阅读说明：本技术 引脚、其制备方法、插接接口及电子设备 (Pin, preparation method thereof, plug-in interface and electronic equipment ) 是由 辜国栋 崔超 于 2021-06-29 设计创作，主要内容包括：本申请提供一种引脚、其制备方法、插接接口及电子设备。所述引脚的制备方法包括：提供引脚基材,所述引脚基材包括多个本体部及固定部,所述固定部分别与所述多个本体部连接,以将所述多个本体部连接为一体；在所述固定部的表面形成掩膜层；以及进行电镀,以在所述本体部的表面形成导电层,所述引脚包括所述本体部及所述导电层。本申请实施例的引脚的制备方法制得的引脚具有更低的生产成本。(The application provides a pin, a manufacturing method thereof, a plug interface and electronic equipment. The preparation method of the pin comprises the following steps: providing a pin base material, wherein the pin base material comprises a plurality of body parts and fixing parts, and the fixing parts are respectively connected with the body parts so as to connect the body parts into a whole; forming a mask layer on the surface of the fixed part; and electroplating to form a conductive layer on the surface of the body part, wherein the pin comprises the body part and the conductive layer. The pin manufactured by the pin manufacturing method has lower production cost.)

1. A method for preparing a pin, the method comprising:

providing a pin base material, wherein the pin base material comprises a plurality of body parts and fixing parts, and the fixing parts are respectively connected with the body parts so as to connect the body parts into a whole;

forming a mask layer on the surface of the fixed part; and

and electroplating to form a conductive layer on the surface of the body part, wherein the pin comprises the body part and the conductive layer.

2. The method for manufacturing a lead according to claim 1, wherein the forming a mask layer on the surface of the fixing portion includes:

and forming a mask layer on the surface of the fixed part through dispensing or injection molding, wherein the mask layer comprises one or more of light-cured glue, epoxy resin, polyamide, polycarbonate and poly-p-phenylene terephthalamide.

3. The method of manufacturing a pin according to claim 2, wherein the thickness of the mask layer is 0.05mm to 2 mm.

4. The method for manufacturing a lead according to claim 1, wherein the conductive layer includes a flat layer and an anti-corrosion layer stacked in this order, the flat layer being disposed closer to the body portion than the anti-corrosion layer; the performing electroplating comprises:

electroplating a flat layer on the surface of the body part, wherein the flat layer is made of a nickel layer; and

and electroplating an anti-corrosion layer on the surface of the flat layer far away from the body part, wherein the anti-corrosion layer is made of a gold layer.

5. The method for manufacturing a lead according to claim 1, wherein the conductive layer includes a flat layer, an abrasion-resistant layer, an adhesion layer, and an anti-corrosion layer, which are sequentially stacked, the flat layer being disposed closer to the body portion than the anti-corrosion layer; the performing electroplating comprises:

electroplating a flat layer on the surface of the body part, wherein the flat layer is a nickel-tungsten layer;

electroplating a wear-resistant layer on the surface of the flat layer far away from the body part, wherein the wear-resistant layer is a palladium nickel layer;

electroplating an adhesion layer on the surface of the wear-resistant layer far away from the body part, wherein the adhesion layer is a gold layer; and

and electroplating an anti-corrosion layer on the surface of the adhesion layer, which is far away from the body part, wherein the anti-corrosion layer is a rhodium ruthenium layer.

6. The method for preparing a pin according to any one of claims 1 to 5, wherein the pin is a pin of a Type C interface, a pin of a lightning interface, or a pin of a micro universal serial bus interface.

7. The method for preparing a pin according to claim 6, wherein the pin is one or more of a power supply pin, a ground pin, a data line pin, and a communication pin.

8. A pin, characterized in that it is produced by the method for producing a pin according to any one of claims 1 to 7.

9. A jack interface, comprising:

the first shell is provided with an accommodating space;

the bearing piece is arranged in the accommodating space; and

a plurality of the pins of claim 8, a plurality of the pins being spaced apart on the carrier for electrical connection with pins of an interface of an external electronic device.

