阅读说明：本技术 基板自动捆包装置 (Automatic packaging device for substrates ) 是由 王卫 房旭 周丽媛 董卫军 李�权 于 2021-09-10 设计创作，主要内容包括：本发明提供了一种基板自动捆包装置包括底板、设置在所述底板上的直线导轨、滑配在所述直线导轨上的载板、设置在所述底板上与所述载板相连的无杆气缸、设置在所述载板上包含数个工位的萃盘定位块、设置在所述底板正上方的盖板,所述底板和所述盖板之间设置有连接两者的导向组件,所述底板上设置有驱动所述盖板上下运动的气动滑台,所述盖板初始位置时盖板位于载板的左侧上方,所述盖板工作状态时载板位于所述盖板正下方；所述盖板上设置有缓冲器；所述盖板上设置有实现基板盖侧的固定与捆包的卡扣。此装置放置于作业台上,对磁铁基板的盖侧、台侧进行合并,用半自动的捆包方式取代人工的作业方式。(The invention provides an automatic packaging device for a substrate, which comprises a bottom plate, a linear guide rail arranged on the bottom plate, a carrier plate arranged on the linear guide rail in a sliding manner, a rodless cylinder arranged on the bottom plate and connected with the carrier plate, a tray-extracting positioning block arranged on the carrier plate and comprising a plurality of stations, and a cover plate arranged right above the bottom plate, wherein a guide assembly for connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate; the cover plate is provided with a buffer; the cover plate is provided with a buckle for fixing and packing the substrate cover side. The device is placed on a working table, combines the cover side and the table side of the magnet substrate, and replaces a manual working mode with a semi-automatic packing mode.)

1. An automatic substrate packaging device, characterized in that: the automatic substrate packing device comprises a bottom plate, a linear guide rail arranged on the bottom plate, a support plate arranged on the linear guide rail in a sliding mode, a rodless cylinder arranged on the bottom plate and connected with the support plate, a tray extracting positioning block arranged on the support plate and comprising a plurality of stations, and a cover plate arranged right above the bottom plate, wherein a guide assembly for connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate; the cover plate is provided with a buffer; the cover plate is provided with a buckle for fixing and packing the substrate cover side.

2. The apparatus according to claim 1, wherein: the novel bearing plate is characterized in that a shaft sleeve is arranged on the carrier plate, a guide pin is arranged on the cover plate, and the guide pin is located in the shaft sleeve when the cover plate is in a working state.

3. The apparatus according to claim 1, wherein: the guide assembly comprises a guide shaft with a vertical central axis and a linear bearing arranged on the guide shaft.

4. The apparatus according to claim 1, wherein: the buckle is installed on the optical axis, the optical axis passes through the optical axis fixed block and installs on the apron.

5. The apparatus according to claim 4, wherein: and the optical axis is provided with a torsion spring for hooking and loosening the base plate by an adjusting buckle.

6. The apparatus according to claim 5, wherein: and the optical axis is provided with a limit pin for limiting the rotation angle of the buckle.

7. The apparatus according to claim 1, wherein: and a buffer fixing block for fixing the buffer is arranged on the cover plate.

8. The apparatus according to claim 1, wherein: a support plate limiting block is arranged on the bottom plate, and the support plate abuts against the support plate limiting block after moving leftwards to a limit position.

Technical Field

The present invention relates to an automatic substrate packaging apparatus, and more particularly, to an automatic substrate packaging apparatus with high work efficiency.

Background

An automatic substrate packaging apparatus is currently operated manually. Current situation-manual work (magnet substrate cover): the cover is laterally placed on the table side through manual cover closing, when two objects approach, the magnet generates large attraction force, so that the placement is difficult, the impact is very easy to cause, and the lens is scattered (all the scattered lenses are NG). Because the proficiency of the operators is different, the hands directly contact the substrate, and no dustproof measures are adopted, the dirt, the rubbish and the injury of the lens are easily caused; the cover placing mode of manual operation is that one substrate is placed at a time, the time consumption is 16s/pcs, and the efficiency is low.

Disclosure of Invention

The invention aims to solve the technical problem of the prior art and provides an automatic packaging device for substrates, which has the following specific scheme:

the invention relates to an automatic packaging device for substrates, which is characterized in that: the automatic substrate packing device comprises a bottom plate, a linear guide rail arranged on the bottom plate, a support plate arranged on the linear guide rail in a sliding mode, a rodless cylinder arranged on the bottom plate and connected with the support plate, a tray extracting positioning block arranged on the support plate and comprising a plurality of stations, and a cover plate arranged right above the bottom plate, wherein a guide assembly for connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate; the cover plate is provided with a buffer; the cover plate is provided with a buckle for fixing and packing the substrate cover side.

The technical problem to be solved by the invention can be further solved by the following technical scheme that a shaft sleeve is arranged on the carrier plate, a guide pin is arranged on the cover plate, and the guide pin is positioned in the shaft sleeve when the cover plate is in a working state.

The technical problem to be solved by the invention can be further solved by the following technical scheme that the guide assembly comprises a guide shaft with a vertical central axis and a linear bearing arranged on the guide shaft.

The technical problem to be solved by the invention can be further solved by the following technical scheme that the buckle is installed on the optical axis, and the optical axis is installed on the cover plate through the optical axis fixing block.

The technical problem to be solved by the invention can be further realized by the following technical scheme that a torsion spring for hooking and releasing the substrate by an adjusting buckle is arranged on the optical axis.

