阅读说明：本技术 一种半导体晶体刻蚀设备 (Semiconductor crystal etching equipment ) 是由 黄敏谊 于 2021-09-16 设计创作，主要内容包括：本发明公开了一种半导体晶体刻蚀设备,包括机体以及所述机体中的覆膜腔,所述覆膜腔左右壁上对称设有第一电动滑轨,所述第一电动滑轨上滑动设有覆膜板,所述覆膜板上端固定设有覆膜装置,所述覆膜装置能够带有刻蚀图案的薄膜贴在晶体表面,设备设有导管,通过导管能够在晶体表面滴加少量的刻蚀液从而对晶体进行刻蚀处理,避免了过多的刻蚀液对晶体造成的损坏,并且无需后续对刻蚀液进行回收处理,减少了工作步骤提高了效率,同时装置中设有挡板,挡板能够在刻蚀液对晶体进行刻蚀时防止其向刻痕的两侧移动,避免了刻蚀液腐蚀刻痕的两侧,从而对晶体进行保护,确保刻蚀后的晶体能够正常使用,并使得晶体上的刻痕更加美观。(The invention discloses a semiconductor crystal etching device, which comprises a machine body and a film coating cavity in the machine body, wherein first electric slide rails are symmetrically arranged on the left wall and the right wall of the film coating cavity, a film coating plate is arranged on the first electric slide rails in a sliding manner, a film coating device is fixedly arranged at the upper end of the film coating plate, the film coating device can be used for attaching a film with an etching pattern to the surface of a crystal, the device is provided with a conduit, a small amount of etching liquid can be dripped on the surface of the crystal through the conduit so as to etch the crystal, the damage to the crystal caused by excessive etching liquid is avoided, the subsequent recovery treatment of the etching liquid is not needed, the working steps are reduced, the efficiency is improved, meanwhile, a baffle plate is arranged in the device, the baffle plate can be prevented from moving to the two sides of nicks when the crystal is etched by the etching liquid, the etching liquid is prevented from corroding the two sides of the nicks, so that the crystal is protected, ensure the normal use of the etched crystal and make the nicks on the crystal more beautiful.)

1. The utility model provides a semiconductor crystal etching equipment, includes the organism and the tectorial membrane chamber in the organism which characterized in that: the film coating machine is characterized in that first electric slide rails are symmetrically arranged on the left wall and the right wall of the film coating cavity, a film coating plate is arranged on the first electric slide rails in a sliding manner, a film coating device is fixedly arranged at the upper end of the film coating plate and can be used for coating a film with an etching pattern on the surface of a crystal, a moving cavity is arranged in the machine body and is positioned on the right side of the film coating cavity, a second electric slide rail is arranged on the bottom wall of the moving cavity in a sliding manner, a moving plate is arranged on the second electric slide rail in a sliding manner, a working box is arranged in the machine body and positioned on the front side of the moving cavity, the front end of the second electric slide rail extends into the working box, a guide pipe is fixedly arranged on the top wall of the working box, a valve is arranged in the guide pipe and can drop a small amount of etching liquid, a third electric slide rail is arranged on the right wall of the working box, sliding blocks are provided with sliding blocks, and fixed cavities are symmetrically arranged in the upper portion and the lower portion of the sliding blocks, the fixed chamber rear wall is provided with a fourth electric sliding rail, a clamping block is arranged on the fourth electric sliding rail in a sliding mode, a mold block is arranged in the sliding block, the right end of the mold block extends to the outside and can be replaced, clamping grooves are symmetrically formed in the mold block in an up-and-down mode, the clamping block can clamp the position, where the mold block is fixedly arranged, of the clamping groove, an infusion port which penetrates through the mold block from top to bottom is arranged in the mold block, the infusion port is located under the guide pipe, a baffle is fixedly arranged at the lower end of the mold block and cannot be corroded by etching liquid, and the shape of the baffle is consistent with the pattern to be etched.

2. A semiconductor crystal etching apparatus as defined in claim 1, wherein: the movable plate upper end bilateral symmetry is equipped with the transfusion mouth, the symmetry slides around on the transfusion mouth and is equipped with and presss from both sides tight piece, press from both sides tight piece and can fix the position of crystal and make the device can process the crystal of equidimension not.

3. A semiconductor crystal etching apparatus as defined in claim 2, wherein: the spongy cushion is fixedly arranged at the front end of the clamping block and can reduce the damage of the clamping block to the crystal after the crystal is clamped, so that the crystal is prevented from being damaged.

