阅读说明：本技术 电子控制装置 (Electronic control device ) 是由 远山仁博 中村祐辉 植松裕 坂本英之 于 2020-03-31 设计创作，主要内容包括：本发明为一种电子控制装置,具备：导电性的壳体；电路基板,其设置在所述壳体内部,搭载包含集成电路的电子零件；以及细长形状的导电性的导体零件,其设置在所述电路基板上,配置在比所述电子零件高的位置,所述导体零件中,所述导体零件与所述壳体的距离比所述导体零件与所述电路基板的距离短。(The present invention provides an electronic control device, comprising: a conductive housing; a circuit board which is provided inside the housing and on which electronic components including an integrated circuit are mounted; and an elongated conductive conductor component provided on the circuit board and disposed at a position higher than the electronic component, wherein a distance between the conductor component and the case is shorter than a distance between the conductor component and the circuit board.)

1. An electronic control device is characterized by comprising:

a conductive housing;

a circuit board which is provided inside the housing and on which electronic components including an integrated circuit are mounted; and

an elongated conductive conductor component provided on the circuit board and disposed at a position higher than the electronic component,

the distance between the conductor part and the housing is shorter than the distance between the conductor part and the circuit board.

2. An electronic control device is characterized by comprising:

a conductive housing;

a circuit board which is provided inside the housing and on which electronic components including an integrated circuit are mounted;

an elongated conductive conductor component provided on the circuit board and disposed at a position higher than the electronic component; and

a dielectric body interposed between the conductor part and the housing,

the distance from the conductor part to the case is shorter than the product of the distance from the conductor part to the circuit board and the relative dielectric constant of the dielectric.

3. The electronic control device according to claim 1 or 2,

the conductor part is electrically connected at both ends thereof to the ground on the circuit substrate or the case directly or via a capacitor or a resistor.

4. The electronic control device according to claim 1 or 2,

the circuit board is provided with an external connection terminal,

the conductor component is disposed in the vicinity of the external connection terminal.

5. The electronic control device according to claim 4,

the external connection terminal is mounted in the vicinity of one side of the circuit board,

the conductor component is disposed so as to connect one side of the circuit board on which the external connection terminal is mounted and the other side thereof.

6. The electronic control device according to claim 4,

the conductor component is mounted on a surface of the circuit board opposite to the surface on which the external connection terminals are mounted.

7. The electronic control device according to claim 3,

the conductor part is connected to the ground of the circuit substrate via a resistor.

8. The electronic control device according to claim 7,

the resistor has a resistance value corresponding to a characteristic impedance determined by the sectional structures of the conductor part and the case.

9. The electronic control device according to claim 1 or 2,

the circuit board is provided with external connection terminals near one side thereof,

the conductor component is disposed parallel to a side on which the external connection terminal is mounted.

10. The electronic control device according to claim 1 or 2,

the plurality of conductor components are arranged on the circuit board.

11. The electronic control device according to claim 10,

the conductor parts are arranged substantially in parallel with four sides of the circuit substrate.

12. The electronic control device according to claim 10,

the conductor component is disposed on a diagonal line of the circuit board.

13. The electronic control device according to claim 1 or 2,

the circuit substrate is provided in advance with a plurality of pads for connecting the conductor parts on the circuit substrate,

the pad has a shape corresponding to a plurality of arrangement directions of the conductor parts.

14. The electronic control device according to claim 1 or 2,

the conductor component is in the shape of a partition standing on the circuit board, and the lower surface of the conductor component is connected to the circuit board.

15. The electronic control device according to claim 1 or 2,

the conductor component is also connected to the circuit board at an intermediate point other than both ends thereof.

16. The electronic control device according to claim 1 or 2,

the conductor component is directly fixed to the housing via the circuit board.

17. The electronic control device according to claim 1 or 2,

the conductor part is in contact with the housing at its intermediate location.

Technical Field

The present invention relates to an electronic control device.

Background

In order to realize a driving assistance system such as collision damage reduction braking, automatic driving, and the like, the calculation performance required of an electronic control device of an automobile is improved. Therefore, an integrated circuit having a high operating frequency is mounted on the electronic control device.

