阅读说明：本技术 一种垂直晶片浸泡去胶转换机构及方法 (Vertical wafer soaking and photoresist removing conversion mechanism and method ) 是由 魏猛 张爽 李冬海 于 2021-09-09 设计创作，主要内容包括：本发明涉及一种垂直晶片浸泡去胶转换机构及方法,属于晶片制造技术领域。该机构包括固定安装板；第一升降装置安装在固定安装板上,第一升降装置安装有升降台,升降台安装有第一竖杆,第一竖杆穿过固定安装板并伸出；第二升降装置安装在升降台上,第二升降装置安装有第二竖杆,第二竖杆穿过固定安装板并伸出；晶片盒,晶片盒的外侧壁上设有第一凸块和第二凸块,第一凸块位于晶片盒的中部,第二凸块位于晶片盒的盒底,第一凸块铰接于第一竖杆的底端,第二凸块上铰接有一连接杆,连接杆与第二竖杆的底端铰接；浸泡槽安装在晶片盒的下方。该方法使用上述机构来去除晶片表面的光刻胶。通过上述结构,该机构以及方法能够更好地将晶片表面的光刻胶去除。(The invention relates to a vertical wafer soaking and photoresist removing conversion mechanism and a method, and belongs to the technical field of wafer manufacturing. The mechanism comprises a fixed mounting plate; the first lifting device is installed on the fixed installation plate, the first lifting device is provided with a lifting platform, the lifting platform is provided with a first vertical rod, and the first vertical rod penetrates through the fixed installation plate and extends out; the second lifting device is arranged on the lifting platform and provided with a second vertical rod, and the second vertical rod penetrates through the fixed mounting plate and extends out; the outer side wall of the wafer box is provided with a first lug and a second lug, the first lug is positioned in the middle of the wafer box, the second lug is positioned at the bottom of the wafer box, the first lug is hinged to the bottom end of a first vertical rod, the second lug is hinged to a connecting rod, and the connecting rod is hinged to the bottom end of a second vertical rod; the immersion tank is arranged below the wafer box. The method uses the above mechanism to remove the photoresist from the wafer surface. Through the structure, the mechanism and the method can better remove the photoresist on the surface of the wafer.)

1. The utility model provides a vertical wafer soaks and removes to glue shifter which characterized in that includes:

fixing the mounting plate;

the first lifting device is arranged on the fixed mounting plate, a lifting platform is arranged at the lifting end of the first lifting device, a first vertical rod is arranged on the lifting platform, and the first vertical rod downwards penetrates through the fixed mounting plate and extends out of the fixed mounting plate;

the second lifting device is arranged on the lifting platform, a second vertical rod is arranged at the lifting end of the second lifting device, and the second vertical rod downwards penetrates through the fixed mounting plate and extends out;

the wafer box is formed by enclosing a side wall and a box bottom, a first lug and a second lug are arranged on the outer side wall of the wafer box, a connecting line of the first lug and the second lug is parallel to the depth direction of the wafer box, the first lug is positioned at a position close to the middle part of the wafer box, the second lug is positioned at a position close to the box bottom of the wafer box, the first lug is hinged to the bottom end of a first vertical rod, a connecting rod is hinged to the second lug, and the connecting rod is hinged to the bottom end of a second vertical rod;

the immersion tank is filled with an organic solvent and is arranged below the wafer box;

in the first state, a box opening of the wafer box faces to the horizontal direction;

in the second state, the box opening of the wafer box faces upwards.

2. The vertical wafer immersion photoresist stripping conversion mechanism of claim 1, wherein: be provided with on the fixed mounting board with the first guide shaft sleeve of first montant adaptation and with the second guide shaft sleeve of second montant adaptation, the slip cartridge of first montant in first guide shaft sleeve, the slip cartridge of second montant in second guide shaft sleeve.

3. The vertical wafer immersion photoresist stripping conversion mechanism of claim 1, wherein: the side wall and the box bottom of the wafer box are both provided with a plurality of pores for the circulation of organic solvent.

4. The vertical wafer immersion photoresist removal mechanism of any one of claims 1 to 3, wherein: a third vertical rod is connected to the lifting platform, the third vertical rod downwards penetrates through the fixed mounting plate and extends out, and the bottom end of the third vertical rod is connected with a piston;

a partition plate in a vertical state is arranged in the soaking tank, the inner cavity of the soaking tank is divided into a first cavity and a second cavity for soaking the wafer box through the partition plate, the piston is opposite to the first cavity up and down, the piston can perform piston motion in the first cavity, the wafer box is opposite to the second cavity up and down, a channel is formed in the bottom end of the partition plate, and the first cavity and the second cavity are communicated through the channel;

the piston is inserted into the first chamber when the wafer cassette is immersed in the organic solvent in the immersion tank.

