阅读说明：本技术 一种半导体设备及吹扫方法 (Semiconductor equipment and purging method ) 是由 何家平 于 2021-09-13 设计创作，主要内容包括：本申请提供一种半导体设备及吹扫方法,包括：反应腔室、传感器、吹扫装置以及控制器,控制器与传感器和吹扫装置连接。传感器检测反应腔室内是否存在晶圆,并将检测信号发送至控制器,控制器根据检测信号生成吹扫信号,并将检测信号和吹扫信号发送至吹扫装置,吹扫装置在接收到检测信号和吹扫信号后对传感器进行吹扫,以去除由于湿润环境导致传感器附着的水滴,减小水滴导致的光强损失,提高传感器的使用寿命,同时减小水滴导致的反射或折射,提高传感器的检测效果,进而使得半导体设备能够对晶圆正常地进行处理工艺,提高晶圆良率。(The application provides a semiconductor device and a purging method, comprising the following steps: the device comprises a reaction chamber, a sensor, a purging device and a controller, wherein the controller is connected with the sensor and the purging device. The sensor detects whether a wafer exists in the reaction chamber or not, and sends the detection signal to the controller, the controller generates a purging signal according to the detection signal, and sends the detection signal and the purging signal to the purging device, the purging device purges the sensor after receiving the detection signal and the purging signal, so as to remove water drops attached to the sensor due to a humid environment, reduce light intensity loss caused by the water drops, prolong the service life of the sensor, reduce reflection or refraction caused by the water drops, improve the detection effect of the sensor, further enable the semiconductor equipment to normally process the wafer, and improve the wafer yield.)

1. A semiconductor device, comprising:

the device comprises a reaction chamber, a sensor, a purging device and a controller; the controller is connected with the sensor and the purging device;

the sensor is used for detecting whether a wafer exists in the reaction chamber or not and sending a detection signal to the controller;

the controller is used for generating a purging signal according to the detection signal and sending the detection signal and the purging signal to the purging device;

the purging device is used for purging the sensor after receiving the detection signal and the purging signal.

2. The apparatus of claim 1, wherein the purge signal comprises a chamber door close signal when the detection signal indicates a wafer is present in the reaction chamber, the controller comprising: a first controller and a second controller;

the first controller is used for sending the detection signal to the purging device after receiving the detection signal for a preset time;

and the second controller is used for controlling the wafer to move out of the reaction chamber after the process is finished after receiving the detection signal, closing a chamber door to generate a chamber door closing signal, and sending the chamber door closing signal to the purging device.

3. The apparatus of claim 2, wherein the predetermined time is greater than or equal to a time required to complete the wafer processing out of the reaction chamber and close a chamber door.

4. The apparatus of claim 2, wherein a first solenoid valve is connected between the first controller and the purge device, and a second solenoid valve is connected between the second controller and the purge device;

the first controller is specifically used for controlling the first electromagnetic valve to be closed for preset time and then to be opened after receiving the detection signal so as to send the detection signal to the purging device;

the second controller is specifically configured to control the second solenoid valve to open after the chamber door closing signal is generated, so as to send the purge signal to the purge device.

5. The apparatus of claim 4, wherein the apparatus comprises: the purging device comprises a pneumatic valve; the first inlet end of the on-off valve is connected with the first electromagnetic valve, the second inlet end of the on-off valve is connected with the second electromagnetic valve, and the outlet end of the on-off valve is connected with the pneumatic valve;

the AND valve is used for controlling the pneumatic valve to be opened after receiving signals of opening the first electromagnetic valve and the second electromagnetic valve, so that the purging device receives the detection signal and the purging signal.

6. The apparatus of claim 1, wherein the detection signal indicates an absence of a wafer within the reaction chamber, the purge signal comprises a chamber rinse signal, and the controller comprises: a second controller;

the second controller is specifically configured to detect whether the semiconductor device is in an idle state after receiving the detection signal, and if so, generate a chamber flushing signal according to the detection signal and send the chamber flushing signal to the purging device.

7. The apparatus of claim 6, wherein a third solenoid valve is connected between the second controller and the purge device;

the second controller is specifically configured to control the third solenoid to open after the chamber flushing signal is generated, so as to send the chamber flushing signal to the purging device.

