阅读说明：本技术 红外传感器和红外传感系统 (Infrared sensor and infrared sensing system ) 是由 隋志坤 宋加才 舒金表 张勇超 杨文宵 于 2021-07-01 设计创作，主要内容包括：本申请涉及一种红外传感器和红外传感系统,红外传感器包括红外发射模块和红外接收模块,红外发射模块包括第一控制单元和第一电阻,第一电阻末端与第一控制单元电连接,第一电阻的两端还分别形成为红外发射模块的两个连接端子,红外接收模块包括第二控制单元和第二电阻,第二电阻末端与第二控制单元电连接,第二电阻的两端还分别形成为红外接收模块的两个连接端子；通过各控制单元采集电阻末端的电压值,便可根据电压值确定相应模块的位置编号。本申请解决了相关技术中红外传感器安装复杂且需要在安装前编码学习的问题,简化了红外传感器的施工安装操作,以及不需要在施工安装前进行编码学习即可实现上电自适应识别的有益效果。(The application relates to an infrared sensor and an infrared sensing system, wherein the infrared sensor comprises an infrared transmitting module and an infrared receiving module, the infrared transmitting module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared transmitting module, the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, and two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module; the voltage value at the tail end of the resistor is acquired through each control unit, and the position number of the corresponding module can be determined according to the voltage value. The method and the device solve the problems that in the related art, the infrared sensor is complex to install and needs to be subjected to code learning before installation, simplify construction and installation operations of the infrared sensor, and achieve the beneficial effect of power-on self-adaptive identification without code learning before construction and installation.)

1. An infrared sensor, characterized in that the infrared sensor comprises an infrared emitting module and an infrared receiving module, wherein,

the infrared emission module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared emission module, and the first control unit is used for acquiring a first voltage value at the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;

the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module, the second control unit is used for collecting a second voltage value at the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.

2. The infrared sensor as set forth in claim 1, wherein said first resistor and said second resistor are equal in resistance.

3. An infrared sensing system is characterized by comprising a plurality of infrared transmitting modules and a plurality of infrared receiving modules, wherein the plurality of infrared transmitting modules and the plurality of infrared receiving modules are in one-to-one correspondence;

each infrared emission module comprises a first control unit and a first resistor, and the tail end of the first resistor of each infrared emission module is electrically connected with the first control unit of the infrared emission module; the first resistors of the infrared emission modules are cascaded between a voltage source and a grounding terminal; the first control unit is used for acquiring a first voltage value at the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;

each infrared receiving module comprises a second control unit and a second resistor, and the tail end of the second resistor of each infrared receiving module is electrically connected with the second control unit of the infrared receiving module; the second resistors of the infrared receiving modules are cascaded between a voltage source and a grounding terminal; the second control unit is used for acquiring a second voltage value at the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.

4. The infrared sensing system as defined in claim 3, wherein the second resistors of a plurality of said infrared receiving modules are cascaded between the voltage source and the ground terminal in the same cascade order as the corresponding first resistors.

5. The infrared sensing system of claim 4, wherein the first resistance is equal in value to the first resistance.

6. The infrared sensing system of claim 3,

the head end of the first resistor cascaded in the infrared emission modules is electrically connected with a voltage source, and the tail end of the last resistor cascaded in the infrared emission modules is electrically connected with a grounding end;

the head end of the first second resistor cascaded in the infrared receiving modules is electrically connected with a voltage source, and the tail end of the last second resistor cascaded in the infrared transmitting modules is electrically connected with a grounding end.

7. The infrared sensing system of claim 3,

the infrared emission module also comprises a modulation coding unit and an emission unit, wherein the modulation coding unit is used for generating a coded modulation signal according to the coding parameters corresponding to the position number of the infrared emission module; the transmitting unit is used for transmitting the coded modulation signal;

the infrared receiving module further comprises a receiving unit and a demodulating unit, wherein the receiving unit is used for receiving the coded modulation signal; the demodulation unit is used for demodulating the coded modulation signal according to the coding parameter corresponding to the position number of the infrared receiving module to obtain a detection signal, and transmitting the detection signal to the second control unit.