10. An electronic device, comprising:

the docking interface of claim 9, the docking interface to transmit data and to charge the electronic device;

the second shell is provided with an accommodating space and a through hole, the through hole is communicated with the accommodating space, and the through hole is used for installing the plug-in connector;

a display component for displaying; and

the circuit board assembly is arranged in the accommodating space, is respectively electrically connected with the display assembly and the plug interface, and is used for controlling the display assembly to display and controlling the plug interface to transmit and charge data.

Technical Field

The application relates to the field of electronics, in particular to a pin, a manufacturing method thereof, a plug interface and electronic equipment.

Background

After a period of use, the pins on the data line plug interface are easily subjected to environmental corrosion and electrochemical corrosion when being charged under the action of water vapor, oxygen and the like in the air, so that the performance of the plug interface is affected. Therefore, the surface of the lead is usually plated with a corrosion-proof layer, however, the lead is plated together with the material tape, and the material tape is cut after the lead is mounted, which greatly increases the manufacturing cost of the lead.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a method for manufacturing a lead, which enables the lead to have a lower production cost.

The embodiment of the application provides a method for preparing a pin, which comprises the following steps:

providing a pin base material, wherein the pin base material comprises a plurality of body parts and fixing parts, and the fixing parts are respectively connected with the body parts so as to connect the body parts into a whole;

forming a mask layer on the surface of the fixed part; and

and electroplating to form a conductive layer on the surface of the body part, wherein the pin comprises the body part and the conductive layer.

In addition, the embodiment of the application also provides a pin, and the pin is prepared by the preparation method of the pin.

In addition, this application embodiment still provides a grafting interface, the grafting interface includes:

the first shell is provided with an accommodating space;

the bearing piece is arranged in the accommodating space; and

the plurality of pins of the embodiment of the application are arranged on the bearing part at intervals and are used for being electrically connected with pins of an interface of external electronic equipment.

In addition, an embodiment of the present application provides an electronic device, which includes:

according to the plug interface of the embodiment of the application, the plug interface is used for transmitting data and charging the electronic equipment;

the second shell is provided with an accommodating space and a through hole, the through hole is communicated with the accommodating space, and the through hole is used for installing the plug-in connector;

a display component for displaying; and

the circuit board assembly is arranged in the accommodating space, is respectively electrically connected with the display assembly and the plug interface, and is used for controlling the display assembly to display and controlling the plug interface to transmit data or charge.

According to the pin manufacturing method, before the pin base material is electroplated, the mask layer is formed on the surface of the fixing portion of the pin base material, and then the pin base material is electroplated, so that during electroplating, the noble metal is only plated on the body portion of the pin base material and cannot be plated on the fixing portion, and therefore the pin manufacturing cost is greatly reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a plug interface according to an embodiment of the present application.

Fig. 2 is an exploded view of the plug interface according to the embodiment of fig. 1.

Fig. 3 is a schematic cross-sectional view of the plug interface of the embodiment of the present application along the direction a-a in fig. 1.

Fig. 4 is a schematic cross-sectional view of a plug interface of another embodiment of the present application along a-a direction in fig. 1.

Fig. 5 is a schematic cross-sectional view of a plug interface of another embodiment of the present application along the direction a-a in fig. 1.

Fig. 6 is a schematic cross-sectional structure diagram of a lead according to an embodiment of the present application.

Fig. 7 is a schematic cross-sectional structure diagram of a lead according to another embodiment of the present application.

Fig. 8 is a schematic structural diagram of a lead substrate according to an embodiment of the present application.

Fig. 9 is a schematic diagram illustrating a manufacturing process of a lead according to an embodiment of the present application.

Fig. 10 is a schematic view illustrating a manufacturing process of a lead according to another embodiment of the present application.

Fig. 11 is a schematic view illustrating a manufacturing process of a lead according to another embodiment of the present application.

Fig. 12 is a schematic diagram of a partially exploded structure of an electronic device according to an embodiment of the present application.

