阅读说明：本技术 一种光有源器件半导体衬底的数控抛光装置及工艺 (Numerical control polishing device and process for semiconductor substrate of optical active device ) 是由 肖志宏 于 2021-09-10 设计创作，主要内容包括：本发明公开了一种光有源器件半导体衬底的数控抛光装置及工艺,涉及抛光装置领域,包括工作台,所述工作台顶部两侧皆设置有安装板,且工作台内部底部安装有真空泵,一块所述安装板内侧壁一端滑动连接有第一滑块,且另一块安装板内侧壁远离第一滑块的一端滑动连接有第二滑块,所述第一滑块一端两侧皆安装有第二气缸。本发明通过在第四气缸上安装一组控制接料盘的第五气缸,且在水箱上安装水泵与热风机,在衬底一面抛光完成后,接料盘挡在抛光垫与抛光台之间,防止抛光垫上的抛光液滴落在衬底上,水泵与热风机再将衬底抛光完成的一面清洗干燥,防止在抛光衬底另一面时衬底上的残留物使衬底不平整降低抛光效果。(The invention discloses a numerical control polishing device and process for a semiconductor substrate of an optical active device, and relates to the field of polishing devices. According to the invention, the fifth cylinder for controlling the material receiving disc is arranged on the fourth cylinder, the water pump and the hot air blower are arranged on the water tank, after one surface of the substrate is polished, the material receiving disc is blocked between the polishing pad and the polishing table, so that polishing liquid on the polishing pad is prevented from dropping on the substrate, the polished surface of the substrate is cleaned and dried by the water pump and the hot air blower, and the polishing effect is reduced because the substrate is not flat due to residues on the substrate when the other surface of the substrate is polished.)

1. A numerical control polishing device for a semiconductor substrate of an optical active device comprises a workbench (1), and is characterized in that: the automatic feeding device is characterized in that mounting plates (2) are arranged on two sides of the top of the workbench (1), a vacuum pump (5) is arranged at the bottom inside the workbench (1), one end of the inner side wall of one mounting plate (2) is connected with a first sliding block (7) in a sliding manner, one end, far away from the first sliding block (7), of the inner side wall of the other mounting plate (2) is connected with a second sliding block (21) in a sliding manner, two sides of one end of the first sliding block (7) are provided with second cylinders (11), the output end of each second cylinder (11) is connected with a first connecting block (12), two sides of the bottom of each first connecting block (12) are provided with tension sensors (13), the other end of each tension sensor (13) is connected with a material taking sucker (14), two sides of one end of each second sliding block (21) are provided with third cylinders (23), the output end of each third cylinder (23) is connected with a second connecting block (24), and the second connecting block (24) is connected with a turnover sucker (26) in a rotating manner, and second motor (25) that output and upset sucking disc (26) are connected are installed to second connecting block (24) one side, the one end that vacuum pump (5) top is close to first slider (7) is connected with a set of first branch material platform (15) and the second branch material platform (16) that extend to workstation (1) top, and the one end that vacuum pump (5) top is close to second slider (21) is connected with second polishing platform (19) that extend to workstation (1) top, vacuum pump (5) top is located and is connected with between second branch material platform (16) and second polishing platform (19) and extends to first polishing platform (17) at workstation (1) top, and vacuum pump (5) top is located and is connected with between second polishing platform (19) and first polishing platform (17) and extends to workstation (1) top and upset sucking disc (26) complex transfer table (18), mounting panel (2) top is located first polishing platform (17) and second polishing platform (19) top and all installs installation platform (19) top There is fourth cylinder (27), and third motor (28) are installed to fourth cylinder (27) output, third motor (28) output is connected with lath (31), and lath (31) bottom surface is provided with polishing pad (32), fifth cylinder (33) are all installed to fourth cylinder (27) both sides, and fifth cylinder (33) output all is connected with take-up (34) that are located polishing pad (32) below.

2. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: fourth cylinder (27) output end edge is connected with spliced pole (29), and spliced pole (29) bottom is connected with the cover and establishes polishing solution frame (30) that lie in lath (31) top outside third motor (28) output, mounting panel (2) top is provided with polishing solution box (36), and all installs liquid pump (37) bottom polishing solution box (36) both sides, liquid pump (37) output is connected in spliced pole (29) with two fourth cylinder (27) outputs respectively, and liquid pump (37) output opening is towards polishing solution frame (30) top.

3. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: the mounting panel (2) inside wall is provided with respectively with first slider (7) and second slider (21) complex first spacing slide rail (6) and second spacing slide rail (20).

4. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: get material sucking disc (14) top intermediate junction and pass mounting panel (2) and workstation (1) first hose (10) of being connected with vacuum pump (5), and upset sucking disc (26) intermediate junction passes second hose (22) that mounting panel (2) and workstation (1) are connected with vacuum pump (5).

5. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: the top of the vacuum pump (5) is positioned at both sides of the first polishing table (17) and the second polishing table (19) and is provided with a sixth cylinder (39), and the output end of each group of the sixth air cylinders (39) is connected with a water tank (40) which is respectively connected with the first polishing table (17) and the second polishing table (19) in a sliding way, a partition plate (41) for dividing the water tank (40) into a purified water tank and a sewage tank is arranged in the water tank (40), the top of the water tank (40) is provided with a water pump (42) with an output end extending into the water purifying tank, and the other side of the top of the water tank (40) is provided with a hot air blower (44), the output ends of the water pump (42) and the hot air blower (44) are both connected with a bent pipe (43), the top of the workbench (1) is respectively provided with a third hose (45) wrapping the first polishing table (17) and the second polishing table (19), and the bottom of the third hose (45) is connected with a sewage tank.

6. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: a first cylinder (3) is installed at one end, close to a first sliding block (7), of the workbench (1), and the output end of the first cylinder (3) is connected with a material carrying plate (4).

7. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: polishing solution frame (30) bottom edge is provided with splashproof frame (35) of parcel polishing pad (32), workstation (1) both sides opposite one end all rotates and is connected with cabinet door (38).

8. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 3, wherein: first motor (8) are all installed to first spacing slide rail (6) and second spacing slide rail (20) one end, and first motor (8) output is connected with lead screw (9) with first slider (7) and second slider (21) threaded connection respectively.

9. A numerically controlled polishing apparatus for an optically active device semiconductor substrate as recited in claim 1, wherein: the top surfaces of the first material distribution table (15), the second material distribution table (16), the first polishing table (17), the transfer table (18) and the second polishing table (19) are all on the same horizontal line.

10. A numerical control polishing process of a semiconductor substrate of an optical active device is characterized by comprising the following steps: a numerical control polishing apparatus using the optically active device semiconductor substrate as claimed in any one of claims 1 to 9, comprising the steps of:

the method comprises the following steps: adding polishing solution into a polishing solution tank (36), then opening a cabinet door (38), adding water into a water purification tank of a water tank (40), closing the cabinet door (38), then placing the piled substrates on a material carrying plate (4), pushing the material carrying plate (4) by a first air cylinder (3) to enable the uppermost substrate and the top surface of a first material distributing table (15) to be positioned on the same horizontal line, and starting a vacuum pump (5);

step two: the first motor (8) drives the screw rod (9) to rotate, the first slider (7) is controlled to drive the material taking sucker (14) to move to the position above the material carrying plate (4), the second cylinder (11) can push the material taking sucker (14) to be close to the substrate, the first hose (10) is conducted to adsorb the substrate, the second cylinder (11) contracts to lift the material taking sucker (14) and the adsorbed substrate, then the first motor (8) controls the first slider (7) to move the material taking sucker (14) adsorbing the substrate to the position above the first distributing table (15), the second cylinder (11) extends out to enable the material taking sucker (14) to drive the substrate to move to the first distributing table (15), the first distributing table (15) is conducted to adsorb the bottom of the substrate, then the second cylinder (11) contracts, if the tensile force sensor (13) does not sense strong tensile force, the first motor (8) drives the first slider (7) to enable the sucker (14) to move to the position above the second distributing table (16) to repeat the operation, if the tension sensor (13) senses stronger tension, even if the first material distribution table (15) or the second material distribution table (16) is closed, the second air cylinder (11) contracts, the first sliding block (7) drives the material taking sucker (14) to place the substrate on the top of the first polishing table (17), and then the first sliding block (7) drives the material taking sucker (14) to reset;

step three: a liquid pump (37) sucks polishing liquid in a polishing liquid box (36) into a polishing liquid frame (30), a fifth air cylinder (33) extends out to push a material receiving disc (34) to be away from a polishing pad (32), a fourth air cylinder (27) at the top of a first polishing table (17) pushes a third motor (28) to descend to drive the polishing pad (32) to move to be attached to the top of a substrate, the polishing liquid flows into the polishing pad (32) from holes in the bottom of the polishing liquid frame (30) and meshes on a plate net (31), then the third motor (28) is started to drive the polishing pad (32) to rotate, the top of the substrate is polished, and a splash-proof frame (35) can wrap the substrate during polishing to prevent the polishing liquid from splashing;

step four: after the top surface of the substrate is polished, the fourth cylinder (27) contracts to drive the polishing pad (32) to be separated from the substrate, the fifth cylinder (33) contracts to drive the material receiving disc (34) to reset to the bottom of the polishing pad (32) to prevent the polishing liquid from continuously falling onto the substrate, then the sixth cylinder (39) pushes the water tank (40), the water pump (42) and the hot air blower (44) to ascend to enable the bent pipe (43) to face the top surface of the substrate, the water pump (42) pumps out the clean water in the clean water tank, the bent pipe (43) is used for washing away the polishing liquid residue on the top of the substrate, the washed sewage flows into the sewage tank through the third hose (45), then the hot air of the hot air blower (44) blows the top of the substrate through the bent pipe (43) to dry the substrate, and the sixth cylinder (39) can contract;

