阅读说明：本技术 线切割加工时间预测方法、装置、计算机设备和存储介质 (Wire-electrode cutting processing time prediction method, wire-electrode cutting processing time prediction device, computer equipment and storage medium ) 是由 成亚飞 郭小川 于 2021-09-17 设计创作，主要内容包括：本发明涉及一种线切割加工时间预测方法、装置、计算机设备和存储介质。该线切割加工时间预测方法根据切割线材质和工件材质来确定加工系数,根据加工工艺和加工高度来确定加工速率,然后根据加工系数、加工速率以及计算出的切割加工面积来获得加工理论时间,能够较为准确的预测出单个工件的切割加工时间,预测效率高,有效解决了目前依赖操作人员的主观经验来预测切割加工时间误差较大,而严重影响工厂交货日期以及生产任务排班的问题。(The invention relates to a linear cutting machining time prediction method, a linear cutting machining time prediction device, computer equipment and a storage medium. The linear cutting machining time prediction method determines the machining coefficient according to the material of the cutting line and the material of the workpiece, determines the machining speed according to the machining process and the machining height, and then obtains the machining theoretical time according to the machining coefficient, the machining speed and the calculated cutting machining area.)

1. A linear cutting processing time prediction method is characterized by comprising the following steps:

acquiring the total processing path length V, the processing height H and the workpiece material of a workpiece to be processed, and the cutting line material and the processing technology for processing the workpiece to be processed;

determining a corresponding processing coefficient B according to the material of the workpiece and the material of the cutting line;

determining a corresponding processing rate F according to the processing technology and the processing height H; wherein the processing rate F is the area cut by the cutting line in unit time;

determining a cutting machining area S on a linear cutting path according to the total machining path length V and the machining height H;

calculating the machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F and the cutting machining area S, wherein the calculation formula of the machining theoretical time T is as follows: t is S B/F.

2. The method for predicting linear cutting processing time according to claim 1, wherein the obtaining of the total processing path length V of the workpiece to be processed comprises:

setting a processing program of linear cutting according to the three-dimensional model of the workpiece to be processed;

by the processing path lengths V1 and V2 … … V of each of the processing programs_mAnd performing superposition summation to determine the total processing path length V for performing linear cutting processing on the workpiece to be processed.

3. The method for predicting linear cutting processing time according to claim 1, wherein the determining the corresponding processing coefficient B according to the material of the workpiece and the material of the cutting line specifically comprises:

and acquiring a corresponding machining coefficient B according to the machining coefficient database, the workpiece material and the cutting line material.

4. The method for predicting linear cutting processing time according to claim 1, wherein the determining the corresponding processing rate F according to the processing technology and the processing height H specifically comprises:

and acquiring a corresponding processing rate according to the processing rate database, the processing technology and the processing height H.

5. The method for predicting linear cutting processing time according to claim 1, wherein the processing is one-cutting-one-trimming, two-cutting-one-trimming or three-cutting-one-trimming, and then:

the total machining path length V is divided into a total machining path length V1 corresponding to the rough cutting machining and a total machining path length V2 corresponding to the finish cutting machining;

the cutting area S is divided into a cutting area S1 corresponding to rough cutting and a cutting area S2 corresponding to finish cutting; wherein, S1 ═ V1 × H, S2 ═ V2 × H;

the machining theoretical time T is equal to the sum of the machining theoretical time T1 of the rough cutting machining and the machining theoretical time T2 of the fine cutting machining; wherein, T1 is S1B/F, and T2 is S2B/F.

6. The wire-electrode cutting processing time prediction method according to any one of claims 1 to 5, characterized by further comprising:

and respectively calculating the corresponding machining theoretical time for a plurality of workpieces to be machined, and sorting the machining theoretical time into a machining time prediction table and exporting the machining theoretical time.

7. The method for predicting linear cutting processing time according to claim 1, wherein the processing coefficient B is further adjusted according to different numerically controlled linear cutting devices.