Accordingly, when electrical noise and electromagnetic noise are coupled to the circuit, the electronic control device tends to be prone to malfunction. In an electronic control device for an automobile, a method for evaluating the resistance to electromagnetic noise from the outside is established as an international standard for ensuring the safety of the automobile. In addition, a test method is also specified in the form of international standards for static electricity that may be a problem as a source of electromagnetic noise.

Patent document 1 discloses a high-frequency shield circuit in which all electronic components on a substrate are covered with a metal cover.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2005-223267

Disclosure of Invention

Problems to be solved by the invention

The technique of patent document 1 has a problem that heat dissipation of electronic components covered with a metal cover and installation of the metal cover are costly.

Means for solving the problems

The electronic control device according to aspect 1 of the present invention preferably includes: a conductive housing; a circuit board which is provided inside the housing and on which electronic components including an integrated circuit are mounted; and an elongated conductive conductor component provided on the circuit board and disposed at a position higher than the electronic component, wherein a distance between the conductor component and the case is shorter than a distance between the conductor component and the circuit board.

The electronic control device according to claim 2 of the present invention preferably includes: a conductive housing; a circuit board which is provided inside the housing and on which electronic components including an integrated circuit are mounted; an elongated conductive conductor component provided on the circuit board and disposed at a position higher than the electronic component; and a dielectric body interposed between the conductor part and the housing, wherein a distance from the conductor part to the housing is shorter than a product of a distance from the conductor part to the circuit board and a relative dielectric constant of the dielectric body.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, the electronic component is excellent in heat dissipation, and the influence of noise entering and exiting from the case gap on the circuit board and unnecessary electromagnetic radiation can be suppressed at low cost.

Drawings

Fig. 1 is a sectional view of an electronic control device of a comparative example.

Fig. 2 is a sectional view of the electronic control device of embodiment 1.

Fig. 3 is a plan view of a circuit board of the electronic control device according to embodiment 1.

Fig. 4 is a diagram showing the distribution of an electric field due to electromagnetic noise in the cross-sectional view of the electronic control device according to embodiment 1.

Fig. 5 is a sectional view of the electronic control device of embodiment 2.

Fig. 6 is a plan view of a circuit board of the electronic control device according to embodiment 3.

Fig. 7 is a plan view of a circuit board of the electronic control device according to embodiment 4.

Fig. 8 is a plan view of a circuit board of the electronic control device according to embodiment 5.

Fig. 9 is a plan view of a circuit board of the electronic control device according to embodiment 6.

Fig. 10 is a plan view of a circuit board of the electronic control device according to embodiment 7.

Fig. 11 is a sectional view of an electronic control device of the 8 th embodiment.

Fig. 12 is a plan view of a circuit board of the electronic control device according to embodiment 8.

Fig. 13 is a sectional view of the electronic control device of the 9 th embodiment.

Fig. 14 is a sectional view of an electronic control device of the 10 th embodiment.

Fig. 15 is a sectional view of an electronic control device of embodiment 11.

Fig. 16 is a sectional view of an electronic control device of embodiment 12.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are illustrative of the present invention and are omitted or simplified as appropriate for clarity of explanation. The present invention can be implemented in other various forms. Each constituent element may be singular or plural unless otherwise specified.

The positions, sizes, shapes, ranges, and the like of the respective constituent elements shown in the drawings may not be shown in order to facilitate understanding of the invention. Therefore, the present invention is not limited to the position, size, shape, range and the like shown in the drawings.

[ comparative example ]

Referring to fig. 1, a vehicle-mounted electronic control device 500 that is a comparative example of the present embodiment will be described.

Fig. 1 is a sectional view of an electronic control device 500 of a comparative example. The electronic control device 500 includes a housing upper part 501 and a housing lower part 502 made of metal, and a circuit board 601 is housed inside the housing upper part 501 and the housing lower part 502 in a vertically sandwiched manner. The circuit board 601 has integrated circuits 603-1 and 603-2 mounted thereon. The circuit board 601 has a connector 701 mounted on an end portion of the circuit board 601. The connector 701 is composed of connector pins 705 connected to a circuit on the circuit board 601 and a housing 704 covering the connector pins 705. The connector 701 shows a state in which a male-female connector is connected. The connector pins 705 in the connector 701 are connected to the wire harness 703 and led out to the outside of the electronic control device 500.

