阅读说明：本技术 应用于半导体装置的高强度氧化锆－氧化铝复合陶瓷基板及其制造方法 (High-strength zirconia-alumina composite ceramic substrate for semiconductor device and method for manufacturing same ) 是由 朱智鸿 汪睿凯 于 2020-05-15 设计创作，主要内容包括：本发明提出了一种应用于半导体装置的高强度氧化锆－氧化铝复合陶瓷基板,将氧化铝、氧化锆及自制合成的添加助剂三种起始粉体,在室温下,于有机溶剂中,进行球磨混合分散,再经调制浆料步骤、除气步骤、生胚成型步骤、冲片步骤、计算步骤及烧结步骤等步骤所制得,而具备优异三点抗折强度＞600MPa机械性能、热传导率＞26W/mK、绝缘特性＞10～(14)Ω·cm与低表面漏电流(150℃)＜200nA等热电性质者。(The invention provides a high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device, which is prepared by performing ball milling, mixing and dispersing on three initial powders of alumina, zirconia and a self-made synthetic additive in an organic solvent at room temperature, and then performing steps of slurry preparation, degassing, green body forming, punching, calculation, sintering and the like, and has excellent three-point rupture strength of more than 600MPa, thermal conductivity of more than 26W/mK, and insulating property of more than 10 14 Omega cm and low surface leakage current (150 ℃) less than 200 nA.)

1. A method for manufacturing a high-strength zirconia-alumina composite ceramic substrate for use in a semiconductor device, comprising the steps of:

ball milling: respectively carrying out ball milling, mixing and dispersing on powdery aluminum oxide, powdery zirconium oxide and an additive in an organic solvent at room temperature;

preparing slurry: preparing mixed slurry of alumina/zirconia/sintering aid according to a predetermined mass ratio;

degassing: degassing and defoaming the mixed slurry until the viscosity of the slurry reaches a set range value;

a step of forming a green body: carrying out scraper forming to prepare a green blank roll with a preset thickness;

punching: punching a green blank roll compounded by zirconia and aluminum;

a calculation step: calculating the size of a green blank of the punching sheet according to the sintering shrinkage ratio tested in advance;

sintering: and (3) enabling the blank sheet obtained in the sheet punching step to pass through a high-temperature furnace to be sintered into a zirconia-alumina composite ceramic substrate.

2. The method for manufacturing a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device according to claim 1, wherein the median particle diameter of the alumina powder is 0.7 to 3.0 μm; the median particle size of the zirconia powder is 0.2-0.80 μm; the median particle size of the powder of the sintering aid is 0.3-1.5 mu m.

3. The method of manufacturing a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device according to claim 1, wherein the mixed slurry comprises 1 to 15 wt.% of zirconia, 0.01 to 5.0 wt.% of a sintering aid, and the balance of alumina.

4. The method of manufacturing a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device according to claim 3, wherein the viscosity of the mixed slurry is 8000 to 30000 cps.

5. The method of claim 4, wherein the sintering step is performed to sinter 227 x 168 mm-sized green sheets into a zirconia-alumina composite ceramic substrate with dimensions of 7.5 inches x 5.5 inches, thickness of 0.1-0.9 mm, and preferably 0.32mm at 1560-1660 ℃.

6. The method for producing a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device according to claim 1, comprising a matrix phase formed of micron alumina particles, a second phase formed of submicron zirconia particles dispersed in the matrix phase, and a sintering aid synthesized by adding a preliminary calcination; the alumina particles of the matrix phase are mainly the matrix phase, and the zirconia particles dispersed in the matrix phase contain yttria as a stabilizer in the content of tetragonal zirconia.