8. A linear cutting processing time prediction device is characterized by comprising:

the data acquisition module is used for acquiring the total processing path length V, the processing height H and the workpiece material of a workpiece to be processed, and the cutting line material and the processing technology for processing the workpiece to be processed;

the machining coefficient determining module is used for determining a corresponding machining coefficient B according to the material of the workpiece and the material of the cutting line;

the machining rate determining module is used for determining a corresponding machining rate F according to the machining process and the machining height H; wherein the processing rate F is the area cut by the cutting line in unit time;

the calculation module is used for determining a cutting machining area S on a linear cutting path according to the total machining path length V and the machining height H;

the calculation module is further configured to calculate a machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F, and the cutting machining area S, where a calculation formula of the machining theoretical time T is as follows: t is S B/F.

9. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor when executing the computer program implements the steps of the method for predicting wire-electrode cutting processing time according to any one of claims 1 to 7.

10. A computer-readable storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the steps of the method for predicting wire-cutting machining time according to any one of claims 1 to 7.

Technical Field

The invention belongs to the technical field of numerical control linear cutting, and particularly relates to a method and a device for predicting linear cutting machining time, computer equipment and a storage medium.

Background

At present, the part processing time of the numerical control wire cutting processing equipment is estimated completely by an experienced operator according to the processing experience of the operator, the processing experience of the operator is seriously relied on, and scientific data is not provided for supporting the estimated result. Meanwhile, the processing time estimated by different operator experiences for the same part is also different, and in addition, the processing time for processing the same part by processing machine tools of different brands is also different. Therefore, the estimated result of the operator is greatly different from the actual processing time, the delivery time after the processing is finished cannot be accurately determined, and the field output and the arrangement of factory production tasks are seriously influenced.

Disclosure of Invention

The invention aims to solve the defects in the prior art at least to a certain extent, and provides a linear cutting machining time prediction method, a linear cutting machining time prediction device, computer equipment and a storage medium.

In order to achieve the purpose, the invention provides a linear cutting machining time prediction method, which comprises the following steps:

acquiring the total processing path length V, the processing height H and the workpiece material of a workpiece to be processed, and the cutting line material and the processing technology for processing the workpiece to be processed;

determining a corresponding processing coefficient B according to the material of the workpiece and the material of the cutting line;

determining a corresponding processing rate F according to the processing technology and the processing height H; wherein the processing rate F is the area cut by the cutting line in unit time;

determining a cutting machining area S on a linear cutting path according to the total machining path length V and the machining height H;

calculating the machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F and the cutting machining area S, wherein the calculation formula of the machining theoretical time T is as follows: t is S B/F.

Optionally, the obtaining the total processing path length V of the workpiece to be processed includes:

setting a processing program of linear cutting according to the three-dimensional model of the workpiece to be processed;

by the processing path lengths V1 and V2 … … V of each of the processing programs_mAnd performing superposition summation to determine the total processing path length V for performing linear cutting processing on the workpiece to be processed.

Optionally, the determining the corresponding processing coefficient B according to the material of the workpiece and the material of the cutting line specifically includes:

and acquiring a corresponding machining coefficient B according to the machining coefficient database, the workpiece material and the cutting line material.

Optionally, the determining the corresponding processing rate F according to the processing technology and the processing height H specifically includes:

and acquiring a corresponding processing rate according to the processing rate database, the processing technology and the processing height H.

Optionally, the machining process is one-cutting-one-trimming, two-cutting-one-trimming or three-cutting-one-trimming, and then:

the total machining path length V is divided into a total machining path length V1 corresponding to the rough cutting machining and a total machining path length V2 corresponding to the finish cutting machining;

the cutting area S is divided into a cutting area S1 corresponding to rough cutting and a cutting area S2 corresponding to finish cutting; wherein, S1 ═ V1 × H, S2 ═ V2 × H;

the machining theoretical time T is equal to the sum of the machining theoretical time T1 of the rough cutting machining and the machining theoretical time T2 of the fine cutting machining; wherein, T1 is S1B/F, and T2 is S2B/F.