8. The apparatus of claim 7, wherein the purge device comprises a pneumatic valve;

the second controller is specifically configured to control the third solenoid to open after generating the chamber flushing signal, so as to control the pneumatic valve to open, so as to send the chamber flushing signal to the purging device.

9. The apparatus according to any one of claims 1 to 8, wherein the sensor is a fiber optic sensor and the purging device is particularly adapted to purge the fiber optic sensor with nitrogen.

10. The apparatus of claim 5 or 8, wherein the pneumatic valve comprises an acid and base resistant and opening adjustable pneumatic valve.

11. The apparatus according to any one of claims 2-8, wherein an amplifier is connected between the sensor and the second controller;

the amplifier is used for amplifying the detection signal generated by the sensor and then sending the amplified detection signal to the second controller.

12. The apparatus of any one of claims 1-8, wherein the size of the purge device is adjustable.

13. A purging method using the semiconductor device according to any one of claims 1 to 12, comprising:

receiving a detection signal sent by a sensor, wherein the detection signal comprises a detection result of whether a wafer exists in a reaction chamber of the semiconductor equipment;

and generating a purging signal according to the detection signal, and sending the detection signal and the purging signal to a purging device, so that the purging device purges the sensor after receiving the detection signal and the purging signal.

14. The method of claim 13, wherein the detection signal indicates the presence of a wafer within the reaction chamber, the purge signal comprises a chamber door close signal;

the sending of the detection signal to the purging device specifically includes:

after the detection signal is received for a preset time, sending the detection signal to the purging device;

and controlling the wafer to move out of the reaction chamber after the process is finished according to the detection signal, generating a chamber door closing signal after a chamber door is closed, and sending the chamber door closing signal to the purging device.

15. The method of claim 13, wherein the detection signal indicates the absence of a wafer within the reaction chamber, the purge signal comprises a chamber rinse signal;

generating a purge signal according to the detection signal, specifically comprising:

and after receiving the detection signal, detecting whether the semiconductor equipment is in an idle state, and if so, generating a chamber flushing signal according to the detection signal.

Technical Field

The application relates to the technical field of semiconductors, in particular to a semiconductor device and a purging method.

Background

In an existing semiconductor machine, a sensor is generally used to detect whether a wafer exists in a reaction chamber, if the wafer exists in the reaction chamber, a processing process is performed on the wafer, and if the wafer does not exist in the reaction chamber, the wafer is transferred into the reaction chamber by a robot arm or the like.

However, when water, chemical liquid, chemical compound, etc. exist in the reaction chamber, the interior of the reaction chamber is a humid environment, which affects the detection effect and the service life of the sensor.

Disclosure of Invention

The application provides a semiconductor device and a purging method, which are used for solving the problems that the interior of a reaction chamber is a humid environment, and the detection effect and the service life of a sensor are influenced.

In a first aspect, the present application provides a semiconductor device comprising:

the device comprises a reaction chamber, a sensor, a purging device and a controller; the controller is connected with the sensor and the purging device;

the sensor is used for detecting whether a wafer exists in the reaction chamber or not and sending a detection signal to the controller;

the controller is used for generating a purging signal according to the detection signal and sending the detection signal and the purging signal to the purging device;

the purging device is used for purging the sensor after receiving the detection signal and the purging signal.

Optionally, when the detection signal indicates that a wafer exists in the reaction chamber, the purge signal includes a chamber door closing signal, and the controller includes: a first controller and a second controller;

the first controller is used for sending the detection signal to the purging device after receiving the detection signal for a preset time;

and the second controller is used for controlling the wafer to move out of the reaction chamber after the process is finished after receiving the detection signal, closing a chamber door to generate a chamber door closing signal, and sending the chamber door closing signal to the purging device.

Optionally, the preset time is greater than or equal to the time required for moving the wafer completion process out of the reaction chamber and closing the chamber door.

Optionally, a first electromagnetic valve is connected between the first controller and the purging device, and a second electromagnetic valve is connected between the second controller and the purging device;

the first controller is specifically used for controlling the first electromagnetic valve to be closed for preset time and then to be opened after receiving the detection signal so as to send the detection signal to the purging device;

the second controller is specifically configured to control the second solenoid valve to open after the chamber door closing signal is generated, so as to send the purge signal to the purge device.