8. The infrared sensing system of claim 7, wherein the infrared receiving module further comprises a signal amplification unit, the signal amplification unit being connected between the receiving unit and the demodulation unit, the signal amplification unit being configured to amplify the code modulated signal.

9. The infrared sensing system of claim 7, wherein the receiving unit comprises a photosensitive receiving tube.

10. The infrared sensing system according to any one of claims 3 to 9, characterized in that the infrared sensing system further comprises a single bus, the plurality of infrared receiving modules are connected to the single bus, and the single bus is configured to report detection signals detected by the infrared receiving modules.

Technical Field

The present application relates to the field of infrared correlation, and more particularly to infrared sensors and infrared sensing systems.

Background

The common infrared correlation type switch in the market consists of two parts, namely a transmitting end and a receiving end. The transmitting end only transmits infrared pulse signals, the receiving end outputs judgment signals according to whether the receiving end receives the infrared pulse signals, for example, an NPN type infrared correlation type switch, if the receiving end can receive the infrared pulse signals, the receiving end judges that the signals output high level, and if the receiving end does not receive the infrared pulse signals, the receiving end judges that the signals output low level.

In the infrared correlation type switch of correlation technique, the pulse signal of the same frequency is all launched to the transmitting terminal, and the receiving terminal can only be through judging whether to accept infrared signal and do signal output, if two sets of infrared switch installation distance are close, probably bring mutual interference, if two sets of infrared switch installation distance are far away, then can have the detection blind area.

For solving this problem, the correlation technique provides an infrared correlation sensor, including light projecting module and photic module, light projecting module is including electric connection's carrier signal encoder in proper order, infrared lamp drive circuit and infrared lamp are constituteed, photic module is including electric connection's photoreceptor in proper order, study and decoder and drive amplifier circuit are constituteed, this kind of infrared correlation sensor is through encoding the signal that light projecting module sent, make every light projecting module all have unique transmission code, photic module learns the code of the signal that light projecting module sent, guarantee that every light projecting module only responds to the same light projecting module of the code rather than self discernment, realize infrared correlation sensor paired uniqueness.

However, the infrared correlation sensor has the following disadvantages:

(1) each pair of infrared correlation type switches are mutually independent, and are inconvenient to construct and install when being used in large batches. Under the scene of using the infrared correlation type switch in a large scale, the layout and wiring are more, the construction difficulty is increased, each pair of infrared correlation tubes work independently, the signals of the receiving ends are reported independently, and more interfaces are required to be arranged for a circuit board for receiving the signals so as to meet the working requirements.

(2) The infrared correlation tube adopting codes needs to be subjected to code learning before installation and construction, can not realize power-on self-adaptive identification, and is inconvenient for subsequent replacement.

At present, no effective solution is provided for the problems that the infrared sensor in the related art is complex to install and needs to be coded and learned before installation.

Disclosure of Invention

The embodiment of the application provides an infrared sensor and an infrared sensing system, and aims to at least solve the problems that in the related art, the installation of the infrared sensor is complex and the code learning is needed before the installation.

In a first aspect, embodiments of the present application provide an infrared sensor, which includes an infrared emitting module and an infrared receiving module, wherein,

the infrared emission module comprises a first control unit and a first resistor, the tail end of the first resistor is electrically connected with the first control unit, two ends of the first resistor are respectively formed into two connecting terminals of the infrared emission module, and the first control unit is used for acquiring a first voltage value at the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;

the infrared receiving module comprises a second control unit and a second resistor, the tail end of the second resistor is electrically connected with the second control unit, two ends of the second resistor are respectively formed into two connecting terminals of the infrared receiving module, the second control unit is used for collecting a second voltage value at the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.

In some embodiments, the first resistor and the second resistor have equal resistance values.

