阅读说明：本技术 用于电子设备热控制的系统和方法 (System and method for thermal control of electronic devices ) 是由 李平雨 S.詹亚武拉文卡塔 金荣德 于 2021-03-05 设计创作，主要内容包括：本发明提供了一种温度控制方法和系统。在一些实施例中,该方法包括感测电子设备的第一温度,确定第一温度超过第一阈值,并且增加供应给热连接到电子设备的热电冷却器的功率。功率的增加可以包括响应于确定第一温度超过第一阈值而增加功率。(The invention provides a temperature control method and system. In some embodiments, the method includes sensing a first temperature of the electronic device, determining that the first temperature exceeds a first threshold, and increasing power supplied to a thermoelectric cooler thermally connected to the electronic device. The increasing of the power may include increasing the power in response to determining that the first temperature exceeds the first threshold.)

1. A method for temperature control, the method comprising:

sensing a first temperature of an electronic device;

determining that the first temperature exceeds a first threshold; and

increasing power supplied to a thermoelectric cooler thermally connected to the electronic device,

wherein the increasing of the power comprises increasing the power in response to determining that the first temperature exceeds the first threshold.

2. The method of claim 1, wherein:

the power supplied to the thermoelectric cooler is the average power supplied to the thermoelectric cooler; and is

The increasing of the power includes modifying a duty cycle of a pulse width modulated drive current applied to the thermoelectric cooler.

3. The method of claim 1, further comprising sensing a second temperature of the electronic device.

4. The method of claim 3, further comprising:

determining that the second temperature is equal to or less than the first threshold;

determining that the second temperature is within an allowable temperature range; and

reducing power supplied to the thermoelectric cooler.

5. The method of claim 3, further comprising:

determining that the second temperature is equal to or less than the first threshold;

determining that the second temperature is outside of an allowable temperature range; and

reducing the power supplied to the thermoelectric cooler to a power level at most approximately equal to the first power level.

6. The method of claim 5, further comprising sensing a third temperature of the electronic device.

7. The method of claim 6, further comprising:

determining that the third temperature is within the allowable temperature range; and

a fourth temperature of the electronic device is sensed.

8. The method of claim 3, further comprising:

determining that the second temperature exceeds the first threshold;

determining:

the power supplied to the thermoelectric cooler is at the driving limit, or

The third temperature is less than a second threshold; and

limiting the rate of activity of the electronic device,

wherein the second threshold is based on a first humidity.

9. The method of claim 8, further comprising:

sensing a first said humidity; and

determining a dew point based on the first humidity,

wherein the second threshold is based on the dew point.

10. The method of claim 8, wherein the third temperature is the second temperature.

11. The method of claim 8, further comprising sensing the third temperature, wherein:

the sensing of the second temperature comprises sensing the second temperature with a first temperature sensor; and is

The sensing of the third temperature includes sensing the third temperature with a second temperature sensor different from the first temperature sensor.

12. The method of claim 1, wherein the electronic device is a central processing unit.

13. The method of claim 1, wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a controller of a solid state drive.

14. The method of claim 1, wherein the sensing of the first temperature of the electronic device comprises sensing a temperature of a memory component of a solid state drive.

15. A temperature control system, comprising:

a processing circuit;

a memory storing instructions; and

a first thermoelectric cooler for cooling the first heat-generating component,

wherein the instructions, when executed by the processing circuit, cause the processing circuit to:

causing a temperature sensor to sense a first temperature of a first solid state drive;

determining that the first temperature exceeds the first threshold; and

causing a first drive circuit to increase power supplied to the first thermoelectric cooler, the first thermoelectric cooler thermally connected to the first solid state drive.

16. The temperature control system of claim 15, further comprising a first rack comprising:

the first solid state drive; and

a second solid state drive, different from the first solid state drive,

wherein the instructions further cause the processing circuit to cause a second drive circuit to increase power supplied to a second thermoelectric cooler thermally connected to the second solid state drive.

17. The temperature control system of claim 16, further comprising a second rack, the second rack comprising:

a third solid-state drive, wherein the third solid-state drive,

wherein the instructions further cause the processing circuitry to cause the third drive circuitry to maintain power supplied to a third thermoelectric cooler thermally connected to the third solid state drive.