Optionally, the apparatus includes: the purging device comprises a pneumatic valve; the first inlet end of the on-off valve is connected with the first electromagnetic valve, the second inlet end of the on-off valve is connected with the second electromagnetic valve, and the outlet end of the on-off valve is connected with the pneumatic valve;

the AND valve is used for controlling the pneumatic valve to be opened after receiving signals of opening the first electromagnetic valve and the second electromagnetic valve, so that the purging device receives the detection signal and the purging signal.

Optionally, the detection signal indicates that no wafer exists in the reaction chamber, the purge signal includes a chamber purge signal, and the controller includes: a second controller;

the second controller is specifically configured to detect whether the semiconductor device is in an idle state after receiving the detection signal, and if so, generate a chamber flushing signal according to the detection signal and send the chamber flushing signal to the purging device.

Optionally, a third electromagnetic valve is connected between the second controller and the purging device;

the second controller is specifically configured to control the third solenoid to open after the chamber flushing signal is generated, so as to send the chamber flushing signal to the purging device.

Optionally, the purging device comprises a pneumatic valve;

the second controller is specifically configured to control the third solenoid to open after generating the chamber flushing signal, so as to control the pneumatic valve to open, so as to send the chamber flushing signal to the purging device.

Optionally, the sensor is an optical fiber sensor, and the purging device is specifically configured to purge the optical fiber sensor with nitrogen.

Optionally, the pneumatic valve comprises an acid and alkali resistant pneumatic valve with an adjustable opening degree.

Optionally, an amplifier is connected between the sensor and the second controller;

the amplifier is used for amplifying the detection signal generated by the sensor and then sending the amplified detection signal to the second controller.

Optionally, the size of the purge device is adjustable.

In a second aspect, the present application provides a purging method comprising: the semiconductor device according to any one of the first aspect and the first aspect, comprising:

receiving a detection signal sent by a sensor, wherein the detection signal comprises a detection result of whether a wafer exists in a reaction chamber of the semiconductor equipment;

and generating a purging signal according to the detection signal, and sending the detection signal and the purging signal to a purging device, so that the purging device purges the sensor after receiving the detection signal and the purging signal.

Optionally, the detection signal indicates the presence of a wafer in the reaction chamber, and the purge signal includes a chamber door closing signal;

the sending of the detection signal to the purging device specifically includes:

after the detection signal is received for a preset time, sending the detection signal to the purging device;

and controlling the wafer to move out of the reaction chamber after the process is finished according to the detection signal, generating a chamber door closing signal after a chamber door is closed, and sending the chamber door closing signal to the purging device.

Optionally, the detection signal indicates that no wafer is present in the reaction chamber, and the purge signal includes a chamber purge signal;

generating a purge signal according to the detection signal, specifically comprising:

and after receiving the detection signal, detecting whether the semiconductor equipment is in an idle state, and if so, generating a chamber flushing signal according to the detection signal.

The application provides a semiconductor device, including: the device comprises a reaction chamber, a sensor, a purging device and a controller, wherein the controller is connected with the sensor and the purging device. The sensor detects whether a wafer exists in the reaction chamber or not, and sends the detection signal to the controller, the controller generates a purging signal according to the detection signal, and sends the detection signal and the purging signal to the purging device, the purging device purges the sensor after receiving the detection signal and the purging signal, so as to remove water drops attached to the sensor due to a humid environment, reduce light intensity loss caused by the water drops, prolong the service life of the sensor, reduce reflection or refraction caused by the water drops, improve the detection effect of the sensor, further enable the semiconductor equipment to normally process the wafer, and improve the wafer yield.

Drawings

In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor device according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of another semiconductor device according to an embodiment of the present application;

fig. 3 is a schematic diagram of signal transmission according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of another semiconductor device according to an embodiment of the present application;

fig. 5 is a schematic diagram of signal transmission according to an embodiment of the present application;

fig. 6 is a schematic flow chart of a purging method according to an embodiment of the present disclosure.