4. A semiconductor crystal etching apparatus as defined in claim 1, wherein: the machine body is internally provided with a transportation cavity positioned on the left side of the film coating cavity, a roller shaft is rotatably arranged between the left wall and the right wall of the transportation cavity, a motor of the roller shaft controls the rotation of the roller shaft, a roller is fixedly arranged on the roller shaft, and the roller can transport crystals to be etched.

5. A semiconductor crystal etching apparatus as defined in claim 4, wherein: the crystal-adsorbing machine is characterized in that motors are symmetrically arranged in the machine body, a motor shaft is connected to the front end of each motor in a power mode, a fixing rod is fixedly arranged on the motor shaft, a fixing block is fixedly arranged at the left end of each fixing rod, an adsorbing block is fixedly arranged at the lower end of each fixing block, and crystals can be transported by the adsorbing blocks.

6. A semiconductor crystal etching apparatus as defined in claim 1, wherein: the upper end of the conduit is provided with an injection port communicated with the outside, and the injection port can be used for adding the liquid into the conduit.

7. The etching liquid, annotate and be equipped with the closing block on the liquid mouth, the closing block can control annotate the switch of liquid mouth.

8. A semiconductor crystal etching apparatus as defined in claim 1, wherein: the sliding block is in the third electric slide rail has small moving amplitude, so that the baffle is always kept against the crystal.

9. A semiconductor crystal etching apparatus as defined in claim 1, wherein: the valve is made of a material which cannot be corroded by the etching liquid, so that the service life of the device is ensured.

Technical Field

The invention relates to the technical field of semiconductors, in particular to a semiconductor crystal etching device.

Background

The etching can be divided into wet etching and dry etching, and the crystal is etched by using the etching liquid in the wet etching, however, the amount of the etching liquid cannot be accurately controlled in the using process, and the redundant etching liquid needs to be recovered, so that the working strength is increased, and the crystal on two sides of the nick is easily corroded by the etching liquid in use, so that the crystal is easily damaged.

Disclosure of Invention

The invention aims to provide semiconductor crystal etching equipment, which solves the problems that the consumption of etching liquid of an etching machine is not easy to control and the etching to the two sides of a nick is serious.

The invention is realized by the following technical scheme.

The invention relates to semiconductor crystal etching equipment which comprises a machine body and a film coating cavity in the machine body, wherein first electric slide rails are symmetrically arranged on the left wall and the right wall of the film coating cavity, a film coating plate is arranged on the first electric slide rails in a sliding manner, a film coating device is fixedly arranged at the upper end of the film coating plate and can be used for adhering a film with an etching pattern to the surface of a crystal, a moving cavity is arranged in the machine body and is positioned on the right side of the film coating cavity, a second electric slide rail is arranged on the bottom wall of the moving cavity in a sliding manner, a moving plate is arranged on the second electric slide rail in a sliding manner, a working box is arranged in the machine body and is positioned on the front side of the moving cavity, the front end of the second electric slide rail extends into the working box, a guide pipe is fixedly arranged on the top wall of the working box, a valve is arranged in the guide pipe and can drip a small amount of etching liquid, and a third electric slide rail is arranged on the right wall of the working box, the third electric slide rail is provided with a sliding block in a sliding manner, the sliding block is symmetrically provided with a fixed cavity from top to bottom, the fixed cavity rear wall is provided with a fourth electric slide rail, the fourth electric slide rail is provided with a clamping block in a sliding manner, the sliding block is internally provided with a mold block, the right end of the mold block extends to the outside and can be replaced, the mold block is internally provided with clamping grooves from top to bottom in a symmetrical manner, the clamping block can be clamped at the position of the mold block fixedly arranged in the clamping grooves, the mold block is internally provided with an infusion port which penetrates through the mold block from top to bottom, the infusion port is arranged under the guide pipe, the lower end of the mold block is fixedly provided with a baffle, the baffle cannot be corroded by etching liquid, and the shape of the baffle is consistent with the pattern to be etched.

Preferably, the movable plate upper end bilateral symmetry is equipped with the transfusion mouth, the last front and back symmetry slip of transfusion mouth is equipped with presss from both sides tight piece, press from both sides tight piece and can fix the position of crystal and make the device can process the crystal of equidimension not.

Preferably, a spongy cushion is fixedly arranged at the front end of the clamping block, and the spongy cushion can reduce the damage to the crystal after the crystal is clamped by the clamping block, so that the crystal is prevented from being damaged.