18. The temperature control system of claim 15, wherein the instructions further cause the processing circuitry to cause the temperature sensor to sense a second temperature of the first solid state drive.

19. The temperature control system of claim 18, wherein the instructions further cause the processing circuit to:

determining that the second temperature is equal to or less than the first threshold;

determining that the second temperature is within an allowable temperature range; and

causing the first drive circuit to reduce power supplied to the first thermoelectric cooler.

20. A temperature control system, comprising:

a processing device;

a memory storing instructions; and

a first thermoelectric cooler for cooling the first heat-generating component,

wherein the instructions, when executed by the processing device, cause the processing device to:

sensing a first temperature of a first solid state drive;

determining that the first temperature exceeds a first threshold; and

increasing power supplied to the first thermoelectric cooler, the first thermoelectric cooler thermally connected to the first solid state drive.

Technical Field

One or more aspects according to embodiments of the present disclosure relate to electronic devices, and more particularly, to systems and methods for thermal control of electronic devices.

Background

In operation, the heat dissipating electronic device may be cooled to avoid exceeding a maximum rated operating temperature and to avoid damage or unreliable operation that may result from operating at high temperatures. Some cooling methods may use air flow to cool the electronic equipment, and may require a large volume for ducts or channels to transport the cooling air, and heat exchangers, such as fin surfaces, to transfer heat to the cooling air.

Accordingly, there is a need for improved cooling systems and methods.

Disclosure of Invention

In some embodiments, the cooling system uses a thermoelectric cooler to extract heat from the electronic device at a greater rate than would be produced without auxiliary heat conduction. The thermoelectric cooler may conduct heat to a heat sink (e.g., a finned heat sink cooled by cooling air), and the thermoelectric cooler may operate at a higher temperature than the highest operating temperature of the electronic device (because of the heat pump operation of the thermoelectric cooler). As a result, the temperature change of the cooling air may be greater than without the thermoelectric cooler, and the cooling air may remove more heat per unit volume of cooling air than without the thermoelectric cooler. This allows for adequate cooling with smaller heat sinks and smaller cooling air passages than would be possible without the thermoelectric cooler.

The control system may monitor the temperature of one or more points in the system and adjust the power supplied to the thermoelectric coolers accordingly (e.g., increasing power at relatively high system temperatures and decreasing power at relatively low system temperatures). The control system may also monitor the ambient humidity and avoid increasing the power supplied to the thermoelectric cooler (i.e., limiting the activity rate of the electronic device) when the temperature at any point in the system approaches the dew point.

According to an embodiment of the present disclosure, there is provided a method for temperature control, the method including: sensing a first temperature of an electronic device; determining that the first temperature exceeds a first threshold; and increasing power supplied to a thermoelectric cooler thermally connected to the electronic device, wherein the increasing of power comprises increasing power in response to determining that the first temperature exceeds the first threshold.

In some embodiments: the power supplied to the thermoelectric cooler is the average power supplied to the thermoelectric cooler; and the increasing of the power includes modifying a duty cycle of a pulse width modulated drive current applied to the thermoelectric cooler.

In some embodiments, the method further comprises sensing a second temperature of the electronic device.

In some embodiments, the method further comprises: determining that the second temperature is equal to or less than a first threshold; determining that the second temperature is within an allowable temperature range; and reducing the power supplied to the thermoelectric cooler.

In some embodiments, the method further comprises: determining that the second temperature is equal to or less than a first threshold; determining that the second temperature is outside of an allowable temperature range; and reducing the power supplied to the thermoelectric cooler to a power level at a maximum approximately equal to the first power.

In some embodiments, the method further comprises sensing a third temperature of the electronic device.

In some embodiments, the method further comprises: determining that the third temperature is within an allowable temperature range; and sensing a fourth temperature of the electronic device.

In some embodiments, the method further comprises determining that the second temperature exceeds a first threshold; determining: the power supplied to the thermoelectric cooler is at a drive limit, or the third temperature is less than a second threshold; and limiting an activity rate of the electronic device, wherein the second threshold is based on the first humidity.

In some embodiments, the method further comprises: sensing a first humidity; and determining the dew point based on the first humidity, wherein the second threshold is based on the dew point.

In some embodiments, the third temperature is the second temperature.

In some embodiments, the method further comprises sensing a third temperature, wherein: sensing the second temperature comprises sensing the second temperature with a first temperature sensor; and sensing the third temperature includes sensing the third temperature with a second temperature sensor different from the first temperature sensor.