A gap around the connector 701, a resin portion of the housing 704 of the connector 701, and the like become opening portions of a barrier constituted by the housing upper portion 501 and the housing lower portion 502 made of metal, causing electromagnetic noise to enter from the outside. Further, a gap between the housing upper portion 501 and the housing lower portion 502 other than the periphery of the connector 701 also serves as an entrance for electromagnetic noise.

As shown in fig. 1, an electric field 803 due to electromagnetic noise entering the housing of the electronic control device 500 is generated. This electric field 803 propagates in the space between the circuit board 601 and the housing upper part 501, and the integrated circuits 603-1 and 603-2 on the circuit board 601 and the circuits on the circuit board 601 around them are exposed to the electric field of electromagnetic noise, thereby causing malfunction. Particularly, in a frequency band having a wavelength close to the size of the case, a resonance is caused in the space inside the case to be strongly coupled to the circuit substrate, thereby causing a problem. Here, for the sake of easy comprehensibility, the electric field 803 of the electromagnetic noise is described only between the case upper portion 501 and the circuit board 601, which have large openings and into which the electromagnetic noise easily enters, but the electromagnetic noise also enters between the case lower portion 502 and the circuit board 601.

In order to solve such a problem, it is considered to completely cover the integrated circuits 603-1 and 603-2 on the circuit board 601 with a metal cover, but heat dissipation of the integrated circuits 603-1 and 603-2 becomes difficult, and there is a concern that space and cost increase in order to provide the metal cover on the circuit board 601.

In the present embodiment described below, the electronic components have excellent heat dissipation, and noise entering and exiting from the case gap and unnecessary electromagnetic radiation can be suppressed at low cost.

[ embodiment 1 ]

Embodiment 1 of the present invention will be described with reference to fig. 2 to 4. Fig. 2 is a sectional view of the electronic control device 100. Fig. 3 is a plan view of the circuit board 201 in the electronic control device 100. Fig. 4 is a diagram showing the distribution of an electric field due to electromagnetic noise in the cross-sectional view of the electronic control device 100.

As shown in fig. 2, the electronic control device 100 includes a case upper part 101 and a case lower part 102 made of metal, and a circuit board 201 is housed inside the case upper part 101 and the case lower part 102 in a vertically sandwiched manner. In the following description, the upper case 101 and the lower case 102 are collectively referred to as a case 103 in some cases. The circuit board 201 has integrated circuits 203-1 and 203-2 mounted thereon. Further, a connector 301 as an external connection terminal is mounted on an end portion of the circuit board 201 on the circuit board 201. The connector 301 is constituted by connector pins 305 connected to the circuit on the circuit substrate 201 and a connector housing 304 covering the connector pins 305. The connector 301 shows a state in which a male-female connector is connected. The connector pins 305 in the connector 301 are connected to the harness 303 and led out to the outside of the electronic control device 100.

As shown in fig. 2, the conductor component 402 is mounted so that both ends thereof are connected to the circuit board 201. The distance H1 between the upper surface of conductor part 402 and housing upper part 101 is shorter than the distance H2 between the upper surface of conductor part 402 and the upper surface of circuit board 201.

As shown in fig. 3, screw fixing holes 205 are provided at 4 corners of the circuit board 201, and the circuit board 201 is fixed to the case lower part 102 by screws through the screw fixing holes 205. Signal lines 204 are arranged in peripheral regions of the integrated circuit 203-1 and the integrated circuit 203-2. The conductor parts 402-1, 402-2 are arranged in such a manner as to span these regions or pass through the upper periphery. Further, the conductor components 402-1 and 402-2 are arranged so as to connect one side of the circuit board 201 on which the connector 301 is arranged with the other side of the circuit board 201 on which the connector 301 is not arranged. The conductor parts 402-1, 402-2 are arranged in parallel on the circuit board 201 at intervals substantially equally dividing the circuit board 201. Also, the conductor parts 402-1, 402-2 are arranged to be located near the connector 301. The example shown in FIG. 3 shows an example in which 2 conductor parts 402-1 and 402-2 are arranged, but a plurality of them may be arranged. In this case, too, the substrates are arranged at substantially equal intervals. In the following description, the plurality of conductor parts may be referred to as the conductor part 402.

