阅读说明：本技术 一种无磷无氮半导体封装清洗剂 (Phosphorus-free and nitrogen-free semiconductor packaging cleaning agent ) 是由 白映月 屈东方 于 2021-08-27 设计创作，主要内容包括：本发明涉及清洗剂技术领域,具体涉及一种无磷无氮半导体封装清洗剂,包括1-苯氧基-2-丙醇、无机皂化剂、无泡乳化剂、pH调节剂和去离子水,所述无机皂化剂与所述pH调节剂的质量比为3～7:4.5～10.5,所述1-苯氧基-2-丙醇、所述无机皂化剂和所述无泡乳化剂的质量比为20～65:3～7:20～35,所述去离子水的电导率小于5μs。1-苯氧基-2-丙醇、无机皂化剂、无泡乳化剂、pH调节剂协同作用,使得半导体封装清洗剂具有环境友好且清洗效率高的优点。(The invention relates to the technical field of cleaning agents, and particularly relates to a phosphorus-free and nitrogen-free semiconductor packaging cleaning agent which comprises 1-phenoxy-2-propanol, an inorganic saponifying agent, a non-foaming emulsifier, a pH regulator and deionized water, wherein the mass ratio of the inorganic saponifying agent to the pH regulator is 3-7: 4.5-10.5, the mass ratio of the 1-phenoxy-2-propanol, the inorganic saponifying agent to the non-foaming emulsifier is 20-65: 3-7: 20-35, and the conductivity of the deionized water is less than 5 microseconds. 1-phenoxy-2-propanol, an inorganic saponifier, a non-foaming emulsifier and a pH regulator have synergistic effect, so that the semiconductor packaging cleaning agent has the advantages of environmental friendliness and high cleaning efficiency.)

1. A phosphorus-free and nitrogen-free semiconductor packaging cleaning agent is characterized in that: the composite material comprises 1-phenoxy-2-propanol, an inorganic saponifying agent, a non-foaming emulsifier, a pH regulator and deionized water, wherein the mass ratio of the inorganic saponifying agent to the pH regulator is 3-7: 4.5-10.5, the mass ratio of the 1-phenoxy-2-propanol, the inorganic saponifying agent to the non-foaming emulsifier is 20-65: 3-7: 20-35, and the conductivity of the deionized water is less than 5 microseconds.

2. The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 1, which is characterized by comprising the following raw materials in percentage by weight:

3. the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 1 or 2, wherein: the inorganic saponifier is potassium hydroxide.

4. The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 3, wherein: the non-foaming emulsifier is allyl polyether.

5. The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 4, wherein: the pH regulator is lactic acid.

6. The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 5, which is characterized by comprising the following raw materials in percentage by weight:

7. the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent as claimed in claim 6, which is characterized by comprising the following raw materials in percentage by weight:

Technical Field

The invention relates to the technical field of cleaning agents, and particularly relates to a phosphorus-free and nitrogen-free semiconductor packaging cleaning agent.

Background

Semiconductors are used as the foundation and support for the development of modern electronic industry, and the applications and materials selected by the electronic industry are more and more extensive. However, as the demands for integration, high precision and high reliability of semiconductor products are continuously increased, the attention on the semiconductor package cleaning industry and the reliability of cleaning are also increased. Flux and solder paste are commonly used as soldering aids in the packaging of semiconductor devices, which may leave more or less residue during the soldering process. The residue and contaminant components are complex and risk corrosion of the device under the action of air oxidation and moisture, especially in high temperature and high humidity environments, resulting in reduced device safety. In order to ensure the quality and high reliability of the semiconductor device, a cleaning process and the use of a cleaning agent must be introduced in the packaging process.

In the semiconductor packaging cleaning agent in the prior art, the main cleaning material is always tetrahydrofurfuryl alcohol or ether alcohol solvent, wherein the tetrahydrofurfuryl alcohol can cause harm to the fertility of a human body; the cleaning power is improved by selecting amines, octanol phosphate and the like as auxiliary materials, and phosphorus and nitrogen containing auxiliary agents can pollute the environment.

Disclosure of Invention

The invention aims to provide a phosphorus-free and nitrogen-free semiconductor packaging cleaning agent aiming at the defects of the prior art, and the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent has the advantages of environmental friendliness and high cleaning efficiency.