Fig. 13 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-plug connection 58-wear layer

10-first housing 59-attachment layer

101-containing space 50' -pin base material

30-carrier 51' -fixing part

50-pin 500-electronic device

51-supply pin 510-display assembly

53-ground pin 520-second housing

55-data line pin 521-accommodating space

57-communication pin 523-via

57' -sense pin 530-circuit board assembly

52-body part 531-processor

54-planar layer 533-memory

56-anti-corrosion layer

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Referring to fig. 1 and fig. 2, an embodiment of the present application provides a plug interface 100, where the plug interface 100 is used for connecting an electronic device to perform charging or data transmission, and the plug interface 100 includes: the first housing 10, the carrier 30 and the plurality of pins 50. The first housing 10 has an accommodating space 101, the carrier 30 is disposed in the accommodating space 101 and is used for carrying the plurality of pins 50, and the plurality of pins 50 are disposed on the carrier 30 at intervals and are used for electrically connecting with pins of an interface of an external electronic device. Optionally, a portion of each of the pins 50 is inserted into the carrier 30, and another portion of each of the pins 50 is exposed on the surface of the carrier 30, so as to fix the pins 50 on the carrier 30.

Alternatively, the socket interface 100 may be a female head (or a female port). The plug interface 100 may be, but not limited to, a Micro Universal Serial Bus (microsub) interface (as shown in fig. 3), a Lightning interface (Lightning interface) (as shown in fig. 4), or a Type C interface (as shown in fig. 5).

Alternatively, the first casing 10 may be a metal casing, such as but not limited to a casing made of aluminum, aluminum alloy, or the like.

Alternatively, the supporting member 30 may be a plastic member, such as a plastic member made of polytetramethylene adipamide (nylon 46, PA 46).

Referring to fig. 3 to 5, optionally, the plurality of pins 50 include a power pin 51, a ground pin 53 and a data line pin 55. The power pin 51 is used for transmitting power to charge an external electronic device. The ground pin 53 is used for grounding. The data line pin 55 is used for transmitting data.

Optionally, as shown in fig. 3, the data line pin 55 includes a data line positive pin (i.e., a D + pin) and a data line negative pin (i.e., a D-pin), and as shown in fig. 5, the data line pin 55 further includes a differential line transmitting pin (TX pin) and a differential line receiving pin (RX pin). When the socket interface 100 is a microsusb interface or a Lightning interface, the data line pin 55 includes a D + pin and a D-pin. When the socket interface 100 is a Type C interface, the data line pin 55 includes a D + pin, a D-pin, a TX pin, and an RX pin, where the D + pin and the D-pin are used for data transmission of a USB 2.0 protocol, and the TX pin and the RX pin are used for data transmission of a USB 3.1 protocol.

Referring to fig. 3, in some embodiments, when the plug interface 100 is a microsub interface, the pins 50 further include a detection pin 57 ', and the detection pin 57' is used for grounding or floating.

Referring to fig. 4 and 5, in some embodiments, when the socket interface 100 is a Type C interface or a Lightning interface, the pins 50 further include a communication pin (CC pin) 57, also called a signal pin 57(Sa pin, Sb pin), and the communication pin 57 is used for determining whether the socket interface 100 is inserted in a forward direction or a reverse direction, in other words, the communication pin 57 is used for determining whether the socket interface 100 is connected to an a-plane or a B-plane of an external electronic device.

Referring to fig. 6 and 7, in some embodiments, the lead 50 includes a body portion 52, a planarization layer 54, and an anti-corrosion layer 56. The flat layer 54 is disposed on the surface of the main body 52, and the flat layer 54 is used to fill the pits on the surface of the main body 52. The anti-corrosion layer 56 is disposed on a side of the flat layer 54 away from the main body 52, and is used for preventing the main body 52 from environmental corrosion under the action of moisture, oxygen, or the like, or from electrochemical corrosion during charging.

As shown in fig. 6, in some embodiments, the corrosion protection layer 56 may be disposed on a surface of the planar layer 54 remote from the body portion 52. In other embodiments, as shown in fig. 7, the anti-corrosion layer 56 and the planarization layer 54 may further include another functional film layer, and the anti-corrosion layer 56 is disposed on a surface of the functional film layer away from the body portion 52.

