阅读说明：本技术 一种用于siw天线的印刷电路板 (Printed circuit board for SIW antenna ) 是由 李丰军 周剑光 杨慧 张魏 于 2021-07-28 设计创作，主要内容包括：本发明公开了一种用于SIW天线的印刷电路板,该印刷电路板被配置为叠层结构,叠层结构的层数为2n,其中n为正整数；印刷电路板的第一层与第二层之间设置有多个第一盲孔,第一盲孔包括采用第一钻孔方式形成的第一孔段和采用第二钻孔方式形成的第二孔段；第一钻孔方式的控制精度低于第二钻孔方式的控制精度；第一孔段与第二孔段由第一层朝向外侧的表面向第二层连续设置,第一孔段的孔径与第一孔段的深度成正比,第二孔段的深度小于第一厚度值,第一层与第二层之间的介质板厚度大于等于第二厚度值,第二厚度值大于所述第一厚度值。本发明提供的用于SIW天线的印刷电路板设计密度可以做的更高、更轻薄且不存在SIW天线信号能量泄露问题。(The invention discloses a printed circuit board for a SIW antenna, which is configured into a laminated structure, wherein the number of layers of the laminated structure is 2n, and n is a positive integer; a plurality of first blind holes are arranged between the first layer and the second layer of the printed circuit board, and each first blind hole comprises a first hole section formed in a first drilling mode and a second hole section formed in a second drilling mode; the control precision of the first drilling mode is lower than that of the second drilling mode; the first hole section and the second hole section are continuously arranged from the outward-facing surface of the first layer to the second layer, the aperture of the first hole section is in direct proportion to the depth of the first hole section, the depth of the second hole section is smaller than a first thickness value, the thickness of the dielectric plate between the first layer and the second layer is larger than or equal to a second thickness value, and the second thickness value is larger than the first thickness value. The printed circuit board for the SIW antenna provided by the invention can be designed to be higher and thinner without the problem of signal energy leakage of the SIW antenna.)

1. A printed circuit board for a SIW antenna, wherein the printed circuit board is configured as a laminated structure having a number of layers of 2n, wherein n is a positive integer; a plurality of first blind holes (3) are arranged between a first layer (1) and a second layer (2) of the printed circuit board, and the first blind holes (3) comprise first hole sections formed in a first drilling mode and second hole sections formed in a second drilling mode; the control precision of the first drilling mode is lower than that of the second drilling mode;

the first hole section and the second hole section are continuously arranged from the outward-facing surface of the first layer (1) to the second layer (2), the aperture of the first hole section is in direct proportion to the depth of the first hole section, the depth of the second hole section is smaller than a first thickness value, the thickness of a medium plate between the first layer (1) and the second layer (2) is larger than or equal to a second thickness value, and the second thickness value is larger than the first thickness value.

2. The printed circuit board for a SIW antenna of claim 1, wherein the first drilling pattern comprises a mechanical drilling, the first drilling pattern having a positional accuracy of ± 3 mils.

3. The printed circuit board for a SIW antenna of claim 1, wherein said second drilling pattern comprises laser drilling, said second drilling pattern having a positional accuracy of ± 2 mils.

4. The printed circuit board for a SIW antenna of claim 1, wherein said first thickness value is 5 mils.

5. The printed circuit board for a SIW antenna of claim 1, wherein said second thickness value is 10 mils.

6. The printed circuit board for a SIW antenna according to claim 1, wherein the printed circuit board is manufactured by co-pressing a high frequency board and a non-high frequency board at one time.

7. A printed circuit board for a SIW antenna according to claim 6, wherein the dielectric plate between the first layer (1) and the second layer (2) is made of a high frequency plate material, and the dielectric plate between the second layer (2) and the 2 n-th layer comprises a dielectric plate made of a non-high frequency plate material.

8. A printed circuit board for a SIW antenna according to claim 1, wherein a plurality of the first blind holes (3) are arranged in an array on the dielectric plate between the first layer (1) and the second layer (2).

9. The printed circuit board for a SIW antenna according to claim 1, wherein the thickness between the first layer (1) to the nth layer of the printed circuit board is equal to the thickness between the n +1 st layer to the 2 nth layer of the printed circuit board.

