阅读说明：本技术 Igbt模块降温方法 (IGBT module cooling method ) 是由 杨幸运 陶少勇 陈小磊 罗凯 于 2021-09-13 设计创作，主要内容包括：本发明公开了一种IGBT模块降温方法,包括步骤：S1、提供烤箱,烤箱具有冷却腔；S2、将IGBT模块置于烤箱的冷却腔中,对IGBT模块进行降温。本发明的IGBT模块降温方法,通过在烤箱内部增加冷却腔,实现IGBT模块的降温冷却,降温效率高,有助于提高生产效率。(The invention discloses a method for cooling an IGBT module, which comprises the following steps: s1, providing an oven, wherein the oven is provided with a cooling cavity; and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module. According to the IGBT module cooling method, the cooling cavity is additionally arranged in the oven, so that the IGBT module is cooled, the cooling efficiency is high, and the production efficiency is improved.)

The IGBT module cooling method is characterized by comprising the following steps:

s1, providing an oven, wherein the oven is provided with a cooling cavity;

and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module.

2. The IGBT module cooling method of claim 1, wherein the IGBT modules are arranged in multiple layers in a cooling cavity of the oven.

3. The IGBT module cooling method according to claim 1 or 2, characterized in that a cooling pipe is arranged in the cooling cavity of the oven, and cooling liquid flows in the cooling pipe.

Technical Field

The invention belongs to the technical field of semiconductor product production processes, and particularly relates to a cooling method for an IGBT module.

Background

In the traditional IGBT module packaging, after the semi-finished module is installed on the shell, glue pouring technology is needed inside, and the glue is cured in an oven at a high temperature of 100 ℃ for half an hour. Because the solidified modules need to be cooled to 50 ℃ before being discharged from the furnace and the temperature inside the furnace has no cooling function, the cooling effect can be achieved only by adopting a natural cooling mode.

The size of the curing furnace equipment used in the prior art is too large, and the length of the curing furnace equipment generally reaches 5-6 meters. Occupies the workshop field of the factory, is heavy and is not beneficial to the implementation of the future planning of the factory. The IGBT module adopts the mode cooling of natural cooling, and the cooling time is long, leads to production efficiency low. The IGBT module reaches the monitoring means of tapping temperature and is less, and the IGBT module reaches the poor management and control of tapping temperature condition, is unfavorable for the management and control of technology uniformity.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a cooling method of an IGBT module, and aims to improve the production efficiency.

In order to achieve the purpose, the invention adopts the technical scheme that: the IGBT module cooling method comprises the following steps:

s1, providing an oven, wherein the oven is provided with a cooling cavity;

and S2, placing the IGBT module in a cooling cavity of an oven, and cooling the IGBT module.

The IGBT modules are arranged in multiple layers in a cooling cavity of the oven.

A cooling pipe is arranged in a cooling cavity of the oven, and cooling liquid flows in the cooling pipe.

According to the IGBT module cooling method, the cooling cavity is additionally arranged in the oven, so that the IGBT module is cooled, the cooling efficiency is high, and the production efficiency is improved.

Drawings

The description includes the following figures, the contents shown are respectively:

FIG. 1 is a schematic view of the oven construction;

labeled as: 1. a cooling chamber; 2. a heating cavity; 3. an IGBT module; 4. a carrying track.

Detailed Description

The following detailed description of the embodiments of the present invention will be given with reference to the accompanying drawings for a purpose of helping those skilled in the art to more fully, accurately and deeply understand the concept and technical solution of the present invention and to facilitate its implementation.

As shown in fig. 1, the invention provides a method for cooling an IGBT module, comprising the following steps:

s1, providing an oven, wherein the oven is provided with a cooling cavity 1;

and S2, placing the IGBT module in the cooling cavity 1 of the oven, and cooling the IGBT module.

Specifically, as shown in fig. 1, a heating chamber 2 and a cooling chamber 1 are provided inside the oven, and the heating chamber 2 and the cooling chamber 1 are independently controlled. In the above step S2, the IGBT modules are transported by the carrying rail 4 into the cooling chamber 1 of the oven, and all the IGBT modules are arranged in multiple stages in the vertical direction in the cooling chamber 1 of the oven. And the cooling cavity 1 is adopted to complete the cooling of the module, so that the cooling efficiency is high.

As shown in figure 1, the length L of the oven is 2m, the width and the height of the oven are both 2m, the occupied area is small, and the transfer is convenient.

Preferably, a cooling pipe is arranged in the cooling cavity 1 of the oven, and cooling liquid flows in the cooling pipe. The cooling pipe is connected with the water pump, the water pump is connected with the liquid storage tank, cooling liquid is stored in the liquid storage tank, the cooling liquid circularly flows between the liquid storage tank and the cooling pipe, the water inlet end of the cooling pipe is connected with the water outlet end of the water pump, the water outlet end of the cooling pipe is connected with the liquid storage tank, and the water inlet end of the water pump is connected with the liquid storage tank. The cooling tube and the air in the cooling cavity 1 are subjected to heat exchange, so that the temperature in the cooling cavity 1 is controlled, the temperature in the cooling cavity 1 is controlled within a set range, and the IGBT module can be cooled.

The invention is described above with reference to the accompanying drawings. It is to be understood that the specific implementations of the invention are not limited in this respect. Various insubstantial improvements are made by adopting the method conception and the technical scheme of the invention; the present invention is not limited to the above embodiments, and can be modified in various ways.