Alternatively, the material of the body portion 52 may be a conductive material such as copper. Alternatively, the body portion 52 may be formed by rolling or the like.

Optionally, the planarization layer 54 has conductivity, and the material of the planarization layer 54 includes one or more of nickel (Ni), tungsten (W), and the like. In some embodiments, the planar layer 54 is a nickel layer having a thickness of 70 to 90 mils, and may be, but is not limited to, 70 mils, 75 mils, 80 mils, 85 mils, 90 mils, and the like. In other embodiments, the planarization layer 54 is a nickel tungsten layer (NiW layer) having a thickness of 30 to 50 steps, and may be, but is not limited to, 30 steps, 35 steps, 40 steps, 45 steps, 50 steps, etc. The planarization layer 54 is too thin to fill the pits in the surface of the body portion 52 well, and the planarization layer 54 is too thick, which increases the manufacturing cost of the lead 50.

Optionally, the corrosion protection layer 56 is electrically conductive. The material of the anti-corrosion layer 56 includes one or more of gold (Au), rhodium (Rh), ruthenium (Ru), and the like. In some embodiments, when the corrosion protection layer 56 is a gold layer, the gold layer is used to protect the body portion 52 from environmental corrosion and to provide better electrical contact properties to the surface of the lead 50. The thickness of the gold layer is 20 steps to 40 steps, and specifically, it may be, but not limited to, 20 steps, 25 steps, 30 steps, 35 steps, 40 steps, and the like. In other embodiments, when the corrosion protection layer 56 is a rhodium ruthenium layer, the corrosion protection layer 56 is used to prevent electrochemical corrosion from occurring under the action of moisture when the body portion 52 is electrically charged. The thickness of the rhodium ruthenium layer is 30 to 50 mils, and specifically, it may be, but not limited to, 30 mils, 35 mils, 40 mils, 45 mils, 50 mils, and the like. The corrosion protection layer 56 is too thin, which is less effective in protecting against environmental corrosion, and the corrosion protection layer 56 is too thick, which increases the manufacturing cost of the pin 50 and has a limited improvement in protection against electrochemical corrosion.

Referring to fig. 7, in some embodiments, the lead 50 further includes a wear layer 58 and an adhesion layer 59. The wear layer 58 is disposed between the flat layer 54 and the corrosion protection layer 56 for increasing the wear resistance of the pin 50; the adhesion layer 59 is arranged between the wear layer 58 and the corrosion protection layer 56 for improving the adhesion of the corrosion protection layer 56 on the adhesion layer 59.

Optionally, the wear layer 58 is electrically conductive. The material of the wear-resistant layer 58 includes one or more of palladium (Pd), nickel (Ni), and the like. Alternatively, the wear-resistant layer 58 is a palladium-nickel layer, and the thickness of the wear-resistant layer 58 is 20 steps to 40 steps, and specifically, may be, but is not limited to, 20 steps, 25 steps, 30 steps, 35 steps, 40 steps, and the like. The wear layer 58 is too thin to provide good wear resistance, and the wear layer 58 is too thick, which increases the manufacturing cost of the pin 50 and provides a limited improvement in wear resistance.

Optionally, the adhesion layer 59 has electrical conductivity. The adhesion layer 59 may be a gold layer. The thickness of the gold layer is 0.5 to 3 steps, and specifically, may be, but not limited to, 0.5 step, 1 step, 1.5 step, 2 steps, 2.5 steps, 3 steps, and the like. Too thin an adhesion layer 59 may not provide good adhesion of the corrosion protection layer 56 to the wear layer 58, and too thick an adhesion layer 59 may increase the manufacturing cost of the pin 50.

When the pin 50 of the female connector of the current plug interface 100 (e.g., Type C interface, Lightning interface, and microsub interface) is manufactured, a pin base material is formed by stamping, and the pin base material includes a plurality of main bodies 52 and fixing portions, and the fixing portions are respectively connected to each main body 52 for fixedly connecting the plurality of main bodies 52. Then, the PIN base material is electroplated by using a dip plating method to plate a noble metal layer on the PIN base material, so that the plurality of body parts 52 form a plurality of PINs 50(PIN PINs), and after the electroplating is finished, the plurality of PINs 50 are installed to form the plug interface 100, and then the fixing parts are cut off. The fixation portion is plated with precious metal during the electroplating process, which severely results in precious metal waste and greatly increases the cost of manufacturing the pin 50.