In a second aspect, an embodiment of the present application provides an infrared sensing system, which includes a plurality of infrared emission modules and a plurality of infrared reception modules, where the plurality of infrared emission modules and the plurality of infrared reception modules correspond to each other one to one;

each infrared emission module comprises a first control unit and a first resistor, and the tail end of the first resistor of each infrared emission module is electrically connected with the first control unit of the infrared emission module; the first resistors of the infrared emission modules are cascaded between a voltage source and a grounding terminal; the first control unit is used for acquiring a first voltage value at the tail end of the first resistor and determining the position number of the infrared emission module according to the first voltage value;

each infrared receiving module comprises a second control unit and a second resistor, and the tail end of the second resistor of each infrared receiving module is electrically connected with the second control unit of the infrared receiving module; the second resistors of the infrared receiving modules are cascaded between a voltage source and a grounding terminal; the second control unit is used for acquiring a second voltage value at the tail end of the second resistor and determining the position number of the infrared receiving module according to the second voltage value.

In some embodiments, the second resistors of a plurality of infrared receiving modules are cascaded between the voltage source and the ground terminal in the same cascade order as the corresponding first resistors.

In some embodiments, the first resistor and the first resistor have the same resistance.

In some embodiments, the head end of the first resistor cascaded in the plurality of infrared emission modules is electrically connected to a voltage source, and the tail end of the last resistor cascaded in the plurality of infrared emission modules is electrically connected to a ground end;

the head end of the first second resistor cascaded in the infrared receiving modules is electrically connected with a voltage source, and the tail end of the last second resistor cascaded in the infrared transmitting modules is electrically connected with a grounding end.

In some embodiments, the infrared emission module further includes a modulation and coding unit and an emission unit, and the modulation and coding unit is configured to generate a coded and modulated signal according to a coding parameter corresponding to the position number of the infrared emission module; the transmitting unit is used for transmitting the coded modulation signal;

the infrared receiving module further comprises a receiving unit and a demodulating unit, wherein the receiving unit is used for receiving the coded modulation signal; the demodulation unit is used for demodulating the coded modulation signal according to the coding parameter corresponding to the position number of the infrared receiving module to obtain a detection signal, and transmitting the detection signal to the second control unit.

In some embodiments, the infrared receiving module further includes a signal amplifying unit, the signal amplifying unit is connected between the receiving unit and the demodulating unit, and the signal amplifying unit is configured to amplify the code modulation signal.

In some of these embodiments, the receiving unit comprises a photosensitive receiving tube.

In some embodiments, the infrared sensing system further includes a single bus, and the plurality of infrared receiving modules are connected to the single bus, and the single bus is configured to report detection signals detected by the infrared receiving modules.

Compared with the prior art, the infrared sensor and the infrared sensing system provided in the embodiment solve the problems that the infrared sensor is complex to install and needs to be subjected to code learning before installation in the prior art, simplify the construction and installation operation of the infrared sensor, and realize the beneficial effect of power-on self-adaptive identification without code learning before construction and installation.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic diagram of an infrared sensor according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an implementation of an installation of an infrared sensor according to an embodiment of the present application;

FIG. 3 is a first schematic structural diagram of an infrared sensing system according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of an infrared sensing system according to an embodiment of the present application;

fig. 5 is a first schematic structural diagram of an infrared receiving module according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of an infrared receiving module according to an embodiment of the present application;

FIG. 7 is a schematic structural diagram of an infrared sensing system in accordance with a preferred embodiment of the present application;

fig. 8 is an enlarged schematic view of a partial hardware structure of an infrared sensing system according to a preferred embodiment of the present application.

Reference numerals:

10. an infrared emission module; 11. a first control unit; 12. a first resistor; 13. a first voltage source; 14. a first ground terminal; 15. a modulation encoding unit; 16. a transmitting unit;

20. an infrared receiving module; 21. a second control unit; 22. a second resistor; 23. a second voltage source; 24. a second ground terminal; 25. a demodulation unit; 26. a receiving unit; 27. a signal amplification unit; 28. a single bus.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided in the present application without any inventive step are within the scope of protection of the present application.

It is obvious that the drawings in the following description are only examples or embodiments of the present application, and that it is also possible for a person skilled in the art to apply the present application to other similar contexts on the basis of these drawings without inventive effort. Moreover, it should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of ordinary skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments without conflict.

