阅读说明：本技术 高频感应加热头及使用其的高频感应加热装置 (High-frequency induction heating head and high-frequency induction heating device using same ) 是由 臼田武史 熊田泉实 高柳毅 于 2021-05-27 设计创作，主要内容包括：本发明公开了高频感应加热头及使用其的高频感应加热装置,目的在于抑制构成高频感应加热头的芯体的损伤等。本发明的高频感应加热头具备：具有成为加热部的磁隙(27)的芯体(4)、向该芯体(4)供给磁通的线圈(5)、以及对该线圈(5)进行冷却的冷却单元,设置保护板(30、31),该保护板(30、31)以能够导热的方式覆盖所述芯体(4)的除了磁隙(27)部分以外的外表面的至少一部分,该保护板(30、31)由相对磁导率低于所述芯体(4)且电阻值低于所述芯体(4)的金属材料构成。(The invention discloses a high-frequency induction heating head and a high-frequency induction heating device using the same, aiming at inhibiting damage of a core body of the high-frequency induction heating head. The high-frequency induction heating head of the present invention comprises: a core (4) having a magnetic gap (27) serving as a heating portion, a coil (5) for supplying a magnetic flux to the core (4), and a cooling unit for cooling the coil (5) are provided with protective plates (30, 31), the protective plates (30, 31) covering at least a part of the outer surface of the core (4) except for the magnetic gap (27) portion in a heat conductive manner, the protective plates (30, 31) being made of a metal material having a lower relative magnetic permeability than the core (4) and a lower resistance value than the core (4).)

1. A high-frequency induction heating head is characterized by comprising:

a core body having a magnetic gap serving as a heating portion;

a coil that supplies magnetic flux to the core; and

a cooling unit that cools the coil,

the high-frequency induction heating head has a protective plate covering at least a part of an outer surface of the core body except for a magnetic gap portion in a thermally conductive manner,

the protective plate is a metal material having a relative magnetic permeability lower than that of the core body and a resistance value lower than that of the core body.

2. The high-frequency induction heating head according to claim 1,

the core is a plate-shaped body having a depth direction smaller than a right-left outer diameter dimension when viewed from the front, and the protective plate is disposed on one or both of a front surface and a back surface of the plate-shaped body.

3. The high-frequency induction heating head according to claim 2,

the core is configured to be annular when viewed from the front, and a gap forming the magnetic gap is formed in a part of the annular shape.

4. The high-frequency induction heating head according to claim 3,

in the core, one end sides of a first C-shaped sub-core and a second inverted C-shaped sub-core are overlapped, and a magnetic gap formed by a gap is formed between the other end side of the first sub-core and the other end side of the second sub-core.

5. The high-frequency induction heating head according to claim 4,

the high-frequency induction heating head is configured such that a first through-hole penetrating the first sub-core and the second sub-core is provided in an overlapping portion of the first sub-core and the second sub-core on one end side, and a through-shaft is allowed to penetrate the first through-hole, and the size of a magnetic gap formed by a gap formed on the other end side of the first sub-core and the second sub-core can be changed using the through-shaft as a switching shaft.

6. The high-frequency induction heating head according to claim 5,

the protective plate provided on one or both of the front surface and the back surface of the pair of first sub-cores and second sub-cores is configured by a first sub-protective plate and a second sub-protective plate provided so as to correspond to the first sub-core and the second sub-core, respectively.

7. The high-frequency induction heating head according to claim 4,

the outer shape of the sub-core body is set to be the same as that of the sub-protection plate.

8. The high-frequency induction heating head according to claim 1,

the core is formed of a ferrite material, and the protection plate is formed of a copper material or an aluminum material.

9. The high-frequency induction heating head according to claim 1,

a thermally conductive grease is present between the core and the protective plate.

10. The high-frequency induction heating head according to claim 9,

the heat-conductive grease is silicone grease.

11. The high-frequency induction heating head according to claim 1,

the cooling unit is configured to form the coil into a tubular shape, to flow cooling water in the tubular shape, and to thermally bond a part of the tubular coil to the protective plate via the heat conductive member.

12. The high-frequency induction heating head according to claim 11,

the through shaft is held by the heat conductive member, and the surface of the protective plate opposite to the core is brought into contact with the heat conductive member.

13. The high-frequency induction heating head according to claim 1,

and the high-frequency induction heating head is provided with an air supply unit for air cooling the core body and the protection plate.

14. A high-frequency induction heating apparatus is characterized by comprising:

the high-frequency induction heating head according to any one of claims 1 to 13; and

and a holding means for holding the object to be heated disposed in the magnetic gap portion of the high-frequency induction heating head.