The technical problem to be solved by the invention can be further realized by the following technical scheme that a limit pin for limiting the rotation angle of the buckle is arranged on the optical axis.

The technical problem to be solved by the present invention can be further solved by the following technical solution, wherein a buffer fixing block for fixing the buffer is disposed on the cover plate.

The technical problem to be solved by the invention can be further realized by the following technical scheme that a support plate limiting block is arranged on the bottom plate, and the support plate abuts against the support plate limiting block after moving leftwards to a limit position.

Compared with the prior art, the invention has the beneficial effects that: the device is placed on a working table, combines the cover side and the table side of the magnet substrate, and replaces a manual working mode with a semi-automatic packing mode.

Improved post-semi-automatic operation (magnet substrate capping): the improved matching of the buckle, the cover plate and the buffer ensures that the substrate is fixed, and the attraction generated by the magnet cannot cause influence; the device ensures that the manual work does not contact the substrate when the packaging is carried out, and can effectively reduce the generation of stains and garbage; when the device is used, 8 substrates are placed simultaneously, the time consumption is 7s/pcs, the packing efficiency is greatly improved, and the manual operation time is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of an automatic substrate packaging apparatus according to the present invention.

Fig. 2 is a schematic view of an automatic substrate packaging apparatus according to the present invention.

Fig. 3 is a schematic structural view of a first process in an automatic substrate binding apparatus according to the present invention.

Fig. 4 is a schematic structural view of a second process in the automatic substrate binding apparatus according to the present invention.

Fig. 5 is a schematic structural view of a third process in the automatic substrate binding apparatus according to the present invention.

Fig. 6 is a schematic structural view of a fourth process in the automatic substrate binding apparatus according to the present invention.

Fig. 7 is a schematic structural view of a fifth process in the automatic substrate binding apparatus according to the present invention.

Fig. 8 is a schematic structural view of a sixth process in the automatic substrate binding apparatus according to the present invention.

In the figure: 1-a bottom plate; 2-a linear guide rail; 3-a carrier plate; 4-an extraction disc positioning block; 5-shaft sleeve; 6-cover plate; 7-a buffer; 8-a buffer fixing block; 9-a pneumatic sliding table; 10-a guide shaft; 11-linear bearings; 12-a spacing pin; 13-optical axis; 14-optical axis fixing block; 15-buckling; 16-torsion spring; 17-a guide pin; 18-a carrier plate stopper; 19-rodless cylinder.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The automatic packaging device for the base plate comprises a bottom plate 1, a linear guide rail 2 arranged on the bottom plate, a support plate 3 matched on the linear guide rail in a sliding manner, a rodless cylinder 19 arranged on the bottom plate and connected with the support plate, a tray-extracting positioning block 4 arranged on the support plate and comprising a plurality of stations, and a cover plate 6 arranged right above the bottom plate, wherein a guide assembly for connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate; the cover plate is provided with a buffer 7; the cover plate is provided with a clip 15 for fixing and packaging the substrate cover side. The device is placed on a working table, combines the cover side and the table side of the magnet substrate, and replaces a manual working mode with a semi-automatic packing mode. Improved post-semi-automatic operation (magnet substrate capping): the improved matching of the buckle, the cover plate and the buffer ensures that the substrate is fixed, and the attraction generated by the magnet cannot cause influence; the device ensures that the manual work does not contact the substrate when the packaging is carried out, and can effectively reduce the generation of stains and garbage; when the device is used, 8 substrates are placed simultaneously, the time consumption is 7s/pcs, the packing efficiency is greatly improved, and the manual operation time is reduced.

The carrier plate is provided with a shaft sleeve 5, the cover plate is provided with a guide pin 17, and the guide pin is positioned in the shaft sleeve when the cover plate is in a working state. The guide assembly comprises a guide shaft 10 with a vertical central axis and a linear bearing 11 arranged on the guide shaft. The buckle is arranged on an optical axis 13, the optical axis is arranged on the cover plate through an optical axis fixing block 14, a torsion spring 16 for adjusting the buckle to hook and loosen the base plate is arranged on the optical axis, and a limit 12 for limiting the rotation angle of the buckle is arranged on the optical axis. The cover plate is provided with a buffer fixing block 8 for fixing the buffer. A carrier plate limiting block 18 is arranged on the bottom plate, and the carrier plate abuts against the carrier plate limiting block after moving leftwards to a limit position.

The working process is as follows: as shown in fig. 3, the substrate cover side is placed in a prescribed direction on the carrier plate at the placement position; as shown in fig. 4, the rodless cylinder moves the carrier plate to the substrate-packing position (left); as shown in fig. 5, the pneumatic sliding table is connected with the cover plate and descends, the cover side is hooked by the buckle and fixed on the cover plate (the buckle is opened outwards after contacting the edge of the cover side by the descending force of the cylinder, and the buckle is returned by the torsion spring after the cover plate is bottomed, so that the cover side of the base plate is fixed); as shown in fig. 6, the cover plate is hooked and fixed above, the rodless cylinder pushes the carrier plate to the pick-and-place position, and the pick-up tray filled with lenses is placed at the designated position of the carrier plate; as shown in fig. 7, the rodless cylinder pushes the carrier plate to the inside of the device to cover (left); as shown in fig. 8, the cover plate descends, the buckle is opened slowly by the interference of the table side and the buckle, the cover side is separated from the buckle gradually, and moves along the pin position under the action of mutual attraction of the magnets to be in butt joint with the pin hole of the table side, so that the cover is closed.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the concept of the present invention in the disclosure of the present invention, and fall into the protection scope of the present invention.