step five: the first motor (8) drives the screw rod (9) to rotate, the second slider (21) is controlled to drive the turnover sucker (26) to move to the position above the first polishing table (17), the third cylinder (23) pushes the turnover sucker (26) to descend, the second hose (22) is conducted, the turnover sucker (26) adsorbs a polishing pad, then the third cylinder (23) contracts to drive the turnover sucker (26) to ascend, the first motor (8) drives the turnover sucker (26) to move to the position above the transfer table (18), the third cylinder (23) stretches out, the second hose (22) is closed, a substrate is placed on the transfer table (18), the transfer table (18) is conducted to adsorb the substrate, then the second motor (25) drives the turnover sucker (26) to turn over by one hundred eighty degrees, the first motor (8) and the third cylinder (23) drive the turnover sucker (26) to adsorb the substrate from the bottom surface of the substrate, then the third cylinder (23) drives the second connecting block (24) and the turnover sucker (26) to ascend, the second motor (25) drives the turnover sucker (26) to turn over by one hundred eighty degrees, the first motor (8) and the third cylinder (23) drive the turnover sucker (26) to place the bottom surface of the substrate on the top of the second polishing table (19) in an upward mode, and finally the second sliding block (21) resets;

step six: a fourth air cylinder (27) above the second polishing table extends out, and the third step and the fourth step are repeated, so that the substrate can be polished;

step seven: after the water in the water tank (40) is used up or the sewage tank is full, the cabinet door (38) can be opened, and purified water is added into the purified water tank or sewage in the sewage tank is discharged.

Technical Field

The invention relates to the field of polishing devices, in particular to a numerical control polishing device and a numerical control polishing process for a semiconductor substrate of an optical active device.

Background

The optical active device is a key device for converting an electrical signal into an optical signal or vice versa in an optical communication system, and is a heart of an optical transmission system. Devices for converting electrical signals into optical signals are called light sources, mainly semiconductor Light Emitting Diodes (LEDs) and Laser Diodes (LDs), devices for converting optical signals into electrical signals are called photodetectors, mainly Photodiodes (PINs) and Avalanche Photodiodes (APDs), optical fiber amplifiers are new devices of optically active devices, erbium-doped fiber amplifiers (EDFAs) are currently used in large quantities, and raman optical amplifiers have a great application prospect.

The existing numerical control polishing device generally uses a sucker to take substrate materials, and the motor with a polishing pad is pushed by a cylinder to polish the substrate materials during polishing.

When taking the material through the sucking disc, probably lead to two or three adsorbs together because of reasons such as static friction between the substrate, can influence the polishing process when polishing, and when changing the polishing surface, the remaining impurity in ground probably leads to the substrate not smooth enough, influences polishing effect.

Disclosure of Invention

Based on the above, the invention aims to provide a numerical control polishing device and a process for a semiconductor substrate of an optical active device, so as to solve the technical problems that when the existing numerical control polishing device takes materials through a sucker, two or three substrates are possibly adsorbed together due to static friction and the like, the polishing process is influenced during polishing, and when the polishing surface is replaced, the polishing effect is influenced due to the fact that the substrates are not smooth enough due to impurities remained on the ground.

In order to achieve the purpose, the invention provides the following technical scheme: a numerical control polishing device for a semiconductor substrate of an optical active device comprises a workbench, wherein mounting plates are arranged on two sides of the top of the workbench, a vacuum pump is arranged at the bottom inside the workbench, one end of the inner side wall of one mounting plate is connected with a first slide block in a sliding manner, the other end, far away from the first slide block, of the inner side wall of the other mounting plate is connected with a second slide block in a sliding manner, second air cylinders are arranged on two sides of one end of the first slide block, the output end of each second air cylinder is connected with a first connecting block, tension sensors are arranged on two sides of the bottom of the first connecting block, the other end of each tension sensor is connected with a material taking suction disc, third air cylinders are arranged on two sides of one end of the second slide block, the output end of each third air cylinder is connected with a second connecting block, a turnover suction disc is rotatably connected on the second connecting block, and a second motor with the output end connected with the turnover suction disc is arranged on one side of the second connecting block, one end of the top of the vacuum pump close to the first sliding block is connected with a group of first material distribution table and second material distribution table which extend to the top of the workbench, and one end of the top of the vacuum pump close to the second sliding block is connected with a second polishing table extending to the top of the workbench, the top of the vacuum pump is positioned between the second material distribution table and the second polishing table and is connected with a first polishing table extending to the top of the workbench, and the top of the vacuum pump is positioned between the second polishing table and the first polishing table and is connected with a transfer table which extends to the top of the workbench and is matched with the turnover sucker, the top of the mounting plate is provided with a fourth cylinder above the first polishing table and the second polishing table, and the output end of the fourth cylinder is provided with a third motor, the output end of the third motor is connected with a plate net, and the bottom surface of the plate net is provided with a polishing pad, fifth cylinders are arranged on two sides of the fourth cylinder, and the output ends of the fifth cylinders are connected with material receiving discs positioned below the polishing pad.