Unless defined otherwise, technical or scientific terms referred to herein shall have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. Reference to "a," "an," "the," and similar words throughout this application are not to be construed as limiting in number, and may refer to the singular or the plural. The present application is directed to the use of the terms "including," "comprising," "having," and any variations thereof, which are intended to cover non-exclusive inclusions; for example, a process, method, system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to the listed steps or elements, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. Reference to "connected," "coupled," and the like in this application is not intended to be limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The term "plurality" as referred to herein means two or more. "and/or" describes an association relationship of associated objects, meaning that three relationships may exist, for example, "A and/or B" may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. Reference herein to the terms "first," "second," "third," and the like, are merely to distinguish similar objects and do not denote a particular ordering for the objects.

In this embodiment, an infrared sensor is provided, and fig. 1 is a schematic structural diagram of an infrared sensor according to an embodiment of the present application, and as shown in fig. 1, the infrared sensor includes: an infrared transmitting module 10 and an infrared receiving module 20.

The infrared emission module 10 includes a first control unit 11 and a first resistor 12, a terminal of the first resistor 12 is electrically connected to the first control unit 11, two ends of the first resistor 12 are also respectively formed as two connection terminals of the infrared emission module 10, and the first control unit 11 is configured to collect a first voltage value at the terminal of the first resistor 12 and determine a position number of the infrared emission module 10 according to the first voltage value.

The infrared receiving module 20 includes a second control unit 21 and a second resistor 22, a terminal of the second resistor 22 is electrically connected to the second control unit 21, two ends of the second resistor 22 are also respectively formed as two connection terminals of the infrared receiving module 20, and the second control unit 21 is configured to collect a second voltage value at the terminal of the second resistor 22 and determine a position number of the infrared receiving module 20 according to the second voltage value.

Fig. 2 is a schematic diagram illustrating an installation implementation of an infrared sensor according to an embodiment of the present application, as shown in fig. 2, when the infrared sensor is installed, only two connection terminals of a plurality of infrared emission modules 10 need to be connected end to end at an infrared signal emission end, that is, a terminal end of a first resistor 12 of a previous infrared emission module 10 is connected to a head end of a first resistor 12 of a next infrared emission module 10, a head end of a first resistor 12 cascaded in the plurality of infrared emission modules 10 is electrically connected to a first voltage source 13, and a terminal end of a last first resistor 12 cascaded in the plurality of infrared emission modules 10 is electrically connected to a first ground end 14.

Similarly, at the infrared signal receiving end, only two connection terminals of the plurality of infrared receiving modules 20 need to be connected end to end, that is, the tail end of the second resistor 22 of the previous infrared receiving module 20 is connected with the head end of the second resistor 22 of the next infrared receiving module 20, the head end of the first second resistor 22 cascaded in the plurality of infrared receiving modules 20 is electrically connected with the second voltage source 23, and the tail end of the last second resistor 22 cascaded in the plurality of infrared transmitting modules 10 is electrically connected with the second grounding end 24.

When the infrared transmitting module 10 and the infrared receiving module 20 are connected to a power supply, a certain voltage is distributed to the two ends of each resistor, and the voltage and the position number of each resistor are configured in advance, so that the position numbers of the infrared transmitting module 10 and the infrared receiving module 20 can be determined according to the voltage values in a table look-up manner.

In some preferred embodiments, the first resistor 12 and the second resistor 22 have equal resistance values, and the voltage values of these resistors are regularly changed according to the principle of dividing the voltage by the series resistors, so that the position numbers of the infrared transmitting module 10 and the infrared receiving module 20 can be calculated according to the voltage values.

For example, in the infrared emission module 10, 4 resistors with the same resistance are sequentially connected in series between a voltage source and a ground terminal, the numbers are 1, 2, 3, and 4, wherein the head end of the resistor No. 1 is connected to the voltage source, the tail end of the resistor No. 4 is connected to the ground terminal, and the total voltage dropped across the 4 resistors is 1V, then the voltage values allocated to the 4 resistors are 1/4V, 2/4V, 3/4V, and 4/4V, respectively, and each first control unit 11 can determine the position number of the corresponding infrared emission module 10 by determining the voltage value of the corresponding resistor and by a calculation method (position number is a single resistor voltage value × the number of resistors). The principle of the infrared receiving module 20 for determining the position number is similar to that of the infrared transmitting module 10, and the detailed description is omitted here.