In some embodiments, the electronic device is a central processing unit.

In some embodiments, sensing a first temperature of the electronic device includes sensing a temperature of a controller of the solid state drive.

In some embodiments, sensing a first temperature of the electronic device includes sensing a temperature of a storage component of the solid state drive.

According to an embodiment of the present disclosure, there is provided a temperature control system including: a processing circuit; a memory to store instructions; and a first thermoelectric cooler, wherein the instructions, when executed by the processing circuitry, cause the processing circuitry to: causing a temperature sensor to sense a first temperature of a first solid state drive; determining that the first temperature exceeds a first threshold; and causing the first drive circuit to increase power supplied to a first thermoelectric cooler thermally connected to the first solid state drive.

In some embodiments, the temperature control system comprises a first rack (rack) comprising: a first solid state drive; and a second solid state drive different from the first solid state drive, wherein the instructions further cause the processing circuit to cause the second drive circuit to increase power supplied to a second thermoelectric cooler thermally connected to the second solid state drive.

In some embodiments, the temperature control system further comprises a second rack comprising: a third solid state drive, wherein the instructions further cause the processing circuit to cause the third drive circuit to maintain power supplied to a third thermoelectric cooler thermally connected to the third solid state drive.

In some embodiments, the instructions further cause the processing circuitry to cause the temperature sensor to sense a second temperature of the first solid state drive.

In some embodiments, the instructions further cause the processing circuitry to: determining that the second temperature is equal to or less than a first threshold; determining that the second temperature is within an allowable temperature range; and causing the first drive circuit to reduce power supplied to the first thermoelectric cooler.

According to an embodiment of the present disclosure, there is provided a temperature control system including: a processing device; a memory; and a first thermoelectric cooler, the memory storing instructions that, when executed by the processing device, cause the processing device to: sensing a first temperature of a first solid state drive; determining that the first temperature exceeds a first threshold; and increasing power supplied to a first thermoelectric cooler thermally connected to the first solid state drive.

Drawings

These and other features and advantages of the present disclosure will be understood and appreciated with reference to the specification, claims, and appended drawings, wherein:

FIG. 1A is a schematic perspective view of an electronic device and a thermoelectric cooler according to an embodiment of the present disclosure;

FIG. 1B is a schematic perspective view of a solid state drive and a thermoelectric cooler according to an embodiment of the present disclosure;

FIG. 2A is a temperature range decision diagram according to an embodiment of the present disclosure; and is

FIG. 2B is a flow diagram of a method for cooling an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a block diagram of a rack (rack) containing solid state drives according to an embodiment of the present disclosure; and is

FIG. 4 is a flow diagram of a method for cooling a plurality of solid state drives according to an embodiment of the present disclosure.

Detailed Description

The detailed description set forth below in connection with the appended drawings is intended as a description of exemplary embodiments of systems and methods for thermal control of electronic devices provided in accordance with the present disclosure and is not intended to represent the only forms in which the present disclosure may be constructed or utilized. This description sets forth features of the disclosure in connection with the illustrated embodiments. It is to be understood, however, that the same or equivalent functions and structures may be accomplished by different embodiments that are intended to be encompassed within the scope of the disclosure. As shown elsewhere herein, like element numbers are intended to indicate like elements or features.

In some embodiments, the cooling system uses a thermoelectric cooler to extract heat from the electronic device at a greater rate than would be produced without auxiliary heat conduction. The thermoelectric cooler may conduct heat to a heat sink (e.g., a finned heat sink cooled by cooling air) that may operate at a higher temperature than the highest operating temperature of the electronic device (because of the heat pump operation of the thermoelectric cooler). This allows for adequate cooling with smaller heat sinks and smaller cooling air passages than would be possible without the thermoelectric cooler.

The control system may monitor the temperature of one or more points in the system and adjust the power supplied to the thermoelectric coolers accordingly (e.g., increase power at relatively high system temperatures and decrease power at relatively low system temperatures). The control system may also monitor the ambient humidity and avoid increasing the power supplied to the thermoelectric cooler (i.e., limiting the activity rate of the electronic device) when the temperature at any point in the system approaches the dew point. For example, if the measured temperature exceeds the first threshold, the control system may (i) increase the power supplied to the thermoelectric cooler if the temperature throughout the system is well above the dew point and if the driver used to drive the thermoelectric cooler has sufficient backup drive capability, or (ii) throttle the electronics to reduce the rate at which they generate heat if the temperature is too close to the dew point or the driver used to drive the thermoelectric cooler lacks sufficient backup drive capability.