Referring to fig. 8 and 9, an embodiment of the present application further provides a method for manufacturing a lead 50, where the method for manufacturing a lead 50 according to an embodiment of the present application includes:

s201, providing a lead base material 50 ', where the lead base material 50' includes a plurality of body portions 52 and fixing portions 51 ', and the fixing portions 51' are respectively connected to the body portions 52 to connect the body portions 52 into a whole;

alternatively, a conductive metal material (e.g., copper) is pressed, rolled, etc. to form a lead base material 50 ', where the lead base material 50' includes a plurality of body portions 52 and fixing portions 51 ', and the fixing portions 51' are respectively connected to the body portions 52 to integrally connect the body portions 52.

Alternatively, the number, shape, size, arrangement, etc. of the body portion 52 may be determined according to the type of the jack interface 100 to be prepared. For example, when the microsusb interface needs to be prepared, the pin substrate 50' includes 5 body portions 52. For another example, when a lightning interface needs to be prepared, the lead base 50' includes 8 body portions 52. For another example, when a TypeC interface needs to be prepared, the pin substrate 50' includes 12 body portions 52 or 8 body portions 52.

S202, forming a mask layer on the surface of the fixing portion 51'; and

optionally, a mask layer is coated or injection molded on the surface of the fixing portion 51 ' by dispensing or injection molding, so as to prevent the fixing portion 51 ' from being plated with a metal layer when the pin substrate 50 ' is subsequently electroplated. Optionally, the mask layer may be made of a material resistant to electroplating bath solution. Alternatively, the raw material components of the mask layer may include one or more of a photo-curable glue (e.g., an ultraviolet light-curable glue), an epoxy, a polyamide, a polycarbonate, and a poly-p-phenylene terephthalamide.

In an embodiment, when the raw material component of the mask layer is an ultraviolet light curing glue (UV glue), a light curing glue layer is attached to the fixing portion 51' by a glue dispensing method, and then the light curing glue layer is placed under a mercury lamp for ultraviolet light curing, so that the light curing glue layer is photo-cured to form the mask layer. In another embodiment, when the material component of the mask layer is epoxy resin, a glue dispensing method is used to attach a glue layer of epoxy resin to the fixing portion 51', and the glue layer of epoxy resin is heated to be thermally cured to form the mask layer. In another embodiment, when the material composition of the mask layer is polyamide, a polyamide layer is injection molded on the surface of the fixing portion 51' as the film layer.

Alternatively, the thickness of the mask layer is 0.05mm to 2mm, and specifically, may be, but is not limited to, 0.05mm, 0.1mm, 0.3mm, 0.5mm, 0.8mm, 1mm, 1.2mm, 1.5mm, 2mm, and the like. The thickness of the mask layer is too thin, the process is not easy to control, and the shielding effect is poor.

S203, electroplating is performed to form a conductive layer on the surface of the body portion 52, and the pin 50 includes the body portion 52 and the conductive layer.

Optionally, before electroplating, the pin base 50 'is subjected to ultrasonic degreasing and electrolytic degreasing to remove grease on the surface of the body portion 52, then water washing to remove dust and other substances on the surface of the body portion 52, acid washing to remove oxides on the surface of the body portion 52, and finally water washing to remove acid on the surface of the pin base 50'.

In some embodiments, the conductive layer includes a planar layer 54 and an anti-corrosion layer 56, which are sequentially stacked, and the planar layer 54 is disposed closer to the body portion 52 than the anti-corrosion layer 56. The performing electroplating comprises:

1) plating a flat layer 54 on the surface of the body portion 52; and

2) a corrosion protection layer 56 is plated on the surface of the planar layer 54 remote from the body portion 52.