In the case of a plurality of pairs of ir correlation pipes (i.e., a plurality of ir transmitting modules 10 and a plurality of ir receiving modules 20), there may be a problem of mutual interference between ir correlation pipes of different pairs, and in order to solve the problem, in the related art, the ir correlation type switch is complicated to construct and install and requires code learning before installation. Compared with the related art, the infrared sensor of the embodiment supports cascade connection use, does not need power-on learning, can determine the position of the infrared sensor by only partitioning resistance, and each infrared receiving module 20 only receives a signal sent by the corresponding infrared emitting module 10 and judges whether the infrared sensor is shielded or not according to the signal. Through the embodiment, the problems that in the related art, the infrared sensor is complex to install and needs to be subjected to code learning before installation are solved, the construction and installation operations of the infrared sensor are simplified, and the beneficial effect that power-on self-adaptive identification can be realized without code learning before construction and installation is achieved.

With reference to the infrared sensor of the foregoing embodiment, this embodiment further provides an infrared sensing system, fig. 3 is a first schematic structural diagram of the infrared sensing system of the embodiment of the present application, and as shown in fig. 3, the infrared sensing system includes: the infrared receiving module comprises a plurality of infrared transmitting modules 10 and a plurality of infrared receiving modules 20, wherein the plurality of infrared transmitting modules 10 correspond to the plurality of infrared receiving modules 20 one to one.

Each infrared emission module 10 comprises a first control unit 11 and a first resistor 12, and the tail end of the first resistor of each infrared emission module 10 is electrically connected with the first control unit 11 of the infrared emission module 10; the first resistors 12 of the plurality of infrared emission modules 10 are cascaded between a first voltage source 13 and a first ground terminal 14; the first control unit 11 is configured to collect a first voltage value at the end of the first resistor 12, and determine a position number of the infrared emission module 10 according to the first voltage value.

Each infrared receiving module 20 comprises a second control unit 21 and a second resistor 22, and the end of the second resistor 22 of each infrared receiving module 20 is electrically connected with the second control unit 21 of the infrared receiving module 20; the second resistors 22 of the plurality of infrared receiving modules 20 are cascaded between the second voltage source 23 and the second ground terminal 24; the second control unit 21 is configured to collect a second voltage value at the end of the second resistor 22, and determine the position number of the infrared receiving module 20 according to the second voltage value.

The working principle of the infrared sensing system has been described in the above embodiments, and the description of the embodiment is omitted.

In some embodiments, the second resistors 22 of the plurality of infrared receiving modules 20 are cascaded between the voltage source and the ground terminal in the same cascade order as the corresponding first resistors 12.

So set up for infrared receiving module 20 and infrared emission module 10 have the same order serial number, make things convenient for infrared receiving module 20 when the signal that receives infrared emission module 10 and send, only need carry out simple comparison with the position number that the signal that sends carried and self position number, select to compare unanimous signal and carry out subsequent processing, for example, judge that infrared sensor is sheltered from.

In some preferred embodiments, the first resistor 12 and the second resistor 22 are equal in value.

By the arrangement, the voltage values of the resistors are changed regularly, and according to the voltage division principle of the series resistors, the position numbers of the infrared transmitting module 10 and the infrared receiving module 20 can be calculated after the voltage values are collected, and the relation between the voltage and the position number of each resistor does not need to be configured in advance.

Referring to fig. 3, in some embodiments, a head end of a first resistor 12 cascaded in the plurality of infrared emission modules 10 is electrically connected to a first voltage source 13, and a tail end of a last first resistor 12 cascaded in the plurality of infrared emission modules 10 is electrically connected to a first ground terminal 14; the first end of the first second resistor 22 cascaded in the plurality of infrared receiving modules 20 is electrically connected to the second voltage source 23, and the last second resistor 22 cascaded in the plurality of infrared transmitting modules 10 is electrically connected to the second ground terminal 24.

Referring to fig. 4, in some embodiments, the infrared emission module 10 further includes a modulation and coding unit 15 and an emission unit 16, where the modulation and coding unit 15 is configured to generate a coded and modulated signal according to a coding parameter corresponding to the position number of the infrared emission module 10; the transmitting unit 16 is used to transmit the code modulated signal.