Through adopting above-mentioned technical scheme, the vacuum pump can be used to the evacuation and adsorb the substrate, gets the substrate that the material sucking disc can absorb, gets the material sucking disc and can divide the substrate that overlaps with tensile force inductor and first branch material platform all second branch material platform, and the third motor can drive the polishing pad and give the substrate polishing, and the take-up (stock) pan can prevent that the polishing liquid drop from dropping on first polishing platform and second polishing platform.

The edge of the output end of the fourth cylinder is connected with a connecting column, the bottom of the connecting column is connected with a polishing solution frame which is sleeved outside the output end of the third motor and is positioned at the top of the plate net, the top of the mounting plate is provided with a polishing solution box, the bottoms of two sides of the polishing solution box are both provided with a liquid pump, the output ends of the liquid pumps are respectively connected with one connecting column of the output ends of the two fourth cylinders, and the opening of the output end of the liquid pump faces the top of the polishing solution frame.

By adopting the technical scheme, the polishing solution frame can enable polishing solution to be uniformly poured into the polishing pad, the polishing solution box can be used for storing the polishing solution, and the liquid pump can pump the polishing solution into the polishing solution frame.

The invention is further provided that the inner side wall of the mounting plate is respectively provided with a first limiting slide rail and a second limiting slide rail which are matched with the first slide block and the second slide block.

Through adopting above-mentioned technical scheme, first spacing slide rail and second spacing slide rail can restrict the slip of first slider and second slider respectively.

The invention is further arranged in such a way that a first hose which penetrates through the mounting plate and the workbench to be connected with the vacuum pump is connected to the middle of the top of the material taking sucker, and a second hose which penetrates through the mounting plate and the workbench to be connected with the vacuum pump is connected to the middle of the overturning sucker.

Through adopting above-mentioned technical scheme, first hose can be used to get the material sucking disc and adsorb the substrate, and the second hose can be used to upset sucking disc and adsorb the substrate.

The invention is further set that the top of the vacuum pump is provided with sixth cylinders at two sides of the first polishing table and the second polishing table, the output end of each group of sixth cylinders is connected with a water tank which is respectively connected with the first polishing table and the second polishing table in a sliding way, a partition board which divides the water tank into a clean water tank and a sewage tank is arranged in the water tank, the top of the water tank is provided with a water pump of which the output end extends into the clean water tank, the other side of the top of the water tank is provided with a hot air blower, the output ends of the water pump and the hot air blower are both connected with a bent pipe, the top of the workbench is respectively provided with a third hose which wraps the first polishing table and the second polishing table, and the bottom of the third hose is connected with the sewage tank.

By adopting the technical scheme, the sixth cylinder can push the bent pipe connected with the water pump and the air heater to face the first polishing table or the second polishing table, the water tank is divided by the partition plate and can be used for storing purified water and sewage, the water pump can draw the purified water in the water tank to flush the surface of the substrate through the bent pipe, the air heater can dry the surface of the substrate through the bent pipe, and the third hose can conveniently guide the sewage to flow into the sewage tank.

The invention is further provided that one end of the workbench close to the first slide block is provided with a first air cylinder, and the output end of the first air cylinder is connected with a material loading plate.

Through adopting above-mentioned technical scheme, first cylinder can promote the material loading board, makes the substrate of the top and first minute material platform be same horizontal line.

The polishing device is further provided with a splash-proof frame wrapping the polishing pad at the edge of the bottom of the polishing liquid frame, and the opposite ends of the two side surfaces of the workbench are rotatably connected with cabinet doors.

Through adopting above-mentioned technical scheme, the polishing solution splashes when splashproof frame can prevent to polish, and the cabinet door is convenient for water feeding drainage work of water tank, and is convenient for overhaul workstation inside.

The invention is further provided that one end of the first limit slide rail and one end of the second limit slide rail are both provided with a first motor, and the output end of the first motor is connected with a screw rod which is respectively in threaded connection with the first slide block and the second slide block.

Through adopting above-mentioned technical scheme, the removal of first slider and second slider can be controlled to first motor and lead screw.

The invention is further provided that the top surfaces of the first material distribution table, the second material distribution table, the first polishing table, the transfer table and the second polishing table are all on the same horizontal line.