Some embodiments have various advantageous features, including improved processing or storage capacity within a fixed volume, improved heat dissipation, improved network efficiency, and energy reduction.

Referring to fig. 1A, in some embodiments, the electronic device 105 may be thermally connected to the thermoelectric cooler 110. As used herein, two components are "thermally coupled" means that heat can readily flow from one component to the other (e.g., due to the two components being in contact or secured together at mating surfaces (e.g., having a layer of thermal interface material between them to compensate for any imperfect flatness of the mating surfaces)). For example, the thermoelectric cooler may be implemented in a device that utilizes the peltier effect. In this case, the device transfers heat from one side to the other when a DC current flows through the device. In some embodiments, this operation may be used to pump heat out of the electronic device 105. The temperature of the electronic device 105 may be sensed with the first temperature sensor 115, and a suitable control signal may be calculated from the sensed temperature by a processing circuit (described in detail below) connected to the first temperature sensor 115 and configured to read the first temperature sensor 115 (e.g., via an analog-to-digital converter). In some embodiments, the first temperature sensor 115 is "on-chip," i.e., on the same chip as the processing circuitry.

The control signal may be fed to the thermoelectric cooler drive circuit 120; the thermoelectric cooler drive circuit 120 may then apply a drive current (e.g., a drive current proportional to the control signal) to the thermoelectric cooler 110. As shown in fig. 1A, the processing circuit may be the electronic device 105 or may be a part of the electronic device 105. As described below, the processing circuitry may include, but is not limited to, an FPGA, an ASIC, a special-purpose processor, and the like. The processing circuitry may also be connected to a water vapor pressure sensor, which may also be referred to herein as a humidity sensor 125. The humidity sensor 125 may be used to calculate the dew point, and the processing circuitry may ensure that no further cooling is performed when any sensed temperature in the system is close to the dew point (e.g., within a margin (which may be referred to as a "dew point margin") such as within 3 degrees celsius of the dew point) when generating the control signal. The system may include a second temperature sensor 130, and the second temperature sensor 130 may be located at a point in the system (e.g., directly on the cold side of the thermoelectric cooler 110) that may be the coldest point in the system in operation and may be at a lower temperature than the first temperature sensor 115 in operation. For simplicity, only two temperature sensors are shown in FIG. 1A. In some embodiments, there may be more temperature sensors distributed in any type of configuration (and the temperature sensors may be divided into a first group and a second group, etc.). Similarly, there may be more humidity sensors than shown, distributed in any type of configuration (and the humidity sensors may be divided into a first group and a second group, etc.).

The electronic device 105 may be (as discussed in further detail below) any electronic device that dissipates heat and is capable of being throttled. The electronic device 105 may be, for example, a central processing unit of a computer (e.g., a server), or a solid state drive, or a controller of a solid state drive. In the embodiment shown in fig. 1B, electronic device 105 is a solid state drive that includes a solid state drive controller 135 and a memory (e.g., flash memory) 140. The memory 140 may include a third temperature sensor 145. In such embodiments, in operation, the temperature of the memory 140 may be different than the temperature of the solid state drive controller 135. The maximum operating temperature of the memory 140 may also be different than the maximum operating temperature of the solid state drive controller 135. As such, in some embodiments, the processing circuitry may (as discussed in further detail below in the context of fig. 2) make a cooling decision based on the temperature sensed by the first temperature sensor 115, and in some embodiments, the processing circuitry may make a cooling decision based on the temperature sensed by the second temperature sensor 130 or the third temperature sensor 145.

