阅读说明：本技术 一种电致发光背光标识牌的制作方法及标识牌 (Manufacturing method of electroluminescent backlight signboard and signboard ) 是由 李坤 唐国初 于 2021-06-25 设计创作，主要内容包括：本发明涉及灯牌制备领域,尤其涉及一种电致发光背光标识牌的制作方法及标识牌。该方法包括：在离型膜层的上表面制备粘接层；在所述粘接层的上表面制作绝缘层,其中所述绝缘层完全覆盖所述粘接层；在所述绝缘层的上表面制备背电极层；在所述背电极层的上表面制备空穴传输层；在所述空穴传输层上表面制备发光层；在所述发光层的上表面制备透明导电层；在所述透明导电层的非导电面制备标识图案层。本发明能够达到在夜间进行识别,且不会存在只有打光是才能反射的应用场景的限制问题的效果。(The invention relates to the field of lamp plate preparation, in particular to a manufacturing method of an electroluminescent backlight signboard and the signboard. The method comprises the following steps: preparing an adhesive layer on the upper surface of the release film layer; manufacturing an insulating layer on the upper surface of the bonding layer, wherein the insulating layer completely covers the bonding layer; preparing a back electrode layer on the upper surface of the insulating layer; preparing a hole transport layer on the upper surface of the back electrode layer; preparing a light-emitting layer on the upper surface of the hole transport layer; preparing a transparent conductive layer on the upper surface of the luminous layer; and preparing a marking pattern layer on the non-conductive surface of the transparent conductive layer. The invention can realize the recognition at night, and has no limitation problem of application scenes which can only reflect when being polished.)

1. A method for manufacturing an electroluminescent backlight signboard is characterized by comprising the following steps:

preparing an adhesive layer on the upper surface of the release film layer;

manufacturing an insulating layer on the upper surface of the bonding layer, wherein the insulating layer completely covers the bonding layer;

preparing a back electrode layer on the upper surface of the insulating layer;

preparing a hole transport layer on the upper surface of the back electrode layer;

preparing a light-emitting layer on the upper surface of the hole transport layer;

preparing a transparent conductive layer on the upper surface of the luminous layer;

and preparing a marking pattern layer on the non-conductive surface of the transparent conductive layer.

2. The method of claim 1, wherein the release film layer comprises: PE is from type membrane, PET is from type membrane, APP is from type membrane or compound from type membrane.

3. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing the adhesive layer on the upper surface of the release film layer comprises:

and preparing an adhesive layer on the upper surface of the release film layer by an adhesive process.

4. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of manufacturing an insulating layer on the upper surface of the adhesive layer specifically comprises:

and manufacturing the insulating layer on the upper surface of the bonding layer by a comma coating process.

5. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing the back electrode layer on the upper surface of the insulating layer specifically comprises:

and preparing the back electrode layer on the upper surface of the insulating layer in a manner of coating the insulating glue which allows ultraviolet irradiation curing.

6. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing a hole transport layer on the upper surface of the back electrode layer specifically comprises:

and preparing the hole transport layer on the upper surface of the back electrode layer of the conductive silver paste by a coating process.

7. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing a light emitting layer on the upper surface of the hole transport layer specifically comprises:

and preparing a light-emitting layer on the upper surface of the hole transport layer by a coating process.

8. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing a transparent conductive layer on the upper surface of the light emitting layer specifically comprises:

and preparing a transparent conductive layer on the upper surface of the luminous layer through a coating process.

9. The method for manufacturing an electroluminescent backlight signboard of claim 1, wherein the step of preparing the identification pattern layer on the non-conductive surface of the transparent conductive layer specifically comprises:

and preparing a marking pattern layer on the non-conductive surface of the transparent conductive layer in a UV (ultraviolet) spray printing mode.

10. A signboard manufactured by a method of manufacturing an electroluminescent backlight signboard according to any one of claims 1 to 9.

Technical Field

The invention relates to the field of lamp plate preparation, in particular to a manufacturing method of an electroluminescent backlight signboard and the signboard.

Background

The traditional signboard generally has types such as ordinary luminous signboard, reverberation signboard, lamp house bill-board and fluorescence signboard, and to people's requirement promotion day by day to the signboard, traditional sign has been not enough to satisfy the demand, develops a novel luminous signboard and is more and more important.