Detailed Description

To make the purpose, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application, and it is obvious that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Processing equipment in the semiconductor field, such as Chemical Mechanical Polishing (CMP) tools, Wet process (Wet) tools, and thin film processing (thin film) tools, generally uses sensors to detect the presence of a wafer in a chamber (chamber) of each tool, such as fiber optic sensors to detect the presence of a wafer in a chamber. When the wafer exists in the reaction chamber, the corresponding processing technology is carried out on the wafer, and when the wafer does not exist in the reaction chamber, a signal is sent to the mechanical arm, so that the mechanical arm transmits the wafer into the reaction chamber.

However, when water (DIW), Chemical liquid (Chemical), polishing liquid (Slurry), cleaning liquid and compounds exist in the reaction chamber, the interior of the reaction chamber is a humid environment, water drops are easily attached to the optical fiber sensor, so that light intensity loss is caused, and the existence of the wafer can be judged only when the light intensity reaches a certain Standard (SPEC), so that the power of the optical fiber sensor needs to be increased to recover the light intensity, but the service life of the optical fiber sensor is influenced by increasing the power of the optical fiber sensor. When the optical fiber sensor is attached with water drops, refraction or reflection occurs, the detection effect of the optical fiber sensor is affected, the machine station gives an error alarm, the normal processing of the wafer is affected, and the wafer yield is affected.

To this end, the present application provides a semiconductor device comprising: the device comprises a reaction chamber, a sensor, a purging device and a controller, wherein the controller is connected with the sensor and the purging device. The sensor detects whether a wafer exists in the reaction chamber or not, and sends the detection signal to the controller, the controller generates a purging signal according to the detection signal, and sends the detection signal and the purging signal to the purging device, the purging device purges the sensor after receiving the detection signal and the purging signal, so as to remove water drops attached to the sensor due to a humid environment, reduce light intensity loss caused by the water drops, prolong the service life of the sensor, reduce reflection or refraction caused by the water drops, improve the detection effect of the sensor, further enable the semiconductor equipment to normally process the wafer, and improve the wafer yield.

The technical solution of the present application will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

An embodiment of the present application provides a semiconductor device, shown with reference to fig. 1, including:

the device comprises a reaction chamber 101, a sensor 102, a purging device 103 and a controller 104, wherein the controller 104 is connected with the sensor 102 and the purging device 103;

the sensor 102 is configured to detect whether a wafer exists in the reaction chamber 101, and send a detection signal to the controller 104;

the controller 104 is used for generating a purging signal according to the detection signal and sending the detection signal and the purging signal to the purging device 103;

the purging device 103 is used for purging the sensor 102 after receiving the detection signal and the purging signal.

The reaction chamber 101 is used to provide a space for performing a process on a wafer, and the process includes, for example: deposition processes, etching processes, and the like. The deposition process comprises the following steps: physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and the like. The etching process comprises the following steps: plasma Etching (PE), Reactive Ion Etching (RIE), and the like.

A semiconductor apparatus may include one or more reaction chambers 101, and when a plurality of reaction chambers are included, the plurality of reaction chambers may perform the same or different processes. The reaction chamber 101 includes an upper plate and a lower plate which are oppositely disposed, and when a wafer is processed, the wafer is placed on the lower plate, and the reaction ions move toward the wafer under the action of an electric field between the upper plate and the lower plate to process the wafer. For example, after the upper plate is connected to the rf source, the process gas forms a plasma under rf excitation, and the plasma moves toward the surface of the wafer under the action of the electric field between the upper plate and the lower plate, thereby etching the wafer. A wafer carrying device may be disposed in the reaction chamber 101, and the wafer carrying device is used for carrying a wafer and may also be used as a lower plate of the reaction chamber 101.

The sensor 102 is used for detecting whether a wafer exists in the reaction chamber 101 and sending a detection signal to the controller 104. When a wafer is present in the reaction chamber 101, the detection signal indicates that a wafer is present in the reaction chamber 101. When no wafer is present in the reaction chamber 101, the detection signal indicates that no wafer is present in the reaction chamber 101.