The infrared receiving module 20 further includes a demodulating unit 25 and a receiving unit 26, and the receiving unit 26 is configured to receive the coded modulation signal; the demodulation unit 25 is configured to demodulate the coded modulation signal according to the coding parameter corresponding to the position number of the infrared receiving module 20 to obtain a detection signal, and transmit the detection signal to the second control unit 21.

Referring to fig. 5, in some embodiments, the infrared receiving module 20 further includes a signal amplifying unit 27, the signal amplifying unit 27 is connected between the receiving unit 26 and the demodulating unit 25, and the signal amplifying unit 27 is configured to amplify the code modulation signal.

In some embodiments, the receiving unit 26 includes a photosensitive receiving tube. In the infrared emitting module 10, the emitting unit 16 can be implemented by an LED, and the photosensitive receiving tube can sense light waves emitted by the LED to receive light signals.

Referring to fig. 6, in some embodiments, the infrared sensing system further includes a single bus 28, the plurality of infrared receiving modules 20 are connected to the single bus 28, and the single bus 28 is configured to report detection signals detected by the infrared receiving modules 20.

The infrared sensing system of the present application will be described below by way of preferred embodiments.

Fig. 7 is a schematic structural diagram of an infrared sensing system according to a preferred embodiment of the present application, and fig. 8 is an enlarged schematic partial hardware structure of the infrared sensing system according to the preferred embodiment of the present application, as shown in fig. 7 to 8:

the infrared emission module has 3 inlet wires and 3 outgoing lines, wherein, 3 inlet wires include VCC, GND, Ra, and 3 outgoing lines include VCC, GND, Rb. The infrared transmitting module comprises an MCU, a partition resistor R, a modulation encoder and an infrared lamp. The cascade mode of the infrared emission module is that the Ra end of the first partition resistor is connected to VCC, the Rb end of the last partition resistor is connected to GND, and the Rb end of each partition resistor is connected to an ADC pin of the MCU. After the infrared emission modules are cascaded, the connection sequence of the infrared emission modules is determined by collecting the voltage of an Rb terminal, and the infrared emission modules emit carrier waves with different codes according to the sequence of the infrared emission modules.

The infrared receiving module is provided with 4 follow-up incoming lines and 4 follow-up outgoing lines, wherein the 4 incoming lines comprise VCC, Signal, Ra and GND; the 4 following lines comprise VCC, Signal, Rb and GND. The infrared receiving module comprises a photosensitive receiving tube, a photoelectric amplifier, a demodulator, an MCU and a partition resistor R. The cascade mode of the infrared receiving modules is that the Ra end of the first partition resistor is connected to VCC, the Rb end of the last partition resistor is connected to GND, and the Rb end of each partition resistor is connected to an ADC pin of the MCU, so that the connection sequence of the infrared receiving modules is determined by collecting the voltage of the Rb ends after the infrared receiving modules are cascaded.

The cascade installation mode of the infrared transmitting module and the infrared receiving module reduces the construction difficulty and saves the construction cost. And moreover, the infrared transmitting module and the infrared receiving module do not need to be electrified for learning, the positions of the infrared transmitting module and the infrared receiving module can be accurately identified only by detecting the voltage of the partition resistor, each path of infrared receiving module only receives the coded modulation signals sent by the infrared transmitting module corresponding to the infrared receiving module and carries out demodulation processing, the processed signals are transmitted to the MCU, and the MCU judges whether the infrared correlation tube is shielded or not by receiving the corresponding coded signals. And finally, the infrared receiving module outputs and reports the infrared receiving module to the outside in a single bus (Signal) communication mode. Two adjacent groups of infrared correlation tubes are not interfered even if the infrared codes are close to each other due to different infrared codes.

It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to be limiting. All other embodiments, which can be derived by a person skilled in the art from the examples provided herein without any inventive step, shall fall within the scope of protection of the present application.

It is obvious that the drawings are only examples or embodiments of the present application, and it is obvious to those skilled in the art that the present application can be applied to other similar cases according to the drawings without creative efforts. Moreover, it should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another.

The term "embodiment" is used herein to mean that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is to be expressly or implicitly understood by one of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the patent protection. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.