阅读说明：本技术 一种基板贴合方法及显示装置 (Substrate attaching method and display device ) 是由 袁月 江应传 于 2021-09-08 设计创作，主要内容包括：本申请提供一种基板贴合方法及显示装置,包括：在第一基板的待贴合面的预定位置涂覆第一胶体；对所述第一胶体进行预固化形成第一支撑体；在所述第一支撑体的远离所述第一基板的表面涂覆第二胶体；将第二基板压合至所述第二胶体；以及固化所述第一支撑体及所述第二胶体。本发明的基板贴合方法将用于固定或者导电的胶体分次涂覆,在其中一个基板表面涂覆第一胶体先进行预固化,再在预固化的表面涂覆第二胶体,再将另外一个面板压合至第二胶体的表面,再对第一胶体及第二胶体进行固化,减小了溢胶的风险。(The application provides a substrate attaching method and a display device, comprising the following steps: coating a first colloid on a preset position of a surface to be bonded of a first substrate; pre-curing the first colloid to form a first support body; coating a second colloid on the surface of the first support body far away from the first substrate; pressing a second substrate to the second colloid; and solidifying the first support body and the second colloid. According to the substrate attaching method, the colloid for fixing or conducting is coated in multiple times, the first colloid is coated on the surface of one substrate and is pre-cured, the second colloid is coated on the pre-cured surface, the other panel is pressed on the surface of the second colloid, and the first colloid and the second colloid are cured, so that the risk of glue overflow is reduced.)

1. A method for bonding a substrate, comprising:

coating a first colloid on a preset position of a surface to be bonded of a first substrate;

pre-curing the first colloid to form a first support body;

coating a second colloid on the surface of the first support body far away from the first substrate;

pressing a second substrate to the second colloid; and

and curing the first support body and the second colloid.

2. The method of claim 1, wherein the first support comprises a middle region and an edge region adjacent to the middle region, the edge region has a thickness greater than that of the middle region, and the second glue fills the middle region.

3. The method of claim 1, wherein the thickness of the second glue is less than or equal to the thickness of the first glue.

4. The method of claim 1, wherein the second glue has a coating area less than or equal to the surface size of the first glue.

5. The method of claim 1, wherein the first glue and the second glue are conductive glue.

6. The method of claim 1, wherein the first encapsulant is different from the second encapsulant.

7. The method of claim 1, wherein the first support is formed by applying the first adhesive in several portions and pre-curing in several portions.

8. The method of claim 1, wherein at least one of the first substrate and the second substrate is any one of a touch panel, a flexible printed circuit, a rigid printed circuit, or a display panel.

9. The method according to claim 8, wherein the first substrate includes a bonding region, the bonding region includes at least two first conductive portions arranged at intervals, and before the step "coating the first adhesive at the predetermined position of the surface to be bonded of the first substrate", the method further includes a step of coating an insulating adhesive in a gap between at least two first conductive portions of the bonding region, and curing the insulating adhesive to form an insulating member between adjacent first conductive portions.

10. The method of claim 1, wherein the first substrate is a glass cover plate; the second substrate is a touch film or touch glass; or the first substrate is touch control glass, and the second substrate is a liquid crystal display panel.

11. A display device, characterized in that the display device comprises a first substrate and a second substrate bonded together by the substrate bonding method according to any one of claims 1 to 10.

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a substrate bonding method and a display device.

Background

In a display device, optical glue or conductive glue is usually required to fix two panels or substrates, and generally, the optical glue or conductive glue is coated on one panel or substrate, and then the other panel or substrate is pressed onto the surface of the optical glue or conductive glue, and then the optical glue or conductive glue is cured. However, during the lamination, due to the fluidity of the optical adhesive or the conductive adhesive, the adhesive overflow phenomenon is often generated, so that the range of the adhesive is difficult to control, and particularly, the conductive adhesive is easy to generate short circuit caused by the adhesive overflow.