As an implementation manner, the sensor 102 may be an optical fiber sensor, which is a sensor that converts the state of the measured object into a measurable optical signal. The method comprises the steps of sending light beams incident from a light source into a modulator through an optical fiber, enabling optical properties of the light such as intensity, wavelength, frequency, phase, polarization state and the like of the light to change under the interaction with external parameters to be detected in the modulator, enabling the light to become modulated light signals, sending the modulated light signals into a photoelectric device through the optical fiber, and obtaining the parameters to be detected through a demodulator. Thus, the fiber optic sensor is able to detect the presence of a wafer within the reaction chamber 101.

The controller 104 generates a purge signal according to the detection signal after receiving the detection signal, and sends the detection signal and the purge signal to the purge device 103.

As one implementation, the controller 104 may include a first controller 1011 and a second controller 1012, as described with reference to fig. 2. The sensor 102 sends a detection signal to the first controller 1011 and the second controller 1012 after detecting whether the wafer exists in the reaction chamber 101. When the detection signal indicates that a wafer exists in the reaction chamber 101, the first controller 1011 does not immediately send the detection signal to the purging device 103 after receiving the detection signal, but sends the detection signal to the purging device 103 after receiving the detection signal for a preset time, and the preset time enables the wafer to be moved out of the reaction chamber 101 after being processed, so as to avoid the performance of the wafer from being affected, for example, introducing extra particles (particles). The predetermined time may be adjusted according to actual conditions, and may be greater than or equal to the time required for completing the wafer process, removing the wafer from the reaction chamber, and closing the chamber door. The second controller 1012, after receiving the detection signal, controls the wafer to move out of the reaction chamber 101 after the process is completed, closes a door of the reaction chamber 101, generates a purge signal including a door close signal (chamber door close signal), and sends the purge signal including the door close signal to the purge device 103.

To facilitate an understanding of this implementation, the purge process is described in detail below in conjunction with the signal transmission diagram shown in FIG. 3. The four folding lines in fig. 3 are respectively denoted as a first folding line a, a second folding line b, a third folding line c and a fourth folding line d from top to bottom. The protrusions of the first folding line a represent a process in which the second controller 1012 receives the sensing signal. The depression of the third fold line c represents the process by which the second controller 1012 generates the cavity door close signal. As can be seen from the first folding line a and the third folding line c, the second controller 1012 receives the detection signal and generates a chamber door closing signal after a certain period of time, which can be understood as the time required for the wafer process to be completed, the reaction chamber to be removed, and the chamber door to be closed. The protrusion of the second folding line b represents the process of the first controller 1011 sending the detection signal, and according to the first folding line a and the second folding line b, the first controller 1011 sends the detection signal after the second controller 1012 receives the detection signal for a period of time, and since the first controller 1011 and the second controller 1012 receive the detection signal simultaneously, that is, the first controller 1011 sends the detection signal to the purging device 103 after receiving the detection signal for the preset time. The projection of the fourth broken line d indicates the process of the purging device 103 performing the purging process after receiving the detection signal and the purging signal.

The first Controller 1011 may be a Programmable Logic Controller (PLC) which uses a Programmable memory, stores therein instructions for performing operations such as Logic operation, sequence control, timing, counting, and arithmetic operation, and controls various types of machinery or manufacturing processes through digital or analog input/output.

Referring to fig. 2, a first Solenoid Valve (SV)105 may be connected between the first controller 1011 and the purging device 103, and the first controller 1011 sends a delay signal to the first SV 105 after receiving the detection signal to control the first SV 105 to close for a predetermined time so that the wafer can be moved out of the reaction chamber 101 after completing the process. After receiving the detection signal for a preset time, an opening signal is sent to the first solenoid valve 105 to control the first solenoid valve 105 to open, so that the detection signal is sent to the purging device 103.

The second electromagnetic valve 106 may be connected between the second controller 1012 and the purging device 103, and after the second controller 1012 generates the chamber door closing signal, the second controller 1012 controls the second electromagnetic valve 106 to open and transmits the chamber door closing signal to the purging device 103.