In one embodiment, the planarization layer 54 is a nickel layer, and the anti-corrosion layer 56 is a gold layer; the performing electroplating comprises: a) placing the pin base material 50' in electroplating bath solution containing nickel ions, and electroplating to plate a nickel layer (flat layer 54) on the surface of the body part 52; and b) electroplating in the electroplating bath solution containing gold ions to plate a gold layer (anti-corrosion layer 56) on the surface of the nickel layer.

Optionally, after each layer of film is electroplated, a water wash is performed to remove plating bath solution remaining in the plating bath of the previous step on the lead substrate 50' before the next layer of film is electroplated. For example, after the planarization layer 54 is plated, a water rinse is performed before the anti-corrosion layer 56 is plated.

In some embodiments, the conductive layer includes a planar layer 54, an abrasion resistant layer 58, an adhesion layer 59, and an anti-corrosion layer 56, which are sequentially stacked, the planar layer 54 being disposed closer to the body portion 52 than the anti-corrosion layer 56. The performing electroplating comprises:

1) plating a flat layer 54 on the surface of the body portion 52;

2) plating a wear-resistant layer 58 on the surface of the flat layer 54 away from the body portion 52;

3) electroplating an adhesion layer 59 on the surface of the wear-resistant layer 58 far away from the body part 52; and

4) the surface of the adhesion layer 59 remote from the body portion 52 is plated with a corrosion protection layer 56.

In one embodiment, the planarization layer 54 is a nickel-tungsten layer, the wear layer 58 is a palladium-nickel layer, the adhesion layer 59 is a gold layer, and the corrosion protection layer 56 is a rhodium-ruthenium layer; the performing electroplating comprises: a) placing the pin base material 50' in electroplating bath solution containing nickel ions and tungsten ions, and electroplating to plate a nickel-tungsten layer (flat layer 54) on the surface of the body part 52; b) electroplating in electroplating bath solution containing palladium ions and nickel ions to plate a palladium nickel layer (wear-resistant layer 58) on the surface of the nickel-tungsten layer; c) electroplating in the electroplating bath solution containing gold ions to plate a gold layer (an adhesion layer 59) on the surface of the palladium-nickel layer; and d) electroplating in the electroplating bath solution containing rhodium ions and ruthenium ions to plate the rhodium ruthenium layer (the anti-corrosion layer 56) on the surface of the gold layer.

Optionally, after each layer of film is electroplated, a water wash is performed to remove plating bath solution remaining in the plating bath of the previous step on the lead substrate 50' before the next layer of film is electroplated.

For the features of the present application that are the same as the above embodiments and are not described in detail, please refer to the description of the corresponding portions of the above embodiments, which is not described herein again.

According to the method for manufacturing the pin 50 of the embodiment of the application, before the pin base material 50 'is electroplated, the mask layer is formed on the surface of the fixing part 51' of the pin base material 50 ', and then the pin base material 50' is electroplated, so that during electroplating, precious metal is only plated on the body part 52 of the pin base material 50 'and is not plated on the fixing part 51', and the manufacturing cost of the pin 50 is greatly reduced.

Referring to fig. 10, an embodiment of the present application further provides a method for manufacturing a lead 50, where the method can be used to manufacture the lead 50 of the embodiment of the present application, and the lead 50 includes a body portion 52, a planarization layer 54, and an anti-corrosion layer 56; the flat layer 54 is disposed on the surface of the body portion 52, and the anti-corrosion layer 56 is disposed on the surface of the flat layer 54 away from the body portion 52, and the preparation method includes:

s301, providing a lead base material 50 ', where the lead base material 50' includes a plurality of body portions 52 and fixing portions 51 ', and the fixing portions 51' are respectively connected to the body portions 52 to connect the body portions 52 into a whole;

s302, plating a flat layer 54 on the surface of the body portion 52;

s303, electroplating an anti-corrosion layer 56 on the surface of the flat layer 54 far away from the body part 52; and

s304, cutting off the fixing part 51' to obtain the pin 50.

Alternatively, the fixing portion 51 'of the plated pin base 50' is cut off to obtain the pin 50. Alternatively, the fixing portion 51' may be cut off before the lead 50 is mounted, or may be cut off after the lead 50 is mounted.