Both ends of the conductor parts 402-1, 402-2 are soldered to the pads 206 on the circuit substrate 201. The pads 206 on the circuit substrate 201 are connected to the ground layer of the inner layer of the circuit substrate 201 by means of vias 207. Here, connection by a via is exemplified, but connection to ground may be made via a line in the surface layer of the circuit board 201. Further, the ground in the circuit board 201 may be connected to AC via a capacitor or the like, even if the ground is not directly connected to the ground. In addition, the two ends of the conductor parts 402-1, 402-2 can be electrically connected directly to the upper housing part 101 or the lower housing part 102, or can be electrically connected to a pattern electrically connecting the upper housing part 101 and the lower housing part 102.

The conductor member 402 is made of a conductive material such as copper. The conductor member 402 may have an elongated shape, and includes, for example, a plate shape, a linear shape, a rod shape, a tubular shape, and the like. In this embodiment and the embodiments described below, a plate shape is described as an example. Further, the elongated conductor component 402 does not need to be a straight line, and may be distorted according to the arrangement of components, the shape of the housing, and the like.

As shown in fig. 4, an electric field 603 due to electromagnetic noise entering the housing of the electronic control device 100 is generated. Here, since the upper surface of the conductor component 402 disposed on the circuit board 201 is disposed closer to the case upper portion 101 side than the circuit board 201, an electric field 603 due to the electromagnetic noise that has entered is concentrated between the conductor component 402 and the case upper portion 101. Thus, the integrated circuits 203-1 and 203-2 on the circuit board 201 and the signal lines 204 on the circuit board 201 around them are less susceptible to the influence of the electric field of electromagnetic noise.

In the example of the arrangement of the conductor components 402 according to the present embodiment, noise entering from the connector 301 side is effective in a case where a standing wave is formed by resonance of the case dimension connecting the side of the circuit board 201 on which the connector 301 is arranged and the other side of the circuit board 201 on which the connector 301 is not arranged.

As described above, the electromagnetic noise that has entered the metal case 103 is concentrated on the portion of the circuit board 201 that is close to the case 103 and has a low impedance with respect to the electromagnetic noise, and propagates. Since the conductor component 402 mounted on the circuit board 201 is disposed closer to the case 103 than the circuit board 201, electromagnetic noise concentrates between the conductor component 402 and the case 103, and the integrated circuit 203 and the like on the circuit board 201 are protected from the electromagnetic noise. Due to the characteristic that the path of the electromagnetic noise is controlled to be concentrated, the effect of protecting the integrated circuit 203 or the like from the electromagnetic noise can be obtained without covering the whole of the integrated circuit with the electromagnetic noise like the conventional shield structure, and therefore, it is easy to achieve compatibility with a heat radiation structure or the like. Further, the area on the circuit board 201 required for providing the conductor component 402 can be reduced, and the structure is simple and the cost is reduced.

Further, according to the reciprocity theorem in electromagnetism, propagation of noise generated from the integrated circuit 203 and the like is also suppressed, and therefore, an effect of suppressing unnecessary electromagnetic waves radiated from the circuit board 201 to the outside is also obtained.

[ 2 nd embodiment ]

Embodiment 2 of the present invention will be described with reference to fig. 5. Fig. 5 is a sectional view of the electronic control device 100. In the present embodiment, in addition to the configuration of embodiment 1, a conductor component 402-2 is disposed between the circuit board 201 and the case lower portion 102. The same portions as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

An integrated circuit 203-3 is disposed on the back surface of the circuit board 201. A plurality of conductor components 402 are arranged on the back surface of the circuit board 201 so as to straddle the upper portion of the integrated circuit 203-3. Specifically, the distance H1 'between the lower surface of the conductor part 402-2 and the case lower portion 102 is set shorter than the distance H2' between the lower surface of the conductor part 402 and the back surface of the circuit board 201.

The material, shape, and the like of the conductor component 402-2 are the same as those described in embodiment 1. The connection between the conductor component 402-2 and the circuit board 201 is also the same as that described in embodiment 1.

According to the present embodiment, the integrated circuit 203-3 and the like can be protected from electromagnetic noise that may enter between the circuit board 201 and the case lower portion 102. Other effects are the same as those described in embodiment 1.