Technical Field

The present invention relates to a high-frequency induction heating head and a high-frequency induction heating apparatus using the same.

Background

A high-frequency induction heating head is used as a heating head for soldering an electronic component to a pad portion of a circuit substrate, for example, as in patent document 1.

The high-frequency induction heating head includes a core having a magnetic gap serving as a heating portion, a coil for supplying a magnetic flux to the core, and a cooling unit for cooling the coil.

That is, in the case of soldering a terminal portion of an electronic component to a pad portion of a circuit substrate, first, the terminal portion of the electronic component is mounted to the pad portion of the circuit substrate, and then, a wire is supplied to the soldering portion of the pad portion and the terminal portion.

The welding portion is disposed in a magnetic gap of the core, and the welding portion and the welding wire are induction-heated by magnetic flux generated in the magnetic gap.

In addition, since a large current flows in the coil, the coil is formed in a tubular shape, and cooling water flows inside the coil.

In addition, it is also proposed to cool not only the coil but also the core by the cooling water.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2014-120649

Disclosure of Invention

Technical problem to be solved by the invention

In the above-described prior art, the core is formed of a ferrite material or the like.

That is, since ferrite materials have high magnetic permeability and high electric resistance, eddy current loss in a high frequency region is small, and they are often used as a constituent of a core of a high frequency induction heating head.

However, the core formed by sintering the ferrite material is very fragile and easily damaged against falling or impact due to collision with other objects, like ceramics.

For example, in the soldering process, when the circuit board is moved toward the high-frequency induction heating head by the XY table or the like, if another electronic component already mounted on the circuit board collides with the core, the core is damaged, and as a result, the core may need to be replaced, which may result in a decrease in productivity.

Therefore, an object of the present invention is to suppress damage and the like of the core.

Means for solving the problems

The high-frequency induction heating head according to the present invention is characterized by comprising: a core body having a magnetic gap serving as a heating portion; a coil that supplies magnetic flux to the core; and a cooling unit that cools the coil, the high-frequency induction heating head having a protective plate that covers at least a part of an outer surface of the core body except for a magnetic gap portion in a heat conductive manner, the protective plate being a metal material having a lower relative magnetic permeability and a lower resistance value than the core body.

Here, the protective plate is a member for protecting the core, and as will be described later in detail, improves the heating efficiency of the magnetic gap.

Furthermore, by covering in a manner that enables heat conduction, the cooling function is improved.

The present invention is not limited to the configuration and shape within the scope of the above object.

In the present invention, the core may be a plate-like body having a depth direction thickness dimension smaller than an outer diameter dimension between right and left outer shapes when viewed from the front, and the protective plate may be disposed on one or both of a front surface and a back surface of the plate-like body.

Here, the front view of the core body means a state viewed from one surface in a direction in which the gap forming the magnetic gap is seen through, and in this state, the front side is a front surface and the opposite side is a back surface.

The outer diameter of the core is defined as the dimension between the left and right outer shapes of the core.

In the present invention, in the core, one end sides of the first C-shaped sub-core and the second inverted C-shaped sub-core may overlap each other, and a magnetic gap formed by a gap may be formed between the other end side of the first sub-core and the other end side of the second sub-core.

Further, a first through hole penetrating the first sub-core and the second sub-core may be provided in a superposed portion of the first sub-core and the second sub-core on one end side, and a through shaft may be passed through the first through hole and may be used as a switching shaft to change a size of a magnetic gap formed by a gap formed on the other end side of the first sub-core and the second sub-core.

In the present invention, the protective plate may be configured by a first sub-protective plate and a second sub-protective plate, the protective plate may be provided on one or both of the front surface and the back surface of the pair of first sub-cores and the second sub-cores, and the first sub-protective plate and the second sub-protective plate may be provided so as to correspond to the first sub-cores and the second sub-cores, respectively.

The outer shape of the sub core may be substantially the same as the outer shape of the sub protective plate.

Here, the outer shape is substantially the same, which means that the shape and the size are substantially the same.

In addition, the core may be formed of a ferrite material, and the protective plate may be formed of a copper material or an aluminum material.

The heat conductive grease may be present between the core and the protective plate.

Here, the thermally conductive grease is preferably a silicone grease.

The cooling unit may be configured such that the coil is tubular, cooling water is caused to flow through the tube, and a part of the tubular coil is thermally coupled to the protective plate via the heat conductive member.

Further, the through shaft may be held by the heat conductive member, and the surface of the protective plate opposite to the core may be brought into contact with the heat conductive member.

In the present invention, an air blowing unit for air-cooling the core and the protective plate may be provided.

The high-frequency induction heating apparatus of the present invention is characterized by comprising: the high-frequency induction heating head; and a holding means for holding the object to be heated disposed in the magnetic gap portion of the high-frequency induction heating head.