Therefore, the prior art has defects which need to be solved urgently.

Disclosure of Invention

The application provides a substrate laminating method which can solve the problem of glue overflow during laminating of a substrate or a panel.

In order to solve the above problems, the technical solution provided by the present application is as follows:

a substrate attaching method includes:

coating a first colloid on a preset position of a surface to be bonded of a first substrate;

pre-curing the first colloid to form a first support body;

coating a second colloid on the surface of the first support body far away from the first substrate;

pressing a second substrate to the second colloid; and

and curing the first support body and the second colloid.

In some embodiments, the first support body comprises a middle area and an edge area adjacent to the middle area, the thickness of the edge area is greater than that of the middle area, and the second colloid fills the middle area.

In some embodiments, the thickness of the second colloid is less than or equal to the thickness of the first colloid.

In some embodiments, the coating area of the second colloid is smaller than or equal to the surface size of the first colloid.

In some embodiments, the first colloid and the second colloid are both conductive adhesives.

In some embodiments, the first colloid and the second colloid are respectively coated by fractional coating.

In some embodiments, the first substrate is a mother circuit board, and the second substrate is a daughter circuit board or a chip.

In some embodiments, the mother circuit board includes a first conductive portion and a second conductive portion that are disposed at an interval, and before the step "coating a first adhesive on a predetermined position of a surface to be attached of the first substrate", the method further includes a step of coating an insulating adhesive on a gap between the first conductive portion and the second conductive portion, and curing the insulating adhesive to form an insulating member.

In some embodiments, the first colloid and the second colloid are both optical glues.

In some of these embodiments, the first substrate is a glass cover plate; the second substrate is a touch film or touch glass; or the first substrate is touch control glass, and the second substrate is a liquid crystal display panel.

The application also relates to a display device which comprises a first substrate and a second substrate which are attached together by using the substrate attaching method.

The beneficial effect of this application does: the substrate attaching method and the display device formed by the substrate attaching method are used for coating fixed or conductive colloid for multiple times, coating the first colloid on the surface of one substrate, pre-curing, coating the second colloid on the surface of the pre-cured substrate, pressing the other panel to the surface of the second colloid, and curing the first colloid and the second colloid, so that the risk of glue overflow is reduced.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a display device according to a first embodiment of the present application;

fig. 2(a) is a cross-sectional view of one step of a substrate bonding method provided by the present application for forming the display device of fig. 1;

FIG. 2(B) is a sectional view taken along line II-II of the display device of FIG. 1;

fig. 3 is a cross-sectional view of a step of a substrate bonding method according to a second embodiment of the present application;

fig. 4 is a cross-sectional view of a step of a substrate bonding method according to a third embodiment of the present application;

fig. 5(a) is a cross-sectional view of a step of forming yet another display device by a substrate bonding method according to a fourth embodiment of the present disclosure.

Fig. 5(B) shows the display device formed by the step of fig. 5(a) after lamination.

Description of the reference numerals

100. 200-a display device; 3. 30-first support

1. 11-a first substrate; 2. 120-a first colloid; 5. 51-a second substrate; 4-second colloid

10-a first conductive portion; 50-a second conductive portion; 101-a touch area; 103-binding region

6-insulating glue; 60-an insulator; 32-a middle region; 34-edge region

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," and the like are used in the orientation or positional relationship indicated in the drawings, which are based on the orientation or positional relationship shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The present application may repeat reference numerals and/or letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. The substrate bonding method of the present application is described in detail with reference to specific embodiments.

The application provides a substrate attaching method, which comprises the following steps:

s1: and coating a first colloid at a preset position of the surface to be bonded of the first substrate.

S2: and pre-curing the first colloid to form a first support body.

S3: and coating a second colloid on the surface of the first support body far away from the first substrate.

S4: and pressing a second substrate to the second colloid.

S5: and curing the first support body and the second colloid.