[ embodiment 3 ]

Embodiment 3 of the present invention will be described with reference to fig. 6. Fig. 6 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 3 and the like are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the resistor 208 is inserted between the pad 206 for mounting the conductor component 402 and the ground and via 207 in the circuit board 201. The effect described in embodiment 1 may be reduced at a frequency at which electrical resonance occurs in the conductor part 402 and noise is accumulated. By connecting the conductor member 402 via the resistor 208 as in the present embodiment, the resonance energy can be converted into thermal energy, thereby avoiding a decrease in the effect.

The resistance value of the resistor 208 is set to a value close to the characteristic impedance when the housing upper part 101 and the conductor part 402 are regarded as a transmission line, thereby forming a condition close to the end of matching. In other words, the resistor 208 has a resistance value corresponding to a characteristic impedance determined by the sectional structures of the conductor part 402 and the housing 103. This can suppress reflection in the resistor 208 and convert the heat energy into heat energy most efficiently. For example, when the distance between the housing upper part 101 and the conductor part 402 is several mm and the width of the conductor part is about 3 mm/thickness 0.5mm, a resistance of about 1 to 10 Ω is preferably used.

The material, shape, and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 4 th embodiment ]

Embodiment 4 of the present invention will be described with reference to fig. 7. Fig. 7 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 3 and the like are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the conductor component 402 is mounted substantially in the center of the circuit board 201 so as to be parallel to the side of the circuit board 201 on which the connector 301 is mounted. Although the example of 1 conductor part 402 is shown, a plurality of conductor parts 402 may be arranged in parallel at substantially equal intervals. When a large number of connectors are mounted due to an increase in the number of sensors and the like connected to the electronic control device 100, the circuit board 201 is often configured such that the side on which the connector 301 is mounted is the long side. In this case, resonance due to the dimension in the longitudinal direction is likely to occur from the lowest frequency, which is a problem, but in the present embodiment, by disposing the conductor component 402 in parallel with this direction, the problem due to the resonance is unlikely to occur.

The material, shape, and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 5 th embodiment ]

Embodiment 5 of the present invention will be described with reference to fig. 8. Fig. 8 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 3 and the like are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the conductor member 402 has a cross shape. The longitudinal direction of each conductor component 402 constituting the cross shape is arranged substantially at the center of the circuit board 201 so as to be parallel to the side of the circuit board 201. Further, 2 conductor components 402 may be combined in parallel with each side of the circuit board 201 to form a cross shape. Further, the conductor components 402 arranged parallel to the sides of the circuit board 201 may be configured by combining a plurality of conductor components in a vertical and horizontal direction. When a plurality of conductor parts are arranged in parallel, the intervals of the conductor parts 402 are arranged at substantially the same interval. The connection between the conductor member 402 and the circuit board at both ends is the same as that described in embodiment 1 or embodiment 3.

According to the present embodiment, the influence of noise can be effectively suppressed, regardless of noise entering from each side of the circuit board 201, that is, the connector 301 side, or noise due to resonance in a direction parallel to the side on which the connector 301 is mounted.

The material and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 6 th embodiment ]

Embodiment 6 of the present invention will be described with reference to fig. 9. Fig. 9 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 3 and the like are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the conductor member 402 has an X-shape. The longitudinal direction of each conductor component 402 constituting the X-shape is arranged substantially at the center of the circuit board 201 so as to be on the diagonal line of the circuit board 201. Further, 2 conductor components 402 may be combined to form an X shape so as to be positioned on a diagonal line of the circuit board 201. The connection between the conductor member 402 and the circuit board at both ends is the same as that described in embodiment 1 or embodiment 3.

By disposing the conductor component 402 obliquely, it is possible to cover various resonances including the longitudinal and lateral directions of the circuit board 201. Further, since circuit components and the like are not disposed at the four corners of the circuit board 201 in many cases as compared with the vicinity of the center, there is an advantage that the pads 206 connected to the conductor components 402 are easily disposed at the portions.

The material and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 7 th embodiment ]

Embodiment 7 of the present invention will be described with reference to fig. 10. Fig. 10 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 3 and the like are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the pads 206 for providing the conductor members 402 are circular, and a plurality of pads 206 are provided on the circuit board 201 at the periphery thereof. Since the pads 206 have a circular shape, the arrangement of the conductor component 402 can be selected as appropriate by selecting 2 arbitrary pads 206 on the circuit board 201 after the circuit board 201 is designed. In the example shown in fig. 10, the conductor component 402-1 is arranged so as to connect one side of the circuit board 201 on which the connector 301 is arranged to the other side of the circuit board 201 on which the connector 301 is not arranged. The conductor component 402-2 is disposed obliquely so as to straddle the opening formed in the connector 301 from the corner of the circuit board 201.