Optionally, the method further comprises:

and respectively calculating the corresponding machining theoretical time for a plurality of workpieces to be machined, and sorting the machining theoretical time into a machining time prediction table and exporting the machining theoretical time.

Optionally, the machining coefficient B is further adjusted according to different numerical control linear cutting equipment.

The present invention also provides a linear cutting processing time prediction device, including:

the data acquisition module is used for acquiring the total processing path length V, the processing height H and the workpiece material of a workpiece to be processed, and the cutting line material and the processing technology for processing the workpiece to be processed;

the machining coefficient determining module is used for determining a corresponding machining coefficient B according to the material of the workpiece and the material of the cutting line;

the machining rate determining module is used for determining a corresponding machining rate F according to the machining process and the machining height H; wherein the processing rate F is the area cut by the cutting line in unit time;

the calculation module is used for determining a cutting machining area S on a linear cutting path according to the total machining path length V and the machining height H;

the calculation module is further configured to calculate a machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F, and the cutting machining area S, where a calculation formula of the machining theoretical time T is as follows: t is S B/F.

The invention further provides computer equipment which comprises a memory and a processor, wherein the memory stores a computer program, and the processor realizes the steps of the linear cutting machining time prediction method when executing the computer program.

The present application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described wire-cut machining time prediction method.

According to the method for predicting the linear cutting machining time, the machining coefficient is determined according to the material of the cutting line and the material of the workpiece, the machining rate is determined according to the machining process and the machining height, the machining theoretical time is obtained according to the machining coefficient, the machining rate and the calculated cutting machining area, the cutting machining time of a single workpiece can be predicted accurately, the prediction efficiency is high, and the problems that the error of the cutting machining time is predicted to be large by depending on the subjective experience of an operator at present, and the delivery date of a factory and the production task scheduling are seriously influenced are effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic flow chart illustrating a method for predicting linear cutting processing time according to an embodiment of the present disclosure;

FIG. 2 is a block diagram of a program of a linear cutting machining time predicting apparatus according to an embodiment of the present invention;

fig. 3 is a block diagram of a computer device according to an embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the present invention and should not be construed as limiting the present invention, and all other embodiments that can be obtained by one skilled in the art based on the embodiments of the present invention without inventive efforts shall fall within the scope of protection of the present invention.

Fig. 1 is a schematic flow chart of a method for predicting the processing time of wire-electrode cutting according to an embodiment of the present invention. In this embodiment, the method for predicting the linear cutting processing time includes the following steps:

and step S10, acquiring the total processing path length V, the processing height H, the workpiece material, the cutting line material and the processing technology of the workpiece to be processed.

It should be understood that, before the workpiece is cut and processed by the numerical control wire cutting equipment, a user is required to set a wire cutting processing program according to a three-dimensional model of the workpiece to be processed, the processing program is that the user selects appropriate positions of a starting point and an end point and cutting processing parameters according to the three-dimensional model through wire cutting programming software, so as to automatically generate the processing program for wire cutting the workpiece to be processed, the generated processing program comprises a plurality of programs, each program corresponds to one processing path, and the processing paths of the plurality of programs are sequentially connected to form a completed total processing path; that is, the machining path lengths V1 and V2 … … V for each of the machining programs_mPerform superposition summationAnd determining the total processing path length V of the workpiece to be processed during linear cutting processing.

The parameters of the cutting process include, but are not limited to, the processing height H, the material of the workpiece, and the material and the processing technique of the cutting line for cutting the workpiece to be processed; wherein, the processing technology refers to the times of rough cutting and/or fine cutting.

And S20, determining the corresponding processing coefficient B according to the material of the workpiece and the material of the cutting line.

The machining coefficient is used for calibrating the cutting time during the cutting line machining, and when the cutting line made of the same material cuts different workpiece materials under the condition that other conditions are approximately the same, the chemical and physical properties of the workpiece materials are different, and the machining effect is greatly different, so that different machining coefficients can be set, for example, the harder the material is, the lower the machining coefficient corresponding to the workpiece with the higher melting point is.