Preferably, a transportation cavity located on the left side of the film coating cavity is arranged in the machine body, a roller shaft is rotatably arranged between the left wall and the right wall of the transportation cavity, the roller shaft is controlled by a motor to rotate, a roller is fixedly arranged on the roller shaft, and the roller can transport crystals to be etched.

Preferably, bilateral symmetry is equipped with the motor in the organism, motor front end power is connected with the motor shaft, the fixed dead lever that is equipped with on the motor shaft, the fixed block that is equipped with in dead lever left end, the fixed absorption piece that is equipped with of fixed block lower extreme, the absorption piece can transport the crystal.

Preferably, the upper end of the conduit is provided with a liquid injection port communicated with the outside, etching liquid can be added into the conduit through the liquid injection port, the liquid injection port is provided with a sealing block, and the sealing block can control the opening and closing of the liquid injection port.

Preferably, the sliding block has a small moving amplitude in the third electric sliding rail, so that the baffle is always kept against the crystal.

Preferably, the valve is made of a material which cannot be corroded by the etching liquid, so that the service life of the device is ensured.

The invention has the beneficial effects that: the equipment is provided with the guide pipe, a small amount of etching liquid can be dripped on the surface of the crystal through the guide pipe so as to etch the crystal, the damage of the crystal caused by excessive etching liquid is avoided, the subsequent recovery processing of the etching liquid is not needed, the working steps are reduced, and the efficiency is improved;

meanwhile, the baffle is arranged in the device, the baffle can prevent the crystal from moving to the two sides of the nicks when the crystal is etched by the etching liquid, the etching liquid is prevented from corroding the two sides of the nicks, the crystal is protected, the crystal after etching can be normally used, and the nicks on the crystal are more attractive.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

FIG. 2 is a schematic view taken from A-A of FIG. 1 in accordance with an embodiment of the present invention;

FIG. 3 is a schematic view of the embodiment of the present invention at B-B in FIG. 2;

FIG. 4 is an enlarged schematic view of the embodiment of the present invention at C in FIG. 1;

FIG. 5 is an enlarged schematic view of the embodiment of the present invention at D in FIG. 1;

FIG. 6 is an enlarged schematic view of the embodiment of the present invention at E in FIG. 1.

Detailed Description

The invention will now be described in detail with reference to fig. 1-6, wherein for ease of description the orientations described hereinafter are now defined as follows: the up, down, left, right, and front-back directions described below correspond to the up, down, left, right, and front-back directions in the projection relationship of fig. 1 itself.

The semiconductor crystal etching device described in conjunction with fig. 1-6 comprises a machine body 10 and a film coating cavity 15 in the machine body 10, wherein first electric slide rails 16 are symmetrically arranged on the left and right walls of the film coating cavity 15, a film coating plate 17 is slidably arranged on the first electric slide rails 16, a film coating device 18 is fixedly arranged at the upper end of the film coating plate 17, the film coating device 18 can be used for coating a film with an etching pattern on the surface of a crystal, a moving cavity 26 positioned on the right side of the film coating cavity 15 is arranged in the machine body 10, a second electric slide rail 20 is slidably arranged on the bottom wall of the moving cavity 26, a moving plate 21 is slidably arranged on the second electric slide rail 20, a working box 19 positioned on the front side of the moving cavity 26 is arranged in the machine body 10, the front end of the second electric slide rail 20 extends into the working box 19, a conduit 30 is fixedly arranged on the top wall of the working box 19, and a valve 31 is arranged in the conduit 30, the valve 31 can drop a small amount of etching solution, the right wall of the working box 19 is provided with a third electric slide rail 36, a sliding block 35 is arranged on the third electric sliding rail 36 in a sliding manner, fixed cavities 37 are symmetrically arranged in the sliding block 35 from top to bottom, a fourth electric slide rail 39 is arranged on the rear wall of the fixed cavity 37, a clamping block 38 is arranged on the fourth electric slide rail 39 in a sliding manner, the sliding block 35 is provided with a die block 32, the right end of the die block 32 extends to the outside and can be replaced, clamping grooves 44 are symmetrically formed in the upper portion and the lower portion of the die block 32, the clamping blocks 38 can be clamped in the clamping grooves 44 so as to fix the position of the die block 32, the mould block 32 is provided with an infusion port 33 which penetrates up and down, the infusion port 33 is positioned under the conduit 30, the lower end of the mold block 32 is fixedly provided with a baffle 34, the baffle 34 cannot be corroded by the etching liquid, and the shape of the baffle 34 is consistent with the shape of the pattern to be etched.