5. The vertical wafer immersion photoresist stripping conversion mechanism of claim 4, wherein: the fixed mounting board is further provided with a third guide shaft sleeve matched with the third vertical rod, and the third vertical rod is inserted into the third guide shaft sleeve in a sliding mode.

6. The vertical wafer immersion photoresist stripping conversion mechanism of claim 4, wherein: still including being used for covering the apron of the accent mouth of second chamber, the apron articulate in soak on the lateral wall of groove, and it is right to have seted up on the apron first montant and the second montant forms the breach of stepping down.

7. The vertical wafer immersion photoresist stripping conversion mechanism of claim 6, wherein: when the cover plate covers the orifice of the second cavity, one side of the cover plate close to the inside of the second cavity is a first plate surface, one side of the cover plate opposite to the first plate surface is a second plate surface, and the first plate surface is detachably provided with a liquid absorption plate capable of absorbing organic solvents.

8. The vertical wafer immersion photoresist stripping conversion mechanism of claim 7, wherein: and a handle is arranged on the second plate surface of the cover plate.

9. The vertical wafer immersion photoresist stripping conversion mechanism of claim 6, wherein: the cover plate is a structural member made of toughened glass.

10. The vertical wafer immersion photoresist stripping conversion mechanism of claim 4, wherein: and the fixed mounting plate is provided with a collimating mechanism for assisting the mounting and positioning of the soaking tank.

11. The vertical wafer immersion photoresist stripping conversion mechanism of claim 10, wherein: the collimation structure includes the luminous component, on the bottom surface that the luminous component set up fixed mounting board and this luminous component was located directly over the baffle.

12. The vertical wafer immersion photoresist stripping conversion mechanism of claim 11, wherein: the straight flute has been seted up on the bottom surface of fixed mounting panel, luminous component installs the tank bottom middle part of straight flute, transparent guard plate is still installed in the notch department of straight flute.

13. The vertical wafer immersion photoresist stripping conversion mechanism of claim 12, wherein: light emitting component is LED lamp pearl, install the battery on the top surface of fixed mounting panel, LED lamp pearl pass through the circuit with the battery electricity is connected, be provided with the switch on the circuit, the switch mounting is in on the top surface of fixed mounting panel.

14. The vertical wafer immersion photoresist stripping conversion mechanism of claim 13, wherein: the LED lamp beads are arranged in a straight line to form a lamp group, and the LED lamp beads are connected in parallel.

15. The vertical wafer immersion photoresist stripping conversion mechanism of claim 14, wherein: the top surface of the partition board is provided with a straight long groove, the straight long groove is positioned right below the straight groove, and the length and the width of the straight long groove are respectively the same as those of the straight groove.

16. A method for removing photoresist of a vertical wafer by soaking is characterized in that: the vertical wafer immersion photoresist removal conversion mechanism of any one of claims 1 to 15, said method comprising:

loading an organic solvent capable of taking out the redundant photoresist on the surface of the wafer into the soaking tank;

loading the wafer to be stripped into the wafer box in the first state;

driving the second vertical rod to descend by using the second lifting device so as to push the second bump downwards, so that the wafer box is driven to rotate around the lower end of the first vertical rod until the wafer box is switched to the second state;

driving the second lifting device and the first vertical rod to descend by using the first lifting device, so as to drive the wafer box in the second state to descend to be immersed in the organic solvent in the immersion tank;

driving the wafer box to reciprocate up and down in the organic solvent by using the first lifting device;

driving the second lifting device and the first vertical rod to ascend by using the first lifting device so as to drive the wafer box to come out of the organic solvent;

the second lifting device is used for driving the second vertical rod to ascend so as to pull the second bump, so that the wafer box is driven to rotate around the lower end of the first vertical rod until the wafer box is converted into the first state;

and taking out the wafers in the wafer box.

Technical Field

The invention belongs to the technical field of wafer manufacturing, and particularly relates to a vertical wafer soaking and photoresist removing conversion mechanism and a method.