10. The printed circuit board for a SIW antenna of claim 9, further comprising at least one second blind via formed using the first drilling pattern, the second blind via disposed between the 2 n-th layer and the n +1 layer.

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board for a SIW antenna.

Background

The Substrate Integrated Waveguide (SIW) is formed by combining an upper metal surface, a lower metal surface and metal columns which are periodically arranged on two sides, wherein two rows of metal columns are equivalent to two side walls of a rectangular Waveguide, and electromagnetic waves are transmitted in a space formed by the two rows of metal columns and the upper conductor surface and the lower conductor surface. The periodic arrangement of the SIW metal pillars causes a certain reflection and energy leakage for the propagation of electromagnetic waves. In practical applications, to prevent the energy leakage of the SIW, the radius R and the spacing W of the metal pillar generally satisfy the following conditions:

r is less than 0.1 lambda g, W is less than 4R, R is less than 0.2a, wherein lambda g is the waveguide wavelength,

through HFSS simulation verification, when the interval between the metal columns meets W < 4R, energy is mainly concentrated between the two rows of metal columns for propagation, and almost no energy leaks between the metal columns and outside the metal columns.

In the existing production process, a 77GHz millimeter wave radar adopts an antenna and a baseband to be manufactured on a printed circuit board, the thickness of a medium layer between a first layer and a second layer of the printed circuit board is larger, if blind holes from the first layer to the second layer of the printed circuit board are manufactured in a mechanical drilling mode, a process of a depth control drill is needed, the drilling aperture of the depth control drill is in direct proportion to the drilling depth, the drilling aperture is larger along with the increase of the drilling depth, when the number of the blind holes between the first layer and the second layer of the printed circuit board is larger, and the constraint condition of SIW between the radius R of a metal column and the spacing W cannot be met, the problem of SIW antenna signal energy leakage exists. And the position precision of mechanical drilling is slightly lower than that of laser drilling, the thickness of the medium between the second layer and the third layer needs to be larger than 6mil when the process is adopted, and the overlarge thickness of the medium between the second layer and the third layer is not beneficial to the symmetry of the printed circuit board. Therefore, the mechanical hole process is not the best option.

In consideration of the alignment precision of metal holes, in the prior art, laser drilling is generally adopted to manufacture blind holes from the first layer to the second layer of the printed circuit board, but when the thickness of the board is more than 5mil, the blind holes manufactured by laser drilling can present a trapezoidal hole effect.

Fig. 1 is a schematic view of a metal cylindrical hole on a printed circuit board according to an embodiment of the present invention, fig. 2 is a schematic view of a metal trapezoidal hole on a printed circuit board according to an embodiment of the present invention, and when a thickness of a board is not greater than 5mil, a blind hole obtained by laser drilling is a circular hole as shown in fig. 1; when the thickness of the plate is more than 5mil, the blind hole obtained by laser drilling is in a trapezoidal hole shape as shown in fig. 2, the proportion of the upper edge and the lower edge of the trapezoid is 70% -90%, and the thicker the plate is, the more obvious the trapezoidal hole effect is.

The trapezoidal aperture deteriorates the performance parameters of the SIW antenna. Fig. 3 is a diagram of simulation results of S11 of the SIW antenna with the metal cylindrical hole according to the embodiment of the present invention, and fig. 4 is a diagram of simulation results of S11 of the SIW antenna with the metal trapezoidal hole according to the embodiment of the present invention, where the operating bandwidth of the general antenna is 76GHz-77GHz, and the S11 value requirement in the operating bandwidth is less than-15 dB. When the frequency range of the S11 curve shown in FIG. 3 is 75.05GHz-78.51GHz, the S11 value is less than-15 dB, the working bandwidth is 3.5GHz, and the antenna index requirement is met. When the frequency range of the S11 curve shown in fig. 4 is 77.9GHz-78.9GHz, the S11 value is less than-15 dB, the working bandwidth is 1GHz, the narrowing is about 2.5GHz compared with fig. 3, and the whole curve shifts to high frequency and does not meet the requirement of antenna index. Comparing the simulation results of S11 in fig. 3 and fig. 4, it can be seen that the metal trapezoidal hole shifts the resonant frequency of the SIW antenna to a high frequency, and deteriorates the S11 parameter and the directional pattern of the system, so that the metal pillar has a trapezoidal structure, which also causes the leakage of the signal energy of the SIW antenna.