When the crystal falls into the film coating cavity 15, the control element starts the film coating plate 17 to enable the film coating plate 17 to move upwards along the first electric slide rail 16, so that the film coating device 18 pastes a film with an etching pattern on the surface of the crystal, then the crystal is transported to the moving plate 21, the moving plate 21 slides forwards along the second electric slide rail 20 to enable the crystal to enter the working box 19 and be positioned under the guide pipe 30, then the corresponding mold block 32 is selected, the mold block 32 is inserted into the working box 19, then the control element starts the fixture block 38 to enable the fixture block to slide along the fourth electric slide rail 39 so as to be clamped into the position of the fixed mold block 32 in the clamping groove 44, the control element starts the sliding block 35 to enable the slide downwards along the third electric slide rail 36 so as to enable the baffle 34 to be in contact with the crystal, at the moment, the control element opens the valve 31 to enable a small amount of etching liquid drops in the guide pipe 30 to etch the crystal, meanwhile, the sliding block 35 continues to move downwards along the third electric sliding rail 36, so that the baffle 34 is always in contact with the crystal, the etching liquid is prevented from corroding the two sides of the nicks, and the valve 31 can be used for dropwise adding the etching liquid for multiple times to prevent the etching liquid from being excessively added to influence the etching effect.

Beneficially, the upper end of the moving plate 21 is symmetrically provided with infusion ports 33, the infusion ports 33 are symmetrically provided with clamping blocks 28 in a sliding mode, and the clamping blocks 28 can fix the positions of the crystals and enable the device to process the crystals with different sizes.

After the crystal is transported onto the moving plate 21, the control unit activates the clamping block 28 to move it back and forth along the infusion port 33, thereby clamping the crystal and fixing the position of the crystal, while enabling the apparatus to process crystals of different sizes.

Advantageously, a sponge pad 45 is fixedly arranged at the front end of the clamping block 28, and the sponge pad 45 can reduce the damage to the crystal after the crystal is clamped by the clamping block 28, so that the crystal is prevented from being damaged.

Advantageously, a transport cavity 11 is arranged in the machine body 10 and is positioned at the left side of the film coating cavity 15, a roller shaft 13 is rotatably arranged between the left wall and the right wall of the transport cavity 11, the roller shaft 13 is controlled by a motor to rotate, a roller 12 is fixedly arranged on the roller shaft 13, and the roller 12 can transport crystals to be etched.

The semiconductor crystal to be etched is placed on the roller 12, and the control element activates the motor to drive the roller shaft 13 and the roller 12 to rotate, so that the crystal moves backwards.

Beneficially, the machine body 10 is provided with motors 22 in bilateral symmetry, the front ends of the motors 22 are connected with a motor shaft 23 in a power mode, fixing rods 25 are fixedly arranged on the motor shaft 23, fixing blocks 24 are fixedly arranged at the left ends of the fixing rods 25, adsorbing blocks 27 are fixedly arranged at the lower ends of the fixing blocks 24, and the adsorbing blocks 27 can transport crystals.

After the crystal moves to the lower end of the adsorption block 27, the adsorption block 27 adsorbs the crystal, then the control element starts the left motor 22 to drive the motor shaft 23 and the fixing rod 25 to rotate, so that the crystal is transported to the film coating cavity 15, then the adsorption block 27 loosens the crystal, so that the device performs film coating treatment on the crystal, then the left motor 22 rotates reversely to enable the adsorption block 27 to return to the initial position, the adsorption block 27 on the right side after the film coating is finished sucks the crystal, and the control element starts the right motor 22, so that the crystal is transported to the upper end of the moving plate 21.

Advantageously, the upper end of the conduit 30 is provided with an injection port 41 communicated with the outside, etching liquid can be added into the conduit 30 through the injection port 41, the injection port 41 is provided with a sealing block 40, and the sealing block 40 can control the opening and closing of the injection port 41.

When the etching liquid in the guide tube 30 is insufficient, the worker removes the closing block 40 to open the liquid injection port 41, and adds new etching liquid to the guide tube 30 through the liquid injection port 41

Advantageously, the sliding block 35 moves only to a small extent on the third motorized slide 36, thus ensuring that the stop 34 always abuts against the crystal.

Advantageously, the valve 31 is made of a material that is not corroded by the etching liquid, so that the service life of the device is ensured.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.