Examples of the object to be heated include a welded portion and a member in which a specific portion is desired to be locally heated.

In this case, a temperature sensor may be combined to control the temperature of the heating portion.

Effects of the invention

As described above, the high-frequency induction heating head according to the present invention includes the core having the magnetic gap serving as the heating portion, the coil supplying the magnetic flux to the core, and the cooling unit cooling the coil, and is provided with the protective plate covering at least a part of the outer surface of the core except for the magnetic gap portion in a heat conductive manner, the protective plate being made of a metal material having a lower relative magnetic permeability and a lower resistance value than the core.

Therefore, the protection plate can protect other objects from directly hitting the core, and as a result, damage to the core can be suppressed.

Further, since the protective plate is made of a metal material having a lower relative permeability and a lower resistance than the core, leakage of magnetic flux to the outside of the magnetic gap portion can be reduced, and as a result, heating efficiency at the magnetic gap portion can be improved, and other nearby structures can not be unintentionally heated.

That is, the magnetic flux flows concentratedly in the magnetic gap portion inside the core, but a part thereof leaks outside the core.

In the high-frequency induction heating head, a large current flows, and therefore, even if a leakage flux leaks, a nearby structure can be sufficiently heated to increase the temperature.

In contrast, in the present invention, since the magnetic flux leaking from the core passes through the protective plate having a lower relative permeability than the core and the protective plate is made of a metal material having a lower resistance than the core, eddy currents flow due to the passage of the magnetic flux, and a magnetic flux in a direction opposite to the direction of the magnetic flux passing through the protective plate is generated by the eddy currents, and as a result, the magnetic flux leaking from the core via the protective plate is reduced, and thus other structures in the vicinity are not unintentionally heated.

Drawings

Fig. 1 is a perspective view of a high-frequency induction heating apparatus using a high-frequency induction heating head according to an embodiment of the present invention.

Fig. 2 is a front view of the high-frequency induction heating apparatus.

Fig. 3 is a side view of the high-frequency induction heating apparatus.

Fig. 4 is a side view of the high-frequency induction heating apparatus.

Fig. 5 is a perspective view of the high-frequency induction heating apparatus with a part removed.

Fig. 6 is an exploded perspective view of the high-frequency induction heating apparatus.

Fig. 7 is an exploded perspective view of the high-frequency induction heating apparatus.

Fig. 8 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 9 is an enlarged exploded perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 10 is an enlarged exploded perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 11 is a front view of a high-frequency induction heating apparatus using a high-frequency induction heating head according to another embodiment of the present invention.

Fig. 12 is a side view of the high-frequency induction heating apparatus.

Fig. 13 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 14 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 15 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 16 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 17 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 18 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 19 is an enlarged perspective view of a high-frequency induction heating head portion of the high-frequency induction heating apparatus.

Fig. 20 is a control block diagram of the high-frequency induction heating apparatus.

Fig. 21 is a flowchart for explaining the operation of the high-frequency induction heating apparatus.

Description of the reference numerals

1: a high-frequency induction heating head; 2: a main body case; 2 a: an upper surface; 2 b: a lower surface; 2 c: an outer peripheral surface; 2A: the IH output is connected with a connector; 3: the cooling water is connected with a connector; 4: a core body; 5: a coil; 6: a capacitor; 7: an electrical water circuit connector; 8: an electrical water circuit connector; 9: a waterway coupling part; 10: an abutment portion; 11: a waterway coupling part; 12: a waterway coupling part; 13: a screw; 14: a screw; 15: a rubber gasket; 16: a screw; 17: a coil base; 18: a coil base; 19: a waterway coupling part; 20: a waterway coupling part; 21: an insulating plate; 22: a screw; 23: a terminal portion; 24: a terminal portion; 25: a sub-core body; 26: a sub-core body; 27: a magnetic gap; 28: a through hole; 29: a screw; 30: a protection plate; 31: a protection plate; 32: a sub-protection plate; 33: a sub-protection plate; 34: a through hole; 35: a sub-protection plate; 36: a sub-protection plate; 37: a through hole; 38: a heat conductive member; 39: screw holes; 40: a bending section; 41: screw holes; 42: a bending section; 43: a through hole; 44: an installation part; 45: a through hole; 46: a screw; 47: a screw; 48: screw holes; 49: a wire feeding device; 50: a radiation thermometer; 51: a radiation thermometer; 52: a circuit substrate; 53: a pad; 54: a terminal; 55: a control unit; 56: a timer; 57: a memory; 58: a power supply unit; 59: a holding unit.