Therefore, there is a need for improvements in the prior art to ensure that the performance of printed circuit boards used in SIW antennas is satisfactory.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. To this end, the first aspect of the present invention provides a printed circuit board for a SIW antenna, the printed circuit board being configured as a stacked structure, the number of layers of the stacked structure being 2n, where n is a positive integer; a plurality of first blind holes are arranged between the first layer and the second layer of the printed circuit board, and each first blind hole comprises a first hole section formed in a first drilling mode and a second hole section formed in a second drilling mode; the control precision of the first drilling mode is lower than that of the second drilling mode;

the first hole section and the second hole section are continuously arranged from the outward-facing surface of the first layer to the second layer, the aperture of the first hole section is in direct proportion to the depth of the first hole section, the depth of the second hole section is smaller than a first thickness value, the thickness of the dielectric plate between the first layer and the second layer is larger than or equal to a second thickness value, and the second thickness value is larger than the first thickness value.

Further, the first drilling mode comprises mechanical drilling, and the position precision of the first drilling mode is +/-3 mils.

Further, the second drilling mode comprises laser drilling, and the position accuracy of the second drilling mode is +/-2 mils.

Further, the first thickness value is 5 mil.

Further, the second thickness value is 10 mils.

Furthermore, the printed circuit board is manufactured by adopting a mode of one-time pressing of mixed pressing of high-frequency plates and non-high-frequency plates.

Further, the dielectric plate between the first layer and the second layer is made of a high-frequency plate, and the dielectric plate between the second layer and the 2 n-th layer comprises a dielectric plate made of a non-high-frequency plate.

Furthermore, the first blind holes are arranged in an array on the dielectric plate between the first layer and the second layer.

Further, the thickness between the first layer to the nth layer of the printed circuit board is equal to the thickness between the n +1 th layer to the 2 nth layer of the printed circuit board.

Further, the multilayer printed circuit board further comprises at least one second blind hole, wherein the second blind hole is formed in the first drilling mode, and the second blind hole is arranged between the 2 n-th layer and the n + 1-th layer.

1. In the embodiment of the invention, the medium plate between the first layer and the second layer is provided with a plurality of blind holes, the blind holes comprise a first hole section and a second hole section which are continuously arranged from outside to inside, the first hole section is drilled in a first drilling mode, the second hole section is drilled in a second drilling mode, and the depth of the first hole section can be reduced by arranging the second hole section on the premise of determining the depth of the blind holes, so that the aperture of the first hole section is reduced, and the design density of the printed circuit board can be effectively improved.

2. The scheme provided by the prior art for drilling the blind holes by simply adopting the first drilling mode requires that the thickness of the self-checking dielectric plate of the second layer and the third layer is not less than 6 mils, while the scheme provided by the embodiment of the invention has no requirement on the thickness of the dielectric plate between the second layer and the third layer, and the dielectric plate between the second layer and the third layer has greater flexibility in thickness selection, thereby being beneficial to the light and thin design of a printed circuit board.

3. According to the embodiment of the invention, the depth of the second hole section is controlled within the plate thickness range applicable to the second drilling mode, so that the characteristics of high position precision and good alignment accuracy of the second drilling mode are utilized, the signal energy leakage of the SIW antenna caused by the trapezoid hole effect is avoided, and the performance of the SIW antenna is ensured.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a metal cylindrical hole in a printed circuit board provided by an embodiment of the present invention;

FIG. 2 is a schematic diagram of a metal trapezoidal hole on a printed circuit board provided by an embodiment of the invention;

FIG. 3 is a diagram of the simulation results of S11 for a SIW antenna having a metal cylinder hole on a printed circuit board according to an embodiment of the present invention;

FIG. 4 is a diagram of the simulation results of S11 of another SIW antenna provided by an embodiment of the present invention, the SIW antenna has a metal trapezoidal hole on a printed circuit board;

fig. 5 is a schematic structural diagram of a printed circuit board for a SIW antenna according to an embodiment of the present invention;

FIG. 6 is a flow chart illustrating a process for manufacturing a printed circuit board for a SIW antenna according to an embodiment of the present invention;

FIG. 7 is a directional diagram of a SIW antenna having a metal cylindrical hole in a printed circuit board according to an embodiment of the present invention;

fig. 8 is a diagram of a simulation result of S11 of another SIW antenna according to an embodiment of the present invention, where the printed circuit board of the SIW antenna has a metal trapezoidal hole.

