconductor coil chip a shown in fig. 9, the semiconductor coil chip a may further include an electrode layer A3, the electrode layer A3 is provided with a first electrode region a31 and a second electrode region a32, the first electrode region a31 is electrically connected to the start end a1111 of each metal segment a111 of the coil body a11 of the coil layer A1, and the second electrode region a32 is electrically connected to the end a1112 of each metal segment a111 of the coil body a11 of the coil layer A1, so that the metal segments a111 of the coil body a11 are connected in parallel through the electrode layer A3; the first electrode regions a31 of the electrode layer A3 are connected to the beginning a1111 of the wire segments a111 of the coil body a11 of the coil layer A1 via a plurality of first wires a311, respectively, and the second electrode regions a32 of the electrode layer A3 are connected to the ending a1112 of the wire segments a111 of the coil body a11 of the coil layer A1 via a plurality of second wires a321, respectively.

In the present invention, the vibrating reed 412 may be made of a magnetic conductive material having magnetic conductivity, and the vibrating reed 412 has magnetic conductivity and can reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a; the base 411 may also be made of a magnetic conductive material having magnetic conductivity, so that the base 411 has magnetic conductivity to reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of force of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a. In addition, in the present invention, the vibrating reed 412 may be matched with a magnetic conductive sheet having magnetic conductivity, and the vibrating reed 412 may be connected to the movable magnet 42 through the magnetic conductive sheet having magnetic conductivity so as to reduce the magnetic resistance of the semiconductor coil chip a and strengthen the magnetic lines of the magnetic field generated by the semiconductor coil chip a, thereby improving the strength of the magnetic field generated by the semiconductor coil chip a.

The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.