The specific machining coefficient is obtained in advance through test data, so that the machining coefficient of each cutting line made of different materials for workpieces made of different materials is obtained, and the machining coefficients are arranged into a machining coefficient database; for example, the following table shows a table of processing coefficients for different materials for one material cut line:

thread material	Material of workpiece	Coefficient of processing
			CU	SKD61	1.21
CU	SKD11	1.03
			CU	NAK80	1.12

In one embodiment, the machining efficiency of different numerically controlled linear cutting devices is different, for example, the machining efficiency of numerically controlled linear cutting devices of different brands and numerically controlled linear cutting devices of controllers of different versions of the same brand is different; therefore, the machining coefficient B can be adjusted according to different numerical control linear cutting equipment. In practical application, the predicted cutting processing time and the actual cutting processing time are compared, and the processing coefficient B is further corrected according to a comparison result, so that the numerical value of the processing coefficient B is more and more accurate.

S30, determining a corresponding processing rate F according to the processing technology and the processing height H; wherein, the processing rate F is the area cut by the cutting line in unit time.

Wherein the machining rate is also called cutting speed, i.e. the sum of the areas of the workpiece cut by the cutting line per unit time, in mm²Min, in the practical application process; the machined surface roughness value increases with machining peak current, increasing pulse width, and decreasing pulse interval; the machining rate also increases with machining peak current, increasing pulse width and decreasing pulse interval, i.e. the machining rate increases with increasing machining average current.

Therefore, the processing technology in the embodiment can be set as cutting one and repairing one, cutting one and repairing two or cutting one and repairing three; the first cutting and trimming means that the cutting process comprises the first rough cutting and the first fine cutting, the second cutting and trimming means that the cutting process comprises the first rough cutting and the second fine cutting, and the third cutting and trimming means that the cutting process comprises the first rough cutting and the second fine cutting. That is, the machining process is equivalent to roughly defining the machined surface roughness, and the appropriate machining rate is determined by defining different machining processes and machining heights.

The specific processing rate is obtained by testing data in advance (the same cutting line material and workpiece material are adopted during testing), so that the corresponding processing rates of different processing technologies at different processing heights are obtained and are arranged into a processing rate database; for example, the following table shows a processing speed table corresponding to different processing heights respectively adopted by different processing technologies:

s40, determining the cutting area S on the linear cutting path according to the total processing path length V and the processing height H;

wherein, the cutting area S is the sum of the areas of the cutting lines on the workpiece in a single cutting process; assuming that only one cutting process is limited in the machining process of the machining program, the cutting machining area S is the total machining path length V and the machining height H.

S50, calculating the machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F and the cutting machining area S, wherein the calculation formula of the machining theoretical time T is as follows: t is S B/F.

The theoretical time T of processing in step S50 is the time required by the cutting line in a single cutting process, i.e. the theoretical time T of processing at this time is the cutting process only once according to the processing technique in the processing program.

According to the method for predicting the linear cutting machining time, the machining coefficient is determined according to the material of the cutting line and the material of the workpiece, the machining rate is determined according to the machining process and the machining height, the machining theoretical time is obtained according to the machining coefficient, the machining rate and the calculated cutting machining area, the cutting machining time of a single workpiece can be predicted accurately, the prediction efficiency is high, and the problems that the error of the cutting machining time is predicted to be large by depending on the subjective experience of an operator at present, and the delivery date of a factory and the production task scheduling are seriously influenced are effectively solved.

In one embodiment, the machining process is one-cut-one, two-cut, or three-cut, and the machining process is one-cut-one, for example, the total machining path length V is divided into a total machining path length V1 corresponding to the rough cutting machining and a total machining path length V2 corresponding to the finish cutting machining; the cutting area S is divided into a cutting area S1 corresponding to the rough cutting and a cutting area S2 corresponding to the finish cutting; wherein, S1 ═ V1 × H, S2 ═ V2 × H; the machining theoretical time T is equal to the sum of the machining theoretical time T1 of the rough cutting machining and the machining theoretical time T2 of the fine cutting machining; wherein, T1 is S1B/F, T2 is S2B/F; that is, when the machining process is to perform wire cutting on the one-to-one pair of workpieces, the machining theoretical time T is T1+ T2, and when the machining process is to perform wire cutting on the one-to-one pair of workpieces, the machining theoretical time T is T1+ 2T 2, and so on.