Detailed Description

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(embodiment mode 1)

In fig. 1 to 4, a high-frequency induction heating head 1 of the present embodiment includes a box-shaped main body case 2.

Six surfaces in total, i.e., an upper surface 2A, a lower surface 2b, and four outer peripheral surfaces 2c of the main body case 2 are formed of resin, and an IH output connection connector 2A and two cooling water connection connectors 3 are provided on the upper surface 2A of the main body case 2.

Further, a core 4 and a coil 5 for supplying a magnetic flux to the core 4 are disposed below the main body case 2.

As shown in fig. 5 to 7, a capacitor 6 is disposed inside the main body case 2, and electric/water path connecting bodies 7 and 8 are provided on both sides of the capacitor 6, respectively, from the capacitor 6 side toward the outside.

These electric water passage connectors 7 and 8 are each formed of a copper material, and can be electrically connected to an article in contact therewith.

First, the electric water passage connection body 8 is formed in a building shape as a whole, a water passage (not shown) extending in the vertical direction is formed inside the electric water passage connection body, and the cooling water connection connector 3 is coupled to the upper surface of the electric water passage connection body 8 at the upper end of the water passage.

As shown in fig. 7, the lower end of the water channel in the electric water channel connector 8 is located below the electric water channel connector 8 and serves as a water channel connection portion 9 on the capacitor 6 side.

Next, the electric water passage connection body 7 is formed in a plate shape as a whole, and a water passage (not shown) extending downward from the lateral direction toward the electric water passage connection body 8 is formed in the base part 10 at the lower part.

In the water channel of the electric water channel connector 7, an end portion on the electric water channel connector 8 side serves as a water channel coupling portion 11 as shown in fig. 6.

In the water channel of the electric water channel connector 7, an end portion of the water channel toward the lower end side is a water channel coupling portion 12 as shown in fig. 7.

In the above-described configuration, both of the left and right electric water path connecting bodies 7 and 8 are screwed to the fixing portion of the capacitor 6 by using the metal screws 13 and 14 shown in fig. 6 and 7, and as shown in fig. 5, the electric water path connecting bodies 7 and 8 are integrated with each other on both sides of the capacitor 6.

In addition, by this integrating operation, the left and right electric water path connecting bodies 7 and 8 form continuous water paths to the cooling water connection connector 3, the water path in the electric water path connecting body 8, the water path coupling portion 9 thereof, the water path coupling portion 11 of the electric water path connecting body 7, the water path of the electric water path connecting body 7, and the water path coupling portion 12, respectively.

The capacitor 6 and the electrical water connection bodies 7 and 8 are integrated in the main body case 2 and held on the lower surface 2b as shown in fig. 5, and the cooling water connection connector 3 is drawn out to the through hole a of the upper surface 2a of the main body case 2.

Further, the lower surfaces of the base portions 10 of the two electric water path connecting bodies 7 are positioned in the through-hole B portion of the lower surface 2B of the main body casing 2, and thus the water path connecting portion 12 of the lower surface of the base portion 10 is in a state of facing the outside of the main body casing 2 through the through-hole B.

The core 4 and the coil 5 are coupled to the lower surfaces of the two base portions 10 by screws 16 shown in fig. 6 and 7 as shown in fig. 5.

Specifically, first, the coil 5 is formed in a U shape by a copper pipe having a water passage formed therein, and one end side and the other end side thereof are coupled to the front and rear coil bases 17 and 18 made of copper material, respectively.

The front and rear coil bases 17 and 18 are formed with horizontal flanges 17a and 18a on the upper sides thereof, through holes through which screws 16 are inserted are formed in the flanges 17a and 18a, the screws 16 are inserted through the through holes of the flanges 17a and 18a from below, and the screws 16 are screwed into screw holes in the lower surface of the base portion 10 of the electric water connecting body 7, whereby the front and rear coil bases 17 and 18 are coupled to the base portion 10 of the electric water connecting body 7.

Further, water passages (not shown) are formed in the coil bases 17 and 18, respectively, so as to face in the vertical direction, a water passage coupling portion (not shown) on one end side of the coil 5 is connected to a lower end of the water passage of the coil base 17, and a water passage coupling portion (not shown) on the other end side of the coil 5 is connected to a lower end of the water passage of the coil base 18.

Further, a water passage coupling portion 19 is formed at a flange 17a at the upper end of the water passage of the coil base 17 as shown in fig. 6, and a water passage coupling portion 20 is formed at a flange 18a at the upper end of the water passage of the coil base 18 as shown in fig. 6.

Therefore, when the coil bases 17 and 18 are fixed to the lower surfaces of the two base portions 10 by the metal screws 16 shown in fig. 6 and 7, the water passage connection portions 19 and 20 of the coil bases 17 and 18 are connected to the water passage connection portions 12 on the lower surfaces of the two base portions 10 via the rubber packing 15, respectively.