By adopting the technical scheme, the top surfaces of the first material distribution table, the second material distribution table, the first polishing table, the transfer table and the second polishing table are all on the same horizontal line, so that the substrate can be conveniently moved to different working areas.

The invention also provides a numerical control polishing process of the semiconductor substrate of the optical active device, which comprises the following steps:

the method comprises the following steps: adding polishing solution into a polishing solution tank, then opening a cabinet door, adding water into a clean water tank of the water tank, closing the cabinet door, then placing the piled substrates on a material carrying plate, pushing the material carrying plate by a first air cylinder to enable the uppermost substrate and the top surface of a first distribution table to be positioned on the same horizontal line, and starting a vacuum pump;

step two: the first motor drives the screw rod to rotate, the first sliding block is controlled to drive the material taking sucker to move to the position above the material carrying plate, the second air cylinder can push the material taking sucker to be close to the substrate, the first hose is conducted to adsorb the substrate, the second air cylinder contracts to lift the material taking sucker and the adsorbed substrate, then the first motor controls the first sliding block to move the material taking sucker adsorbing the substrate to the position above the first distributing table, the second air cylinder extends out to enable the material taking sucker to drive the substrate to move to the first distributing table, the first distributing table is conducted to adsorb the bottom of the substrate, then the second air cylinder contracts, if the tensile force sensor does not sense strong tensile force, the first motor drives the first sliding block to move the material taking sucker to the position above the second distributing table to repeat the operation, if the tensile force sensor senses strong tensile force, even if the first distributing table or the second distributing table is closed, the second air cylinder contracts, the first sliding block drives the material taking sucker to place the substrate on the top of the first polishing table, then the first sliding block drives the material taking sucker to reset;

step three: the liquid pump sucks polishing liquid in the polishing liquid box into the polishing liquid frame, the fifth cylinder extends out to push the material receiving disc to be away from the polishing pad, the fourth cylinder at the top of the first polishing table pushes the third motor to descend to drive the polishing pad to move to be tightly attached to the top of the substrate, the polishing liquid flows into the polishing pad from the opening at the bottom of the polishing liquid frame and the meshes on the plate net, then the third motor is started to drive the polishing pad to rotate to polish the top of the substrate, and the splash-proof frame can wrap the substrate to prevent the polishing liquid from splashing during polishing;

step four: after the top surface of the substrate is polished, the fourth cylinder contracts to drive the polishing pad to be separated from the substrate, the fifth cylinder contracts to drive the material receiving disc to be reset to the bottom of the polishing pad to prevent polishing liquid from continuously falling onto the substrate, then the sixth cylinder pushes the water tank, the water pump and the hot air blower to ascend to enable the bent pipe to face the top surface of the substrate, the water pump pumps out clean water in the clean water tank, residues of the polishing liquid on the top of the substrate are washed away through the bent pipe, the washed sewage flows into the sewage tank through the third hose, hot air of the hot air blower blows the top of the substrate through the bent pipe to dry the substrate, and the sixth cylinder can contract;

step five: the first motor drives the screw rod to rotate, the second sliding block is controlled to drive the turnover sucker to move to the position above the first polishing table, the third air cylinder pushes the turnover sucker to descend, the second hose is conducted, the turnover sucker is enabled to adsorb the polishing pad, then the third cylinder contracts to drive the turnover sucker to ascend, the first motor drives the turnover sucker to move to the upper part of the transfer table, the third cylinder stretches out, the second hose is closed, the substrate is placed on the transfer table, the transfer table is conducted to adsorb the substrate, then the second motor drives the turnover sucker to turn over by one hundred eighty degrees, the first motor and the third cylinder drive the turnover sucker to suck the substrate from the bottom surface of the substrate, then the third cylinder drives the second connecting block and the turnover sucker to ascend, the second motor drives the turnover sucker to turn over by one hundred eighty degrees, the first motor and the third cylinder drive the turnover sucker to place the bottom surface of the substrate upwards on the top of the second polishing table, and finally the second sliding block resets;

step six: extending a fourth air cylinder above the second polishing table, and repeating the third step and the fourth step to finish polishing the substrate;

step seven: after the water in the water tank is used up or the sewage tank is full, the door of the cabinet can be opened, and purified water is added into the purified water tank or sewage in the sewage tank is discharged.

In summary, the invention mainly has the following beneficial effects:

1. according to the invention, the fifth cylinder for controlling the material receiving disc is arranged on the fourth cylinder, the water pump and the hot air blower are arranged on the water tank, after one surface of the substrate is polished, the material receiving disc is blocked between the polishing pad and the polishing platform, so that polishing liquid on the polishing pad is prevented from dropping on the substrate, the water pump and the hot air blower clean and dry the polished surface of the substrate, and the substrate is prevented from being uneven due to residues on the substrate when the other surface of the substrate is polished, so that the polishing effect is reduced;

2. according to the invention, the tension sensor is arranged between the material taking sucker and the first connecting block, the first material distributing table and the second material distributing table are arranged on the workbench, the bottom surface of the substrate is adsorbed by the first material distributing table or the second material distributing table, the top surface of the substrate is adsorbed by the material taking sucker, and the second air cylinder is contracted, so that whether the substrates adsorbed by the material taking sucker are overlapped or not can be judged according to the tension sensed by the tension sensor, and the influence of two or three overlapped substrates on polishing is prevented during polishing.