The semiconductor device may further comprise an And Valve (And Valve)108, And the purging device 103 may comprise a pneumatic Valve, And the And Valve 108 comprises two input ports And one output port, the two input ports are respectively connected with the first solenoid Valve 105 And the second solenoid Valve 106, i.e. connected with a first input port of the Valve 108 And the first solenoid Valve 105, And connected with a second input port of the Valve 108 And the second solenoid Valve 106. The outlet end of the valve 108 is connected with the pneumatic valve of the purging device 103, and after the valve 108 receives signals of opening the first solenoid valve 105 and the second solenoid valve 106, the pneumatic valve is controlled to be opened, namely after the first solenoid valve 105 and the second solenoid valve 106 are simultaneously opened, the pneumatic valve can be controlled to be opened with the valve 108, the pneumatic valve is a switch whether purging gas is conducted, and after the pneumatic valve is opened, the purging device 103 can receive a detection signal and a purging signal.

In a specific application, an Amplifier (Amplifier) may be connected between the sensor 102 and the second controller 1012, so that the sensor 102 amplifies the detection signal by the Amplifier and then sends the amplified detection signal to the second controller 1012, so as to improve the signal identification effect of the second controller 1012.

As another implementation, the controller 104 may include a second controller 1012, shown with reference to fig. 4. The sensor 102 sends a detection signal to the second controller 1012 after detecting whether a wafer is present in the reaction chamber 101. When the detection signal indicates that no wafer exists in the reaction chamber, the second controller 1012 detects whether the semiconductor device is in an idle state (idle) after receiving the detection signal, where the idle state indicates that the semiconductor device can be normally used, but the process is not performed at this time. When the semiconductor device is detected to be in an idle state, a purging signal including a chamber flushing signal (chamber flushing) is used for flushing the reaction chamber in order to prevent particles from being generated in the reaction chamber when the semiconductor device is in the idle state. The second controller 1012 sends a purge signal including a chamber flush signal to the purge device 103 after generating the purge signal including the chamber flush signal.

To facilitate understanding of this implementation, the purge process is described in detail below with reference to the signal transmission diagram shown in fig. 5. The two folding lines in fig. 5 are respectively marked as a fifth folding line e and a sixth folding line f from top to bottom, a protrusion of the fifth folding line e represents a process of sending a chamber flushing signal by the controller 104, and a protrusion of the sixth folding line f represents a process of performing the purging process by the purging device 103. According to the fifth broken line e and the sixth broken line f, the purging device 103 performs the purging process after receiving the chamber flushing signal.

In this embodiment, the second controller 1012 may further send the detection signal to the purging device 103 after receiving the detection signal. The controller 104 may further include a first controller 1011, and the first controller 1011 is connected to the sensor 102 and the purge device 103, and the first controller 1011 transmits a detection signal to the purge device 103.

The third solenoid valve 110 may be connected between the second controller 1012 and the purging device 103, and as shown in fig. 4, the second controller 1012 controls the third solenoid valve 110 to be opened after generating the chamber flushing signal, so as to send the chamber flushing signal to the purging device 103.

The purge device 103 may include a pneumatic valve, and the second controller 1012 may control the third solenoid valve 110 to be opened after generating the chamber flushing signal, and the pneumatic valve may be controlled to be opened after the third solenoid valve 110 is opened to transmit the detection signal and the purge signal to the purge device 103.

After receiving the detection signal and the purge signal, the purge device 103 determines that no wafer exists in the reaction chamber 101 at this time, and may perform purge processing, thereby purging the sensor 102.

Specifically, the purging device 103 purges the sensor with nitrogen, and after a pneumatic valve of the purging device 103 is opened, the nitrogen enters the reaction chamber 101 through the pneumatic valve to purge the optical fiber sensor. The pneumatic valve of the purging device 103 can adopt an acid-base-resistant pneumatic valve with an adjustable opening degree, the pneumatic valve is prevented from being corroded by acid and base, and the purpose of adjusting the nitrogen flow rate can be achieved. When the purging device 103 is used to flush the chamber, the nitrogen flow may be determined based on the number of particles in the reaction chamber 101, with the more particles, the greater the nitrogen flow rate is controlled.

In a specific application, the size of the purging device 103 is adjustable, and the purging device 103 can be sized according to the size of the reaction chamber 101, so that the purging device 103 can effectively purge the sensor 102 or the reaction chamber 101.