A rubber packing 15 shown in fig. 7, for example, is interposed between the water passage coupling portions 9 and 11 to prevent water leakage.

By adopting the above configuration, for example, when cooling water of 25 ℃ is introduced from one cooling water connection connector 3, the cooling water flows into the water channel in one electric water channel connection body 8, the water channel connection portion 9, the water channel connection portion 11 of one electric water channel connection body 7, the water channel in one electric water channel connection body 7, the water channel connection portion 12, the water channel connection portion 19 of the coil base 17, the water channel connection portion on one end side of the coil 5, the water channel connection portion on the other end side of the coil 5, the water channel of the coil base 18, the water channel connection portion 20 of the coil base 18, the water channel connection portion 12 of the other electric water channel connection body 7, the water channel in the other electric water channel connection body 8, and the other cooling water connection connector 3, and is then cooled in the cooling portion of the main body housing 2, and is circulated again to the one cooling water connection connector 3.

Since the coil bases 17 and 18 are stacked on each other with the insulating plate 21 made of resin interposed therebetween and the screw 22 for coupling the coil bases and 18 is made of resin and is insulating, short-circuit electrical conduction between the coil bases 17 and 18 does not occur.

One terminal of the IH output connection connector 2A shown in fig. 5 is connected to the terminal portion 23 of one of the electric water circuit connection bodies 8 by a wire (not shown in order to avoid complication of the drawing), and the other terminal of the IH output connection connector 2A is connected to the terminal portion 24 of the other of the electric water circuit connection bodies 8 by a wire (not shown in order to avoid complication of the drawing).

The capacitor 6 and the electric water circuit connection bodies 7 and 8 are also electrically connected by the integration of the metal screws 13 and 14.

The capacitor 6, the electric water circuit connection bodies 7 and 8, the coil bases 17 and 18, and the coil 5 are also electrically connected.

That is, when power is supplied from IH output connection connector 2A, resonance is generated between capacitor 6 and coil 5, and this resonance current is supplied to coil 5, resulting in a state in which magnetic flux is generated.

Next, the core 4 heated by the magnetic flux will be described.

As shown in fig. 8 to 10, the core 4 is configured such that one end sides (upper end sides) of the C-shaped first sub-core 25 and the inverted C-shaped second sub-core 26 overlap each other, and a magnetic gap 27 formed by a gap is formed between the other end sides (lower end sides) of the sub-cores 25 and 26.

That is, the core 4 is configured to be annular in a front view by overlapping one end sides (upper end sides) of the C-shaped sub-core 25 and the inverted C-shaped sub-core 26, and a gap forming the magnetic gap 27 is formed in a part of the ring.

Then, the coil 5 linearly penetrates the inner space of the annular core 4, and thereby the magnetic flux generated in the coil 5 flows through the core 4 and the magnetic gap 27.

Further, a through hole 28 penetrating the sub-cores 25 and 26 is provided in an overlapping portion at one end side of the sub-cores 25 and 26, a screw 29 is passed through the through hole 28 as a through shaft, and the size of the magnetic gap 27 can be changed with the screw 29 as a switching shaft.

The core 4 is formed in a plate shape having a thickness dimension in the depth direction smaller than an outer diameter dimension in a front view, and protective plates 30 and 31 are disposed on the front surface and the back surface of the plate-shaped core 4, respectively.

In the protective plate 30, the first sub-protective plate 32 having a C shape and the second sub-protective plate 33 having an inverted C shape are overlapped on one end side (upper side), and a through hole 34 penetrating the sub-protective plates 32 and 33 is provided in the overlapped portion of the sub-protective plates 32 and 33, and the screw 29 penetrates the through hole 34 as the penetrating shaft.

In the protective plate 31, the first sub-protective plate 35 having a C shape and the second sub-protective plate 36 having an inverted C shape are overlapped on each other at one end side (upper side), a through hole 37 penetrating the sub-protective plates 35, 36 is provided at the overlapped portion of the sub-protective plates 35, 36, and the screw 29 penetrates the through hole 37 as the penetrating shaft.

That is, the screw 29 is used as a through shaft, and penetrates through the through hole 34 of the sub-protection plates 32 and 33, then penetrates through the through hole 28 of the sub-cores 25 and 26, and thereafter penetrates through the through hole 37 of the sub-protection plates 35 and 36, and is screwed into the screw hole 39 of the U-shaped heat conduction member 38.

With this configuration, both the front surface and the back surface of the core 4 can conduct heat, and are covered with the protective plates 30 and 31.