Drawings

FIG. 1 is a schematic diagram of a first perspective of the present invention;

FIG. 2 is a schematic diagram of a second perspective of the present invention;

FIG. 3 is a cross-sectional view of the present invention;

FIG. 4 is an enlarged view of A of FIG. 1 according to the present invention;

FIG. 5 is an enlarged view of B of FIG. 2 according to the present invention;

FIG. 6 is an enlarged view of C of FIG. 3 according to the present invention.

In the figure: 1. a work table; 2. mounting a plate; 3. a first cylinder; 4. a material carrying plate; 5. a vacuum pump; 6. a first limiting slide rail; 7. a first slider; 8. a first motor; 9. a screw rod; 10. a first hose; 11. a second cylinder; 12. a first connection block; 13. a tension sensor; 14. a material taking sucker; 15. a first material distribution table; 16. a second material distribution table; 17. a first polishing table; 18. a transfer table; 19. a second polishing table; 20. a second limiting slide rail; 21. a second slider; 22. a second hose; 23. a third cylinder; 24. a second connecting block; 25. a second motor; 26. turning over the sucker; 27. a fourth cylinder; 28. a third motor; 29. connecting columns; 30. a polishing solution frame; 31. a plate net; 32. a polishing pad; 33. a fifth cylinder; 34. a take-up pan; 35. a splash-proof frame; 36. a polishing solution tank; 37. a liquid pump; 38. a cabinet door; 39. a sixth cylinder; 40. a water tank; 41. a partition plate; 42. a water pump; 43. bending the pipe; 44. a hot air blower; 45. a third hose.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following describes an embodiment of the present invention based on its overall structure.

A numerical control polishing device for semiconductor substrate of optical active device, as shown in figure 1-6, comprises a workbench 1, wherein both sides of the top of the workbench 1 are provided with mounting plates 2, and the bottom of the interior of the workbench 1 is provided with a vacuum pump 5 capable of vacuumizing for absorbing the substrate, one end of the inner side wall of one mounting plate 2 is connected with a first slide block 7 in a sliding way, one end of the inner side wall of the other mounting plate 2 far away from the first slide block 7 is connected with a second slide block 21 in a sliding way, both sides of one end of the first slide block 7 are provided with second air cylinders 11, the second air cylinders 11 can push a material taking sucker 14 to take and place materials, the output end of the second air cylinders 11 is connected with a first connecting block 12, both sides of the bottom of the first connecting block 12 are provided with tension sensors 13 for judging whether the materials absorbed by the material taking sucker 14 are overlapped, and the other end of the tension sensors 13 is connected with a material taking sucker 14 for taking and placing materials, both sides of one end of the second sliding block 21 are provided with a third cylinder 23 which can push the turnover sucker 26 to take and put materials, the output end of the third cylinder 23 is connected with a second connecting block 24, the second connecting block 24 is connected with the turnover sucker 26 in a rotating way, one side of the second connecting block 24 is provided with a second motor 25 the output end of which is connected with the turnover sucker 26 and can drive the turnover sucker 26 to turn over, one end of the top of the vacuum pump 5 close to the first sliding block 7 is connected with a group of first material distributing table 15 and a group of second material distributing table 16 which extend to the top of the working table 1 and are used for judging whether materials are overlapped and separating the materials, one end of the top of the vacuum pump 5 close to the second sliding block 21 is connected with a second polishing table 19 which extends to the top of the working table 1, the top of the vacuum pump 5 is arranged between the second material distributing table 16 and the second polishing table 19 and is connected with a first polishing table 17 which extends to the top of the working table 1, and the first polishing table 17 and the second polishing table 19 are used for polishing different surfaces of the substrate, and the top of the vacuum pump 5 is located between the second polishing table 19 and the first polishing table 17 and is connected with a transfer table 18 which extends to the top of the workbench 1 and is matched with the turnover sucker 26, and is used for transferring the substrate, so that the substrate is turned over, the top of the mounting plate 2 is located above the first polishing table 17 and the second polishing table 19 and is provided with a fourth air cylinder 27, the output end of the fourth air cylinder 27 is provided with a third motor 28, the output end of the third motor 28 is connected with a plate mesh 31, the bottom surface of the plate mesh 31 is provided with a polishing pad 32, the fourth air cylinder 27 can push the third motor 28, so that the polishing pad 32 is contacted with the substrate to polish the substrate, the two sides of the fourth air cylinder 27 are provided with fifth air cylinders 33, the output ends of the fifth air cylinders 33 are connected with material receiving discs 34 located below the polishing pad 32, the material receiving discs 34 can be controlled by the fifth air cylinders 33, and polishing liquid drops can be prevented from falling on the substrate after polishing is completed.