The common non-luminous signboard cannot be identified at night. The reflective signboard has no luminous effect and only has a passive reflection when light passes, so that the application scene is limited. The lamp box billboard has an autonomous light-emitting effect, but is inconvenient to install and construct and very heavy, so that the application scene is greatly limited. The fluorescent signboard has self-luminescence, but the premise is that a large amount of light needs to be absorbed in the daytime, and the luminescence brightness is low.

Disclosure of Invention

The invention aims to solve the technical problem of providing a manufacturing method of an electroluminescent backlight signboard and the signboard.

The technical scheme for solving the technical problems is as follows: a method for manufacturing an electroluminescent backlight signboard comprises the following steps:

preparing an adhesive layer on the upper surface of the release film layer;

manufacturing an insulating layer on the upper surface of the bonding layer, wherein the insulating layer completely covers the bonding layer;

preparing a back electrode layer on the upper surface of the insulating layer;

preparing a hole transport layer on the upper surface of the back electrode layer;

preparing a light-emitting layer on the upper surface of the hole transport layer;

preparing a transparent conductive layer on the upper surface of the luminous layer;

and preparing a marking pattern layer on the non-conductive surface of the transparent conductive layer.

The invention has the beneficial effects that: the signboard prepared by the invention can be identified at night, and the limitation problem of application scenes that only polishing can reflect is avoided.

On the basis of the technical scheme, the invention can be further improved as follows.

Further, the release film layer includes: PE is from type membrane, PET is from type membrane, APP is from type membrane or compound from type membrane.

Further, the preparation of the adhesive layer on the upper surface of the release film layer specifically comprises the following steps:

and preparing an adhesive layer on the upper surface of the release film layer by an adhesive process.

Further, the manufacturing of the insulating layer on the upper surface of the bonding layer specifically includes:

and manufacturing the insulating layer on the upper surface of the bonding layer by a comma coating process.

Further, the preparation of the back electrode layer on the upper surface of the insulating layer specifically comprises:

and preparing the back electrode layer on the upper surface of the insulating layer in a manner of coating the insulating glue which allows ultraviolet irradiation curing.

Further, the step of preparing the hole transport layer on the upper surface of the back electrode layer specifically comprises:

and preparing the hole transport layer on the upper surface of the back electrode layer of the conductive silver paste by a coating process.

Further, the preparation of the light-emitting layer on the upper surface of the hole transport layer specifically comprises:

and preparing a light-emitting layer on the upper surface of the hole transport layer by a coating process.

Further, the preparation of the transparent conductive layer on the upper surface of the light emitting layer specifically comprises:

and preparing a transparent conductive layer on the upper surface of the luminous layer through a coating process.

Further, the step of preparing the identification pattern layer on the non-conductive surface of the transparent conductive layer specifically comprises:

and preparing a marking pattern layer on the non-conductive surface of the transparent conductive layer in a UV (ultraviolet) spray printing mode.

Another technical solution of the present invention for solving the above technical problems is as follows: a signboard is manufactured by the manufacturing method of any one of the electroluminescent backlight signboard.

The signboard manufactured by the invention can be identified at night, and the limitation problem of application scenes that only light is emitted can not exist.

Drawings

FIG. 1 is a schematic flow chart of a method for manufacturing an electroluminescent backlight signboard according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram provided in an embodiment of a method for manufacturing an electroluminescent backlight signboard of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. the light-emitting diode comprises a release film layer, 2, an adhesive layer, 3, an insulating layer, 4, an electrode layer, 5, a hole transport layer, 6, a light-emitting layer, 7, a transparent conductive layer, 8 and a pattern layer.

Detailed Description

The principles and features of this invention are described below in conjunction with examples which are set forth to illustrate, but are not to be construed to limit the scope of the invention.

As shown in fig. 1, a method for manufacturing an electroluminescent backlight signboard includes:

preparing an adhesive layer 2 on the upper surface of the release film layer 1;

manufacturing an insulating layer 3 on the upper surface of the bonding layer 2, wherein the insulating layer 3 completely covers the bonding layer 2;

preparing a back electrode layer 4 on the upper surface of the insulating layer 3;

preparing a hole transport layer 5 on the upper surface of the back electrode layer 4;

preparing a light-emitting layer 6 on the upper surface of the hole transport layer 5;

preparing a transparent conductive layer 7 on the upper surface of the luminous layer 6;

and preparing a mark pattern layer 8 on the non-conductive surface of the transparent conductive layer 7.