Wherein, 1-the first layer, 2-the second layer, and 3-the first blind hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout.

Examples

Fig. 5 is a schematic structural diagram of a printed circuit board for an SIW antenna according to an embodiment of the present invention, and specifically, as shown in fig. 5, the printed circuit board for an SIW antenna is configured to be a stacked structure, where the number of layers of the stacked structure is 2n, where n is a positive integer; a plurality of first blind holes 3 are arranged between a first layer 1 and a second layer 2 of the printed circuit board, and the first blind holes 3 comprise first hole sections formed by adopting a first drilling mode and second hole sections formed by adopting a second drilling mode; the first drilling mode can be mechanical drilling, the second drilling mode can be laser drilling, and the control precision of the first drilling mode is lower than that of the second drilling mode;

the first hole section and the second hole section are continuously arranged from the outward-facing surface of the first layer 1 to the second layer 2, the aperture of the first hole section is in direct proportion to the depth of the first hole section, the depth of the second hole section is smaller than a first thickness value, for example, 5mil, the thickness of the dielectric plate between the first layer 1 and the second layer 2 is greater than or equal to a second thickness value, for example, 10mil, and the second thickness value is greater than the first thickness value.

When the thickness of the dielectric plate between the first layer 1 and the second layer 2 is greater than or equal to 10mil, the thickness of the dielectric plate is positively correlated with the bandwidth of the antenna. Considering that the quality of formed holes cannot be guaranteed by manufacturing blind holes on a dielectric plate with the thickness of more than or equal to 10 mils in a pure mechanical drilling mode and a pure laser drilling mode, when the requirement of an antenna on the bandwidth is high in the prior art, the bandwidth is increased by changing the shape of the antenna instead of increasing the thickness of the dielectric plate; when the requirement of the antenna on the bandwidth is low, the thickness of a medium plate between the first layer 1 and the second layer 2 of the printed circuit board is usually less than 10 mils, and under the condition, a pure laser process can be adopted to manufacture blind holes meeting the requirement.

It should be noted that the first thickness value may be set to other values less than 5mil, such as 4.8mil, 3mi, etc., and similarly, it is also possible to set the second thickness value to other values greater than 10mil, such as 10.1mil, 12mil, etc., if necessary.

The embodiment of the invention divides a first blind hole into a first hole section and a second hole section for manufacturing, wherein the first hole section is manufactured in a mechanical drilling mode, a depth control process is needed when the first hole section is drilled, and the process requires that the thickness of a next layer of medium is more than 6 mil; the second hole section is manufactured in a laser drilling mode, and the laser drilling mode has no requirement on the thickness of the next layer of medium; therefore, compared with the blind hole manufacturing method which simply adopts mechanical drilling in the prior art, the blind hole manufacturing method which combines mechanical drilling and laser drilling provided by the embodiment of the invention only has the requirement on the thickness of the medium of the next layer in the first hole section. And when the first hole section is drilled, the thickness of the second hole section can be used as a part of the thickness from the bottom surface of the first hole section to the next layer (namely, the second layer 2 to the third layer) of medium, so that when the scheme of the embodiment of the invention is adopted, the thickness of the next layer (namely, the second layer 2 to the third layer) of medium only needs to meet the requirement that the sum of the depth of the next layer and the depth of the second hole section is more than 6 mils, the requirement of mechanical drilling on the thickness of the next layer (namely, the second layer 2 to the third layer) of medium is obviously reduced, and the thickness can be met by most of medium layers. Therefore, the thickness of the next layer of medium can be flexibly selected in a larger range by adopting a blind hole manufacturing mode combining mechanical drilling and laser drilling.