In order to achieve the purpose, the invention adopts the following technical scheme:

the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises 1-phenoxy-2-propanol, an inorganic saponifying agent, a non-foaming emulsifier, a pH regulator and deionized water, wherein the mass ratio of the inorganic saponifying agent to the pH regulator is 3-7: 4.5-10.5, the mass ratio of the 1-phenoxy-2-propanol, the inorganic saponifying agent to the non-foaming emulsifier is 20-65: 3-7: 20-35, and the conductivity of the deionized water is less than 5 microseconds.

In the technical scheme, the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

in the technical scheme, the inorganic saponifier is potassium hydroxide.

In the technical scheme, the non-foaming emulsifier is allyl polyether which is acid-resistant and alkali-resistant and is not easy to separate out in an inorganic saponifier; contains double bonds, can improve the hydrophilicity of the 1-phenoxy-2-propanol, thereby improving the cleaning efficiency.

In the technical scheme, the pH regulator is lactic acid.

In the technical scheme, the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

in the technical scheme, the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

the invention has the beneficial effects that:

(1) the semiconductor packaging cleaning agent takes the 1-phenoxy-2-propanol as an alcohol solvent, and the 1-phenoxy-2-propanol has high flash point and boiling point, is not easy to volatilize, has low smell and meets the requirement of environmental protection; the inorganic saponifier does not contain N/P, not only meets the requirement of environmental protection, but also has strong decontamination capability; because the inorganic saponifier is alkaline, the pH of the cleaning agent is adjusted to be neutral by using the pH regulator, so that the cleaning agent can be prevented from corroding semiconductor materials, and the environmental pollution caused by using a nitrogenous corrosion inhibitor is avoided; the addition of the foamless emulsifier avoids the generation of foam in the use process of the cleaning agent, avoids the reduction of cleaning force caused by the foam, greatly improves the efficiency of the cleaning process and avoids the problem that foam is easily generated in the use process of other polyether emulsifiers and needs to be removed by adding a defoaming agent. 1-phenoxy-2-propanol, an inorganic saponifier, a non-foaming emulsifier and a pH regulator have synergistic effect, so that the semiconductor packaging cleaning agent has the advantages of environmental friendliness and high cleaning efficiency.

(2) The mass ratio of the inorganic saponifying agent to the pH regulator in the semiconductor packaging cleaning agent is 3-7: 4.5-10.5, so that the cleaning agent is neutral, and the corrosion to partial semiconductor materials is avoided, so that the application of the cleaning agent is limited; the mass ratio of the 1-phenoxy-2-propanol to the inorganic saponifier to the non-foaming emulsifier is 20-65: 3-7: 20-35, and the three components can be well compatible, so that the optimal cleaning effect and cleaning efficiency are achieved.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood, however, that the description herein of specific embodiments is only for the purpose of illustrating the invention and is not to be taken as a limitation on the invention.

The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises 1-phenoxy-2-propanol, an inorganic saponifying agent, a non-foaming emulsifier, a pH regulator and deionized water, wherein the mass ratio of the inorganic saponifying agent to the pH regulator is 3-7: 4.5-10.5, and the mass ratio of the 1-phenoxy-2-propanol, the inorganic saponifying agent and the non-foaming emulsifier is 20-65: 3-7: 20-35.

Further, the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

preferably, the inorganic saponifier is potassium hydroxide; the non-foaming emulsifier is allyl polyether which is acid-alkali resistant and is not easy to separate out in an inorganic saponifier; contains double bonds, can improve the hydrophilicity of the 1-phenoxy-2-propanol, thereby improving the cleaning efficiency; the pH regulator is lactic acid; the conductivity of the deionized water is less than 5 mus. .

Example 1

The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

example 2

The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

example 3

The phosphorus-free and nitrogen-free semiconductor packaging cleaning agent comprises the following raw materials in percentage by weight:

the preparation method of the phosphorus-free and nitrogen-free semiconductor packaging cleaning agent of the embodiment 1-3 comprises the steps of weighing the components according to the formula amount and uniformly mixing.

Metal compatibility testing

1. The same aluminum materials were respectively soaked in 25% strength cleaning agent of examples 1-3 at 65 ℃ for 60min, after the test, the surface gloss of the aluminum materials was unchanged, and the mass change rate was less than 0.005%. The compatibility of the cleaning agent of examples 1 to 3 with aluminum materials is illustrated.

2. The same silver-plated plates were immersed in the cleaning agents of examples 1 to 3 at a concentration of 25% at 65 ℃ for 60min, and after the test, the silver-plated plates treated in examples 1 to 3 had no significant change in appearance, and the cleaning agents of examples 1 to 3 had compatibility with silver oxide.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.