Background

In the semiconductor field, the wafer fabrication process requires a variety of processes, including the removal of a photoresist layer from the wafer surface. The known method for removing the photoresist layer on the surface of the wafer is to directly spray high-pressure or low-pressure organic solvent on the surface of the wafer, so that the wafer can be damaged, and the other method is to firstly place the wafer in an organic solvent tank for standing and soaking and then remove the wafer by using a high-pressure or low-pressure spray head, so that the photoresist removing effect is greatly improved, but for some photoresist layers with strong adhesion, the two removal methods cannot achieve the ideal photoresist removing effect.

Disclosure of Invention

The invention provides a vertical wafer soaking and photoresist removing conversion mechanism and a method, which are used for solving the technical problem that the photoresist removing effect on the surface of a wafer is not ideal in the prior art.

The invention is realized by the following technical scheme: a vertical wafer immersion photoresist stripping switching mechanism, comprising:

fixing the mounting plate;

the first lifting device is arranged on the fixed mounting plate, a lifting platform is arranged at the lifting end of the first lifting device, a first vertical rod is arranged on the lifting platform, and the first vertical rod downwards penetrates through the fixed mounting plate and extends out of the fixed mounting plate;

the second lifting device is arranged on the lifting platform, a second vertical rod is arranged at the lifting end of the second lifting device, and the second vertical rod downwards penetrates through the fixed mounting plate and extends out;

the wafer box is formed by enclosing a side wall and a box bottom, a first lug and a second lug are arranged on the outer side wall of the wafer box, a connecting line of the first lug and the second lug is parallel to the depth direction of the wafer box, the first lug is positioned at a position close to the middle part of the wafer box, the second lug is positioned at a position close to the box bottom of the wafer box, the first lug is hinged to the bottom end of a first vertical rod, a connecting rod is hinged to the second lug, and the connecting rod is hinged to the bottom end of a second vertical rod;

the immersion tank is filled with an organic solvent and is arranged below the wafer box;

in the first state, a box opening of the wafer box faces to the horizontal direction;

in the second state, the box opening of the wafer box faces upwards.

Furthermore, in order to better implement the invention, a first guide shaft sleeve adapted to the first vertical rod and a second guide shaft sleeve adapted to the second vertical rod are arranged on the fixed mounting plate, the first vertical rod is slidably inserted into the first guide shaft sleeve, and the second vertical rod is slidably inserted into the second guide shaft sleeve.

Furthermore, in order to better implement the present invention, the side wall and the bottom of the wafer box are both provided with a plurality of pores for the circulation of organic solvents.

Furthermore, in order to better realize the invention, a third vertical rod is connected to the lifting platform, the third vertical rod downwards penetrates through the fixed mounting plate and extends out, and the bottom end of the third vertical rod is connected with a piston;

a partition plate in a vertical state is arranged in the soaking tank, the inner cavity of the soaking tank is divided into a first cavity and a second cavity for soaking the wafer box through the partition plate, the piston is opposite to the first cavity up and down, the piston can perform piston motion in the first cavity, the wafer box is opposite to the second cavity up and down, a channel is formed in the bottom end of the partition plate, and the first cavity and the second cavity are communicated through the channel;

the piston is inserted into the first chamber when the wafer cassette is immersed in the organic solvent in the immersion tank.

Furthermore, in order to better implement the present invention, a third guiding shaft sleeve adapted to the third vertical rod is further disposed on the fixed mounting plate, and the third vertical rod is slidably inserted into the third guiding shaft sleeve.

Furthermore, in order to better realize the invention, the soaking device further comprises a cover plate used for covering the cavity opening of the second cavity, the cover plate is hinged on the side wall of the soaking groove, and a yielding notch for yielding the first vertical rod and the second vertical rod is formed in the cover plate.

Further, in order to better implement the present invention, when the cover plate covers the opening of the second cavity, a side plate surface of the cover plate close to the inside of the second cavity is a first plate surface, a side plate surface of the cover plate opposite to the first plate surface is a second plate surface, and a liquid absorption plate capable of absorbing an organic solvent is detachably mounted on the first plate surface.

Further, in order to better implement the present invention, a handle is disposed on the second plate surface of the cover plate.

Further, in order to better implement the invention, the cover plate is a structural member made of tempered glass.

Further, in order to better implement the invention, an alignment mechanism for assisting the installation and the positioning of the soaking tank is arranged on the fixed mounting plate.

Further, in order to better implement the present invention, the collimating structure includes a light emitting member disposed on a bottom surface of the fixing mounting plate and located directly above the spacer.

Furthermore, in order to better realize the invention, a straight groove is formed on the bottom surface of the fixed mounting plate, the light emitting part is mounted in the middle of the bottom of the straight groove, and a transparent protection plate is further mounted at the notch of the straight groove.