It should be noted that, when the blind hole with a small aperture is adopted, the reference layer is not easily broken by the via hole, the signal backflow is reduced, and the signal quality can be improved. With the reduction of the aperture of the blind hole, the design density of the printed circuit board is reduced, the wiring difficulty is reduced, and the distance between different network signals is increased, so that the crosstalk between the signals is reduced, and the signal quality is improved.

The depth control process of mechanical drilling determines that the depth of the first hole section is in direct proportion to the aperture of the first hole section, the depth of the first hole section can be reduced by arranging the second hole section on the premise that the depth of the first blind hole is fixed and the area of the printed circuit board is fixed, and the required aperture is reduced along with the reduction of the depth of the mechanical drilling, for example, in an example that the thickness of a dielectric layer is 10 mils, the aperture of the first blind hole of the embodiment of the invention is reduced by 0.1mm compared with the aperture of a blind hole which only adopts a mechanical drilling mode.

Because the drilling position precision of the mechanical hole is 3mil, which is slightly lower than the precision of 2mil of the laser hole, the second hole section is manufactured in a laser drilling mode, which is beneficial to improving the position precision and the alignment accuracy of the blind hole, so that the printed circuit board for the SIW antenna meets the performance parameter index requirement of the SIW antenna.

Fig. 6 is a process flow chart of a printed circuit board for a SIW antenna according to an embodiment of the present invention, specifically, as shown in fig. 6, the process flow includes: a) cutting the material, b) transferring the pattern of the L2-5 layers, c) laminating, d) drilling, e) plating copper, f) plating the outer layer and plating the pattern. The first blind hole arranged on the dielectric slab between the first layer 1 and the second layer 2 is manufactured by adopting a mechanical and laser process, and the related processes of the link are as follows in sequence: copper window etching → AOI → drilling through hole → deep control machine drilling → laser blind hole; the depth of the deep control mechanical drill is combined with the requirements of the process on the aspect ratio of the drill hole and the quality of laser hole forming, and the requirements are determined according to case analysis of specific projects. The quality of the formed hole of the first blind hole is ensured, and the requirements on the design density of the printed circuit board and the thickness of the laminated medium are reduced.

In one embodiment, the 77G millimeter wave radar printed circuit board is implemented on a printed circuit board using an antenna and a baseband. The printed circuit board is manufactured by adopting a mode of one-time pressing of mixed pressing of high-frequency plates and non-high-frequency plates. One reason for considering the one-time bonding is that the SIW antenna has a high requirement on the position accuracy of the via hole.

The dielectric plate between the first layer 1 and the second layer 2 is made of a high-frequency plate with low dielectric constant, low loss and low surface roughness, such as an RO3003 plate. The dielectric sheet between the second layer 2 and the 2 n-th layer may be a dielectric sheet made of a non-high frequency plate material, and the non-high frequency plate material may be an FR4 plate material. Therefore, the same printed circuit board not only meets the requirement of high-performance radio frequency signals, but also meets the requirement of low cost of digital signals.

The plurality of first blind holes 3 are arranged in an array on the dielectric plate between the first layer 1 and the second layer 2, for example, the plurality of first blind holes shown in fig. 1 are arranged periodically on both sides of the dielectric plate.

Referring to fig. 6, in order to avoid warpage of the pcb, the stacking is made as symmetrical as possible, and the thickness between the first layer 1 and the nth layer of the pcb should be equal to the thickness between the (n + 1) th layer and the 2 nth layer of the pcb as much as possible. Meanwhile, at least one second blind hole is formed in the printed circuit board in a first drilling mode, and the second blind hole is formed between the 2 n-th layer and the n + 1-th layer. The second blind hole has low requirement on precision hole type, is manufactured by adopting a depth control process of mechanical drilling, and the diameter of the drilled hole is in direct proportion to the thickness of the medium between the (n + 1) th layer and the (2 n) th layer, so that the thickness of the medium between the (n + 1) th layer and the (2 n) th layer is as small as possible.