In some possible embodiments, the signboard prepared by the invention can be identified at night, and the limitation problem of the application scene that only polishing can be reflected does not exist.

It should be noted that, except for the pattern layer 8, other structures can be prepared by a coating process, and the specific preparation process can refer to example 1.

In the embodiment 1, a target identification pattern is printed on a non-conductive surface of a PET transparent conductive film in a UV spray painting mode;

coating a luminescent layer 6 coating, a hole transport layer 5 coating, a back electrode coating and an insulating layer 3 coating on the conductive surface of the PET conductive film in sequence by adopting coating equipment, and coating the next layer after each coating needs to be completely cured;

coating the adhesive layer 2 with non-setting adhesive water on the insulating layer 3;

sticking the release surface of the release film on the adhesive layer 2 in a sticking way to prepare the electroluminescent signboard;

lead out with the wire respectively through with transparent conducting layer 7 and back electrode layer 4, will tear from the type membrane during use and paste at the target plane, then the circular telegram can light the signboard, and this signboard is even the circuit and can light when needs are luminous, and is as good as with ordinary signboard when not lighting.

Preferably, in any of the above embodiments, the release film layer 1 includes: PE is from type membrane, PET is from type membrane, APP is from type membrane or compound from type membrane.

Preferably, in any of the above embodiments, the adhesive layer 2 prepared on the upper surface of the release film layer 1 is specifically:

and preparing an adhesive layer 2 on the upper surface of the release film layer 1 by an adhesive process.

The thickness of the release film layer 1 is 20 to 100 μm.

Preferably, in any of the above embodiments, the step of forming the insulating layer 3 on the upper surface of the adhesive layer 2 specifically includes:

and manufacturing the insulating layer 3 on the upper surface of the bonding layer by a comma coating process.

The thickness of the adhesive layer is 50 to 100 μm.

Preferably, in any of the above embodiments, the preparing of the back electrode layer 4 on the upper surface of the insulating layer 3 specifically includes:

the back electrode layer 4 is prepared on the upper surface of the insulating layer 3 by means of insulating paste coating which allows ultraviolet irradiation curing.

The insulating layer 3 has a thickness of 15 to 50 μm.

Preferably, in any of the above embodiments, the hole transport layer 5 is specifically prepared on the upper surface of the back electrode layer 4:

and preparing the hole transport layer 5 on the upper surface of the back electrode layer 4 of the conductive silver paste by a coating process.

The thickness of the back electrode layer 4 is 5 to 20 μm.

Preferably, in any of the above embodiments, the light-emitting layer 6 is specifically prepared on the upper surface of the hole transport layer 5:

a light emitting layer 6 is prepared on the upper surface of the hole transport layer 5 by a coating process.

The thickness of the hole transport layer 5 is 20 to 35 μm.

Preferably, in any of the above embodiments, the transparent conductive layer 7 is specifically prepared on the upper surface of the light emitting layer 6:

a transparent conductive layer 7 is prepared on the upper surface of the light emitting layer 6 by a coating process.

The thickness of the light-emitting layer 6 is 15 to 30 μm.

Preferably, in any of the above embodiments, the step of preparing the identification pattern layer 8 on the non-conductive surface of the transparent conductive layer 7 specifically includes:

and preparing a marking pattern layer 8 on the non-conductive surface of the transparent conductive layer 7 by means of UV (ultraviolet) spray painting and printing.

The transparent conductive layer 7 is a transparent conductive film including a PEC substrate, and the thickness of the transparent conductive layer 7 is 100-200 μm.

Another technical solution of the present invention for solving the above technical problems is as follows: a signboard is manufactured by the manufacturing method of any one of the electroluminescent backlight signboard.

In some possible embodiments, the signboard prepared by the invention can be identified at night, and the limitation problem of the application scene that only the lighting can be reflected does not exist.

In the above embodiments, although the steps 1, 2 and the like are numbered, but only the specific embodiments are given in the present application, and a person skilled in the art may adjust the execution sequence of the steps 1, 2 and the like according to actual situations, which is also within the protection scope of the present invention, and it is understood that some embodiments may include some or all of the above embodiments.

The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described method embodiments are merely illustrative, and for example, the division of steps into only one logical functional division may be implemented in practice in another way, for example, multiple steps may be combined or integrated into another step, or some features may be omitted, or not implemented.

The above method, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention essentially or partially contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.