Further, in order to better realize the invention, the light emitting component is an LED lamp bead, a storage battery is installed on the top surface of the fixed installation plate, the LED lamp bead is electrically connected with the storage battery through a circuit, a switch is arranged on the circuit, and the switch is installed on the top surface of the fixed installation plate.

Furthermore, in order to better realize the LED lamp, the number of the LED lamp beads is a plurality, the LED lamp beads are arranged in a straight line to form a lamp group, and the LED lamp beads are connected in series.

Further, in order to better implement the present invention, a straight long groove is disposed on the top surface of the partition board, the straight long groove is located right below the straight groove, and the length and the width of the straight long groove are respectively the same as those of the straight groove.

The invention also provides a vertical wafer soaking and photoresist removing method, which uses the vertical wafer soaking and photoresist removing switching mechanism and comprises the following steps:

loading an organic solvent capable of taking out the redundant photoresist on the surface of the wafer into the soaking tank;

loading the wafer to be stripped into the wafer box in the first state;

driving the second vertical rod to descend by using the second lifting device so as to push the second bump downwards, so that the wafer box is driven to rotate around the lower end of the first vertical rod until the wafer box is switched to the second state;

driving the second lifting device and the first vertical rod to descend by using the first lifting device, so as to drive the wafer box in the second state to descend to be immersed in the organic solvent in the immersion tank;

driving the wafer box to reciprocate up and down in the organic solvent by using the first lifting device;

driving the second lifting device and the first vertical rod to ascend by using the first lifting device so as to drive the wafer box to come out of the organic solvent;

the second lifting device is used for driving the second vertical rod to ascend so as to pull the second bump, so that the wafer box is driven to rotate around the lower end of the first vertical rod until the wafer box is converted into the first state;

and taking out the wafers in the wafer box.

Compared with the prior art, the invention has the following beneficial effects:

the invention provides a vertical wafer soaking and degumming switching mechanism which comprises a fixed mounting plate; the first lifting device is arranged on the fixed mounting plate, a lifting platform is arranged at the lifting end of the first lifting device, a first vertical rod is arranged on the lifting platform, and the first vertical rod downwards penetrates through the fixed mounting plate and extends out; the second lifting device is arranged on the lifting platform, a second vertical rod is arranged at the lifting end of the second lifting device, and the second vertical rod downwards penetrates through the fixed mounting plate and extends out; the wafer box is formed by enclosing a side wall and a box bottom, a first lug and a second lug are arranged on the outer side wall of the wafer box, a connecting line of the first lug and the second lug is parallel to the depth direction of the wafer box, the first lug is positioned at a position close to the middle part of the wafer box, the second lug is positioned at a position close to the box bottom of the wafer box, the first lug is hinged to the bottom end of a first vertical rod, a connecting rod is hinged to the second lug, and the connecting rod is hinged to the bottom end of a second vertical rod; the soaking tank is filled with an organic solvent and is arranged below the wafer box; in the first state, the box opening of the wafer box faces to the horizontal direction; in the second state, the opening of the wafer box faces upwards.

Through the structure, the initial state is the first state, a wafer is put into the wafer box from the box opening of the wafer box, then the second vertical rod is driven to descend by the second lifting device, at the moment, the position of the first vertical rod is unchanged, so the position of the middle part of the wafer box is unchanged, the position of the second bump on the wafer box descends, so the wafer box rotates around the lower end of the first vertical rod until the box opening of the wafer box rotates to face upwards, at the moment, the wafer box is in the second state, then the lifting platform is driven to descend by the first lifting device, the lifting platform can drive the first vertical rod and the second vertical rod to synchronously start, thereby driving the wafer box to descend until the wafer box enters the soaking groove below the wafer box and is soaked in the organic solvent in the soaking groove, then the lifting platform is driven to reciprocate up and down by the first lifting device, so that the wafer box is driven to reciprocate up and down in the organic solvent by the first vertical rod and the second vertical rod, at this moment, alright rinse with the wafer in the wafer box, rinse a period of back, utilize first elevating gear drive wafer box to rise and come out from the organic solvent the inside, then utilize d second elevating gear drive second montant to rise to make the box mouth of wafer box face the horizontal direction once more, also make the wafer box reply first state, at last with the wafer in the wafer box take out can.