In one embodiment, the cutting process time prediction method further includes: and respectively calculating corresponding machining theoretical time for the plurality of workpieces to be machined, and sorting the plurality of machining theoretical time into a machining time prediction table and exporting the machining theoretical time. In this way, the derived estimated processing time table is provided to an APS (Advanced Planning and Scheduling, APS) production Scheduling system for use, thereby improving the on-time delivery rate of factory orders and shortening the order production process time.

Referring to fig. 2, fig. 2 is a schematic diagram illustrating program modules of a linear cutting processing time prediction apparatus according to an embodiment of the present disclosure; in the present embodiment, the cutting process time prediction apparatus 200 includes a data acquisition module 201, a process coefficient determination module 202, a process rate determination module 203, and a calculation module.

The data acquisition module 201 is configured to acquire a total processing path length V, a processing height H, a workpiece material, a cutting line material for processing the workpiece to be processed, and a processing technology of the workpiece to be processed; specifically, the data acquisition module 201 treatsAnalyzing the processing program corresponding to the processing workpiece, thereby obtaining the processing path lengths V1 and V2 … … V of each program in the processing program_mAnd (4) performing superposition summation to obtain the total processing path length V, and simultaneously obtaining parameters such as the processing height H, the workpiece material, the cutting line material, the processing technology and the like.

The machining coefficient determining module 202 is configured to determine a corresponding machining coefficient B according to a material of the workpiece and a material of the cutting line; the specific machining coefficient is obtained in advance through test data, so that the machining coefficient of each cutting line made of different materials for workpieces made of different materials is obtained, and the machining coefficients are arranged into a machining coefficient database; the machining coefficient determining module 202 may directly obtain the corresponding machining coefficient from the machining coefficient database by the material of the workpiece and the material of the cutting line.

The machining rate determining module 203 is used for determining a corresponding machining rate F according to the machining process and the machining height H; wherein, the processing rate F is the area cut by the cutting line in unit time; the specific processing speed is obtained in advance through test data, so that the corresponding processing speed of each different processing technology when different processing heights are adopted is obtained, and the processing speed is arranged into a processing speed database; the machining rate determining module 203 may directly obtain the corresponding machining rate from the machining rate database through the machining process and the machining height.

The calculating module 204 is configured to determine a cutting area S on the linear cutting path according to the total processing path length V and the processing height H; the calculating module 204 is further configured to calculate a machining theoretical time T for performing linear cutting on the workpiece to be machined according to the machining coefficient B, the machining rate F, and the cutting machining area S, where a calculation formula of the machining theoretical time T is as follows: t is S B/F.

Wherein, when the machining process is a first-cut modification, the total machining path length V is divided into a total machining path length V1 corresponding to the rough cutting machining and a total machining path length V2 corresponding to the finish cutting machining; the cutting area S is divided into a cutting area S1 corresponding to the rough cutting and a cutting area S2 corresponding to the finish cutting; wherein, S1 ═ V1 × H, S2 ═ V2 × H; the machining theoretical time T is equal to the sum of the machining theoretical time T1 of the rough cutting machining and the machining theoretical time T2 of the fine cutting machining; wherein, T1 is S1B/F, T2 is S2B/F; that is, when the machining process is to perform wire cutting on the one-to-one pair of workpieces, the machining theoretical time T is T1+ T2, and when the machining process is to perform wire cutting on the one-to-one pair of workpieces, the machining theoretical time T is T1+ 2T 2, and so on.