Fig. 2A shows a temperature diagram with high temperatures above and low temperatures below. Also shown are (i) a first threshold 205 and a temperature range, referred to as an "allowable temperature range" 210, which may be an acceptable operating temperature range. The first threshold 205 may be within an allowable temperature range 210. As shown in fig. 2A, and as discussed in further detail below, when the sensed temperature is above the tolerance temperature range 210 and exceeds the first threshold 205, the system may increase the power supplied to the thermoelectric cooler 110 or limit the activity rate of the electronic device (i.e., "throttle" the electronic device) if the thermoelectric cooler drive circuit 120 is unable to deliver more power to the thermoelectric cooler 110, or if the temperature in the system is near the dew point. If the electronic device is a solid state drive, limiting the activity rate of the electronic device may require limiting the rate at which the solid state drive performs operations including, but not limited to, read, write, erase, and garbage collection operations. Limiting the activity rate of the electronic device may require transitioning the central processing unit to a low power consumption state if the electronic device is a central processing unit, in which the central processing unit may, for example, turn off one or more cores (if the central processing unit includes multiple cores), or in which the central processing unit performs operations at a reduced rate to reduce power consumption.

If the temperature is below the first threshold 205 and within the allowable temperature range 210, the system may reduce the power supplied to the thermoelectric cooler 110. If the temperature is below the lower limit of the allowable temperature range 210, the system may reduce the power to be equal to or less than the first power level (e.g., it may completely shut off the power to the thermoelectric cooler 110). The first power level may be a power level that is small enough not to cause any part of the system to reach the dew point with an acceptably small risk, or it may be zero.

FIG. 2B illustrates a flow diagram of a method for cooling a solid state drive in some embodiments. At 215, the solid state drive controller 135 causes the temperature sensor to sense the temperature (T) of the controller chip or the entire solid state drive. At 220, the solid state drive controller 135 tests whether the sensed temperature is within the allowable temperature range 210. If so, there is no change to the power supplied to the thermoelectric cooler 110 and the system returns to sensing the temperature at 215. Although fig. 2B is explained herein in the context of an embodiment in which the method is performed by the solid state drive controller 135, in some embodiments the method may be performed by any suitable processor (FGPA, ASIC, etc.) as well.

If the sensed temperature is not within the allowable temperature range 210, the solid state drive controller 135 tests 225 whether the temperature exceeds the first threshold 205(Th 1). If the temperature exceeds the first threshold 205, then at 230, the solid state drive controller 135 (as discussed in further detail below) tests whether a limit on the power supplied to the thermoelectric cooler 110 has been reached, and if not, at 235, the solid state drive controller 135 allows the solid state drive to operate without limiting the rate of activity of the solid state drive (e.g., when activated, stops solid state drive throttling), and at 240, the thermoelectric cooler drive circuit 120 is caused to increase the power (e.g., average power) supplied to the thermoelectric cooler 110, e.g., by (i) increasing the drive current applied to the thermoelectric cooler 110, or (ii) increase the drive voltage applied to the thermoelectric cooler 110, or (iii) increase the duty cycle of the pulse width modulated drive current or voltage applied to the thermoelectric cooler 110, or (iv) modify any waveform of the drive current or voltage.

For example, a limit on the power supplied to the thermoelectric cooler 110 may be reached (i) because the thermoelectric cooler drive circuit 120 has applied the maximum power it can provide to the thermoelectric cooler 110, or (ii) because the temperature in the system is below the dew point plus a dew point margin. The dew point may be calculated from the sensed humidity by the solid state drive controller 135 or equivalent processing circuitry using a function (e.g., polynomial or cubic spline) that approximates the functional form of the dew point as a function of the sensed humidity, or may be obtained from a look-up table listing the dew point as a function of the sensed humidity. The temperature compared to the dew point to determine that the power limit has been reached may be the same temperature (sensed by the first temperature sensor 115) as compared to the first threshold 205 and the tolerance temperature range 210, or it may be (as described above, and for the reasons described above) the temperature (e.g., a lower temperature) sensed by the second temperature sensor 130.

If, at 230, the solid state drive controller 135 determines that the limit on the power supplied to the thermoelectric cooler 110 has been reached, instead of further increasing the power supplied to the thermoelectric cooler 110, throttling of the solid state drive may be initiated at 245, i.e., the activity rate of the solid state drive may be limited, as described above.

If, at 225, the solid state drive controller 135 determines that the sensed temperature does not exceed the first threshold 205, then, at 250, it is tested whether the sensed temperature is within the allowable temperature range 210. If so, then at 255, the thermoelectric cooler driver circuit 120 is caused to reduce the power supplied to the thermoelectric cooler 110. If the sensed temperature is not within the allowable temperature range 210 (e.g., if below the lower limit of the allowable temperature range 210), the solid state drive controller 135 may reduce the power to equal to or less than the first power level at 260 (e.g., may cause the thermoelectric cooler drive circuit 120 to completely shut off the power supplied to the thermoelectric cooler 110).