Through the mechanism, the wafer can be placed in the organic solvent for soaking, and can be driven to move up and down in the organic solvent, so that the wafer is rinsed, the photoresist on the surface of the wafer can be better removed, and the mechanism provided by the invention has a better effect of removing the redundant photoresist on the surface of the wafer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic front view of a vertical wafer immersion stripping switching mechanism according to an embodiment of the present invention in a first state;

fig. 2 is a schematic side view of the vertical wafer immersion stripping switching mechanism in a first state according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a side view of the vertical wafer immersion stripping switching mechanism in a second state according to an embodiment of the present invention;

FIG. 4 is a schematic view of a wafer cassette of an embodiment of the present invention extending into an immersion tank;

FIG. 5 is a schematic diagram of the operation of the piston in an embodiment of the present invention;

fig. 6 is a schematic view of the mounting structure of the collimating mechanism in the embodiment of the present invention.

In the figure:

1-fixing the mounting plate; 101-straight groove; 2-a first lifting device; 3-a lifting platform; 4-a first vertical bar; 5-a second lifting device; 6-a second vertical bar; 7-a wafer box; 8-a first bump; 9-a second bump; 10-a connecting rod; 11-soaking tank; 111-a first cavity; 112-a second cavity; 12-a first guide bush; 13-a second guide bush; 14-a third vertical bar; 15-a piston; 16-a separator; 161-straight long groove; 17-a third guide sleeve; 18-a cover plate; 19-a liquid absorbing plate; 20-a handle; 21-protection plate; 22-LED lamp beads; 23-a storage battery; 24-switch.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.

Example 1:

the embodiment provides a vertical wafer soaking and photoresist removing conversion mechanism for solving the technical problem that in the prior art, the removal effect of redundant photoresist on the surface of a wafer is not good. This vertical wafer soaks and removes to glue shifter includes fixed mounting panel 1, first elevating gear 2, second elevating gear 5, wafer box 7 and soaks groove 11, wherein:

the fixed mounting plate 1 is a flat plate and is used for being fixedly connected to a foreign object, and a first through hole, a second through hole and a third through hole are formed in the fixed mounting plate 1.

The first lifting device 2 is installed on the fixed mounting plate 1 and located above the fixed mounting plate 1, and optionally, the second lifting device 5 in this embodiment is a linear module or an air cylinder or a hydraulic cylinder. A lifting platform 3 is installed at the lifting end of the first lifting device 2, and the lifting platform 3 can lift along with the first lifting device 2. A first vertical rod 4 is welded on the lifting platform 3 or connected with the lifting platform through a bolt, the first vertical rod 4 is a straight rod, the upper end of the first vertical rod 4 is connected with the bottom surface of the lifting platform 3, and the first vertical rod 4 is in sliding penetrating connection with the first through hole, so that the lower end of the first vertical rod 4 downwards penetrates through the fixed mounting plate 1 and extends out, namely the lower end of the first vertical rod 4 is located below the fixed mounting plate 1.

The second lifting device 5 is installed on the lifting platform 3, and optionally, the second lifting device 5 in this embodiment is an air cylinder or a hydraulic cylinder. A second vertical rod 6 is installed at the lifting end of the second lifting device 5, the second vertical rod 6 is a straight rod, the upper end of the second vertical rod 6 is connected with the lifting end of the second lifting device 5, and the second vertical rod 6 is slidably connected in the second through hole in a penetrating manner, so that the lower end of the second vertical rod 6 downwards penetrates through the fixed mounting plate 1 and extends out, that is, the lower end of the second vertical rod 6 is located below the fixed mounting plate 1.

The wafer box 7 is a box structure, and the wafer box 7 is enclosed by a side wall and a box bottom and has a box opening. The outer side wall of the wafer box 7 is welded or integrally formed with a first bump 8 and a second bump 9, and the connecting line of the first bump 8 and the second bump 9 is parallel to the depth direction of the wafer box 7. The first bump 8 is located near the middle of the wafer cassette 7, and the second bump 9 is located near the bottom of the wafer cassette 7. And the first lug 8 is hinged with the bottom end of the first vertical rod 4, the second lug 9 is hinged with a connecting rod 10, and the connecting rod 10 is hinged with the bottom end of the second vertical rod 6. Thus, the first vertical rod 4, the wafer box 7, the connecting rod 10 and the second vertical rod 6 form a crank-link mechanism. With the above configuration, the wafer cassette 7 is made to have at least the first state and the second state. Wherein, in the first state, the box opening of the wafer box 7 faces to the horizontal direction, so as to load the wafer into the wafer box 7 or take the wafer out of the wafer box 7; in the second state, the cassette opening of the wafer cassette 7 faces upward.