The application provides a substrate laminating method for fixed or electrically conductive colloid coats in grades, coats first colloid and carries out the precuring at first on one of them base plate surface, and then coats the second colloid on the first supporter surface that the precuring formed, and with another base plate pressfitting to the surface of second colloid, solidify first colloid and second colloid again, reduced the risk of excessive glue.

Example 1

In this embodiment, a substrate bonding method is described by taking the first substrate 1 as a mother circuit board and the second substrate 5 as a daughter circuit board. More specifically, referring to fig. 1 and fig. 2(a) -2(B), the first substrate 1 is taken as a touch panel, the second substrate 5 is taken as a flexible printed circuit, and the first substrate 1 and the second substrate 5 are bonded to form the display device 100.

The first substrate 1 (touch panel) has a touch area 101 and a binding area 103 surrounding the touch area 101. The touch area 101 is substantially rectangular. The second substrate 5 (flexible circuit board) and the first substrate 1 are bonded in the bonding region 103. In other embodiments, the first substrate 1 is not limited to a touch panel, but may be another flexible circuit board, a rigid circuit board, a display panel, or the like. The specific flow of the attaching method is as follows:

s1: providing a first substrate 1, wherein the first substrate 1 comprises a bonding area 103, and the bonding area 103 comprises at least two first conductive parts 10 arranged at intervals. In this embodiment, the first conductive part 10 may be an electrode, a pad, a gold finger, or the like. The first glue 2 is applied to the bonding areas 103 of the first substrate 1. The first colloid 2 is anisotropic conductive adhesive. The anisotropic conductive adhesive is composed of a liquid optical transparent adhesive and a plurality of conductive particles mixed in the liquid optical transparent adhesive. The anisotropic conductive adhesive is a conductive adhesive for packaging electronic components, has the functions of unidirectional conduction and gluing fixation, is vertically conductive, and is horizontally non-conductive. The liquid optically clear adhesive may be a thermosetting resin as the adhesive. In one embodiment, the thermosetting resin is at least one of modified phenolic resin, epoxy resin, unsaturated polyester. It is to be understood that the thermosetting resin is not limited to the above examples.

S2: and pre-curing the first colloid 2 to form a first support body 3. The first support body 3 formed by the pre-curing of the first colloid 2 can keep stable structural shape, and in the subsequent pressing process, the shape of the first support body 3 can not be changed, so that the function of supporting the second colloid 4 can be achieved. It is understood that the first support 3 may be formed by coating and pre-curing a plurality of times as long as a predetermined height is reached.

S3: and coating a second colloid 4 on the surface of the first support 3 far away from the first substrate 1. The thickness of the second colloid 4 is less than or equal to the thickness of the first colloid 2 and/or the area of the second colloid 4 is less than or equal to the area of the first colloid 2.

The thickness of the second colloid 4 is smaller than or equal to that of the first colloid 2, so that when pressure is applied to the second colloid 4, the phenomenon that the second colloid 4 overflows due to too large compression amount is avoided, and the risk of glue overflow generated when the second colloid 4 is pressed is reduced.

The area of the second colloid 4 is smaller than or equal to the area of the first colloid 2, and the colloid overflow gradually covers the surface of the first support body 3 when the second colloid 4 is pressed, so that the risk of glue overflow generated by the second colloid 4 during pressing can be reduced.

S4: a second substrate 5 is provided, the second substrate 5 comprising a second conductive part 50 corresponding to the first conductive part 10, the second conductive part 50 may be an electrode, a pad, a gold finger, or the like. And pressing a second substrate 5 to the second colloid 4, wherein the second colloid 4 is positioned between the first conductive part 10 and the second conductive part 50, and the first conductive part 10 is conducted with the second conductive part 50 through the cured first support body 3 and the second colloid 4.

S5: and curing the first support body 3 and the second colloid 4 to complete the bonding of the substrates, thereby finally obtaining the display device 100.