Further, bent portions 40 are formed rearward on the upper portions of the sub protection plates 32, 33 so as to cover the upper surfaces of the sub cores 25, 26, and screw holes 41 are formed therein.

Further, a forward bent portion 42 is formed at the upper portions of the sub-protection plates 35 and 36 so as to cover a rearward bent portion at the upper portions of the sub-protection plates 32 and 33, and a through hole 43 is formed at this position.

Further, an outward attachment portion 44 is provided on the upper portions of the sub-protection plates 35 and 36, and a through hole 45 is provided therein.

The through-hole 43 is a long hole extending in the front-rear direction, and the through-hole 45 is a long hole extending in the outer circumferential direction.

In such a configuration, the protective plate 31, the core 4, and the protective plate 30 are stacked and held and fixed to the heat conductive member 38, but in this method, for example, the protective plate 31, the core 4, and the protective plate 30 are stacked first, and a rod-shaped jig (not shown) is inserted through the through hole 34, the through hole 28, and the through hole 37 to perform axis alignment.

Next, the screw 46 is screwed to the screw hole 41 of the protective plate 30 from above the protective plate 31 through the through hole 43, whereby the core 4 is sandwiched between the protective plates 30 and 31 from the front and the rear.

Then, the rod-shaped jig is pulled out from the temporarily unitized core body 4 and the protection plates 30 and 31, and then, the screw 29 is inserted through the through hole 34, the through hole 28, and the through hole 37 of the protection plate 31, the core body 4, and the protection plate 30, and the screw 29 is screwed into the screw hole 39 of the heat-conducting member 38, which is disposed in the holding portion 38a of the heat-conducting member 38 of fig. 9.

The screw 47 is inserted through the through hole 45 of the protective plate 31 and screwed into the screw hole 48 of the heat-conducting member 38.

In this state, the size of the magnetic gap 27 is adjusted, and finally the screws 29, 47 are strongly fastened, whereby the protection plate 31, the core 4, and the protection plate 30 are completely held and fixed to the heat conductive member 38.

With the above configuration, the surface of the protection plate 31 opposite to the core 4 comes into contact with the heat-conducting member 38, and the heat conduction between the heat-conducting member 38 and the protection plate 31 is facilitated.

That is, when the coil base 18 is cooled by the cooling water for cooling the coil 5, the low temperature thereof is used for cooling the core 4 made of the ferrite material via the heat conductive member 38 made of the copper material and the protective plate 31 made of the copper material, and in the present embodiment, the temperature of the core 4 can be suppressed to about 100 ℃ even when the operation is performed for 24 hours continuously.

The high-frequency induction heating head of the present embodiment is a heating head in which the terminal portion of the electronic component is soldered to the land of the circuit board in the magnetic gap 27 portion, and thus the soldering operation can be continuously performed for 24 hours, and the productivity can be dramatically improved.

In such a high-frequency induction heating head, as is well known, a land of a circuit board, a terminal portion of an electronic component, solder, and the like become objects to be heated, and in high-frequency induction heating using the high-frequency induction heating head, a holding means for holding the circuit board and the solder needs to be provided.

In the present embodiment, the protective plates 30 and 31 are made of a metal material having a lower relative magnetic permeability than the core 4 and a lower electrical resistance than the core 4.

Specifically, the core 4 is formed of a ferrite material, and the protection plates 30, 31 are formed of a copper material or an aluminum material.

Since the relative permeability of the ferrite material constituting the core 4 is 50 to 5000, and the relative permeability is substantially 1 when the protection plates 30 and 31 are made of a copper material or an aluminum material, the magnetic flux flowing through the core 4 flows only in the core 4, and the leakage to the protection plates 30 and 31 is small.

However, in the present embodiment, since a large current of about 100A flows through coil 5, even if the leakage magnetic flux is sufficiently smaller than the magnetic flux flowing through magnetic gap 27, the structure near core 4 may be sufficiently heated to increase the temperature.

In contrast, in the present embodiment, since the magnetic flux leaking from the core 4 passes through the protection plates 30 and 31 having a lower relative permeability than the core 4, and the protection plates 30 and 31 are made of a metal material having a lower resistance value than the core 4, an eddy current flows due to the passage of the magnetic flux, and a magnetic flux in a direction opposite to the direction of the magnetic flux passing through the protection plates 30 and 31 is generated by the eddy current, as a result, the magnetic flux leaking from the core 4 through the protection plates 30 and 31 is reduced, and thus other structures in the vicinity are not unintentionally heated.

According to the experiment, the unintended heating at the position 4mm away from the magnetic gap 27 can be reduced by 20%, and the unintended heating at the position 8mm away can be reduced by 40%.