The soaking tank 11 is of a tank body structure, the notch of the soaking tank is positioned at the top end, a liquid inlet and a liquid outlet are arranged on the tank wall of the soaking tank 11, and a throttle valve is arranged on each of the liquid inlet and the liquid outlet. And the organic solvent for removing the redundant photoresist on the surface of the wafer enters the soaking tank 11 from the liquid inlet, and when the organic solvent in the soaking tank 11 needs to be discharged, the throttle valve of the liquid outlet is opened. The immersion tank 11 is installed below the wafer cassette 7.

With the above structure, the initial state is the first state, the wafer is placed into the wafer box 7 from the box opening of the wafer box 7, then the second lifting device 5 is used to drive the second vertical rod 6 to descend, at this time, the position of the first vertical rod 4 is unchanged, so the position of the middle part of the wafer box 7 is unchanged, and the position of the second bump 9 on the wafer box 7 descends, so the wafer box 7 rotates around the lower end of the first vertical rod 4 until the box opening of the wafer box 7 rotates to the upward direction, at this time, the wafer box 7 is in the second state, then the first lifting device 2 is used to drive the lifting platform 3 to descend, the lifting platform 3 will drive the first vertical rod 4 and the second vertical rod 6 to synchronously advance, so as to drive the wafer box 7 to descend until the wafer box 7 enters the soaking groove 11 below and is soaked in the organic solvent in the soaking groove 11, and then the first lifting device 2 is used to drive the lifting platform 3 to reciprocate up and down, thereby through first montant 4 and second montant 6 drive wafer box 7 up-and-down motion in organic solvent the inside, at this moment, alright rinse the wafer in the wafer box 7, rinse after a period, utilize first elevating gear 2 to drive wafer box 7 and rise and come out from the organic solvent the inside, then utilize d second elevating gear 5 to drive second montant 6 and rise, thereby make the box mouth of wafer box 7 face the horizontal direction once more, also make wafer box 7 reply first state, take out the wafer in the wafer box 7 at last can.

Through the mechanism, the wafer can be placed in the organic solvent for soaking, and can be driven to move up and down in the organic solvent, so that the wafer is rinsed, the photoresist on the surface of the wafer can be better removed, and the mechanism provided by the invention has a better effect of removing the redundant photoresist on the surface of the wafer.

An alternative implementation of this embodiment is as follows: welding or integrated into one piece are provided with first direction axle sleeve 12 and second direction axle sleeve 13 on above-mentioned fixed mounting panel 1, first direction axle sleeve 12 and first montant 4 adaptation, second direction axle sleeve 13 and second montant 6 adaptation, and first montant 4 slides the cartridge in first direction axle sleeve 12, and second montant 6 slides the cartridge in second direction axle sleeve 13. Like this, then can fix a position the direction to the lift of first montant 4 and second montant 6, avoid first montant 4 and second montant 6 when going up and down the incomplete lateral deviation to reinforcing operating stability.

An alternative implementation of this embodiment is as follows: the side wall and the bottom of the wafer box 7 are both provided with a plurality of pores for the circulation of organic solvent. Pore setting for organic solvent not only can follow wafer cassette 7's box mouth business turn over wafer cassette 7, can also follow wafer cassette 7's lateral wall and box bottom business turn over wafer cassette 7, when rinsing, can increase organic solvent's circulation, thereby play better rinsing effect.

An alternative implementation of this embodiment is as follows: a third vertical rod 14 is welded or connected to the lifting platform 3 through a bolt, the third vertical rod 14 is a straight rod, the upper end of the third vertical rod 14 is connected to the bottom surface of the lifting platform 3, and the third vertical rod 14 is connected to the third through hole in a penetrating manner, so that the lower end of the third vertical rod 14 downwardly penetrates through the fixed mounting plate 1 and extends out, that is, the lower end of the third vertical rod 14 is located below the fixed mounting plate 1. A piston 15 is connected to the lower end of the third vertical bar 14, the piston 15 is adhered to the lower end of the third vertical bar 14, and the piston 15 is made of a material that does not chemically react with the organic solvent, and specifically, the piston 15 is made of the same material as that of the immersion tank 11.