Referring to fig. 1, 2 and 6, the edge of the output end of the fourth cylinder 27 is connected with a connection column 29, the bottom of the connection column 29 is connected with a polishing solution frame 30 sleeved outside the output end of the third motor 28 and located at the top of the plate net 31, the polishing solution frame 30 can be used for temporarily storing polishing solution, the top of the mounting plate 2 is provided with a polishing solution tank 36 for storing polishing solution, the bottoms of the two sides of the polishing solution tank 36 are both provided with a liquid pump 37, the output end of the liquid pump 37 is respectively connected with one connection column 29 of the output ends of the two fourth cylinders 27, the opening of the output end of the liquid pump 37 faces the top of the polishing solution frame 30, and the liquid pump 37 can pump polishing solution into the polishing solution frame 30.

Referring to fig. 1 and 2, the inner side wall of the mounting plate 2 is respectively provided with a first limiting slide rail 6 and a second limiting slide rail 20 which are matched with the first slide block 7 and the second slide block 21, and the first limiting slide rail 6 and the second limiting slide rail 20 can respectively limit the sliding of the first slide block 7 and the second slide block 21.

Referring to fig. 1 and 2, a first hose 10 passing through the mounting plate 2 and the worktable 1 and connected to the vacuum pump 5 is connected to the top of the material taking suction cup 14 for sucking the substrate, and a second hose 22 passing through the mounting plate 2 and the worktable 1 and connected to the vacuum pump 5 is connected to the middle of the turnover suction cup 26 for sucking the substrate by the turnover suction cup 26.

Referring to fig. 3, the top of the vacuum pump 5 is provided with sixth cylinders 39 at two sides of the first polishing table 17 and the second polishing table 19, the water tank 40 is controlled to move up and down, the output end of each group of sixth cylinders 39 is connected with a water tank 40 slidably connected with the first polishing table 17 and the second polishing table 19, a partition plate 41 for dividing the water tank 40 into a clean water tank and a dirty water tank is disposed inside the water tank 40, the water tank 40 is divided by the partition plate 41 and can be used for storing clean water and dirty water, a water pump 42 with an output end extending into the clean water tank is disposed at the top of the water tank 40, a hot air blower 44 is disposed at the other side of the top of the water tank 40, the water pump 42 and the hot air blower 44 can clean the surface of the polished substrate, the output ends of the water pump 42 and the hot air blower 44 are connected with a bent pipe 43, the water pump 42 can pump clean water and rinse the surface of the substrate through the bent pipe 43, the hot air blower 44 can dry the surface of the substrate, the top of the working table 1 is respectively provided with a third hose 45 wrapping the first polishing table 17 and the second polishing table 19, and the bottom of the third hose 45 is connected with the sewage tank, so that sewage can be conveniently guided to flow into the sewage tank.

Referring to fig. 2, a first cylinder 3 is installed at one end of the worktable 1 near the first slide block 7, an output end of the first cylinder 3 is connected to the material-carrying plate 4, and the first cylinder 3 can push the material-carrying plate 4, so that the uppermost substrate and the first material-distributing table 15 are in the same horizontal line.

Referring to fig. 1 and 6, the edge of the bottom of the polishing liquid frame 30 is provided with a splash-proof frame 35 for wrapping the polishing pad 32, so that the polishing liquid can be prevented from splashing during polishing, and the opposite ends of the two side surfaces of the workbench 1 are rotatably connected with cabinet doors 38, so that the water tank 40 can be conveniently filled with water and drained, and the inside of the workbench 1 can be conveniently overhauled.

Referring to fig. 1 and 2, a first motor 8 is mounted at one end of each of the first limiting slide rail 6 and the second limiting slide rail 20, an output end of the first motor 8 is connected to a lead screw 9 in threaded connection with the first slider 7 and the second slider 21, respectively, and the first motor 8 and the lead screw 9 can control movement of the first slider 7 and the second slider 21.

Referring to fig. 1, the top surfaces of the first material distribution table 15, the second material distribution table 16, the first polishing table 17, the transfer table 18 and the second polishing table 19 are all in the same horizontal line, so that the substrate can be moved to different working areas.