After any adjustments to the power supplied to the thermoelectric cooler 110 or the activity rate of the solid state drive, the system waits at 265 or 270 for a time interval selected to be approximately equal to the thermal reaction time of the system (e.g., the delay between when the power supplied to the thermoelectric cooler 110 changes and when a majority (e.g., 65%) of the final temperature change occurs at the first temperature sensor 15). The system then senses the temperature again at 275 or 215, and the process repeats.

If the electronic device is another electronic device that dissipates heat and can be throttled, the methods shown in fig. 2A and 2B may be performed in a similar manner, i.e., operating at a reduced activity rate and dissipating the reduced heat when operating at the reduced activity rate. In embodiments where separate temperature control requirements apply to different components of the system (e.g., in a solid state drive with a first set of requirements for solid state drive controller 135 and a second set of requirements for memory (e.g., flash memory) 140), a respective first threshold 205 and tolerance temperature range 210 may be defined for each of the components. The test result at 220 may then be considered a logical and of the results for each of the two sensed temperatures (e.g., if each of the two components is evaluated as yes, the result may be yes or Y), and the test result at 225 may be considered a logical or of the results for each of the two sensed temperatures. In some embodiments, the above process may be performed using a machine learning module (host side, device side, etc.) that may monitor data representative of the historical performance of the device and throttle accordingly. Such a machine learning module may be based on any suitable machine learning model, or multiple models, including but not limited to artificial neural networks, decision trees, support vector machines, regression analysis, bayesian networks, and genetic algorithms. The temperature control system of the present disclosure can save a large amount of power and prevent water damage at dew point by using the above temperature control method.

Referring to fig. 3, in some embodiments, a plurality of racks 301, 302 (two of which are shown) may be at locations in a facility (e.g., at a server farm); each rack 301, 302 may house a plurality of solid state drives 311, 312, 313, 314. Each of the solid state drives may implement temperature control as described above, or in some embodiments, the shared controller 320 may manage, for example, all or a group of solid state drives, or all or a group of solid state drives in one of the racks 301, 302. In some embodiments, shared controller 320 may be part of one device, an independent controller, a host side, or the like. And it may comprise any suitable circuitry (e.g., processor, FGPA, ASIC, etc.). Further, the shared controller may communicate with the electronic devices via a protocol (such as ethernet or any other suitable protocol compatible with the electronic devices). For example, the electronic device may include an ethernet enabled solid state disk that may receive commands from a controller to send or receive temperature or humidity data and power adjustment commands. The shared controller 320 may collect the sensed temperatures from all solid state drives it manages and send commands to each of these solid state drives instructing each drive as to the power to be supplied to the thermoelectric cooler 110 and as to whether to limit the activity rate of the solid state drives. In some embodiments, the shared controller 320 may have an overall view of the system as a whole and throttle power at the device, server, rack, or cluster level in a data center having these solid state disk devices. Further, the machine learning module may continually monitor and improve power routing based on historical performance to achieve optimal power efficiency and minimize heat loss. Such a machine learning module may be based on any suitable machine learning model, or multiple models, including but not limited to artificial neural networks, decision trees, support vector machines, regression analysis, bayesian networks, and genetic algorithms.

In embodiments that include multiple racks 301, 302, and each of the racks can house multiple solid state drives, it may be the case that heat is transferred to some extent between solid state drives in a chassis (but not between solid state drives in different chassis), and as shown in fig. 4, the shared controller 320 may, for example in response to sensing the temperature (T) of the first solid state drive 311(SSD1) at 405, and determines that the temperature exceeds the first threshold 205 at 410 (Th1), and at 415 and at 420, causes the thermoelectric cooler drive circuit 120 to increase the power (cooling power 1 and cooling power 2) supplied to the thermoelectric coolers 110 in the first and second solid state drives 311, 312 in the same rack 301, but does not change (i.e., maintain) the power supplied to thermoelectric coolers 110 in third solid state drives 313 in another bay 302 (cooling power 3) at 425. Further, in some embodiments, the shared controller 320 may command the occurrence of throttling in multiple drives that are close to each other (e.g., in the same rack, or in the upper or lower half of a rack) when any or several thermoelectric cooler drive circuits 120 in the multiple drives run out of spare drive capacity. This approach may be advantageous when significant thermal sharing occurs between drives, in which case throttling a single drive may have less of an impact on its temperature than if it were a separate drive isolated from other heat sources.