A partition plate 16 in a vertical state is clamped or welded in the immersion tank 11, and the partition plate 16 divides the inner cavity of the immersion tank 11 into a first cavity 111 and a second cavity 112 for immersing the wafer cassette 7. The piston 15 is fitted into the first chamber 111, and the piston 15 is vertically opposed to the first chamber 111, and the piston 15 is movable in the first chamber 111 as the piston 15. The wafer box 7 is opposite to the second chamber 112, and when the wafer box 7 is immersed, the wafer box extends into the second chamber 112.

A passage is provided at the bottom end of the partition 16, and communicates the first chamber 111 and the second chamber 112. And, the piston 15 is inserted into the first chamber 111 while the wafer cassette 7 is immersed in the organic solvent in the immersion tank 11. That is, when the wafer cassette 7 is not immersed in the organic solvent in the immersion tank 11, the piston 15 is suspended right above the first chamber 111.

With the above structure, when the wafer box 7 intrudes into the organic solvent in the second cavity 112, the piston 15 is inserted into the first cavity 111, and when the elevating platform 3 drives the wafer box 7 to be completely immersed into the second cavity 112, the piston 15 will continue to be pressed down in the first cavity 111 under the action of the elevating platform 3, so that the pressure in the first cavity 111 rises, and the organic solvent in the first cavity 111 is driven to be immersed into the second cavity 112. This saves the time required for the wafer cassette 7 to be immersed in the organic solvent until it is completely immersed in the organic solvent. Note that, in the initial state, the organic solvent level in the first chamber 111 is flush with the organic solvent level in the second chamber 112. When the first lifting device 2 drives the lifting platform 3 to drive the wafer box 7 to reciprocate up and down in the organic solvent, the lifting and lowering will also drive the piston 15 to reciprocate up and down in the first chamber 111, and when the piston 15 reciprocates up and down in the first chamber 111, the organic solvent in the first chamber 111 is driven to move into and out of the second chamber 112, that is, the amount of the organic solvent in the second chamber 112 is driven to change, during this process, the organic solvent level in the second chamber 112 may rise and fall, thereby disturbing the organic solvent in the second chamber 112, thereby further increasing the flow rate of the organic solvent in the second chamber 112 and thus increasing the flow rate of the organic solvent in the pores, and thus, more organic solvent will enter and exit the wafer box 7 per unit time, so as to better rinse the wafers in the wafer box 7.

An alternative implementation of this embodiment is as follows: a third guide shaft sleeve 17 is further arranged on the fixed mounting plate 1, and a third vertical rod 14 is inserted in the third guide shaft sleeve 17 in a sliding manner. Therefore, the lifting of the third vertical rod 14 can be positioned and guided, and the third vertical rod 14 is prevented from generating lateral deviation during lifting, so that the running stability is enhanced.

An alternative implementation of this embodiment is as follows: a cover plate 18 capable of covering the opening of the second chamber 112 is hinged to the side wall of the steeping cistern 11. It should be noted that the mouth of the second chamber 112 is actually part of the above-mentioned notch of the immersion tank 11. The cover plate 18 is further provided with a abdicating notch to abdicate the first vertical rod 4 and the second vertical rod 6.

In the initial state, the cover plate 18 does not cover the opening of the second chamber 112. After the wafer box 7 enters the immersion tank 11, the cover plate 18 is turned to cover the opening of the second cavity 112, and the first vertical rod 4 and the second vertical rod 6 are positioned to be clamped into the abdicating notch.

By means of the cover plate 18, when the wafers in the wafer box 7 are rinsed, the cover plate 18 can block the organic solvent splashed from the cavity opening of the second cavity 112, waste of the organic solvent is reduced, and the organic solvent can be prevented from falling to other places to pollute the environment.

When the cover plate 18 covers the opening of the second cavity 112, a side of the cover plate 18 close to the inside of the second cavity 112 is defined as a first plate, and a side of the cover plate 18 opposite to the first plate is defined as a second plate. A liquid absorbing plate 19, such as a sponge plate or an activated carbon plate, capable of absorbing an organic solvent is adhered to the first plate surface or attached thereto by screws. When the wafer is rinsed, the splashed organic solvent will not directly adhere to the first plate surface, but will be absorbed by the liquid absorption plate 19, so that the organic solvent on the cover plate 18 can be prevented from flowing out when the cover plate 18 is opened.

Optionally, a handle 20 is screwed or bonded to the first panel to facilitate the rotation of the cover 18. The cover 18 is made of tempered glass, and when the cover 18 covers the opening of the second chamber 112, a user can see the inside of the steeping cistern 11 through the transparent cover 18.

Example 2:

the embodiment provides a vertical wafer soaking and photoresist removing conversion mechanism, which is further improved and optimized based on embodiment 1.