The pads 206 may have a fan shape, a polygonal shape, or the like, other than a circular shape, as long as they have a shape corresponding to a plurality of arrangement directions of the conductor parts 402.

The behavior of noise in the GHz band, in which resonance is likely to occur due to the size of the housing 103, is sometimes difficult to predict at the time of design. In addition, the noise resistance of the integrated circuit 203 is not known in advance at the time of design in many cases. In such a case, by changing the mounting manner of the conductor part 402 as appropriate after the design to change the noise resistance, it is possible to cope with the situation without correcting the circuit pattern of the circuit board 201.

The material and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 8 th embodiment ]

Embodiment 8 of the present invention will be described with reference to fig. 11 and 12. Fig. 11 is a sectional view of the electronic control device 100. Fig. 12 is a plan view of the circuit board 201 in the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 2 to 4 are denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, as shown in fig. 11, the conductor component 402 is in the shape of a partition standing on the circuit board 201 and is disposed on the circuit board 201. As shown in fig. 12, the entire lower surface of the conductor member 402 is connected to the pad 206 of the circuit board 201. The conductor component 402 is arranged to connect one side of the circuit board 201 on which the connector 301 is arranged to the other side of the circuit board 201 on which the connector 301 is not arranged. In the example shown in fig. 12, the conductor component 402 divides the region on the circuit board 201 where the integrated circuits 203-1 and 203-2 are arranged and the other region. As shown in fig. 11, a distance H1 between the upper surface of conductor part 402 and case upper part 101 is set shorter than a distance H2 between the upper surface of conductor part 402 and the upper surface of circuit board 201.

The conductor member 402 is made of a conductive material such as copper. The conductor component 402 may have a partition wall shape, and may have a shape dividing a region, such as a flat plate shape.

According to this embodiment, the region in which the high-frequency integrated circuit 203 is mounted and the region other than the region can be divided by the conductor component 402, and a region that is protected from electromagnetic noise in the housing 103 can be provided. Other effects are the same as those described in embodiment 1.

[ 9 th embodiment ]

Embodiment 9 of the present invention will be described with reference to fig. 13. Fig. 13 is a sectional view of the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 2 and the like are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 13, the conductor component 402 is connected to the circuit board 201 at both ends thereof, and the substantially central portion of the conductor component 402 is also connected to the circuit board 201 at the connection point 210. The connection to the circuit board 201 is connected to a ground or the like on the circuit board 201, as in embodiment 1. Although fig. 13 shows an example in which one portion of the substantially central portion of the conductor component 402 is connected to the circuit board 201, for example, when four sides of the circuit board 201 are long, a plurality of portions of the conductor component 402 may be connected to the circuit board 201 at substantially equal intervals. That is, the conductor component 402 is also connected to the circuit board 201 at an intermediate point other than both ends thereof.

According to the present embodiment, the conductor component 402 is fixed to the circuit board 201 at a plurality of positions, and thus the resistance to vibration and acceleration can be improved.

The material, shape, and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 10 th embodiment ]

A 10 th embodiment of the present invention will be described with reference to fig. 14. Fig. 14 is a sectional view of the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 2 and the like are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 14, a screw fixing hole is provided in a part of the circuit board 201, and the conductor component 402 is directly fixed to the case lower portion 102 via the circuit board 201 by a screw 209. Fig. 14 shows an example in which the case lower portion 102 is directly fixed by screws 209, but the case lower portion 102 may be provided with a protrusion, and the circuit board 201 and the conductor component 402 may be inserted into the protrusion to be fixed. That is, the conductor component 402 is directly fixed to the case 103 via the circuit board 201.

According to the present embodiment, the conductor component 402 is fixed to the housing 103 by screwing or the like, whereby the fixation can be further secured.

The material and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 11 th embodiment ]

Embodiment 11 of the present invention will be described with reference to fig. 15. Fig. 15 is a sectional view of the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 2 and the like are denoted by the same reference numerals, and description thereof is omitted.

