阅读说明：本技术 一种圆晶沟槽镀膜设备 (Round crystal groove coating equipment ) 是由 向宇 向国清 于 2021-08-17 设计创作，主要内容包括：本发明公开了一种圆晶沟槽镀膜设备,包括传动链条,传动链条上轴接有若干涂布板,涂布板上安装有圆晶夹持装置,涂布板底部连接有齿轮；所述传动链条两侧安装有限位板,沿传动链条传动方向依次安装有清洗剂涂布板枪、第一刮平机构、聚硅氮烷涂布枪和第二刮平机构；所述清洗剂涂布板枪和聚硅氮烷涂布枪对应位置的一侧限位板上固定有与齿轮啮合的齿条。本发明在涂布前采用清洗剂降低沟槽的表面张力以及粘度,从而有效防止气泡产生,此外采用特殊结构,使得其喷涂是形成螺旋线构造,便于涂布,节省了原料。(The invention discloses a round crystal groove coating device which comprises a transmission chain, wherein a plurality of coating plates are axially connected with the transmission chain, round crystal clamping devices are installed on the coating plates, and gears are connected to the bottoms of the coating plates; limiting plates are arranged on two sides of the transmission chain, and a cleaning agent coating plate gun, a first leveling mechanism, a polysilazane coating gun and a second leveling mechanism are sequentially arranged along the transmission direction of the transmission chain; and racks meshed with the gears are fixed on the limiting plates on one sides of the corresponding positions of the cleaning agent coating plate gun and the polysilazane coating gun. The invention adopts the cleaning agent to reduce the surface tension and viscosity of the groove before coating, thereby effectively preventing bubbles from generating.)

1. A wafer groove coating device is characterized by comprising a transmission chain (1), wherein a plurality of coating plates (2) are axially connected with the transmission chain (1), wafer clamping devices (3) are installed on the coating plates (2), and gears (4) are connected to the bottoms of the coating plates (2); limiting plates (5) are arranged on two sides of the transmission chain (1), and a cleaning agent coating plate gun (6), a first scraping mechanism (7), a polysilazane coating gun (8) and a second scraping mechanism (9) are sequentially arranged along the transmission direction of the transmission chain (1); and a rack (10) meshed with the gear (4) is fixed on the limiting plate (5) at one side of the corresponding positions of the cleaning agent coating plate gun (6) and the polysilazane coating gun (8).

2. The wafer groove coating equipment as claimed in claim 1, wherein the cleaning agent is butyl ether.

3. The wafer groove coating equipment according to claim 2, wherein the wafer clamping device (3) comprises a plurality of limiting blocks (31) arranged along the circumferential direction of the coating plate (2), and the limiting blocks (31) are connected with clamping blocks (33) through elastic structures (32).

4. The wafer groove coating equipment according to claim 3, wherein the elastic structure (32) is a spring, and the end of the clamping block (33) is wedge-shaped.

5. The wafer groove coating equipment according to claim 1, wherein the first scraping mechanism (7) and the second scraping mechanism (9) have the same structure and each comprise a lifting structure (11), the lifting structure (11) is connected with a rotating structure (12), and the rotating structure (12) is connected with a scraping plate (13).

6. The wafer groove coating equipment according to claim 5, wherein the lifting structure (11) is an electric cylinder, and the rotating structure (12) is a motor.

7. The wafer groove coating equipment according to claim 1, wherein the coating plate (2) comprises a conical head (21), and a mounting rod (22) is connected to the conical head (21).

Technical Field

The invention belongs to the field of semiconductors, and particularly relates to a wafer groove coating device.

Background

As the size of semiconductor devices is gradually reduced, the trench size of semiconductor devices is gradually increased toward the aspect ratio. This causes the air to be easily sealed in the groove when the groove is filled with polysilazane, resulting in a cavity inside, and thus a plating apparatus that reduces the probability of the cavity is required.

In addition, the conventional coating device usually drops enough polysilazane in the middle of the wafer and then coats it evenly, which is easy to waste raw materials and causes the top of the groove to be blocked due to insufficient initial coating amount of the groove on the periphery.

Disclosure of Invention

In order to solve the problems, the invention discloses a wafer groove coating device. The invention adopts the cleaning agent to reduce the surface tension and viscosity of the groove before coating, thereby effectively preventing bubbles from generating.

In order to achieve the purpose, the technical scheme of the invention is as follows:

a coating device for a round crystal groove comprises a transmission chain, wherein a plurality of coating plates are axially connected with the transmission chain, a round crystal clamping device is installed on each coating plate, and a gear is connected to the bottom of each coating plate; limiting plates are arranged on two sides of the transmission chain, and a cleaning agent coating plate gun, a first leveling mechanism, a polysilazane coating gun and a second leveling mechanism are sequentially arranged along the transmission direction of the transmission chain; and racks meshed with the gears are fixed on the limiting plates on one sides of the corresponding positions of the cleaning agent coating plate gun and the polysilazane coating gun.