7. The method of claim 1, wherein the pre-calcined sintering aid is selected from the group consisting of 0.8-8.8% calcium oxide, 56.7-61.7% silicon oxide, and 32.5-37.5% magnesium oxide, and the pre-calcined sintering aid is prepared by mixing and drying calcium oxide, silicon dioxide, and magnesium oxide with a bead mill, and calcining to obtain a SiMgCa compound to ensure uniformity of the composite ceramic, such that SiMgCa is present around the alumina particles to reduce the sintering temperature and improve the uniformity of the microstructure.

8. The method of claim 1, wherein the additive is formed by dispersing and mixing calcium oxide, silicon dioxide and magnesium oxide with zirconia balls in a certain ratio by bead milling, drying the uniformly dispersed and mixed slurry in an oven, and calcining the dried slurry at high temperature in a high temperature furnace.

9. The method of claim 1, wherein the organic chemical binder is solvent polyvinyl butyral, ether ester as a plasticizer, and a proper amount of surfactant as a dispersant.

10. A method for manufacturing a high-strength zirconia-alumina composite ceramic substrate for use in a semiconductor device, comprising the steps of:

ball milling: three starting powders, namely alumina with the median particle size of 0.7-3.0 mu m, zirconia with the median particle size of 0.20-0.80 mu m and a sintering aid with the median particle size of 0.3-1.5 mu m are used for ball milling, mixing and dispersing in an organic solvent at room temperature;

preparing slurry: preparing mixed slurry of 1-15 wt.% of zirconium oxide, 0.01-5.0 wt.% of sintering aid and the balance of aluminum oxide;

degassing: degassing and defoaming the mixed slurry until the viscosity of the slurry reaches a set range value of 8000-30000 cps;

a step of forming a green body: carrying out scraper forming on the mixed slurry with the viscosity of 8000-30000 cps to prepare a green coil with the thickness of 0.12-1.1 mm;

punching: punching the zirconium oxide-aluminum composite green coil;

a calculation step: the outer diameter of the green blank is calculated to be 227 multiplied by 168mm according to the sintering shrinkage ratio tested in advance;

sintering: the blank sheet with the size of 227 multiplied by 168mm is fired into a zirconia-alumina composite ceramic substrate with the size of 7.5 inches multiplied by 5.5 inches and the thickness of 0.1 to 0.9mm by a high temperature furnace at the temperature of 1560 to 1660 ℃.

11. The method of manufacturing a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device according to claim 10, wherein the zirconia-alumina composite ceramic substrate obtained in the sintering step has an optimum thickness of 0.32 mm.

12. A high-strength zirconia-alumina composite ceramic substrate for use in a semiconductor device, which is produced by the production method according to any one of claims 1 to 11, and which has a three-point flexural strength of more than 600MPa, a thermal conductivity of more than 26W/mK, and an insulation property of more than 10¹⁴Omega cm and low surface leakage current of less than 200 nA.

Technical Field

The invention relates to a zirconia-alumina composite ceramic substrate and a manufacturing method thereof, in particular to a zirconia-alumina composite ceramic substrate which is prepared by mixing alumina, zirconia, self-made and synthesized powder such as addition agent and the like and has excellent thermoelectric properties such as three-point rupture strength more than 600MPa, thermal conductivity more than 26W/mK, insulating property more than 1014 omega-cm and low surface leakage current (150 ℃) < 200nA and the like through a plurality of steps.

Background

With the rapid development of electronic devices, the trend of light, thin and short device substrates is remarkably developed, so that the alumina ceramic substrates used in the past for a long time are gradually thinned and the mechanical strength characteristics of the materials are gradually no longer loaded.

The traditional alumina ceramic substrate is formed by sintering alumina with the purity of more than 99.95 percent and compositions of calcium oxide (Calcia) or magnesium oxide (Magnesia) with the purity of less than 100ppm and the like. However, with the development of the thinning process of the large-area device, the mechanical properties of the alumina ceramic substrate are greatly reduced, and the subsequent operations related to sputtering, etching, electroplating and the like cannot be provided, even the requirement for thinning the product device cannot be satisfied.