Thus, the article which is not originally heated is not unintentionally heated by the magnetic flux from the core 4, and is not deteriorated.

In addition, in the vicinity of the magnetic gap 27, the article which is not originally intended to be heated is not unintentionally heated by the magnetic flux, so that the degree of freedom of the heating operation is improved, and the productivity is also improved.

Further, the reduction of the leakage magnetic flux also increases the magnetic flux of the magnetic gap 27, and the heating efficiency can be improved.

When the protective plates 30 and 31 are formed of a copper material, the resistance value is 1.68 × 10^-8Ω m, and the resistance value is 2.83 × 10 when the protective plates 30 and 31 are formed of an aluminum material^-8Ω m is extremely small in resistance value compared with the case where the ferrite material is substantially insulating.

Further, since the outer shape of the core 4 is substantially the same as the outer shape of the protective plates 30 and 31 and the front and rear surfaces of the core 4 are covered with the protective plates 30 and 31, other objects can be protected by the protective plates 30 and 31 from directly colliding with the core 4, and as a result, damage to the core 4 can be suppressed.

That is, since the core 4 is made of ferrite, the core 4 is easily damaged by the collision of another article or the falling of the core 4 itself, but if the outer shape of the core 4 and the outer shapes of the protection plates 30 and 31 are made substantially the same, if the front and back surfaces of the core 4 are covered with the protection plates 30 and 31, the other article can be protected from the direct collision with the core 4 by the protection plates 30 and 31, and as a result, the damage of the core 4 can be suppressed.

Further, since the heat conduction of the protective plate 31 is 403W/m.k when it is formed of a copper material and 236W/m.k when it is formed of an aluminum material, and the heat conductivity is good, when the coil 5 is cooled by cooling water, the core 4 can be sufficiently cooled through the protective plate 31, but when a heat conductive grease such as silicone grease is interposed between the core 4 and the protective plate 31, the cooling effect can be further improved.

In the above embodiment, the example in which the core 5 is water-cooled is shown, but the core 5 may be air-cooled.

For example, air for cooling may be sent to the heat-conducting member 38 and the protective plates 30 and 31.

For this purpose, heat radiating fins may be provided on the heat-conducting member 38 and the protective plates 30 and 31.

(embodiment mode 2)

Fig. 11 to 21 are views showing other embodiments of the present invention.

In this embodiment, the contents described with reference to fig. 1 to 10 are used as they are, and a temperature detection function is added.

In the present embodiment, the description of the contents described in fig. 1 to 10 is simplified in order to avoid complication of the description, but in order to accurately understand the (embodiment 2), it is necessary to understand all the descriptions and use the description of the (embodiment 1) and fig. 1 to 10.

Note that, in fig. 11 to 21, in order to avoid complication of the drawings, reference numerals of all the components described in fig. 1 to 10 are not given, and fig. 11 to 21 are basically the same as fig. 1 to 10.

The embodiments of fig. 11 to 21 are characterized in that a wire feeder 49 is provided as an example of a feeder of solder, and radiation thermometers 50 and 51 are provided as examples of temperature measuring means.

The circuit board 52 is transported as shown in fig. 15 to 19 by an XY Θ table (not shown) serving as an example of a transport unit.

In the land 53 portion of the circuit board 52, the terminals 54 of the electronic component mounted on the back surface of the circuit board 52 protrude from the back surface side toward the front surface side.

The terminal 54 is moved to between the magnetic gaps 27, and in this state, the terminal 54 is soldered to the land 53 portion.

In this state, the radiation thermometer 50 measures the temperature of the upper end portion of the terminal 54, and the radiation thermometer 51 measures the temperatures of the pad 53 portion and the lower portion of the terminal 54.

As shown in fig. 20, the radiation thermometers 50 and 51 are connected to a control unit 55.

The controller 55 is also connected to a timer 56, a memory 57 (including a program of fig. 21, etc.), and a power supply unit 58, and the coil 5 and the capacitor 6 are connected to the power supply unit 58.

As shown in fig. 15, the wire feeder 49 is held by the heat conductive member 38 via the holding member 59, and the wire is appropriately fed from the wire feeder 49 to the magnetic gap 27.

The radiation thermometers 50 and 51 are held by the main body case 2 by another holding means, but the holding means is not shown in order to avoid complication of the drawing.

In the above configuration, when the circuit board 52 is transported by the XY Θ table (not shown), and the terminal 54 is disposed in the magnetic gap 27 portion as shown in fig. 18, the supply of power to the coil 5 is started as the preheating (S1 in fig. 21), and the temperature measurement by the radiation thermometers 50 and 51 is also started (S2 in fig. 21).

In this preheating, heating is performed at 120A, 70W, for example.