For the features of the present application that are the same as the above embodiments and are not described in detail, please refer to the description of the corresponding portions of the above embodiments, which is not described herein again.

Referring to fig. 11, an embodiment of the present application further provides a method for manufacturing a lead 50, where the method for manufacturing a lead 50 according to an embodiment of the present application is used to manufacture the lead 50, where the lead 50 includes a body 52, and a flat layer 54, an abrasion-resistant layer 58, an adhesion layer 59, and an anti-corrosion layer 56 sequentially stacked on a surface of the body 52; the preparation method comprises the following steps:

s401, providing a pin base material 50 ', where the pin base material 50' includes a plurality of body portions 52 and fixing portions 51 ', and the fixing portions 51' are respectively connected to the body portions 52 to connect the body portions 52 into a whole;

s402, electroplating a flat layer 54 on the surface of the body part 52;

s403, electroplating a wear-resistant layer 58 on the surface of the flat layer 54 away from the body part 52;

s404, electroplating an adhesion layer 59 on the surface of the wear-resistant layer 58 far away from the body part 52;

s405, electroplating an anti-corrosion layer 56 on the surface of the adhesion layer 59 far away from the body part 52; and

s406, the fixing portion 51' is cut off to obtain the lead 50.

For the features of the present application that are the same as the above embodiments and are not described in detail, please refer to the description of the corresponding portions of the above embodiments, which is not described herein again.

Referring to fig. 12 and fig. 13, an embodiment of the present application further provides an electronic device 500, which includes: in the plug interface 100 according to the embodiment of the application, the plug interface 100 is used for transmitting data and charging the electronic device 500; the second housing 520 is provided with an accommodating space 521 and a through hole 523, the through hole 523 is communicated with the accommodating space 521, and the through hole 523 is used for installing the plug interface 100; a display component 510 for displaying; and a circuit board assembly 530, wherein the circuit board assembly 530 is disposed in the accommodating space 521, and the circuit board assembly 530 is electrically connected to the display assembly 510 and the plug interface 100, respectively, and is configured to control the display assembly 510 to display and control the plug interface 100 to transmit and charge data. Optionally, the display assembly 510 is further used for closing the accommodating space 521; in other words, the second housing 520 and the display module 510 enclose a closed receiving space 521.

The electronic device 500 of the embodiment of the present application may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a desktop computer, an intelligent bracelet, an intelligent watch, an electronic reader, a game machine, an intelligent glasses, an intelligent toy, a story machine, and other electronic devices that can be charged or transmit data.

For a detailed description of the plugging interface 100, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Optionally, the second housing 520 includes a bottom plate (not shown) and a side plate (not shown) connected to the bottom plate in a bent manner. The bottom plate and the side plate enclose an accommodating space 521, and the through hole 523 is located on the side plate. In some embodiments, the bottom plate and the side plate are of a unitary structure, and in other embodiments, the bottom plate and the side plate are formed separately and then connected together. In a specific embodiment, the bottom plate is a rear cover of the electronic device 500, and the side plate is a middle frame of the electronic device 500.

Alternatively, the display module 510 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Referring again to fig. 13, optionally, the circuit board assembly 530 may include a processor 531 and a memory 533. The processor 531 is electrically connected to the display module 510, the socket interface 100 and the memory 533 respectively. The processor 531 is configured to control the display module 510 to display, and control the plug interface 100 to perform data transmission or charging; the memory 533 is used for storing a program code required by the processor 531 to operate, a program code required by the display module 510, a display content of the display module 510, a program code for controlling the plug interface 100 to perform data transmission and charging, and the like.

Alternatively, the processor 531 includes one or more general-purpose processors 531, wherein the general-purpose processor 531 may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, an ASIC, and the like. The processor 531 is configured to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 533, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 533 may include a Volatile Memory (Volatile Memory), such as a Random Access Memory (RAM); the Memory 533 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk (Hard Disk Drive, HDD), or a Solid-State Drive (SSD). Memory 533 may also comprise a combination of the above types of memory.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.