In a further improvement, the cleaning agent is butyl ether.

The wafer clamping device comprises a plurality of limiting blocks arranged along the circumferential direction of the coating plate, and the limiting blocks are connected with clamping blocks through elastic structures.

In a further improvement, the elastic structure is a spring, and the end part of the clamping block is wedge-shaped.

The improved structure of the first scraping mechanism and the second scraping mechanism is the same and comprises lifting structures, the lifting structures are connected with rotating structures, and the rotating structures are connected with scraping plates.

In a further improvement, the lifting structure is an electric cylinder, and the rotating structure is a motor.

In a further improvement, the coating plate comprises a conical head, and the conical head is connected with a mounting rod.

The invention has the advantages that:

the invention adopts the cleaning agent to reduce the surface tension and viscosity of the groove before coating, thereby effectively preventing bubbles from generating.

Drawings

FIG. 1 is a schematic diagram of a front cross-sectional structure of the present invention;

FIG. 2 is a schematic side view of the present invention;

fig. 3 is a schematic top view of the smearing out to form a helix.

Detailed Description

The invention is further explained with reference to the drawings and the embodiments.

Examples

The coating equipment for the round crystal groove as shown in fig. 1 and fig. 2 comprises a transmission chain 1, a coating plate 2, a conical head 21, a mounting rod 22, a round crystal clamping device 3, a limiting block 31, an elastic structure 32, a clamping block 33, a gear 4, a limiting plate 5, a cleaning agent coating plate gun 6, a first leveling mechanism 7, a polysilazane coating gun 8, a second leveling mechanism 9, a rack 10, a lifting structure 11, a rotating structure 12 and a leveling plate 13.

The transmission chain 1 is axially connected with a plurality of coating plates 2, the coating plates 2 are provided with wafer clamping devices 3, and the bottoms of the coating plates 2 are connected with gears 4; limiting plates 5 are arranged on two sides of the transmission chain 1, and a cleaning agent coating plate gun 6, a first leveling mechanism 7, a polysilazane coating gun 8 and a second leveling mechanism 9 are sequentially arranged along the transmission direction of the transmission chain 1; and a rack 10 meshed with the gear 4 is fixed on the limiting plate 5 at one side of the corresponding positions of the cleaning agent coating plate gun 6 and the polysilazane coating gun 8. The cleaning agent is butyl ether.

The molecular formula of the butyl ether is C₄H₉₂O, molecular weight 130.23, colorless liquid, slightly ether odor. Can be used as solvent, electronic grade cleaning agent and organic synthesis. It is used as solvent in organic synthesis, and also as extractant and refining agent for organic acid, wax, resin, etc. The invention adopts the property of the cleaning agent, namely the cleaning agent is easy to be attached to the surface of an object,therefore, the surface tension and viscosity of the wafer groove are reduced, polysilazane can flow along the groove wall conveniently, and the sealed bubbles are effectively prevented.

Silazane polymers are inorganic polymers with a main chain of Si-N, which can be converted to SiCN, SiCNO or silica ceramics at high temperatures due to the particularity of their chemical structures.

The round crystal clamping device 3 comprises a plurality of limiting blocks 31 arranged along the circumferential direction of the coating plate 2, and the limiting blocks 31 are connected with clamping blocks 33 through springs. The end of the clamping block 33 is wedge-shaped.

The first scraping mechanism 7 and the second scraping mechanism 9 are identical in structure and respectively comprise a lifting structure 11, the lifting structure 11 is connected with a rotating structure 12, and the rotating structure 12 is connected with a scraping plate 13. The lifting structure 11 is an electric cylinder, and the rotating structure 12 is a motor. The coating plate 2 comprises a conical head 21 to which a mounting rod 22 is attached to the conical head 21.

The using method of the invention is as follows:

as shown in fig. 1 and 2, the coating plate 2 moves under the drive of the transmission chain 1, when the cleaning agent coating plate gun 6 moves, the bottom gear contacts with the rack, so that the coating plate rotates while moving transversely, thereby forming a spiral structure as shown in fig. 3, thereby preventing the waste of raw materials during the coating process, then the coating plate 2 is stopped under the first scraping mechanism 7, the scraping plate of the first scraping mechanism 7 descends and rotates to evenly coat the butyl ether, so that the polysilazane coating liquid permeates into the surface of the groove, the transmission chain 1 continues to run to the position below the polysilazane coating gun 8, the transverse movement of the device is the same rotation, so that the polysilazane forms a spiral line shape on the surface of the coating plate 2, then the second strickling mechanism is coated uniformly, thereby saving raw materials, because the butyl ether is adopted for pre-coating, the polysilazane is convenient to permeate along the groove, thereby effectively reducing the occurrence of bubbles.

While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the specification and the embodiments, which are fully applicable to various fields of endeavor for which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.