Alumina substrates have been widely used for a long time as an insulating substrate for mounting semiconductor wafers, but with the demand of semiconductor multitasking, the semiconductor wafers are often electrified with high voltage and high current, and the conventional alumina substrates obviously cannot meet the requirements of high strength and high thermal conductivity. Although the manufacturers have proposed that alumina is used as the main component, and a certain amount of additives such as zirconia and yttria are added, and then the substrate with the bending strength of 400MPa can be obtained after high-temperature sintering. However, it is difficult to achieve high strength and high thermal conductivity of the substrate at the same time because the high strength substrate needs to have high thermal conductivity, and the alumina crystal grains need to be grown to reduce the crystal boundary glass layer causing thermal conductivity barrier.

In view of the above, the present inventors have conducted research and long-term research and improvement, and finally have made the present invention.

Disclosure of Invention

Accordingly, the present invention is directed to a high-strength zirconia-alumina composite ceramic substrate for a semiconductor device and a method for manufacturing the same, in which alumina (Al) is prepared₂O₃) Zirconium oxide (ZrO)₂) And a sintering aid (MCS).

According to the present invention, a high strength zirconia-alumina composite ceramic substrate for a semiconductor device and a method for manufacturing the same, which comprises a matrix phase formed of micron alumina particles, a second phase formed of submicron zirconia particles dispersed in the matrix phase, and a sintering aid synthesized by calcination in advance, is a further object of the present invention.

According to the high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device and the method for manufacturing the same of the present invention, the zirconia particles dispersed in the alumina particle matrix phase contain yttria as a stabilizer in a content of tetragonal zirconia, which is a further object of the present invention.

According to the invention, the high-strength zirconia-alumina composite ceramic substrate applied to the semiconductor device and the manufacturing method thereof, the sintering aid is formed by mixing and drying calcium oxide, silicon dioxide and magnesium oxide according to a certain proportion by a bead mill and then calcining to generate a silicon-magnesium-calcium compound; the sintering aid is added into the zirconia-alumina composite ceramic material, so that a certain proportion of silicon, magnesium and calcium is contained around alumina particles, and the sintering temperature of the zirconia-alumina composite ceramic is reduced, and the uniformity of a sintering microstructure is improved.

According to the high-strength zirconia-alumina composite ceramic substrate applied to the semiconductor device and the manufacturing method thereof of the invention, the prepared zirconia-alumina composite ceramic substrate has excellent three-point rupture strength of more than 600MPa mechanical property, thermal conductivity of more than 26W/mK and insulation property of more than 10¹⁴The thermoelectric properties such as omega cm and low surface leakage current (150 ℃) less than 200nA are another object of the present invention.

With regard to the detailed construction, application, principle, action and efficacy of the present invention, it should be understood by referring to the following description with reference to the accompanying drawings.

Drawings

FIG. 1 is a flow chart of the production of a zirconia-alumina composite ceramic substrate according to the present invention.

Description of reference numerals:

100: ball milling step

200: step of preparing slurry

300: degassing step

400: step of forming green body

500: punching step

600: calculating step

700: sintering step

Detailed Description

The high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device and a manufacturing method thereof are provided, and the zirconia-alumina composite ceramic substrate manufactured by the manufacturing method is composed of alumina (Al2O3), zirconia (ZrO2) and a presynthesized sintering aid (MCS).