As shown in fig. 15, the conductor component 402 is connected to the circuit board 201 at both ends thereof, and a substantially central portion of the conductor component 402 is fixed to the case upper portion 101 by a screw 211. Although fig. 15 shows an example in which one portion of the substantially central portion of the conductor component 402 is connected to the case upper portion 101, for example, when four sides of the circuit board 201 are long, a plurality of portions substantially equally divided by the conductor component 402 may be connected to the case upper portion 101. That is, the conductor part 402 is in contact with the housing 103 at its intermediate place.

In the present embodiment, the conductor member 402 is fixed to the housing upper part 101 by 1 or more screws in the middle thereof, and conduction is achieved. This produces a direct path between the housing upper part 101 and the conductor part 402, and therefore, an effect of further concentrating the path of noise is obtained. Further, by fixing the conductor member 402 midway, the resistance to vibration and acceleration is improved.

The material and the like of the conductor member 402 are the same as those described in embodiment 1. Other effects are the same as those described in embodiment 1.

[ 12 th embodiment ]

Referring to fig. 16, embodiment 12 of the present invention will be explained. Fig. 16 is a sectional view of the electronic control device 100. The same portions as those in embodiment 1 shown in fig. 2 and the like are denoted by the same reference numerals, and description thereof is omitted.

In this embodiment, the dielectric 106 is inserted between the conductor part 402 and the housing upper part 101. Since the effect of concentrating the noise electric field more strongly is obtained by inserting the dielectric body 106, the position restriction of the distance H3 between the conductor part 402 and the housing upper part 101 is eased. Specifically, assuming that the relative permittivity of the dielectric body 106 is ∈ r, ∈ r of the distance H3 between the conductor part 402 and the case upper part 101 is smaller than the distance H4 between the conductor part 402 and the circuit board 201. In other words, the distance H3 between the conductor part 402 and the case upper part 101 is shorter than the product of the distance H4 between the conductor part 402 and the circuit board 201 and the relative dielectric constant ∈ r of the dielectric body.

In embodiments 1 to 11, the dielectric member 106 may be inserted between the conductive member 402 and the case upper part 101.

Other effects of the present embodiment are the same as those described in embodiment 1.

According to the embodiment described above, the following operational effects are obtained.

(1) The electronic control device 100 includes: a conductive case 103; a circuit board 201 which is provided inside the housing 103 and on which electronic components including the integrated circuit 203 are mounted; and a conductive conductor part 402 having an elongated shape, which is provided on the circuit board 201 and is disposed at a position higher than the electronic component, wherein in the conductor part 402, the distance between the conductor part 402 and the case 103 is shorter than the distance between the conductor part 402 and the circuit board 201. Thus, the electronic component is excellent in heat dissipation, and the influence of noise entering and exiting from the case gap on the circuit board and unnecessary electromagnetic radiation can be suppressed at low cost.

(2) The electronic control device 100 includes: a conductive case 103; a circuit board 201 which is provided inside the housing 103 and on which electronic components including the integrated circuit 203 are mounted; an elongated conductive conductor component 402 provided on the circuit board 201 and disposed at a position higher than the electronic component; and a dielectric 106 interposed between the conductor part 402 and the case 103, wherein a distance from the conductor part 402 to the case 103 is shorter than a product of a distance from the conductor part 402 to the circuit board 201 and a relative dielectric constant of the dielectric 106. Thus, the electronic component is excellent in heat dissipation, and the influence of noise entering and exiting from the case gap on the circuit board and unnecessary electromagnetic radiation can be suppressed at low cost.

The present invention is not limited to the above-described embodiments, and other embodiments contemplated within the scope of the technical idea of the present invention are also included within the scope of the present invention as long as the features of the present invention are not impaired. Further, the above embodiment may be combined with a plurality of modifications.

The disclosures of the following priority base applications are incorporated by reference into this application:

japanese patent application 2019-82014 (application No. 4/23 in 2019).

Description of the symbols

100 … electronic control device

101 … Upper part of housing

102 … lower part of the shell

103 … casing

106 … dielectric body

201 … Circuit Board

203-1, 203-2 … integrated circuit

204 … signal line

205 … screw fixing hole

206 … pad

207 … via

208 … resistor

209 … screw

304 … connector cover

305 … connector pin

402 … conductor parts.