Specifically, a collimating mechanism is arranged on the fixed mounting plate 1 and used for assisting the installation and positioning of the soaking tank 11. Since the piston 15 needs to move in and out of the second chamber 112 and the piston 15 needs to move in the second chamber 112 during the operation of the whole device, the steeping cistern 11 needs to be accurately positioned and installed so that the piston 15 can accurately enter the second chamber 112 during the lifting and lowering process. On this basis, an alignment mechanism is arranged on the fixed mounting plate 1 for mounting and positioning the steeping cistern 11, so that the mouth of the second chamber 112 therein is positioned right below the piston 15 after the steeping cistern 11 is mounted.

Alternatively, the collimating structure in this embodiment is a light emitting member that is disposed on the bottom surface of the fixed mounting board 1 and is located directly above the partition 16. Light is emitted by the light emitting component, and light emitted by the light emitting component will illuminate light spots on the top surface of the partition board 16 by virtue of the straight line propagation principle of the light, so that the light spots are used as reference objects, and the soaking tank 11 is positioned. Specifically, the straight flute 101 has been seted up on the bottom surface of fixed mounting panel 1, and luminous component installs at the tank bottom middle part of straight flute 101, and transparent guard plate 21 is still installed to the notch department of straight flute 101, with the help of guard plate 21, can protect luminous component to the protection is luminous component, prolongs luminous component's life.

Optionally, the light emitting component in this embodiment is an LED lamp bead 22, a storage battery 23 is installed on the top surface of the fixed mounting plate 1, the LED lamp bead 22 is electrically connected to the storage battery 23 through a circuit, a switch 24 is arranged on the circuit, and the switch 24 is installed on the top surface of the fixed mounting plate 1. When the LED lamp is installed, the circuit is conducted through the switch 24, and the LED lamp beads 22 are electrically connected with the storage battery 23 to emit light. After installation is complete, the line is disconnected by switch 24. This saves energy. The quantity of LED lamp pearl 22 is a plurality of, and a plurality of LED lamp pearl 22 is a straight line and arranges and constitute banks to a plurality of LED lamp pearl 22 is parallelly connected. Can strengthen luminous intensity like this to a plurality of LED lamp pearl 22 sets up in parallel, and after a certain LED lamp pearl 22 broke down, all the other LED lamp pearls 22 can also normal use.

Alternatively, a straight long groove 161 is provided on the top surface of the partition 16, the straight long groove 161 is located directly below the straight groove 101, and the length and width of the straight long groove 161 are the same as those of the straight groove 101, respectively. Thus, the light spot emitted from the light emitted from the upper straight groove 161 on the partition 16 will fall into the straight groove 161, which is further convenient for the user to determine whether the steeping cistern 11 is installed in place.

Example 3:

this embodiment provides a vertical wafer immersion stripping method, which uses the straight wafer immersion stripping switching mechanism provided in embodiment 1 to take out the excess photoresist on the wafer surface. The method comprises the following steps:

step 1: loading an organic solvent capable of taking out the redundant photoresist on the surface of the wafer into the soaking tank 11;

step 2: loading the wafer to be stripped into the wafer box 7 in the first state;

and step 3: the second lifting device 5 is used for driving the second vertical rod 6 to descend so as to push the second bump 9 downwards, so that the wafer box 7 is driven to rotate around the lower end of the first vertical rod 4 until the wafer box 7 is converted to the second state;

and 4, step 4: driving the second lifting device 5 and the first vertical rod 4 to descend by using the first lifting device 2, thereby driving the wafer box 7 in the second state to descend so as to be immersed in the organic solvent in the immersion tank 11;

and 5: the first lifting device 2 is used for driving the wafer box 7 to reciprocate up and down in the organic solvent, so that wafers in the wafer box 7 are rinsed;

step 6: the first lifting device 2 is used for driving the second lifting device 5 and the first vertical rod 4 to ascend so as to drive the wafer box 7 to come out of the organic solvent;

and 7: the second lifting device 5 is used for driving the second vertical rod 6 to ascend so as to pull the second bump 9, so that the wafer box 7 is driven to rotate around the lower end of the first vertical rod 4 until the wafer box 7 is converted to the first state;

and 8: the wafers in the wafer cassette 7 are taken out.

By the method, the wafer can be soaked in the organic solvent, and can be driven to move up and down in the organic solvent, so that the wafer is rinsed, and photoresist on the surface of the wafer can be better removed.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.