Any component or any combination of components described (e.g., in any system diagram included herein) can be used to perform one or more of the operations of any flow diagram included herein. Further, (i) the operations are example operations and may include various additional steps not explicitly contemplated, and (ii) the temporal order of the operations may vary.

In some embodiments, the methods described herein are performed by a processing circuit that can read the sensor (e.g., by one or more analog-to-digital converters connected to the processing circuit) and send a control signal (e.g., to the thermoelectric cooler driver circuit 120) (by one or more digital-to-analog converters connected to the processing circuit). For example, the solid state drive controller 135 may be a processing circuit. The term "processing circuitry" as used herein refers to any combination of hardware, firmware, and software for processing data or digital signals. The processing circuit hardware may include, for example, Application Specific Integrated Circuits (ASICs), general or special purpose Central Processing Units (CPUs), Digital Signal Processors (DSPs), Graphics Processing Units (GPUs), and programmable logic devices such as Field Programmable Gate Arrays (FPGAs). As used herein, in a processing circuit, each function is performed either by hardware (i.e., hardwired to perform the function) or by more general purpose hardware, such as a CPU, configured to execute instructions stored in a non-transitory storage medium. The processing circuitry may be fabricated on a single Printed Circuit Board (PCB) or distributed across several interconnected printed circuit boards. The processing circuitry may include other processing circuitry; for example, the processing circuitry may comprise two processing circuits, an FPGA and a CPU, interconnected on a PCB.

As used herein, when a first quantity (e.g., a first variable) is referred to as being "based on" a second quantity (e.g., a second variable), it is meant that the second quantity affects the first quantity, e.g., the second quantity may be an input (e.g., a unique input, or one of several inputs) to a function that computes the first quantity, or the first quantity may be equal to the second quantity, or the first quantity may be the same as the second quantity (e.g., stored in the same location in memory).

As used herein, the term "or" should be interpreted as "and/or" such that, for example, "a or B" refers to "a" or "B" or any of "a and B. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed herein could be termed a second element, component, region, layer or section without departing from the spirit and scope of the present inventive concept.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive concepts. As used herein, the terms "substantially," "about," and similar terms are used as approximate terms, rather than degree terms, and are intended to account for inherent deviations in measurements or calculations that would be recognized by one of ordinary skill in the art. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. An expression (such as "at least one") modifies the entire list of elements when preceding the list of elements, without modifying individual elements in the list. Furthermore, when describing embodiments of the inventive concept, the use of "may" refer to "one or more embodiments of the present disclosure. Moreover, the term "exemplary" is intended to indicate either an example or an illustration. As used herein, the term "using" may be considered synonymous with the term "utilizing".

It will be understood that when an element or layer is referred to as being "on," "connected to," "coupled to" or "adjacent to" another element or layer, it can be directly on, connected to, coupled to or adjacent to the other element or layer or one or more intervening elements or layers may be present. In contrast, when an element or layer is referred to as being "directly on," "directly connected to," "directly coupled to" or "directly adjacent to" another element or layer, there are no intervening elements or layers present.

Any numerical range recited herein is intended to include all sub-ranges subsumed within that range with the same numerical precision. For example, a range of "1.0 to 10.0" or "between 1.0 and 10.0" is intended to include all sub-ranges between (and including) the recited minimum value of 1.0 and the recited maximum value of 10.0, i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as, for example, 2.4 to 7.6. Any maximum numerical limitation recited herein is intended to include all lower numerical limitations subsumed therein, while any minimum numerical limitation recited in this specification is intended to include all higher numerical limitations subsumed therein.

Although exemplary embodiments of systems and methods for thermal control of electronic devices have been specifically described and illustrated herein, many modifications and variations will be apparent to those skilled in the art. Thus, it should be understood that systems and methods for thermal control of electronic devices constructed in accordance with the principles of the present disclosure may be practiced otherwise than as specifically described herein. The invention is also defined in the appended claims and equivalents thereof.