In one embodiment, the printed circuit board is a 6-layer hybrid board, the dielectric board between the first layer 1 and the second layer 2 is made of a 10MIL RO3003 ED board, and the first blind hole between the first layer 1 and the second layer 2 is designed to have a hole diameter of 0.4 mm. According to the existing process capability, a laser hole process is used for 10mil thickness, the first blind hole from the first layer 1 to the second layer 2 has a trapezoidal effect, the upper and lower proportion is about 70%, the upper surface aperture is 0.4mm according to the design value, and the lower aperture is about 0.28 mm. In practical applications, the number of layers of the printed circuit board may also be other values, for example, 4 layers, 8 layers, and the like, and the embodiment of the present invention is not limited thereto.

Fig. 7 is a directional diagram of a SIW antenna provided in the prior art, fig. 8 is a directional diagram of a SIW antenna provided in an embodiment of the present invention, a printed circuit board manufactured according to the existing process capability is subjected to simulation verification to obtain the directional diagram of the SIW antenna having the metal trapezoidal blind hole shown in fig. 7, a mechanical + laser process is provided according to an embodiment of the present invention, and the upper and lower apertures are simulated to obtain the directional diagram of the SIW antenna having the metal cylindrical blind hole shown in fig. 8. In the figure, Phi is 0deg, and Phi is 90deg, which is the antenna azimuth plane. The abscissa is angle (degree) and the ordinate is gain (dB); the 30 position to the right of the solid line is the side lobe level. As shown in fig. 7 and 8, by improving the SIW antenna design with trapezoidal blind holes, the overall performance is improved (HFSS simulation) as follows:

firstly, the side lobe level of a directional diagram of the SIW antenna system is improved, and the side lobe level of the general antenna is required to be less than-15 dB. The sidelobe level in fig. 7 is-12 dB, and the data does not meet the antenna specification requirements. The side lobe level in fig. 8 is-15 dB, which is improved by 3dB compared with fig. 7, and meets the requirement of the antenna side lobe level.

Secondly, the beam offset of the pitching surface of the antenna is improved, the beam offset in fig. 7 indicates that the angle of the maximum point of the pitching surface gain is at the position of 4 degrees, the beam offset in fig. 8 indicates that the angle of the maximum point of the pitching surface gain is at the position of 2 degrees, and compared with fig. 7, the beam offset of the pitching surface of the antenna is improved from the original 4 degrees of offset to 2 degrees of offset.

And thirdly, the fluctuation of an antenna azimuth plane directional pattern and the antenna gain are improved, wherein the antenna gain refers to the maximum point of the pitching gain.

As can be seen from the above embodiment of the printed circuit board for the SIW antenna provided by the present invention, the embodiment of the present invention has the following advantages:

1. in the embodiment of the invention, a plurality of first blind holes are arranged on the dielectric plate between the first layer 1 and the second layer 2, each first blind hole comprises a first hole section and a second hole section which are continuously arranged from outside to inside, wherein the first hole section is drilled in a first drilling mode, the second hole section is drilled in a second drilling mode, and the depth of the first hole section can be reduced by arranging the second hole section on the premise of determining the depth of the first blind hole, so that the aperture of the first hole section is reduced, and the design density of the printed circuit board can be effectively improved.

2. The scheme provided by the prior art for drilling the blind holes by simply adopting the first drilling mode requires that the thickness of the self-checking dielectric slab of the second layer 2 and the third layer is not less than 6 mils, while the scheme provided by the embodiment of the invention has no requirement on the thickness of the dielectric slab between the second layer 2 and the third layer, and the dielectric slab between the second layer 2 and the third layer has greater flexibility in thickness selection, thereby being beneficial to the light and thin design of a printed circuit board.

3. According to the embodiment of the invention, the depth of the second hole section is controlled within the plate thickness range applicable to the second drilling mode, so that the characteristics of high position precision and good alignment accuracy of the second drilling mode are utilized, the trapezoidal hole effect is avoided, and the performance of the SIW antenna is ensured.

It should be noted that: the precedence order of the above embodiments of the present invention is only for description, and does not represent the merits of the embodiments. And specific embodiments thereof have been described above. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be possible or may be advantageous.

The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.