The linear cutting machining time prediction device 200 of the embodiment of the application determines the machining coefficient according to the material of the cutting line and the material of the workpiece, determines the machining rate according to the machining process and the machining height, and then obtains the machining theoretical time according to the machining coefficient, the machining rate and the calculated cutting machining area, can accurately predict the cutting machining time of a single workpiece, is high in prediction efficiency, and effectively solves the problems that the current cutting machining time error is predicted according to the subjective experience of an operator, and the delivery date of a factory and the production task scheduling are seriously influenced.

Referring to fig. 3, fig. 3 is a block diagram of a computer device according to an embodiment of the present disclosure; the computer device of the embodiment comprises a memory 302 and a processor 301, wherein the memory stores a computer program, and the processor 301 implements the steps of the wire-electrode cutting machining time prediction method when executing the computer program. In particular, the computer device further comprises a communication interface 303, a display 304 and an input device 305, which communicate with each other via one or more communication buses 306.

It is to be understood that the configuration shown in fig. 3 is merely an illustration and is not intended to limit the configuration of the computer device. The computer device may also include more or fewer components than shown in fig. 3, or have a different configuration than shown in fig. 3. The components shown in fig. 3 may be implemented in hardware, software, or a combination thereof.

Specifically, the memory 302 may be used to store an operating system, a computer program, and modules, such as program instructions/modules corresponding to the methods and apparatuses for predicting wire-cutting machining time in the embodiments of the present application; the processor 301 is used to provide computing and control capabilities to try out software programs and modules stored in the memory 302 to perform various functional applications and data processing, i.e., to implement the wire-electrode cutting machining time prediction method described above.

The Communication interface 303 is used for performing wired or Wireless Communication with an external terminal, and the Wireless Communication may be implemented by a Global System for mobile Communication (GSM), Wireless Fidelity (WiFi), Near Field Communication (NFC), bluetooth or other technologies. For example, the processing program corresponding to the workpiece to be processed may be acquired from other terminal devices outside the computer through the communication interface 303; or, when the corresponding theoretical processing time is calculated for a plurality of workpieces to be processed by the wire-cut processing time prediction method, and the theoretical processing times are arranged into a processing time prediction table, the processing time prediction table can be sent to an APS (Advanced Planning and Scheduling, APS) production Scheduling system for use through the communication interface 303, so that the on-time delivery rate of factory orders is improved, and the order production process time is shortened.

The display screen 304 is used to display data output to the operator, the content of which may include parameters, text, graphics, video, and any combination thereof, specific examples of the display screen 304 include, but are not limited to, a liquid crystal display, an LED display, or an LCD display.

The input device 305 includes a touch layer overlaid on the display screen to receive operator inputs, such as clicking, sliding, and other gesture operations of the operator, so that the user interface responds to these operator inputs by the object, and the touch layer may be based on resistive, capacitive, or any other possible touch detection technology. Of course, the input device 305 may also include one or more of an external keyboard, touchpad, or mouse.

Each functional module in the embodiments of the present application may be integrated into one processing module, or each module may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.

Still further, the present application also provides a computer readable storage medium, on which a computer program is stored, which when executed by the processor 301, implements the steps of the wire-electrode cutting machining time prediction method described above.

It will be understood by those skilled in the art that all or part of the processes of the methods according to the above embodiments may be implemented by a computer program instructing associated hardware, and when the computer program is executed, the processes of the embodiments of the method for predicting the time for wire-electrode cutting processing may be implemented. The Memory 302 in the present application may include at least one of a nonvolatile Memory and a volatile Memory, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a Static Random Access Memory (SRAM), a Dynamic Random Access Memory (DRAM), an erasable Programmable Read-Only Memory (EPROM), a Programmable Read-Only Memory (PROM), a magnetic disk, or an optical disk.

It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present invention is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no acts or modules are necessarily required of the invention.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In view of the above description of the technical solutions provided by the present invention, those skilled in the art will recognize that there may be variations in the technical solutions and the application ranges according to the concepts of the embodiments of the present invention, and in summary, the content of the present specification should not be construed as limiting the present invention.