In this embodiment, the first colloid 2 and the second colloid 4 are coated twice, so that the materials of the second colloid 4 and the first colloid 2 may be the same or different. In this embodiment, the material of the first colloid 2 is different from the material of the second colloid 4, the viscosity of the first colloid 2 is greater than the viscosity of the second colloid 4, and the volume resistivity of the first colloid 2 is greater than the volume resistivity of the second colloid 4. The viscosity of the colloid can be realized by the type selection of the liquid optical transparent adhesive, and the volume resistivity can be improved by the parameters of the material, the particle size, the shape, the doping density and the like of the conductive particles. The viscosity of the first colloid 2 is higher than that of the second colloid 4, and the short circuit between adjacent conducting parts on the substrate caused by the flowing of the first colloid 2 is improved by reducing the flowing of the first colloid 2.

Due to the conductive and bonding effects of the conductive adhesive, the conductive adhesive needs to have two characteristics of small volume resistivity and large viscosity, and has certain difficulty in material selection. The application selects the first colloid 2 to be pre-cured and then coats the second colloid 4, and can select the first colloid 2 with high viscosity and the second colloid 4 with low volume resistivity to be combined for use, thereby reducing the difficulty of material type selection. Other characteristics of the first colloid 2 and the second colloid 4 can be simultaneously combined.

In addition, in this embodiment, coat first colloid 2 and second colloid 4 respectively, it is fixed and switch on to realize bonding through first colloid 2 and second colloid 4 between first base plate 1 and the second, compare and coat the thinner colloid of one deck and avoid overflowing the glue, the advantage of this application is, can make the glue thickness between first base plate 1 and the second base plate 5 thicker some, the pressure range of pressfitting can widen some, utilize the anisotropic realization of colloid to insulate, in addition, the thickness of suitable or slightly thick colloid, can reduce in the hot pressing process, circuit board deformation, especially the risk of flexible circuit board deformation.

Referring to table 1 below, table 1 shows the result of directly pressing the second substrate 5 onto the surface of the colloid a after coating a layer of colloid a on the surface of the first substrate 1 at the predetermined position, and then curing. Wherein, the colloid A of coating is square, the initial area of the colloid A of predetermineeing the coating is 100um, predetermine coating thickness and predetermine the compressive capacity and all set for 3 theoretical values, thickness is predetermine the coating thickness and predetermine the difference between the compressive capacity after the compression, because colloid A volume is before and after the compression remains unchanged, and if pressure is even, the degree that colloid A flows to each direction after the compression is the same, also be the direction after also compressing, volume is the principle that remains unchanged before and after the compression calculates, after the compression to colloid A: length after compression ═ width after compression [ [ (initial area) × (preset coating thickness)/thickness after compression [ ]]^1/2(ii) a The difference is the difference between the compressed length or width and the original length or width, and it can be found that the length and width after compression are as follows.

TABLE 1

Referring to the following table 2, table 2 shows the glue application between the first substrate 1 and the second substrate 5 in several steps, for example, after applying the first glue 2 and compressing: length after compression and width after compression [ (initial length ═ width after compression ]Area) (total thickness of pre-set coating-thickness of first colloid 2 coating)/thickness after compression]^1/2(ii) a Since the first colloid 2 is directly cured after being coated, the thickness of the first colloid 2 is fixed, and the difference between the preset coating thickness and the coating thickness of the first colloid 2 is the thickness of the second colloid 4 to be coated, as follows.

TABLE 2

Therefore, after the colloid is coated for several times, the difference between the length or the width before and after the compression is smaller than that before and after the compression when the colloid is coated only once, that is, the glue overflow range is reduced, and the situation that the conductive part of the first substrate 1 or the second substrate 5 is short-circuited due to glue overflow can be reduced.

In addition, in table 2, it is exemplified that the preset coating thickness of the first colloid 2 is smaller than the coating thickness of the second colloid 4, and these numbers can be set according to actual situations, and in other embodiments, the preset coating thickness of the first colloid 2 is larger than or equal to the coating thickness of the second colloid 4.