The semiconductor equipment provided by the embodiment of the application is described in detail above, the sensor detects whether a wafer exists in the reaction chamber, the detection signal is sent to the controller, the controller generates the purging signal according to the detection signal, and sends the detection signal and the purging signal to the purging device, the purging device purges the sensor after receiving the detection signal and the purging signal, so as to remove water drops attached to the sensor due to a humid environment, reduce light intensity loss caused by the water drops, prolong the service life of the sensor, reduce reflection or refraction caused by the water drops, improve the detection effect of the sensor, further enable the semiconductor equipment to normally process the wafer, and improve the yield of the wafer.

An embodiment of the present application further provides a purging method, which uses the semiconductor device described above and shown in fig. 6, and includes:

s101, receiving a detection signal sent by a sensor, wherein the detection signal comprises a detection result of whether a wafer exists in a reaction chamber of the semiconductor equipment.

The sensor detects whether a wafer exists in a reaction chamber of the semiconductor device, and sends a detection signal including a detection result of whether the wafer exists in the reaction chamber to the controller.

And S102, generating a purging signal according to the detection signal, and sending the detection signal and the purging signal to a purging device so that the purging device purges the sensor after receiving the detection signal and the purging signal.

The controller judges the type of the detection signal and generates a purging signal according to the detection signal after receiving the detection signal sent by the sensor, when the detection signal indicates that a wafer exists in the reaction chamber, the wafer is controlled to move out of the reaction chamber after the process is completed according to the detection signal, a chamber door of the reaction chamber is closed, a purging signal including a chamber door closing signal is generated after the chamber door is closed, and the purging signal including the chamber door closing signal is sent to the purging device.

The controller sends the detection signal to the purging device after receiving the detection signal indicating that the wafer exists in the reaction chamber and after receiving the detection signal for preset time, wherein the preset time is more than or equal to the time required for the wafer process to be completed, the wafer process to be moved out of the reaction chamber and the wafer door to be closed, so that the purging device can purge the sensor after the wafer leaves the reaction chamber.

In a specific application, the controller may include a first controller and a second controller, and when the detection signal indicates that a wafer exists in the reaction chamber, the first controller sends the detection signal to the purging device after receiving the detection signal for a preset time. And after receiving the detection signal, the second controller controls the wafer to move out of the reaction chamber after the process is completed, closes a chamber door of the reaction chamber, generates a purging signal comprising a chamber door closing signal after the chamber door is closed, and sends the purging signal comprising the chamber door closing signal to the purging device.

When the detection signal indicates that no wafer exists in the reaction cavity, the controller detects whether the semiconductor equipment is in an idle state after receiving the detection signal, if so, a purging signal including a cavity purging signal is generated according to the detection signal, and the purging signal including the cavity purging signal is sent to the purging device.

Specifically, the controller includes first controller and second controller, and first controller sends the detected signal to sweeping device after receiving detected signal, and the second controller detects whether the semiconductor is in the idle state after receiving detected signal, if, according to the detected signal generation including the chamber wash the sweep signal of signal to will including the chamber wash the sweep signal of signal send to sweeping device.

The purging device purges the sensor after receiving the detection signal sent by the controller and the purging signal comprising the chamber door closing signal, or purges the sensor after receiving the detection signal sent by the controller and the purging signal comprising the chamber flushing signal. Namely, the purging device purges the sensor when no wafer exists in the reaction chamber, so as to avoid influencing the performance of the wafer.

According to the purging method provided by the embodiment of the application, after the controller receives the detection signal sent by the sensor, the purging signal is generated according to the detection signal, and the detection signal and the purging signal are sent to the purging device, so that the purging device purges the sensor, water drops attached to the sensor due to a humid environment are removed, light intensity loss caused by the water drops is reduced, the service life of the sensor is prolonged, meanwhile, reflection or refraction caused by the water drops is reduced, the detection effect of the sensor is improved, further, the semiconductor equipment can normally process wafers, and the wafer yield is improved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same. Although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: it is also possible to modify the solutions described in the previous embodiments or to substitute some or all of them with equivalents. And the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.