As shown in fig. 17 to 19, the radiation thermometer 50 measures the temperature of the upper end portion of the terminal 54.

As shown in fig. 17 to 19, the radiation thermometer 51 measures the temperature of the pad 53 and the lower portion of the terminal 54.

First, it is determined whether or not the measured temperature (the temperature of the upper end portion of the terminal 54) measured by the radiation thermometer 50 exceeds the solder melting temperature (e.g., 300 ℃) (S3 of fig. 21).

If the temperature of the upper end portion of the terminal 54 does not exceed 300 ℃, it is then determined whether the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 exceeds an overheat threshold temperature (e.g., 350 ℃) (S4 of fig. 21).

If the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 does not exceed the overheat threshold temperature (e.g., 350 ℃), the process returns (S3 of fig. 21) to continue the preheating.

When the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 exceeds the overheat threshold temperature (for example, 350 ℃), the supply of the power to the coil 5 is stopped (S5 of fig. 21).

In addition, in (S3 of fig. 21), when the temperature of the upper end portion of the terminal 54 exceeds 300 ℃, it is next determined whether the measured temperature (the temperature of the upper end portion of the terminal 54) measured by the radiation thermometer 50 exceeds the overheat threshold temperature (e.g., 350 ℃) (S6 of fig. 21).

In (S6 of fig. 21), when the temperature of the upper end portion of the terminal 54 exceeds the overheat threshold temperature (for example, 350 ℃), the supply of power to the coil 5 is stopped (S7 of fig. 21).

If the temperature of the upper end portion of the terminal 54 does not exceed the overheat threshold temperature (for example, 350 ℃) in (S6 of fig. 21), it is next determined whether or not the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 exceeds the solder melting temperature (for example, 300 ℃) (S8 of fig. 21).

If the measured temperature (the temperature of the pad 53 portion and the lower portion of the terminal 54) measured by the radiation thermometer 51 does not exceed the solder melting temperature (for example, 300 ℃) in (S8 of fig. 21), the process returns (S3 of fig. 21) and the preheating is continued.

Further, in (S8 of fig. 21), when the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 exceeds the solder melting temperature (for example, 300 ℃), it is next determined whether or not the measured temperature (the solder temperature of the pad 53 portion, the lower portion of the terminal 54, the portion when solder is supplied) measured by the radiation thermometer 51 exceeds the overheat threshold temperature (for example, 350 ℃) (S9 of fig. 21).

In (S9 of fig. 21), when the measured temperature (the temperature of the pad 53 portion, the lower portion of the terminal 54) measured by the radiation thermometer 51 exceeds the overheat threshold temperature (e.g., 350 ℃), the supply of power to the coil 5 is stopped (S10 of fig. 21).

Further, in (S9 of fig. 21), when the measured temperature (the temperature of the pad 53 portion and the lower portion of the terminal 54) measured by the radiation thermometer 51 does not exceed the overheat threshold temperature (for example, 350 ℃), the wire feeding by the wire feeding device 49 is started, and the output to the coil 5 is changed to 90A and 50W as the main heating (S11 of fig. 21).

Next, it is determined whether or not the measured temperature (the temperature of the upper end portion of the terminal 54) measured by the radiation thermometer 50 exceeds an overheat threshold temperature (for example, 350 ℃) (S12 of fig. 21).

In (S12 of fig. 21), when the measured temperature (the temperature of the upper end portion of the terminal 54) measured by the radiation thermometer 50 exceeds the overheat threshold temperature (for example, 350 ℃), the supply of the power to the coil 5 is stopped (S13 of fig. 21).

If the measured temperature (the temperature of the upper end portion of the terminal 54) measured by the radiation thermometer 50 does not exceed the overheat threshold temperature (for example, 350 ℃) in (S12 of fig. 21), the main heating is continued until the timer time (for example, 2 seconds) of the timer 56 is exceeded (S14 of fig. 21).

In addition, when the timer time (e.g., 2 seconds) is exceeded (S14 in fig. 21), the power supply to the coil 5 is stopped (S15 in fig. 21).

As described above, in this embodiment, the temperature of the upper end portion of the terminal 54 is measured by the radiation thermometer 50, and the temperatures of the pad 53 portion and the lower portion of the terminal 54 are measured by the radiation thermometer 51, so that appropriate soldering by appropriate heating can be performed.

In addition, the circuit board 52 is not damaged even in the case of excessive heating.

Industrial applicability of the invention

The high-frequency induction heating head according to the present invention and the high-frequency induction heating apparatus using the same can heat a specific portion in a non-contact manner, and therefore can be used in a welding apparatus and the like.

In addition to welding, the present invention can be applied to many fields as long as the object to be heated can be held in the magnetic gap portion.