Example 2

Referring to fig. 3, fig. 3 is a method for bonding a substrate according to a second embodiment of the present application. The substrate bonding method provided by the second embodiment is substantially the same as the substrate bonding method provided by the first embodiment, and the difference is that:

before the step S1 "coating the first colloid 2 on the predetermined position of the surface to be adhered of the first substrate 1", the method further includes the steps of coating an insulating glue 6 on a gap between at least two first conductive parts 10 of the bonding region 103, and curing the insulating glue 6 to form an insulating member 60 between the adjacent first conductive parts 10. In this embodiment, the insulating material 60 is formed between the adjacent first conductive portions 10, so that the first conductive portions 10 on both sides of the insulating material 60 can be prevented from being electrically connected, and the yield can be improved. The thickness of the insulating paste 6 is slightly larger than the thickness of the first conductive part 10, and the finally formed insulating member 60 is slightly higher than the height of the first conductive part 10, so that the raised height can be used as a retaining wall for the subsequent coating of the first paste 2.

Example 3

Referring to embodiment 4, fig. 4 is a diagram illustrating a substrate bonding method according to a third embodiment of the present application. The substrate bonding method provided by the third embodiment is substantially the same as the substrate bonding method provided by the first embodiment, and the difference is that:

in step S1, the first support 30 formed by coating and curing includes a middle region 32 and an edge region 34 adjacent to the middle region 32, the thickness of the edge region 34 is greater than that of the middle region 32, and the second glue 4 fills the middle region 32. In this embodiment, the edge region 34 of the first support 3 is used as a dam for the second glue 4 to overflow, so as to reduce the amount of glue overflowing from the second glue 4.

In this embodiment, the first support 30 is formed by applying the first colloid in several times and pre-curing in several times. That is, the first adhesive with the first thickness may be coated on the predetermined position of the first substrate 1, and after pre-curing, the first adhesive with the second thickness may be coated on the edge region 34 of the first adhesive, so as to obtain the first support 30 with the thick edge region 34 and the thin middle region 32.

Example 4

Referring to embodiments 5(a) -5(B), fig. 5(a) -5(B) are schematic diagrams illustrating a substrate bonding method and a display device 200 formed according to a fourth embodiment of the present disclosure. The fourth embodiment provides a substrate bonding method substantially the same as the substrate bonding method provided by the first embodiment, except that:

in this embodiment, in step S1, the first substrate 11 is provided as a glass cover or a touch glass; the first colloid 120 is Optically Clear Adhesive (OCA) or optically Clear resin glue (OCR).

In step S2, the second substrate 51 is a touch film or a touch glass or a liquid crystal display panel. The second colloid 4 is optical transparent glue or optical transparent resin glue. In the present embodiment, the first colloid 120 and the second colloid 4 are used only for bonding between two substrates and are not used for electrical conduction.

In the present application, the first colloid 120 and the second colloid 4 are made of the same material and are coated in several times.

The first colloid 120 and the second colloid 4 are coated by times by using the substrate attaching method, the thicknesses of the first colloid 120 and the second colloid 4 can be controlled, the generation of bubbles in the colloid can be reduced, and the phenomena of glue shortage and glue overflow in the edge area can be controlled when the first substrate 11 and the second substrate 51 are attached; the optical performance of the display device 200 formed of the first substrate 11 and the second substrate 51 is ensured.

In summary, the substrate bonding method and the display devices 100 and 200 formed by the substrate bonding method are used for fixing or/and coating conductive colloid for multiple times, wherein the first colloid 2 is coated on one substrate surface and is pre-cured, the second colloid 4 is coated on the pre-cured colloid surface, the other panel is pressed on the second colloid 4 surface, and the first colloid 2 and the second colloid 4 are cured, so that the risk of glue overflow is reduced.

In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.