A digitally controlled polishing process for an optically active device semiconductor substrate, as shown in fig. 1-6, comprising the steps of:

the method comprises the following steps: adding polishing solution into a polishing solution tank 36, then opening a cabinet door 38, adding water into a clean water tank of a water tank 40, closing the cabinet door 38, then placing the piled substrates on a material carrying plate 4, pushing the material carrying plate 4 by a first air cylinder 3 to enable the uppermost substrate and the top surface of a first material distributing table 15 to be positioned on the same horizontal line, and starting a vacuum pump 5;

step two: the first motor 8 drives the screw rod 9 to rotate, the first slider 7 is controlled to drive the material taking sucker 14 to move to the upper part of the material carrying plate 4, the second cylinder 11 can push the material taking sucker 14 to be close to the substrate, the first hose 10 is conducted to adsorb the substrate, the second cylinder 11 contracts to lift the material taking sucker 14 and the adsorbed substrate, then the first motor 8 controls the first slider 7 to move the material taking sucker 14 adsorbing the substrate to the upper part of the first distribution table 15, the second cylinder 11 extends out to enable the material taking sucker 14 to drive the substrate to move to the first distribution table 15, the first distribution table 15 is conducted to adsorb the bottom of the substrate, then the second cylinder 11 contracts, if the tension sensor 13 does not sense strong tension, the first motor 8 drives the first slider 7 to move the material taking sucker 14 to the upper part of the second distribution table 16 to repeat the above operation, if the tension sensor 13 senses strong tension, even if the first distribution table 15 or the second distribution table 16 is closed, the second air cylinder 11 contracts, the first sliding block 7 drives the material taking sucker 14 to place the substrate on the top of the first polishing table 17, and then the first sliding block 7 drives the material taking sucker 14 to reset;

step three: the liquid pump 37 sucks polishing liquid in the polishing liquid box 36 into the polishing liquid frame 30, the fifth cylinder 33 extends out to push the material receiving disc 34 to be away from the polishing pad 32, the fourth cylinder 27 at the top of the first polishing table 17 pushes the third motor 28 to descend to drive the polishing pad 32 to move to be attached to the top of the substrate, the polishing liquid seeps into the polishing pad 32 from the open holes at the bottom of the polishing liquid frame 30 and the meshes on the plate net 31, then the third motor 28 starts to drive the polishing pad 32 to rotate to polish the top of the substrate, and the splash-proof frame 35 can wrap the substrate to prevent the polishing liquid from splashing when polishing;

step four: after the top surface of the substrate is polished, the fourth cylinder 27 contracts to drive the polishing pad 32 to be separated from the substrate, the fifth cylinder 33 contracts to drive the material receiving disc 34 to be reset to the bottom of the polishing pad 32 to prevent polishing liquid from continuously falling onto the substrate, then the sixth cylinder 39 pushes the water tank 40, the water pump 42 and the hot air blower 44 to ascend to enable the bent pipe 43 to face the top surface of the substrate, the water pump 42 pumps out clean water in the clean water tank, the residue of the polishing liquid on the top of the substrate is washed away through the bent pipe 43, the washed sewage flows into the sewage tank through the third hose 45, then hot air of the hot air blower 44 blows the top of the substrate through the bent pipe 43 to dry the substrate, and the sixth cylinder 39 can contract;

step five: the first motor 8 drives the screw rod 9 to rotate, the second slider 21 is controlled to drive the turnover sucker 26 to move to the position above the first polishing table 17, the third cylinder 23 pushes the turnover sucker 26 to descend, the second hose 22 is conducted to enable the turnover sucker 26 to adsorb a polishing pad, then the third cylinder 23 contracts to drive the turnover sucker 26 to ascend, the first motor 8 drives the turnover sucker 26 to move to the position above the transfer table 18, the third cylinder 23 extends out, the second hose 22 is closed to place a substrate on the transfer table 18, the transfer table 18 is conducted to adsorb the substrate, then the second motor 25 drives the turnover sucker 26 to turn over by one hundred eighty degrees, the first motor 8 and the third cylinder 23 drive the turnover sucker 26 to adsorb the substrate from the bottom surface of the substrate, then the third cylinder 23 drives the second connecting block 24 and the turnover sucker 26 to ascend, the second motor 25 drives the turnover sucker 26 to turn over by one hundred eighty degrees, the first motor 8 and the third cylinder 23 drive the turnover sucker 26 to place the bottom surface of the substrate on the top of the second polishing table 19 upwards, finally, the second slide block 21 is reset;

step six: extending a fourth air cylinder 27 above the second polishing table, and repeating the third step and the fourth step to finish polishing the substrate;

step seven: after the water tank 40 is emptied of inlet water or the waste tank is full, the door 38 can be opened to add purified water to the clean water tank or discharge waste water from the waste tank.

Although embodiments of the present invention have been shown and described, it is intended that the present invention should not be limited thereto, that the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples, and that modifications, substitutions, variations or the like, which are not inventive and may be made by those skilled in the art without departing from the principle and spirit of the present invention and without departing from the scope of the claims.