As shown in fig. 1, the high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device according to the present invention is manufactured by a process including:

ball milling step 100: three kinds of initial powder, namely alumina with the median particle size of 0.70-3.0 mu m, zirconia with the median particle size of 0.20-0.80 mu m and a sintering aid with the median particle size of 0.30-1.5 mu m, are used for ball milling, mixing and dispersing in an organic solvent at room temperature;

slurry preparation step 200: preparing mixed slurry of 1-15 wt.% of zirconium oxide, 0.01-5.0 wt.% of sintering aid and the balance of aluminum oxide;

a degassing step 300: degassing and defoaming the mixed slurry until the viscosity of the slurry reaches a set range value of 8000-30000 cps;

green body forming step 400: carrying out scraper forming on the mixed slurry with the viscosity of 8000-30000 cps to prepare a green coil with the thickness of 0.12-1.10 mm;

punching step 500: punching the zirconium oxide-aluminum composite green coil;

a calculation step 600: the outer diameter of the green blank is calculated to be 227 multiplied by 168mm according to the sintering shrinkage ratio tested in advance;

sintering step 700: the blank sheet with the size of 227 multiplied by 168mm is fired into a zirconia-alumina composite ceramic substrate with the size of 7.5 inches multiplied by 5.5 inches, the thickness of 0.1 to 0.9mm and the best thickness of 0.32mm by a high temperature furnace at the temperature of 1560 to 1660 ℃.

The invention relates to a high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device and a manufacturing method thereof, and the zirconia-alumina composite ceramic substrate manufactured by the manufacturing method comprises a matrix (matrix) phase formed by micron alumina particles, a second phase formed by submicron zirconia particles dispersed in the matrix phase and a sintering aid which is synthesized by adding calcination in advance. The alumina particles of the matrix phase are mainly the matrix phase, and the zirconia particles dispersed in the matrix phase contain yttria (Y2O3) as a stabilizer in the content of tetragonal zirconia.

In the manufacturing process, the sintering aid added and synthesized by pre-calcination is prepared by mixing and drying calcium oxide, silicon dioxide and magnesium oxide according to a certain proportion (for example, 0.8-8.8% of calcium oxide, 56.7-61.7% of silicon dioxide and 32.5-37.5%) by a bead mill, and then calcining at 850-1250 ℃ to generate a silicon-magnesium-calcium compound, so as to ensure the uniformity of the addition in the zirconia-alumina composite ceramic, so that silicon-magnesium-calcium is contained around alumina particles in a certain proportion (for example, the content is more than 0.1 wt.%), and thus the sintering temperature of the zirconia-alumina composite ceramic is reduced and the uniformity of a sintered microstructure is improved.

The invention relates to a high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device and a manufacturing method thereof.

The invention relates to a high-strength zirconia-alumina composite ceramic substrate applied to a semiconductor device and a manufacturing method thereof.A solvent Polyvinyl butyral (PVB) is used as an organic chemical adhesive, an ether ester is used as a plasticizer, and a proper amount of surfactant is used as a dispersant.

The invention is applied to the high-strength zirconia-alumina composite ceramic substrate of the semiconductor device, through the preparation method, a small amount of silicon-magnesium-calcium sintering aid is uniformly dispersed among alumina particles in proportion, thereby not only reducing the sintering temperature, but also avoiding the strength reduction caused by the abnormal grain growth of alumina and avoiding the reduction of the thermal conductivity caused by the existence of excessive glass phase among alumina grain boundaries. Therefore, the prepared zirconia-alumina composite ceramic substrate can achieve the following performances:

1. has excellent three-point rupture strength of more than 600 MPa.

2. The thermal conductivity is more than 26W/mK.

3. The insulation property is more than 1014 omega cm.

4. Low surface leakage current (150 ℃) less than 200 nA.

In summary, the present invention provides a high strength zirconia-alumina composite ceramic substrate for semiconductor devices and a method for manufacturing the same, wherein the zirconia-alumina composite ceramic substrate manufactured by the method has characteristics significantly superior to those of the conventional alumina ceramic substrate, and can achieve the purpose and effect of reliability of post-process operation of the substrate and the stability requirement of the end product components, thereby meeting the requirements of the invention patent and suggestive of the application of the invention patent.

It is to be understood that the foregoing is illustrative of the preferred embodiments of the invention and that various changes may be made in the invention without departing from the spirit and scope of the invention as defined by the appended claims.